EP20K100TC144-3 - APEX 20K 100K Gates FPGA 144TQFP | Intel
Référence : EP20K100TC144-3 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.95 | $2 895,00 |
| 500 | $24.1 | $12 050,00 |
| 1 000 | $19.8 | $19 800,00 |
EP20K100TC144-3 Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacturing. FPGAs belong to the broader category of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. Within the digital logic hierarchy, an FPGA sits above fixed-function ASICs in flexibility and below microprocessors in software programmability. The APEX 20K family specifically pioneered the combination of LUT logic with embedded memory blocks on a single die, paving the way for modern SoC FPGAs.
Key features of the EP20K100TC144-3 include 4,160 logic elements, 100K typical gates, four embedded system blocks providing 53,248 RAM bits, 416 macrocells, a MultiCore interconnect routing fabric, and IEEE 1149.1 JTAG boundary-scan support. The device is in-system programmable via the IEEE 1532 / 1149.1 interface, allowing rapid prototyping and field upgrades. The TQFP-144 package (also referenced as 144-LQFP, body size approximately 20 × 20 mm, 0.5 mm pitch) provides 101 usable I/O lines with multiple I/O standards including LVTTL, LVCMOS, PCI, and SSTL.
The device architecture combines fine-grained logic cells (LEs) with coarse-grained embedded system blocks. Logic elements are grouped into Logic Arrays (LABs), and ESBs can be configured as dual-port RAM, ROM, FIFO, or CAM. This hybrid architecture makes the APEX 20K suitable for designs that need both datapath logic and on-chip memory, such as communications glue logic, custom DSP pipelines, and bus-interface bridging.
Typical applications include telecom line-card glue logic, industrial control interfaces, custom peripheral bridges, and legacy ASIC replacement designs. The 100K-gate density is well suited to medium-complexity state machines, FIFO/buffer managers, and protocol converters. Designers migrating to this device typically use the Altera Quartus II design environment for synthesis, place-and-route, and bitstream generation.
When designing with the EP20K100TC144-3, pay attention to power-rail sequencing and decoupling. The 2.5 V core and 3.3 V/5 V tolerant I/Os require bulk and high-frequency decoupling close to each supply pin. Unused I/O pins should be left floating or driven to a defined logic level per Quartus II configuration to minimize in-rush current. Because the EP20K100TC144-3 has been in production since the early 2000s and the APEX 20K family is mature, lead time and lifecycle should be confirmed with the distributor before committing to new designs.
This page synthesizes distributor pricing, drop-in alternative guidance, and engineering design notes that complement the official datasheet.
Alternatives de remplacement direct pour EP20K100TC144-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K100TC144-3 (même facteur de forme et même empreinte) — différant par Package, Family, Operating Temperature, Speed Grade, Core Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K100TC144-1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K100TC144-2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K200TC144-3
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K100EFC144-3
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K100CT144C7
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EP20K100FC144-3
✅ Remplacement direct✓ En stock
$59.5 / unité
Voir la fiche technique →EP20K100TC144-3 Valeurs maximales et caractéristiques électriques
| Series | APEX 20K |
| Family | APEX 20K (APEX 20KE-compatible die) |
| Logic Elements / Cells | 4,160 |
| Macrocells | 416 |
| Typical Gates | 100,000 |
| Number of I/O | 101 |
| Number of Logic Blocks/Elements | 4,160 |
| Total RAM Bits | 53,248 |
| Voltage - Supply | 2.5 V core |
| Température de fonctionnement | 0 °C to 85 °C (Commercial) |
| Type de montage | Surface Mount |
| Boîtier | 144-LQFP / TQFP-144 (20 × 20 mm, 0.5 mm pitch) |
| Propagation Delay | 1.6 ns |
| Maximum Internal Frequency | 167 MHz |
| Process Technology | 0.22 µm CMOS |
| Speed Grade | -3 |
| In-System Programmability | IEEE 1149.1 / 1532 JTAG |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de EP20K100TC144-3
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | GND — Ground |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | TDI — JTAG test data input |
| Broche 15 | TMS — JTAG test mode select |
| Broche 16 | TCK — JTAG test clock |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | VCCINT — Core supply voltage (2.5 V) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | VCCINT — Core supply voltage (2.5 V) |
| Broche 39 | GND — Ground |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | I/O — User I/O pin (bank 3) |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | VCCINT — Core supply voltage (2.5 V) |
| Broche 58 | GND — Ground |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | I/O — User I/O pin (bank 4) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | GND — Ground |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | TDO — JTAG test data output |
| Broche 75 | I/O — User I/O pin (bank 4) |
| Broche 76 | VCCINT — Core supply voltage (2.5 V) |
| Broche 77 | GND — Ground |
| Broche 78 | I/O — User I/O pin (bank 5) |
| Broche 79 | I/O — User I/O pin (bank 5) |
| Broche 80 | I/O — User I/O pin (bank 5) |
| Broche 81 | I/O — User I/O pin (bank 5) |
| Broche 82 | I/O — User I/O pin (bank 5) |
| Broche 83 | I/O — User I/O pin (bank 5) |
| Broche 84 | I/O — User I/O pin (bank 5) |
| Broche 85 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 86 | I/O — User I/O pin (bank 5) |
| Broche 87 | GND — Ground |
| Broche 88 | I/O — User I/O pin (bank 5) |
| Broche 89 | I/O — User I/O pin (bank 5) |
| Broche 90 | I/O — User I/O pin (bank 5) |
| Broche 91 | I/O — User I/O pin (bank 5) |
| Broche 92 | I/O — User I/O pin (bank 5) |
| Broche 93 | I/O — User I/O pin (bank 5) |
| Broche 94 | nCONFIG — Configuration control (active low) |
| Broche 95 | nSTATUS — Configuration status (active low) |
| Broche 96 | VCCINT — Core supply voltage (2.5 V) |
| Broche 97 | GND — Ground |
| Broche 98 | I/O — User I/O pin (bank 6) |
| Broche 99 | I/O — User I/O pin (bank 6) |
| Broche 100 | I/O — User I/O pin (bank 6) |
| Broche 101 | I/O — User I/O pin (bank 6) |
| Broche 102 | I/O — User I/O pin (bank 6) |
| Broche 103 | I/O — User I/O pin (bank 6) |
| Broche 104 | I/O — User I/O pin (bank 6) |
| Broche 105 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 106 | I/O — User I/O pin (bank 6) |
| Broche 107 | GND — Ground |
| Broche 108 | I/O — User I/O pin (bank 6) |
| Broche 109 | I/O — User I/O pin (bank 6) |
| Broche 110 | I/O — User I/O pin (bank 6) |
| Broche 111 | I/O — User I/O pin (bank 6) |
| Broche 112 | I/O — User I/O pin (bank 6) |
| Broche 113 | I/O — User I/O pin (bank 6) |
| Broche 114 | CONF_DONE — Configuration done indicator |
| Broche 115 | DCLK — Configuration clock |
| Broche 116 | DATA0 — Configuration data input |
| Broche 117 | I/O — User I/O pin (bank 7) |
| Broche 118 | I/O — User I/O pin (bank 7) |
| Broche 119 | VCCINT — Core supply voltage (2.5 V) |
| Broche 120 | GND — Ground |
| Broche 121 | I/O — User I/O pin (bank 7) |
| Broche 122 | I/O — User I/O pin (bank 7) |
| Broche 123 | I/O — User I/O pin (bank 7) |
| Broche 124 | I/O — User I/O pin (bank 7) |
| Broche 125 | I/O — User I/O pin (bank 7) |
| Broche 126 | I/O — User I/O pin (bank 7) |
| Broche 127 | I/O — User I/O pin (bank 7) |
| Broche 128 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 129 | I/O — User I/O pin (bank 7) |
| Broche 130 | GND — Ground |
| Broche 131 | I/O — User I/O pin (bank 7) |
| Broche 132 | I/O — User I/O pin (bank 7) |
| Broche 133 | I/O — User I/O pin (bank 7) |
| Broche 134 | I/O — User I/O pin (bank 7) |
| Broche 135 | I/O — User I/O pin (bank 7) |
| Broche 136 | I/O — User I/O pin (bank 7) |
| Broche 137 | I/O — User I/O pin (bank 8) |
| Broche 138 | I/O — User I/O pin (bank 8) |
| Broche 139 | I/O — User I/O pin (bank 8) |
| Broche 140 | I/O — User I/O pin (bank 8) |
| Broche 141 | I/O — User I/O pin (bank 8) |
| Broche 142 | VCCINT — Core supply voltage (2.5 V) |
| Broche 143 | GND — Ground |
| Broche 144 | I/O — User I/O pin (bank 8) |
Applications typiques
EP20K100TC144-3 convient pour 7 applications: Telecom Line-Card Glue Logic, Industrial Control Interface Bridging, Legacy ASIC Replacement, Custom DSP Pipeline Implementation, Custom Peripheral Bus Bridge, Test and Measurement Instrumentation Front-End, Aerospace and Defense Avionics Interface.
Telecom Line-Card Glue Logic
The EP20K100TC144-3 is well suited for telecom line-card glue logic where 101 user I/O and 4,160 logic elements provide enough headroom for protocol converters, TDM framers, and backplane bridges. The 167 MHz internal frequency in the -3 speed grade supports 155 Mbps telecom data paths, while the 53,248 bits of embedded memory absorb small packet buffers and lookup tables without external SRAM. Designers typically place the device between a network processor and PHY/SERDES, configuring LVTTL or LVCMOS I/O standards for direct 3.3 V interfacing. Compared with discrete TTL glue, the FPGA cuts board area and improves timing closure.
Recommandé
Industrial Control Interface Bridging
In industrial control systems, the EP20K100TC144-3 bridges legacy parallel buses (ISA, HPI, VME) to modern serial protocols such as SPI, I2C, and UART. Its 101 I/O lines tolerate 5 V inputs and can be configured for LVTTL or PCI signaling, simplifying interfacing to legacy peripherals. The MultiCore interconnect fabric enables deterministic routing for real-time control loops, while 53,248 bits of embedded RAM serve as mailbox FIFOs between master and slave processors. The 0 to 85 °C commercial temperature range covers most factory-floor enclosures without requiring industrial-grade screening.
Recommandé
Legacy ASIC Replacement
Designers often use the EP20K100TC144-3 as a drop-in replacement for end-of-life ASICs in long-lifecycle industrial, military, and aerospace programs. The 100K-gate density matches many mid-1990s gate-array ASICs, while in-system JTAG programmability allows field updates without board rework. The TQFP-144 footprint is compatible with many legacy ASIC land patterns, enabling direct PCB swaps. The 53,248-bit on-chip memory replaces small external SRAM/ROM, and the 2.5 V core draws modest power, easing thermal management in sealed enclosures.
Recommandé
Custom DSP Pipeline Implementation
The EP20K100TC144-3 supports custom DSP pipelines such as FIR filters, correlators, and CRC engines. At 167 MHz internal frequency, the device delivers up to 167 MIPS on simple multiplier-free datapaths, and the embedded system blocks serve as coefficient RAM or delay-line storage. For higher-throughput designs, designers can pipeline FIR taps across multiple LABs while keeping control logic in surrounding logic elements. The 101 I/O lines stream wide sample buses into external ADC/DAC devices, while JTAG lets engineers debug pipelines in real time.
Recommandé
Custom Peripheral Bus Bridge
The EP20K100TC144-3 is commonly used as a peripheral bus bridge that converts one bus standard (PCI, VME, ISA, or proprietary) to another (PCI Express soft-IP, SPI, I2C, or GPIO). The 100K-gate capacity handles full bus-state machines plus DMA controllers, and the embedded memory acts as FIFO storage for data crossing clock domains. The JTAG interface supports in-system firmware updates, which is critical for field-deployed bridges. The TQFP-144 package is hand-solderable for prototype builds, while production runs use standard SMT lines.
Recommandé
Test and Measurement Instrumentation Front-End
In bench-top test equipment, the EP20K100TC144-3 implements custom waveform generators, pattern generators, and protocol-analyzer front ends. The 167 MHz internal frequency supports real-time streaming at 100 Msps or higher for parallel-output patterns, while the 53,248-bit embedded RAM stores deep look-up tables for arbitrary waveform synthesis. LVTTL I/O standards can directly drive TTL comparators and 50 Ω terminated lines, simplifying analog front-end design. Designers using Quartus II can incorporate on-chip logic analyzers (SignalTap equivalent) for real-time debug.
Recommandé
Aerospace and Defense Avionics Interface
The EP20K100TC144-3 has historically been qualified for aerospace and defense programs where long-lifecycle support and MIL-spec reliability are required. Its 101 user I/O accommodate ARINC 429, MIL-STD-1553, and discrete avionics buses when paired with companion transceivers. The TQFP-144 package is compatible with hermetic and plastic-encapsulated assembly processes, and 4,160 logic elements implement bus monitors, protocol engines, and discrete I/O conditioning. Designers should validate lot-conformance and radiation tolerance per program requirements, since APEX 20K is not formally Rad-hard by design.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K100TC144-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K100TC144-1 | EP20K100TC144-2 | EP20K200TC144-3 | EP20K100EFC144-3 | EP20K100CT144C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 (144-LQFP) | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same |
| Family | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20KE | APEX 20K (C-grade) |
| Logic Elements | 4,160 | 4,160 (same die) | 4,160 (same die) | 8,320 | 4,160 (APEX 20KE) | 4,160 |
| Typical Gates | 100,000 | 100,000 | 100,000 | 200,000 | 100,000 | 100,000 |
| Maximum Internal Frequency | 167 MHz | ~120 MHz (-28%) | ~145 MHz (-13%) | 167 MHz (same) | ~150 MHz (-10%) | ~120 MHz (-28%) |
| Total RAM Bits | 53,248 | 53,248 | 53,248 | 106,496 | 53,248 (with ESB enhancements) | 53,248 |
| Number of User I/O | 101 | 101 | 101 | 101 (max for TQFP-144) | 101 | 101 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -3 (fastest) | -1 (slowest) | -2 (mid) | -3 | -3 | C7 |
Principaux différenciateurs
- Highest speed grade (-3) within the APEX 20K 100K-gate TQFP-144 family (vs EP20K100TC144-1)
- Pin-to-pin upgrade path to 200K-gate APEX 20K in the same TQFP-144 footprint (vs EP20K200TC144-3)
- Same TQFP-144 footprint as APEX 20KE with richer ESB features (vs EP20K100EFC144-3)
Notes de conception
Estimated: at 100% utilization across 4,160 logic elements switching simultaneously at 167 MHz, the EP20K100TC144-3 core current can reach 0.4 A on the 2.5 V rail (roughly 1 W). Use a low-impedance 2.5 V LDO or switching regulator and place a 100 µF bulk plus 0.1 µF and 0.01 µF ceramic decoupling network within 5 mm of every VCCINT pin. VCCIO pins per bank require their own decoupling matched to the I/O standard and toggle rate; bank-powered I/O can add another 0.2 to 0.5 W at full LVCMOS-33 drive.
The 144-pin TQFP package has 0.5 mm lead pitch; follow JEDEC IPC-7351 land-pattern guidelines for TQFP-144 to avoid solder bridging. Use a 4-layer PCB with continuous ground and power planes, and route JTAG signals (TDI, TDO, TMS, TCK) with 50 Ω controlled impedance away from clock and switching I/O. Decoupling capacitors should be placed on the same side as the FPGA, between the pin and the nearest via to the power plane, with via count scaled to peak transient current.
Do not assume the bitstream is portable across APEX 20K density or package variants - even pin-compatible parts require recompilation if the die differs (for example EP20K100EFC144-3 vs EP20K100TC144-3). Always confirm that the JTAG chain order, configuration scheme (PS, AS, JTAG), and nCONFIG/nSTATUS pull-up values match the chosen configuration EPC or enhanced device. For multi-rail sequencing, bring up VCCINT first, then VCCIO, then drive nCONFIG high to avoid partial-configuration latch-up.
Estimated: at 1 W total power dissipation and a 144-TQFP theta_JA of approximately 35 °C/W (still air, JEDEC EIA/JESD51-2 4-layer board), junction temperature rise is roughly 35 °C above ambient. Within the 0 to 85 °C commercial range, this provides ~50 °C margin. For sealed enclosures, designers should add a thermal copper pour under the exposed pad area or upgrade to an FBGA package with lower theta_JA for higher-power designs.
Informations de conformité
RoHS and REACH compliant per distributor listings. AEC-Q100 not applicable (commercial-grade FPGA; not qualified to automotive stress standards). Lead-free reflow-compatible. Halogen-free status not explicitly disclosed in available distributor data.
