EP20K100TC144-3 - APEX 20K 100K Gates FPGA 144TQFP | Intel
N.º da peça: EP20K100TC144-3 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.95 | $2.895,00 |
| 500 | $24.1 | $12.050,00 |
| 1.000 | $19.8 | $19.800,00 |
EP20K100TC144-3 Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacturing. FPGAs belong to the broader category of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. Within the digital logic hierarchy, an FPGA sits above fixed-function ASICs in flexibility and below microprocessors in software programmability. The APEX 20K family specifically pioneered the combination of LUT logic with embedded memory blocks on a single die, paving the way for modern SoC FPGAs.
Key features of the EP20K100TC144-3 include 4,160 logic elements, 100K typical gates, four embedded system blocks providing 53,248 RAM bits, 416 macrocells, a MultiCore interconnect routing fabric, and IEEE 1149.1 JTAG boundary-scan support. The device is in-system programmable via the IEEE 1532 / 1149.1 interface, allowing rapid prototyping and field upgrades. The TQFP-144 package (also referenced as 144-LQFP, body size approximately 20 × 20 mm, 0.5 mm pitch) provides 101 usable I/O lines with multiple I/O standards including LVTTL, LVCMOS, PCI, and SSTL.
The device architecture combines fine-grained logic cells (LEs) with coarse-grained embedded system blocks. Logic elements are grouped into Logic Arrays (LABs), and ESBs can be configured as dual-port RAM, ROM, FIFO, or CAM. This hybrid architecture makes the APEX 20K suitable for designs that need both datapath logic and on-chip memory, such as communications glue logic, custom DSP pipelines, and bus-interface bridging.
Typical applications include telecom line-card glue logic, industrial control interfaces, custom peripheral bridges, and legacy ASIC replacement designs. The 100K-gate density is well suited to medium-complexity state machines, FIFO/buffer managers, and protocol converters. Designers migrating to this device typically use the Altera Quartus II design environment for synthesis, place-and-route, and bitstream generation.
When designing with the EP20K100TC144-3, pay attention to power-rail sequencing and decoupling. The 2.5 V core and 3.3 V/5 V tolerant I/Os require bulk and high-frequency decoupling close to each supply pin. Unused I/O pins should be left floating or driven to a defined logic level per Quartus II configuration to minimize in-rush current. Because the EP20K100TC144-3 has been in production since the early 2000s and the APEX 20K family is mature, lead time and lifecycle should be confirmed with the distributor before committing to new designs.
This page synthesizes distributor pricing, drop-in alternative guidance, and engineering design notes that complement the official datasheet.
Alternativas drop-in para EP20K100TC144-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K100TC144-3 (mesmo formato e footprint) — diferindo em Package, Family, Operating Temperature, Speed Grade, Core Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K100TC144-1
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP20K100TC144-2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP20K200TC144-3
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP20K100EFC144-3
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP20K100CT144C7
✅ Drop-In✓ Em estoque
$9.75 / unidade
Ver ficha técnica →EP20K100FC144-3
✅ Drop-In✓ Em estoque
$59.5 / unidade
Ver ficha técnica →EP20K100TC144-3 Classificações máximas e características elétricas
| Series | APEX 20K |
| Family | APEX 20K (APEX 20KE-compatible die) |
| Logic Elements / Cells | 4,160 |
| Macrocells | 416 |
| Typical Gates | 100,000 |
| Number of I/O | 101 |
| Number of Logic Blocks/Elements | 4,160 |
| Total RAM Bits | 53,248 |
| Voltage - Supply | 2.5 V core |
| Temperatura de operação | 0 °C to 85 °C (Commercial) |
| Tipo de montagem | Surface Mount |
| Encapsulamento | 144-LQFP / TQFP-144 (20 × 20 mm, 0.5 mm pitch) |
| Propagation Delay | 1.6 ns |
| Maximum Internal Frequency | 167 MHz |
| Process Technology | 0.22 µm CMOS |
| Speed Grade | -3 |
| In-System Programmability | IEEE 1149.1 / 1532 JTAG |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do EP20K100TC144-3
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | GND — Ground |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | I/O — User I/O pin (bank 1) |
| Pino 14 | TDI — JTAG test data input |
| Pino 15 | TMS — JTAG test mode select |
| Pino 16 | TCK — JTAG test clock |
| Pino 17 | I/O — User I/O pin (bank 1) |
| Pino 18 | I/O — User I/O pin (bank 1) |
| Pino 19 | I/O — User I/O pin (bank 1) |
| Pino 20 | VCCINT — Core supply voltage (2.5 V) |
| Pino 21 | GND — Ground |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | I/O — User I/O pin (bank 2) |
| Pino 25 | I/O — User I/O pin (bank 2) |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | GND — Ground |
| Pino 31 | I/O — User I/O pin (bank 2) |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | I/O — User I/O pin (bank 2) |
| Pino 36 | I/O — User I/O pin (bank 2) |
| Pino 37 | I/O — User I/O pin (bank 2) |
| Pino 38 | VCCINT — Core supply voltage (2.5 V) |
| Pino 39 | GND — Ground |
| Pino 40 | I/O — User I/O pin (bank 3) |
| Pino 41 | I/O — User I/O pin (bank 3) |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | I/O — User I/O pin (bank 3) |
| Pino 45 | I/O — User I/O pin (bank 3) |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 48 | I/O — User I/O pin (bank 3) |
| Pino 49 | GND — Ground |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | I/O — User I/O pin (bank 3) |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | I/O — User I/O pin (bank 3) |
| Pino 55 | I/O — User I/O pin (bank 3) |
| Pino 56 | I/O — User I/O pin (bank 3) |
| Pino 57 | VCCINT — Core supply voltage (2.5 V) |
| Pino 58 | GND — Ground |
| Pino 59 | I/O — User I/O pin (bank 4) |
| Pino 60 | I/O — User I/O pin (bank 4) |
| Pino 61 | I/O — User I/O pin (bank 4) |
| Pino 62 | I/O — User I/O pin (bank 4) |
| Pino 63 | I/O — User I/O pin (bank 4) |
| Pino 64 | I/O — User I/O pin (bank 4) |
| Pino 65 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 66 | I/O — User I/O pin (bank 4) |
| Pino 67 | GND — Ground |
| Pino 68 | I/O — User I/O pin (bank 4) |
| Pino 69 | I/O — User I/O pin (bank 4) |
| Pino 70 | I/O — User I/O pin (bank 4) |
| Pino 71 | I/O — User I/O pin (bank 4) |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | TDO — JTAG test data output |
| Pino 75 | I/O — User I/O pin (bank 4) |
| Pino 76 | VCCINT — Core supply voltage (2.5 V) |
| Pino 77 | GND — Ground |
| Pino 78 | I/O — User I/O pin (bank 5) |
| Pino 79 | I/O — User I/O pin (bank 5) |
| Pino 80 | I/O — User I/O pin (bank 5) |
| Pino 81 | I/O — User I/O pin (bank 5) |
| Pino 82 | I/O — User I/O pin (bank 5) |
| Pino 83 | I/O — User I/O pin (bank 5) |
| Pino 84 | I/O — User I/O pin (bank 5) |
| Pino 85 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 86 | I/O — User I/O pin (bank 5) |
| Pino 87 | GND — Ground |
| Pino 88 | I/O — User I/O pin (bank 5) |
| Pino 89 | I/O — User I/O pin (bank 5) |
| Pino 90 | I/O — User I/O pin (bank 5) |
| Pino 91 | I/O — User I/O pin (bank 5) |
| Pino 92 | I/O — User I/O pin (bank 5) |
| Pino 93 | I/O — User I/O pin (bank 5) |
| Pino 94 | nCONFIG — Configuration control (active low) |
| Pino 95 | nSTATUS — Configuration status (active low) |
| Pino 96 | VCCINT — Core supply voltage (2.5 V) |
| Pino 97 | GND — Ground |
| Pino 98 | I/O — User I/O pin (bank 6) |
| Pino 99 | I/O — User I/O pin (bank 6) |
| Pino 100 | I/O — User I/O pin (bank 6) |
| Pino 101 | I/O — User I/O pin (bank 6) |
| Pino 102 | I/O — User I/O pin (bank 6) |
| Pino 103 | I/O — User I/O pin (bank 6) |
| Pino 104 | I/O — User I/O pin (bank 6) |
| Pino 105 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 106 | I/O — User I/O pin (bank 6) |
| Pino 107 | GND — Ground |
| Pino 108 | I/O — User I/O pin (bank 6) |
| Pino 109 | I/O — User I/O pin (bank 6) |
| Pino 110 | I/O — User I/O pin (bank 6) |
| Pino 111 | I/O — User I/O pin (bank 6) |
| Pino 112 | I/O — User I/O pin (bank 6) |
| Pino 113 | I/O — User I/O pin (bank 6) |
| Pino 114 | CONF_DONE — Configuration done indicator |
| Pino 115 | DCLK — Configuration clock |
| Pino 116 | DATA0 — Configuration data input |
| Pino 117 | I/O — User I/O pin (bank 7) |
| Pino 118 | I/O — User I/O pin (bank 7) |
| Pino 119 | VCCINT — Core supply voltage (2.5 V) |
| Pino 120 | GND — Ground |
| Pino 121 | I/O — User I/O pin (bank 7) |
| Pino 122 | I/O — User I/O pin (bank 7) |
| Pino 123 | I/O — User I/O pin (bank 7) |
| Pino 124 | I/O — User I/O pin (bank 7) |
| Pino 125 | I/O — User I/O pin (bank 7) |
| Pino 126 | I/O — User I/O pin (bank 7) |
| Pino 127 | I/O — User I/O pin (bank 7) |
| Pino 128 | VCCIO7 — I/O bank 7 supply voltage |
| Pino 129 | I/O — User I/O pin (bank 7) |
| Pino 130 | GND — Ground |
| Pino 131 | I/O — User I/O pin (bank 7) |
| Pino 132 | I/O — User I/O pin (bank 7) |
| Pino 133 | I/O — User I/O pin (bank 7) |
| Pino 134 | I/O — User I/O pin (bank 7) |
| Pino 135 | I/O — User I/O pin (bank 7) |
| Pino 136 | I/O — User I/O pin (bank 7) |
| Pino 137 | I/O — User I/O pin (bank 8) |
| Pino 138 | I/O — User I/O pin (bank 8) |
| Pino 139 | I/O — User I/O pin (bank 8) |
| Pino 140 | I/O — User I/O pin (bank 8) |
| Pino 141 | I/O — User I/O pin (bank 8) |
| Pino 142 | VCCINT — Core supply voltage (2.5 V) |
| Pino 143 | GND — Ground |
| Pino 144 | I/O — User I/O pin (bank 8) |
Aplicações típicas
EP20K100TC144-3 é adequado para 7 aplicaçãos: Telecom Line-Card Glue Logic, Industrial Control Interface Bridging, Legacy ASIC Replacement, Custom DSP Pipeline Implementation, Custom Peripheral Bus Bridge, Test and Measurement Instrumentation Front-End, Aerospace and Defense Avionics Interface.
Telecom Line-Card Glue Logic
The EP20K100TC144-3 is well suited for telecom line-card glue logic where 101 user I/O and 4,160 logic elements provide enough headroom for protocol converters, TDM framers, and backplane bridges. The 167 MHz internal frequency in the -3 speed grade supports 155 Mbps telecom data paths, while the 53,248 bits of embedded memory absorb small packet buffers and lookup tables without external SRAM. Designers typically place the device between a network processor and PHY/SERDES, configuring LVTTL or LVCMOS I/O standards for direct 3.3 V interfacing. Compared with discrete TTL glue, the FPGA cuts board area and improves timing closure.
Recomendado
Industrial Control Interface Bridging
In industrial control systems, the EP20K100TC144-3 bridges legacy parallel buses (ISA, HPI, VME) to modern serial protocols such as SPI, I2C, and UART. Its 101 I/O lines tolerate 5 V inputs and can be configured for LVTTL or PCI signaling, simplifying interfacing to legacy peripherals. The MultiCore interconnect fabric enables deterministic routing for real-time control loops, while 53,248 bits of embedded RAM serve as mailbox FIFOs between master and slave processors. The 0 to 85 °C commercial temperature range covers most factory-floor enclosures without requiring industrial-grade screening.
Recomendado
Legacy ASIC Replacement
Designers often use the EP20K100TC144-3 as a drop-in replacement for end-of-life ASICs in long-lifecycle industrial, military, and aerospace programs. The 100K-gate density matches many mid-1990s gate-array ASICs, while in-system JTAG programmability allows field updates without board rework. The TQFP-144 footprint is compatible with many legacy ASIC land patterns, enabling direct PCB swaps. The 53,248-bit on-chip memory replaces small external SRAM/ROM, and the 2.5 V core draws modest power, easing thermal management in sealed enclosures.
Recomendado
Custom DSP Pipeline Implementation
The EP20K100TC144-3 supports custom DSP pipelines such as FIR filters, correlators, and CRC engines. At 167 MHz internal frequency, the device delivers up to 167 MIPS on simple multiplier-free datapaths, and the embedded system blocks serve as coefficient RAM or delay-line storage. For higher-throughput designs, designers can pipeline FIR taps across multiple LABs while keeping control logic in surrounding logic elements. The 101 I/O lines stream wide sample buses into external ADC/DAC devices, while JTAG lets engineers debug pipelines in real time.
Recomendado
Custom Peripheral Bus Bridge
The EP20K100TC144-3 is commonly used as a peripheral bus bridge that converts one bus standard (PCI, VME, ISA, or proprietary) to another (PCI Express soft-IP, SPI, I2C, or GPIO). The 100K-gate capacity handles full bus-state machines plus DMA controllers, and the embedded memory acts as FIFO storage for data crossing clock domains. The JTAG interface supports in-system firmware updates, which is critical for field-deployed bridges. The TQFP-144 package is hand-solderable for prototype builds, while production runs use standard SMT lines.
Recomendado
Test and Measurement Instrumentation Front-End
In bench-top test equipment, the EP20K100TC144-3 implements custom waveform generators, pattern generators, and protocol-analyzer front ends. The 167 MHz internal frequency supports real-time streaming at 100 Msps or higher for parallel-output patterns, while the 53,248-bit embedded RAM stores deep look-up tables for arbitrary waveform synthesis. LVTTL I/O standards can directly drive TTL comparators and 50 Ω terminated lines, simplifying analog front-end design. Designers using Quartus II can incorporate on-chip logic analyzers (SignalTap equivalent) for real-time debug.
Recomendado
Aerospace and Defense Avionics Interface
The EP20K100TC144-3 has historically been qualified for aerospace and defense programs where long-lifecycle support and MIL-spec reliability are required. Its 101 user I/O accommodate ARINC 429, MIL-STD-1553, and discrete avionics buses when paired with companion transceivers. The TQFP-144 package is compatible with hermetic and plastic-encapsulated assembly processes, and 4,160 logic elements implement bus monitors, protocol engines, and discrete I/O conditioning. Designers should validate lot-conformance and radiation tolerance per program requirements, since APEX 20K is not formally Rad-hard by design.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K100TC144-3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K100TC144-1 | EP20K100TC144-2 | EP20K200TC144-3 | EP20K100EFC144-3 | EP20K100CT144C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 (144-LQFP) | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same |
| Family | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20KE | APEX 20K (C-grade) |
| Logic Elements | 4,160 | 4,160 (same die) | 4,160 (same die) | 8,320 | 4,160 (APEX 20KE) | 4,160 |
| Typical Gates | 100,000 | 100,000 | 100,000 | 200,000 | 100,000 | 100,000 |
| Maximum Internal Frequency | 167 MHz | ~120 MHz (-28%) | ~145 MHz (-13%) | 167 MHz (same) | ~150 MHz (-10%) | ~120 MHz (-28%) |
| Total RAM Bits | 53,248 | 53,248 | 53,248 | 106,496 | 53,248 (with ESB enhancements) | 53,248 |
| Number of User I/O | 101 | 101 | 101 | 101 (max for TQFP-144) | 101 | 101 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -3 (fastest) | -1 (slowest) | -2 (mid) | -3 | -3 | C7 |
Principais diferenciais
- Highest speed grade (-3) within the APEX 20K 100K-gate TQFP-144 family (vs EP20K100TC144-1)
- Pin-to-pin upgrade path to 200K-gate APEX 20K in the same TQFP-144 footprint (vs EP20K200TC144-3)
- Same TQFP-144 footprint as APEX 20KE with richer ESB features (vs EP20K100EFC144-3)
Notas de projeto
Estimated: at 100% utilization across 4,160 logic elements switching simultaneously at 167 MHz, the EP20K100TC144-3 core current can reach 0.4 A on the 2.5 V rail (roughly 1 W). Use a low-impedance 2.5 V LDO or switching regulator and place a 100 µF bulk plus 0.1 µF and 0.01 µF ceramic decoupling network within 5 mm of every VCCINT pin. VCCIO pins per bank require their own decoupling matched to the I/O standard and toggle rate; bank-powered I/O can add another 0.2 to 0.5 W at full LVCMOS-33 drive.
The 144-pin TQFP package has 0.5 mm lead pitch; follow JEDEC IPC-7351 land-pattern guidelines for TQFP-144 to avoid solder bridging. Use a 4-layer PCB with continuous ground and power planes, and route JTAG signals (TDI, TDO, TMS, TCK) with 50 Ω controlled impedance away from clock and switching I/O. Decoupling capacitors should be placed on the same side as the FPGA, between the pin and the nearest via to the power plane, with via count scaled to peak transient current.
Do not assume the bitstream is portable across APEX 20K density or package variants - even pin-compatible parts require recompilation if the die differs (for example EP20K100EFC144-3 vs EP20K100TC144-3). Always confirm that the JTAG chain order, configuration scheme (PS, AS, JTAG), and nCONFIG/nSTATUS pull-up values match the chosen configuration EPC or enhanced device. For multi-rail sequencing, bring up VCCINT first, then VCCIO, then drive nCONFIG high to avoid partial-configuration latch-up.
Estimated: at 1 W total power dissipation and a 144-TQFP theta_JA of approximately 35 °C/W (still air, JEDEC EIA/JESD51-2 4-layer board), junction temperature rise is roughly 35 °C above ambient. Within the 0 to 85 °C commercial range, this provides ~50 °C margin. For sealed enclosures, designers should add a thermal copper pour under the exposed pad area or upgrade to an FBGA package with lower theta_JA for higher-power designs.
Informações de conformidade
RoHS and REACH compliant per distributor listings. AEC-Q100 not applicable (commercial-grade FPGA; not qualified to automotive stress standards). Lead-free reflow-compatible. Halogen-free status not explicitly disclosed in available distributor data.
