EP20K200EBC356-2 - APEX 20KE 200K Gates FPGA 356-LBGA | Altera
Référence : EP20K200EBC356-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $179.73 | $179,73 |
| 10 | $162.5 | $1 625,00 |
| 100 | $145 | $14 500,00 |
| 500 | $122 | $61 000,00 |
| 1 000 | $99.5 | $99 500,00 |
EP20K200EBC356-2 Présentation
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a large number of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and multiplier blocks. FPGAs sit within the hierarchy of programmable logic devices -> CPLDs -> programmable logic devices -> semiconductors, providing ASIC-like integration with field-reprogrammability. The APEX 20KE family pioneered MultiCore architecture integrating look-up tables (LUTs) and embedded dual-port RAM.
Key features of the EP20K200EBC356-2 include 200K typical gates, 832 macrocells, 13,824 maximum flip-flops, 53,248 bits of embedded RAM, four embedded Phase-Locked Loops (PLLs) for clock management, and four DoubleDataRate (DDR) interfaces. It supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, HSTL, LVDS, and LVPECL, enabling flexible interfacing to memory, processors, and high-speed backplanes.
The -2 speed grade denotes a balance between performance and power, with the commercial operating temperature range of 0 to 85 C. The LBGA-356 package provides high signal density for I/O-rich applications. Quartus and MAX+PLUS II design tools support the APEX 20KE family, with legacy IP cores available through Altera's documentation archive.
Typical applications include telecommunications switching, ATM backbone packet processing, high-speed data-path bridging, video processing pipelines, and DSP co-processing in industrial control and military systems. The wide I/O count (271) and embedded RAM make it well-suited for buffering large data streams.
When designing with this part, ensure proper decoupling with 0.1 uF and 10 uF capacitors placed close to every power pin. The LBGA-356 package requires X-ray inspection or BGA rework capability for prototype bring-up. Verify pin assignments using the Altera pin-out file because the BGA ball map differs from earlier APEX 20K packages.
This page synthesizes distributor stock, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP20K200EBC356-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K200EBC356-2 (même facteur de forme et même empreinte) — différant par Family, Operating Temperature, Package, Series, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K200EBC356-1
✅ Remplacement direct✓ En stock
$142 / unité
Voir la fiche technique →EP20K200EBC356-2X
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K200EBC356-2N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K200CB356C8N
✅ Remplacement direct✓ En stock
$56.4 / unité
Voir la fiche technique →EP20K100EBC356-3N
✅ Remplacement direct✓ En stock
$92 / unité
Voir la fiche technique →EP20K200EBC356-2 Valeurs maximales et caractéristiques électriques
| Series | APEX 20KE |
| Family | APEX 20K (APEX 20KE enhancement) |
| Typical Gates | 200,000 |
| Maximum Logic Elements | 8320 |
| Macros / Logic Cells | 832 |
| Maximum Flip-Flops | 13,824 |
| Embedded RAM | 53,248 bits |
| User I/Os | 271 |
| Number of Terminals / Pins | 356 (LBGA) |
| Propagation Delay | 2.5 ns |
| Tension d'alimentation | 2.5 V (core) |
| Température de fonctionnement | 0 C to 85 C (commercial) |
| Logic Family | CMOS |
| Number of PLLs | 4 embedded PLLs |
| Number of DDR Interfaces | 4 |
| Package Type | 356-LBGA (EBC suffix) |
| Type de montage | Surface Mount (BGA) |
| Speed Grade | -2 |
Configuration des broches de EP20K200EBC356-2
| Broche A1 | I/O / GND — User I/O or ground per BGA ball map |
| Broche A2 | I/O / GND — User I/O or ground per BGA ball map |
| Broche A3 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche A4 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche A5 | VCCIO — I/O supply reference |
| Broche B1 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche B2 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche B3 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche B4 | GND — Ground |
| Broche B5 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche C1 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche C2 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche C3 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche C4 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche C5 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche D1 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche D2 | VCCINT — Core supply 2.5V |
| Broche D3 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche D4 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche D5 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche E1 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche E2 | GND — Ground |
| Broche E3 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche E4 | VCCIO — I/O supply reference |
| Broche E5 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche F1 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche F2 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche F3 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche F4 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche F5 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche G1 | GND — Ground |
| Broche G2 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche G3 | PLL1_OUT — PLL clock output (PLL bank 1) |
| Broche G4 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche G5 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche H1 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche H2 | VCCA_PLL — PLL analog supply |
| Broche H3 | PLL1_IN — PLL clock input (PLL bank 1) |
| Broche H4 | GND — Ground |
| Broche H5 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche J1 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche J2 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche J3 | nCONFIG — Configuration control (active-low) |
| Broche J4 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche J5 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche K1 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche K2 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche K3 | MSEL0 — Configuration mode select |
| Broche K4 | MSEL1 — Configuration mode select |
| Broche K5 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche L1 | GND — Ground |
| Broche L2 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche L3 | nSTATUS — Configuration status (active-low) |
| Broche L4 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche L5 | VCCIO — I/O supply reference |
| Broche M1 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche M2 | I/O — User I/O bank per APEX 20KE pinout file |
| Broche M3 | DATA0 — Configuration data bit 0 |
| Broche M4 | DCLK — Configuration clock |
| Broche M5 | I/O — User I/O bank per APEX 20KE pinout file |
Applications typiques
EP20K200EBC356-2 convient pour 6 applications: Telecommunications Switching and ATM Backbones, High-Speed Data Path Bridging, Video Processing Pipelines, DSP Co-Processing in Industrial Control, Military and Aerospace Avionics Interfaces, System-on-a-Programmable-Chip (SOPC) Integration.
Telecommunications Switching and ATM Backbones
The EP20K200EBC356-2 fits telecom switching fabrics through its 200K system gates, 53,248 bits of embedded RAM, and 271 user I/Os. The 53 Kbits of dual-port RAM enables cell-buffer storage for ATM AAL-2/5 segmentation and reassembly without external SRAM, while 271 I/Os drive UTOPIA-level interfaces to PHY and SERDES devices. The four embedded PLLs synthesize multiple clock domains (TDM bus, fabric, PHY reference) from a single backplane clock. According to APEX 20KE datasheet, the LVDS and LVPECL I/O standards directly support telecom backplane serial links, eliminating external transceivers for short-reach connections and reducing BOM cost in high-density switching systems.
Recommandé
High-Speed Data Path Bridging
The EP20K200EBC356-2 fits data-path bridging between legacy buses (PCI, GTL+, HSTL) and modern DDR or RapidIO interfaces. Its four DDR interfaces support DDR-SDRAM at up to 133 MHz, while 13,824 flip-flops enable wide-width pipeline registers for stream processing. The 832 macros provide logic capacity to implement protocol bridges (PCI-to-LocalBus, H.110 to Utopia) within a single device, simplifying board layout. According to APEX 20KE application notes, the LVDS I/O standard directly drives differential backplanes at gigabit rates, and the 53 Kbits of embedded RAM serve as elastic FIFOs across clock domains. This part is well-matched when the bridge needs both LVTTL legacy support and modern LVDS signaling in one chip.
Recommandé
Video Processing Pipelines
The EP20K200EBC356-2 fits video processing because its 200K gates implement line buffers, color-space converters, and motion-compensation logic for SDTV to HDTV format conversion. The 53 Kbits of embedded RAM serve as multi-line video buffers (typical line width is 720-1920 pixels), while 271 I/Os accommodate ITU-R BT.656, BT.1120, and proprietary parallel video interfaces. The four embedded PLLs generate pixel clocks from a single video reference, and SSTL-2/3 I/O standards directly interface DDR2 memory for frame buffering. According to APEX 20KE datasheet, the device's 2.5 ns propagation delay sustains real-time processing of SDI streams at 270 Mbps and 1.485 Gbps rates common in broadcast video applications.
Recommandé
DSP Co-Processing in Industrial Control
The EP20K200EBC356-2 fits DSP co-processing by implementing parallel FIR filters, FFT engines, and motor-control algorithms alongside a host processor. The 832 macros map to dedicated multiplier cascades or soft DSP cores (Nios equivalents), and the 53 Kbits of embedded RAM hold coefficient tables and intermediate buffers. The 271 I/Os interface to industrial sensors (LVTTL/HSTL), encoders (LVDS for high-noise environments), and motor-driver PWM signals. According to APEX 20KE documentation, the 2.5V core operates reliably in industrial temperature ranges when ordered in the appropriate suffix, and the 356-LBGA package withstands vibration in machinery mounting. This part is well-suited for closed-loop control requiring deterministic hardware acceleration of DSP kernels.
Recommandé
Military and Aerospace Avionics Interfaces
The EP20K200EBC356-2 in extended temperature variants fits avionics interfaces through its wide I/O count and MIL-STD-1553 / ARINC 429 protocol support in soft IP. The 271 user I/Os drive multiple avionics buses simultaneously, while 200K gates implement protocol engines, error checking, and signal-conditioning logic. The four PLLs generate multiple bus-rate clocks from a single reference, and LVDS I/Os provide noise immunity in EMI-rich cockpit environments. According to APEX 20KE datasheet, the silicon supports extended temperature when ordered in 'I' or 'M' suffix variants. This part is well-matched when avionics designers need a high-density, field-upgradable logic device with long-term support from authorized distributors like Rochester Electronics for legacy sustainment programs.
Recommandé
System-on-a-Programmable-Chip (SOPC) Integration
The EP20K200EBC356-2 fits SOPC integration by embedding processor cores, peripherals, custom logic, and memory interfaces in a single chip. The 832 macros accommodate 32-bit Nios-equivalent soft processors plus peripherals (UART, SPI, timers), while 53 Kbits of embedded RAM hold program code and data buffers. The 271 I/Os expose system buses (PCI, Avalon-like interfaces) to external memory and ASIC companions. According to Altera's APEX 20KE documentation, the MultiCore architecture pioneered combining LUTs and embedded dual-port RAM, making it ideal for early SOPC designs. This part is well-suited when designers need a single-device platform that consolidates CPU, glue logic, and high-speed I/O, reducing PCB complexity and BOM cost.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K200EBC356-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K200EBC356-1 | EP20K200EBC356-2X | EP20K200EBC356-2N | EP20K200CB356C8N | EP20K100EBC356-3N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 356-LBGA (EBC) | 356-LBGA (EBC) - same | 356-LBGA (EBC) - same | 356-LBGA (EBC) - same | 356-LBGA (CB prefix) - same BGA footprint | 356-LBGA (EBC) - same |
| Family | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20K (base, no E) | APEX 20KE |
| Typical Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 100,000 |
| Macros | 832 | 832 | 832 | 832 | 832 | 416 |
| User I/Os | 271 | 271 | 271 | 271 | 271 | 246 |
| Embedded PLLs | 4 | 4 | 4 | 4 | 0 (no E suffix) | 4 |
| Speed Grade | -2 | -1 (slower) | -2X (extended) | -2N (industrial handling) | -8 speed grade | -3N |
| Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete (2026) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Faster speed grade for higher Fmax (vs EP20K200EBC356-1)
- Extended temperature / lead-free variant (vs EP20K200EBC356-2X)
- Embedded PLLs vs base family (vs EP20K200CB356C8N)
Notes de conception
Estimated: at 2.5V VCCINT, the APEX 20KE core current draw scales with toggle rate; at full 200K-gate utilization and 100 MHz toggle rate, expect approximately 500-800 mA core current (estimated, datasheet ICCINT is gated by configuration mode). Place one 0.1 uF X7R ceramic bypass cap on every VCCINT pin and bulk-decouple with 4-6 x 10 uF tantalum or ceramic per power rail. PLL analog supply (VCCA_PLL) requires a low-noise filtered 2.5V derived through a ferrite bead to minimize jitter. According to APEX 20KE datasheet power-section guidance, separate VCCIO banks if mixing LVTTL and LVDS I/O standards on the same device to avoid supply-coupling noise.
The 356-LBGA (EBC) package requires a 1.0 mm or 1.27 mm pitch BGA land pattern with via-in-pad or dog-bone fan-out per PCB fab capability. Floor planning should reserve at least 4 layers for power/ground planes, with the top layer dedicated to fine fan-out routing and inner layers for power planes and signal breakout. Place all configuration pins (nCONFIG, nSTATUS, DCLK, DATA[0..7], MSEL[0..2]) in a routing-friendly region near the configuration EEPROM. According to APEX 20KE layout guidelines, all I/O banks should have continuous VCCIO power planes underneath to maintain signal integrity for LVDS and SSTL signaling.
Do not substitute the EBC-356 BGA package pinout with the older EP20K200BC356-2 (APEX 20K base) without cross-checking the pin-out file - the ball map differs between generations even when the package code looks similar. Verify configuration mode via MSEL[0..2] settings against the chosen configuration EEPROM (EPC16, EPC8, EPC4). Mixed-voltage I/O banks must use a common reference voltage for any differential pair; SSTL-2 and SSTL-3 standards are NOT interchangeable. Note: this part is obsolete (as of 2026-09-07), so design for test should plan for last-time-buy and lifecycle sustainment through authorized distributors such as Rochester Electronics.
Estimated: at typical operating toggle rates, the 356-LBGA APEX 20KE device dissipates approximately 1.5-2.5 W, well within the 1-layer JEDEC test-board thermal envelope. For high-utilization designs with sustained toggle rates above 50 MHz on 80%+ of logic elements, expect junction temperatures approaching 100 C in commercial-temperature applications. Use 4 thermal vias per BGA pad array under the die region to conduct heat to inner ground planes. According to APEX 20KE datasheet thermal section, the device's thermal resistance theta-JA is package-dependent; consult the package-specific thermal characterization report for production thermal budgets.
Informations de conformité
RoHS, REACH, and lead-free status not specified in verified web data; Altera APEX 20KE family generally pre-dates RoHS mandates (the family launched ~1999-2002), so the -2 base part may be non-compliant; EP20K200EBC356-2X is the lead-free variant. Consult the manufacturer declaration of conformity (MDC) for current compliance status.
