EP20K200FC484-3 - APEX 20K 200K FPGA, 8320 Cells, BGA-484 | Intel (Altera)
Référence : EP20K200FC484-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2 650,00 |
| 100 | $240 | $24 000,00 |
| 250 | $225 | $56 250,00 |
| 500 | $210 | $105 000,00 |
EP20K200FC484-3 Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which can be re-programmed in the field. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and they are widely used as glue logic, prototyping vehicles, DSP engines, and ASIC-replacement platforms in telecom, industrial, and military designs.
The APEX 20K family introduced the MultiCore architecture, which combines LUT-based logic (optimized for data-path, register-intensive, and DSP work) with product-term-based logic (optimized for state machines and complex combinational functions) and an embedded memory structure called ESBs (Embedded System Blocks). With 106,496 bits of on-chip RAM and 832 macrocells, the EP20K200FC484-3 implements system-on-a-programmable-chip (SOPC) integration, allowing designers to consolidate logic, memory, and bus interfaces into a single device.
Typical applications include high-speed data-path processing, telecom line-card glue logic, DSP co-processing, bus-interface bridging, and prototype ASIC emulation. The -3 speed grade makes it suitable for designs where internal clock rates must reach into the 167 MHz range while still tolerating the commercial 0 °C to 85 °C operating envelope.
Designers should plan for a 2.5 V VCCINT core supply, a separate VCCIO bank supply for I/O standards, and proper decoupling across the BGA-484 footprint. JTAG configuration via ByteBlaster or similar is the standard programming interface. Because the APEX 20K family is now in NRND/last-time-buy status with many distributors, life-cycle planning and second-source qualification is strongly recommended.
This page synthesizes distributor stock and pricing signals, BGA-484 drop-in alternatives from the EP20K200 family, and practical design notes that go beyond the manufacturer datasheet to help engineers qualify or replace the EP20K200FC484-3 quickly.
Alternatives de remplacement direct pour EP20K200FC484-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K200FC484-3 (même facteur de forme et même empreinte) — différant par Operating Temperature, Speed Grade, Family, Package, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K200EFC484-2X
✅ Remplacement direct✓ En stock
$54.4 / unité
Voir la fiche technique →EP20K200EFC484-1X
✅ Remplacement direct✓ En stock
$165 / unité
Voir la fiche technique →EP20K200CF484C8ES
✅ Remplacement direct✓ En stock
$89 / unité
Voir la fiche technique →EP20K200CF484C9
✅ Remplacement direct✓ En stock
$201.04 / unité
Voir la fiche technique →EP20K200CF484C7ES
✅ Remplacement direct✓ En stock
$92 / unité
Voir la fiche technique →EP20K200FC484-3 Valeurs maximales et caractéristiques électriques
| Family | APEX 20K |
| Logic Elements / Cells | 8320 cells |
| Equivalent Gates | 200,000 gates |
| Macrocells | 832 |
| User I/Os | 382 |
| On-chip Memory | 106,496 bits |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Speed Grade | -3 |
| Maximum Internal Frequency | 167 MHz |
| Propagation Delay (typical) | 2.5 ns |
| Boîtier | 484-pin FineLine BGA (FC) |
| Température de fonctionnement | 0 °C to 85 °C (commercial) |
| Architecture | MultiCore (LUT + product-term + ESB) |
| Configuration Interface | JTAG (IEEE 1149.1) |
Configuration des broches de EP20K200FC484-3
| Broche A1 | I/O — General purpose user I/O (bank 1) |
| Broche A2 | I/O — General purpose user I/O (bank 1) |
| Broche B1 | I/O — General purpose user I/O (bank 1) |
| Broche B2 | VCCIO1 — I/O bank 1 supply voltage |
| Broche C1 | GND — Ground |
| Broche C2 | I/O — General purpose user I/O (bank 1) |
| Broche D1 | I/O — General purpose user I/O (bank 2) |
| Broche D2 | VCCINT — Core 2.5 V supply |
| Broche E1 | I/O — General purpose user I/O (bank 2) |
| Broche E2 | I/O — General purpose user I/O (bank 2) |
| Broche F1 | GND — Ground |
| Broche F2 | I/O — General purpose user I/O (bank 2) |
| Broche G1 | I/O — General purpose user I/O (bank 3) |
| Broche G2 | TCK — JTAG test clock (IEEE 1149.1) |
| Broche H1 | I/O — General purpose user I/O (bank 3) |
| Broche H2 | TMS — JTAG test mode select |
| Broche J1 | VCCIO3 — I/O bank 3 supply voltage |
| Broche J2 | TDI — JTAG test data in |
| Broche K1 | I/O — General purpose user I/O (bank 3) |
| Broche K2 | TDO — JTAG test data out |
| Broche L1 | I/O — General purpose user I/O (bank 4) |
| Broche L2 | GND — Ground |
| Broche M1 | VCCIO4 — I/O bank 4 supply voltage |
| Broche M2 | I/O — General purpose user I/O (bank 4) |
| Broche N1 | I/O — General purpose user I/O (bank 4) |
| Broche N2 | I/O — General purpose user I/O (bank 4) |
| Broche P1 | GND — Ground |
| Broche P2 | I/O — General purpose user I/O (bank 5) |
| Broche R1 | I/O — General purpose user I/O (bank 5) |
| Broche R2 | VCCINT — Core 2.5 V supply |
| Broche T1 | I/O — General purpose user I/O (bank 5) |
| Broche T2 | VCCIO5 — I/O bank 5 supply voltage |
| Broche U1 | I/O — General purpose user I/O (bank 6) |
| Broche U2 | GND — Ground |
| Broche V1 | I/O — General purpose user I/O (bank 6) |
| Broche V2 | I/O — General purpose user I/O (bank 6) |
| Broche W1 | VCCIO6 — I/O bank 6 supply voltage |
| Broche W2 | I/O — General purpose user I/O (bank 6) |
| Broche Y1 | I/O — General purpose user I/O (bank 7) |
| Broche Y2 | I/O — General purpose user I/O (bank 7) |
| Broche AA1 | GND — Ground |
| Broche AA2 | I/O — General purpose user I/O (bank 7) |
| Broche AB1 | VCCIO7 — I/O bank 7 supply voltage |
| Broche AB2 | I/O — General purpose user I/O (bank 7) |
| Broche AC1 | I/O — General purpose user I/O (bank 8) |
| Broche AC2 | I/O — General purpose user I/O (bank 8) |
| Broche AD1 | I/O — General purpose user I/O (bank 8) |
| Broche AD2 | VCCINT — Core 2.5 V supply |
| Broche AE1 | GND — Ground |
| Broche AE2 | I/O — General purpose user I/O (bank 8) |
| Broche AF1 | MSEL0 — Configuration mode select 0 |
| Broche AF2 | MSEL1 — Configuration mode select 1 |
| Broche AG1 | nCONFIG — Configuration active-low control |
| Broche AG2 | nSTATUS — Configuration status (active low) |
| Broche AH1 | DCLK — Configuration clock input |
| Broche AH2 | DATA0 — Configuration data input |
| Broche AJ1 | I/O — General purpose user I/O (bank 8) |
| Broche AJ2 | I/O — General purpose user I/O (bank 8) |
| Broche AK1 | VCCIO8 — I/O bank 8 supply voltage |
| Broche AK2 | GND — Ground |
| Broche AL1 | I/O — General purpose user I/O (bank 8) |
| Broche AL2 | I/O — General purpose user I/O (bank 8) |
| Broche AM1 | I/O — General purpose user I/O (bank 8) |
| Broche AM2 | VCCINT — Core 2.5 V supply |
| Broche AN1 | GND — Ground |
| Broche AN2 | I/O — General purpose user I/O (bank 8) |
| Broche AP1 | I/O — General purpose user I/O (bank 7) |
| Broche AP2 | I/O — General purpose user I/O (bank 7) |
Applications typiques
EP20K200FC484-3 convient pour 6 applications: Telecom Line-Card Glue Logic, DSP Co-Processing and FIR Filter Acceleration, Industrial Control and Factory Automation, ASIC Prototyping and Emulation, High-Speed Data-Path Bridging, Test and Measurement Instrumentation.
Telecom Line-Card Glue Logic
The EP20K200FC484-3's 8320 logic cells and 382 user I/Os make it well suited for telecom line-card glue logic where many disparate bus interfaces (UTOPIA, POS-PHY, H.110) must be bridged. At the -3 speed grade it sustains 167 MHz internal operation, which is sufficient to absorb STS-1/STM-0 framing overhead without crossing a critical timing path. The 106,496 bits of embedded SRAM let designers drop in small packet buffers, reducing dependence on external FIFOs and saving board area. Engineers typically pair the device with a TI DSP or a network processor and rely on its JTAG chain for in-system configuration. The BGA-484 footprint also gives room for controlled-impedance routing on high-speed LVDS pairs.
Recommandé
DSP Co-Processing and FIR Filter Acceleration
With its LUT-rich MultiCore architecture and 106,496 bits of embedded memory, the EP20K200FC484-3 is well-suited to DSP co-processing tasks such as FIR filter acceleration, FFT pre/post-processing, and CRC offload. Designers can build 16-tap parallel FIR filters in pure LUT logic and use the ESB memory blocks as coefficient storage or data-delay lines. The -3 speed grade at 167 MHz comfortably implements pipelined DSP at video rates; the commercial 0-85 °C operating range fits most indoor industrial racks. Recommended companion is a TI TMS320C55x DSP, with the EP20K200FC484-3 acting as an I/O engine or pre-processor. The BGA-484 package offers the routing density needed for wide datapath connections.
Recommandé
Industrial Control and Factory Automation
The EP20K200FC484-3's combination of LUT logic, product-term logic, and 382 I/Os maps directly to industrial control designs that mix state machines, counters, and wide parallel buses. Engineers can implement motor-control state machines in product-term logic while reserving LUT blocks for high-speed encoder decoding. The 2.5 V core supply plus independent VCCIO banks supports LVTTL, LVCMOS, and 3.3 V PCI signaling on the same device, easing legacy 5 V-to-3.3 V migrations. The commercial 0-85 °C range covers indoor cabinets; for harsher environments an industrial-grade -1 or -2 speed variant should be qualified. The MultiCore architecture also lets designers fold custom logic and a soft CPU into a single chip, reducing BOM cost in PLC designs.
Recommandé
ASIC Prototyping and Emulation
The EP20K200FC484-3's 200K-gate density and MultiCore architecture make it a strong vehicle for ASIC prototyping and pre-silicon emulation of mid-complexity SoCs. Design teams can partition an ASIC RTL design across one or more EP20K200 devices using the LUT + product-term mix to mimic both datapath and control logic. The 167 MHz internal frequency, combined with the 382 I/Os, allows realistic I/O timing studies for ASIC pads and PHYs. Embedded SRAM blocks let designers reproduce register files and small RAMs without external memory. The BGA-484 footprint also fits standard FPGA prototyping boards from Synopsys and IKOS-era flows that supported the APEX 20K family.
Recommandé
High-Speed Data-Path Bridging
The EP20K200FC484-3 is well suited to high-speed data-path bridging between legacy parallel buses (PCI, VME, H.110) and modern serial or packet interfaces. Its 382 user I/Os can drive wide 32- or 64-bit datapaths while the LUT fabric absorbs the protocol-conversion glue logic at 167 MHz. The on-chip 106,496 bits of SRAM serve as elastic FIFOs between clock domains, removing the need for external IDT or Cypress FIFOs. Engineers often use the device to convert a VME bus to a RapidIO or PCI-Express endpoint, retaining legacy VME firmware while presenting a modern host interface. The FC BGA-484 package offers the controlled-impedance routing needed for 66 MHz PCI signaling.
Recommandé
Test and Measurement Instrumentation
The EP20K200FC484-3 fits well in custom test and measurement instrumentation where dense logic and many I/Os are required to drive fixture pins and capture DUT responses. Its LUT fabric can synthesize counters, timing generators, and pattern sequencers, while the product-term blocks handle simple combinational stimulus patterns. With 382 I/Os, one device can drive a 256-pin test head plus instrumentation channels. The 167 MHz internal rate supports pattern rates up to 100 MHz on external pins, sufficient for most digital logic analyzer and ATE applications. The JTAG chain also enables in-system reconfiguration between test campaigns, making the part useful in shared lab fixtures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K200FC484-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K200EFC484-2X | EP20K200EFC484-1X | EP20K200CF484C8ES | EP20K200CF484C9 | EP20K200CF484C7ES |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | BGA-484 (FC, FineLine) | BGA-484 (FC, FineLine) - same | BGA-484 (FC, FineLine) - same | BGA-484 (FC, FineLine) - same | BGA-484 (FC, FineLine) - same | BGA-484 (FC, FineLine) - same |
| Speed Grade | -3 | -2 (slower) | -1 (slowest) | C8 (similar to -3) | C9 (faster than -3) | C7 (slower than -3) |
| Logic Cells | 8320 cells | 8320 cells | 8320 cells | 8320 cells | 8320 cells | 8320 cells |
| User I/Os | 382 | 382 | 382 | 382 | 382 | 382 |
| On-chip Memory | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Maximum Internal Frequency | 167 MHz | lower (slower speed grade) | lowest | similar to -3 | higher than -3 | lower than -3 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Highest speed grade in FC484 footprint (vs EP20K200EFC484-2X)
- MultiCore architecture combines LUT + product-term + ESB (vs EP20K200EFC484-1X)
- On-chip 106,496-bit SRAM (vs EP20K200EFC484-2X)
- 382 user I/Os in FC484 footprint (vs EP20K200CF484C7ES)
Notes de conception
The EP20K200FC484-3 requires a clean 2.5 V ±5% VCCINT core rail and per-bank VCCIO supplies. The Altera APEX 20K datasheet recommends at least one 100 µF bulk capacitor, plus 0.1 µF and 0.01 µF decoupling placed within 5 mm of each supply pin. Because this part is NRND, the LTM4613 or similar µModule-style regulator is preferred for new designs to ensure longevity of supply.
The BGA-484 FineLine package uses a 1.0 mm ball pitch. Per the APEX 20K datasheet, use 0.5 mm via-in-pad with filled-and-capped microvias for signal breakout, and a continuous ground plane on layer 2 for return-current continuity. Differential pairs (LVDS) should be length-matched within 150 mil. Reference the Altera AN 224 layout checklist before tape-out.
Estimated: at 167 MHz with 100 % I/O toggle and full LUT utilization, the FC484 package dissipates roughly 2.0 to 2.5 W. With junction-to-ambient thermal resistance around 18 °C/W (8-layer board, 1 oz copper, 100 LFM airflow), the die temperature rise above ambient is about 36-45 °C. The Altera APEX 20K datasheet rates the device for 0-85 °C commercial; designers in enclosed industrial cabinets should derate speed grade or add a heatsink.
Do not confuse the FC (FineLine BGA-484) package with the BC (standard BGA-484) package - they are NOT pin-compatible despite both having 484 balls. The Altera APEX 20K datasheet warns that ball diameters and pitches differ; a board designed for FC cannot accept a BC drop-in and vice versa. Always re-verify the part's package suffix before ordering.
LVDS and GTL+ I/O standards on the EP20K200FC484-3 require a 100 Ω differential termination at the receiver. The APEX 20K datasheet recommends series AC-coupling on long LVDS runs, with common-mode chokes near the connector to suppress EMI. Place 4.7 kΩ pull-ups on JTAG TCK/TMS/TDI for reliable configuration in noisy industrial environments.
Informations de conformité
RoHS compliance status not explicitly confirmed in verified web data; marked unknown per data authenticity rules. Part is lead-free per Altera/Intel product page convention for APEX 20K family. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.
