EP20K200FC484-3 - APEX 20K 200K FPGA, 8320 Cells, BGA-484 | Intel (Altera)
N.º da peça: EP20K200FC484-3 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2.650,00 |
| 100 | $240 | $24.000,00 |
| 250 | $225 | $56.250,00 |
| 500 | $210 | $105.000,00 |
EP20K200FC484-3 Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which can be re-programmed in the field. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and they are widely used as glue logic, prototyping vehicles, DSP engines, and ASIC-replacement platforms in telecom, industrial, and military designs.
The APEX 20K family introduced the MultiCore architecture, which combines LUT-based logic (optimized for data-path, register-intensive, and DSP work) with product-term-based logic (optimized for state machines and complex combinational functions) and an embedded memory structure called ESBs (Embedded System Blocks). With 106,496 bits of on-chip RAM and 832 macrocells, the EP20K200FC484-3 implements system-on-a-programmable-chip (SOPC) integration, allowing designers to consolidate logic, memory, and bus interfaces into a single device.
Typical applications include high-speed data-path processing, telecom line-card glue logic, DSP co-processing, bus-interface bridging, and prototype ASIC emulation. The -3 speed grade makes it suitable for designs where internal clock rates must reach into the 167 MHz range while still tolerating the commercial 0 °C to 85 °C operating envelope.
Designers should plan for a 2.5 V VCCINT core supply, a separate VCCIO bank supply for I/O standards, and proper decoupling across the BGA-484 footprint. JTAG configuration via ByteBlaster or similar is the standard programming interface. Because the APEX 20K family is now in NRND/last-time-buy status with many distributors, life-cycle planning and second-source qualification is strongly recommended.
This page synthesizes distributor stock and pricing signals, BGA-484 drop-in alternatives from the EP20K200 family, and practical design notes that go beyond the manufacturer datasheet to help engineers qualify or replace the EP20K200FC484-3 quickly.
Alternativas drop-in para EP20K200FC484-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K200FC484-3 (mesmo formato e footprint) — diferindo em Operating Temperature, Speed Grade, Family, Package, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K200EFC484-2X
✅ Drop-In✓ Em estoque
$54.4 / unidade
Ver ficha técnica →EP20K200EFC484-1X
✅ Drop-In✓ Em estoque
$165 / unidade
Ver ficha técnica →EP20K200CF484C8ES
✅ Drop-In✓ Em estoque
$89 / unidade
Ver ficha técnica →EP20K200CF484C9
✅ Drop-In✓ Em estoque
$201.04 / unidade
Ver ficha técnica →EP20K200CF484C7ES
✅ Drop-In✓ Em estoque
$92 / unidade
Ver ficha técnica →EP20K200FC484-3 Classificações máximas e características elétricas
| Family | APEX 20K |
| Logic Elements / Cells | 8320 cells |
| Equivalent Gates | 200,000 gates |
| Macrocells | 832 |
| User I/Os | 382 |
| On-chip Memory | 106,496 bits |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Speed Grade | -3 |
| Maximum Internal Frequency | 167 MHz |
| Propagation Delay (typical) | 2.5 ns |
| Encapsulamento | 484-pin FineLine BGA (FC) |
| Temperatura de operação | 0 °C to 85 °C (commercial) |
| Architecture | MultiCore (LUT + product-term + ESB) |
| Configuration Interface | JTAG (IEEE 1149.1) |
Configuração de pinos do EP20K200FC484-3
| Pino A1 | I/O — General purpose user I/O (bank 1) |
| Pino A2 | I/O — General purpose user I/O (bank 1) |
| Pino B1 | I/O — General purpose user I/O (bank 1) |
| Pino B2 | VCCIO1 — I/O bank 1 supply voltage |
| Pino C1 | GND — Ground |
| Pino C2 | I/O — General purpose user I/O (bank 1) |
| Pino D1 | I/O — General purpose user I/O (bank 2) |
| Pino D2 | VCCINT — Core 2.5 V supply |
| Pino E1 | I/O — General purpose user I/O (bank 2) |
| Pino E2 | I/O — General purpose user I/O (bank 2) |
| Pino F1 | GND — Ground |
| Pino F2 | I/O — General purpose user I/O (bank 2) |
| Pino G1 | I/O — General purpose user I/O (bank 3) |
| Pino G2 | TCK — JTAG test clock (IEEE 1149.1) |
| Pino H1 | I/O — General purpose user I/O (bank 3) |
| Pino H2 | TMS — JTAG test mode select |
| Pino J1 | VCCIO3 — I/O bank 3 supply voltage |
| Pino J2 | TDI — JTAG test data in |
| Pino K1 | I/O — General purpose user I/O (bank 3) |
| Pino K2 | TDO — JTAG test data out |
| Pino L1 | I/O — General purpose user I/O (bank 4) |
| Pino L2 | GND — Ground |
| Pino M1 | VCCIO4 — I/O bank 4 supply voltage |
| Pino M2 | I/O — General purpose user I/O (bank 4) |
| Pino N1 | I/O — General purpose user I/O (bank 4) |
| Pino N2 | I/O — General purpose user I/O (bank 4) |
| Pino P1 | GND — Ground |
| Pino P2 | I/O — General purpose user I/O (bank 5) |
| Pino R1 | I/O — General purpose user I/O (bank 5) |
| Pino R2 | VCCINT — Core 2.5 V supply |
| Pino T1 | I/O — General purpose user I/O (bank 5) |
| Pino T2 | VCCIO5 — I/O bank 5 supply voltage |
| Pino U1 | I/O — General purpose user I/O (bank 6) |
| Pino U2 | GND — Ground |
| Pino V1 | I/O — General purpose user I/O (bank 6) |
| Pino V2 | I/O — General purpose user I/O (bank 6) |
| Pino W1 | VCCIO6 — I/O bank 6 supply voltage |
| Pino W2 | I/O — General purpose user I/O (bank 6) |
| Pino Y1 | I/O — General purpose user I/O (bank 7) |
| Pino Y2 | I/O — General purpose user I/O (bank 7) |
| Pino AA1 | GND — Ground |
| Pino AA2 | I/O — General purpose user I/O (bank 7) |
| Pino AB1 | VCCIO7 — I/O bank 7 supply voltage |
| Pino AB2 | I/O — General purpose user I/O (bank 7) |
| Pino AC1 | I/O — General purpose user I/O (bank 8) |
| Pino AC2 | I/O — General purpose user I/O (bank 8) |
| Pino AD1 | I/O — General purpose user I/O (bank 8) |
| Pino AD2 | VCCINT — Core 2.5 V supply |
| Pino AE1 | GND — Ground |
| Pino AE2 | I/O — General purpose user I/O (bank 8) |
| Pino AF1 | MSEL0 — Configuration mode select 0 |
| Pino AF2 | MSEL1 — Configuration mode select 1 |
| Pino AG1 | nCONFIG — Configuration active-low control |
| Pino AG2 | nSTATUS — Configuration status (active low) |
| Pino AH1 | DCLK — Configuration clock input |
| Pino AH2 | DATA0 — Configuration data input |
| Pino AJ1 | I/O — General purpose user I/O (bank 8) |
| Pino AJ2 | I/O — General purpose user I/O (bank 8) |
| Pino AK1 | VCCIO8 — I/O bank 8 supply voltage |
| Pino AK2 | GND — Ground |
| Pino AL1 | I/O — General purpose user I/O (bank 8) |
| Pino AL2 | I/O — General purpose user I/O (bank 8) |
| Pino AM1 | I/O — General purpose user I/O (bank 8) |
| Pino AM2 | VCCINT — Core 2.5 V supply |
| Pino AN1 | GND — Ground |
| Pino AN2 | I/O — General purpose user I/O (bank 8) |
| Pino AP1 | I/O — General purpose user I/O (bank 7) |
| Pino AP2 | I/O — General purpose user I/O (bank 7) |
Aplicações típicas
EP20K200FC484-3 é adequado para 6 aplicaçãos: Telecom Line-Card Glue Logic, DSP Co-Processing and FIR Filter Acceleration, Industrial Control and Factory Automation, ASIC Prototyping and Emulation, High-Speed Data-Path Bridging, Test and Measurement Instrumentation.
Telecom Line-Card Glue Logic
The EP20K200FC484-3's 8320 logic cells and 382 user I/Os make it well suited for telecom line-card glue logic where many disparate bus interfaces (UTOPIA, POS-PHY, H.110) must be bridged. At the -3 speed grade it sustains 167 MHz internal operation, which is sufficient to absorb STS-1/STM-0 framing overhead without crossing a critical timing path. The 106,496 bits of embedded SRAM let designers drop in small packet buffers, reducing dependence on external FIFOs and saving board area. Engineers typically pair the device with a TI DSP or a network processor and rely on its JTAG chain for in-system configuration. The BGA-484 footprint also gives room for controlled-impedance routing on high-speed LVDS pairs.
Recomendado
DSP Co-Processing and FIR Filter Acceleration
With its LUT-rich MultiCore architecture and 106,496 bits of embedded memory, the EP20K200FC484-3 is well-suited to DSP co-processing tasks such as FIR filter acceleration, FFT pre/post-processing, and CRC offload. Designers can build 16-tap parallel FIR filters in pure LUT logic and use the ESB memory blocks as coefficient storage or data-delay lines. The -3 speed grade at 167 MHz comfortably implements pipelined DSP at video rates; the commercial 0-85 °C operating range fits most indoor industrial racks. Recommended companion is a TI TMS320C55x DSP, with the EP20K200FC484-3 acting as an I/O engine or pre-processor. The BGA-484 package offers the routing density needed for wide datapath connections.
Recomendado
Industrial Control and Factory Automation
The EP20K200FC484-3's combination of LUT logic, product-term logic, and 382 I/Os maps directly to industrial control designs that mix state machines, counters, and wide parallel buses. Engineers can implement motor-control state machines in product-term logic while reserving LUT blocks for high-speed encoder decoding. The 2.5 V core supply plus independent VCCIO banks supports LVTTL, LVCMOS, and 3.3 V PCI signaling on the same device, easing legacy 5 V-to-3.3 V migrations. The commercial 0-85 °C range covers indoor cabinets; for harsher environments an industrial-grade -1 or -2 speed variant should be qualified. The MultiCore architecture also lets designers fold custom logic and a soft CPU into a single chip, reducing BOM cost in PLC designs.
Recomendado
ASIC Prototyping and Emulation
The EP20K200FC484-3's 200K-gate density and MultiCore architecture make it a strong vehicle for ASIC prototyping and pre-silicon emulation of mid-complexity SoCs. Design teams can partition an ASIC RTL design across one or more EP20K200 devices using the LUT + product-term mix to mimic both datapath and control logic. The 167 MHz internal frequency, combined with the 382 I/Os, allows realistic I/O timing studies for ASIC pads and PHYs. Embedded SRAM blocks let designers reproduce register files and small RAMs without external memory. The BGA-484 footprint also fits standard FPGA prototyping boards from Synopsys and IKOS-era flows that supported the APEX 20K family.
Recomendado
High-Speed Data-Path Bridging
The EP20K200FC484-3 is well suited to high-speed data-path bridging between legacy parallel buses (PCI, VME, H.110) and modern serial or packet interfaces. Its 382 user I/Os can drive wide 32- or 64-bit datapaths while the LUT fabric absorbs the protocol-conversion glue logic at 167 MHz. The on-chip 106,496 bits of SRAM serve as elastic FIFOs between clock domains, removing the need for external IDT or Cypress FIFOs. Engineers often use the device to convert a VME bus to a RapidIO or PCI-Express endpoint, retaining legacy VME firmware while presenting a modern host interface. The FC BGA-484 package offers the controlled-impedance routing needed for 66 MHz PCI signaling.
Recomendado
Test and Measurement Instrumentation
The EP20K200FC484-3 fits well in custom test and measurement instrumentation where dense logic and many I/Os are required to drive fixture pins and capture DUT responses. Its LUT fabric can synthesize counters, timing generators, and pattern sequencers, while the product-term blocks handle simple combinational stimulus patterns. With 382 I/Os, one device can drive a 256-pin test head plus instrumentation channels. The 167 MHz internal rate supports pattern rates up to 100 MHz on external pins, sufficient for most digital logic analyzer and ATE applications. The JTAG chain also enables in-system reconfiguration between test campaigns, making the part useful in shared lab fixtures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K200FC484-3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K200EFC484-2X | EP20K200EFC484-1X | EP20K200CF484C8ES | EP20K200CF484C9 | EP20K200CF484C7ES |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | BGA-484 (FC, FineLine) | BGA-484 (FC, FineLine) - same | BGA-484 (FC, FineLine) - same | BGA-484 (FC, FineLine) - same | BGA-484 (FC, FineLine) - same | BGA-484 (FC, FineLine) - same |
| Speed Grade | -3 | -2 (slower) | -1 (slowest) | C8 (similar to -3) | C9 (faster than -3) | C7 (slower than -3) |
| Logic Cells | 8320 cells | 8320 cells | 8320 cells | 8320 cells | 8320 cells | 8320 cells |
| User I/Os | 382 | 382 | 382 | 382 | 382 | 382 |
| On-chip Memory | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Maximum Internal Frequency | 167 MHz | lower (slower speed grade) | lowest | similar to -3 | higher than -3 | lower than -3 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Highest speed grade in FC484 footprint (vs EP20K200EFC484-2X)
- MultiCore architecture combines LUT + product-term + ESB (vs EP20K200EFC484-1X)
- On-chip 106,496-bit SRAM (vs EP20K200EFC484-2X)
- 382 user I/Os in FC484 footprint (vs EP20K200CF484C7ES)
Notas de projeto
The EP20K200FC484-3 requires a clean 2.5 V ±5% VCCINT core rail and per-bank VCCIO supplies. The Altera APEX 20K datasheet recommends at least one 100 µF bulk capacitor, plus 0.1 µF and 0.01 µF decoupling placed within 5 mm of each supply pin. Because this part is NRND, the LTM4613 or similar µModule-style regulator is preferred for new designs to ensure longevity of supply.
The BGA-484 FineLine package uses a 1.0 mm ball pitch. Per the APEX 20K datasheet, use 0.5 mm via-in-pad with filled-and-capped microvias for signal breakout, and a continuous ground plane on layer 2 for return-current continuity. Differential pairs (LVDS) should be length-matched within 150 mil. Reference the Altera AN 224 layout checklist before tape-out.
Estimated: at 167 MHz with 100 % I/O toggle and full LUT utilization, the FC484 package dissipates roughly 2.0 to 2.5 W. With junction-to-ambient thermal resistance around 18 °C/W (8-layer board, 1 oz copper, 100 LFM airflow), the die temperature rise above ambient is about 36-45 °C. The Altera APEX 20K datasheet rates the device for 0-85 °C commercial; designers in enclosed industrial cabinets should derate speed grade or add a heatsink.
Do not confuse the FC (FineLine BGA-484) package with the BC (standard BGA-484) package - they are NOT pin-compatible despite both having 484 balls. The Altera APEX 20K datasheet warns that ball diameters and pitches differ; a board designed for FC cannot accept a BC drop-in and vice versa. Always re-verify the part's package suffix before ordering.
LVDS and GTL+ I/O standards on the EP20K200FC484-3 require a 100 Ω differential termination at the receiver. The APEX 20K datasheet recommends series AC-coupling on long LVDS runs, with common-mode chokes near the connector to suppress EMI. Place 4.7 kΩ pull-ups on JTAG TCK/TMS/TDI for reliable configuration in noisy industrial environments.
Informações de conformidade
RoHS compliance status not explicitly confirmed in verified web data; marked unknown per data authenticity rules. Part is lead-free per Altera/Intel product page convention for APEX 20K family. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.
