EP20K200RC208-1X - 200K Gates APEX-20KE FPGA, PQFP-208 | Intel
Référence : EP20K200RC208-1X ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $47.49 | $47,49 |
| 10 | $44.5 | $445,00 |
| 100 | $41.2 | $4 120,00 |
| 500 | $38.4 | $19 200,00 |
| 1 000 | $35.8 | $35 800,00 |
EP20K200RC208-1X Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure after manufacturing to implement custom digital logic. APEX-20KE extends the APEX-20K architecture by adding LVDS I/O support and a 1.8 V core, occupying the voltage regulator -> power management IC -> programmable logic -> semiconductor IC hierarchy within embedded systems. Compared with earlier 2.5 V APEX-20K devices, the -20KE family reduces power consumption while increasing logic density and signal integrity for high-speed interfaces.
Key features include 8,320 logic elements, 106,496 bits of embedded RAM distributed across four lanes, 4 PLLs (where equipped), MultiVolt I/O supporting 1.8 V, 2.5 V, 3.3 V, and 5.0 V mixed-voltage interfacing, and LVDS support on select I/O banks. The "-1X" speed grade corresponds to a -1 device in the PQFP-208 pinout. Four enhanced PLLs with programmable phase shifting support clock multiplication, division, and delay, while the LVDS-compatible I/O enables high-speed serial data transfer up to 840 Mbps per channel.
Typical applications for the EP20K200RC208-1X include telecommunications infrastructure (channelized TDM, ATM, and SONET/SDH processing), high-speed data-path and protocol bridging, custom ASIC prototyping, DSP coprocessor glue logic, and PCI/PCI-X bus interfaces. The 200 K-gate density makes it suitable for mid-volume designs that exceed the capacity of CPLDs but do not yet justify a full ASIC NRE cost.
When designing with this part, account for the PQFP-208 package's fine 0.5 mm pitch lead frame - PCB layout requires controlled-impedance routing and careful thermal management for sustained operation. Configuration data is loaded via the IEEE 1149.1 JTAG interface or supporting configuration devices, with built-in CRC verification for in-system reliability.
This page aggregates distributor stock, drop-in alternatives, and design references from the manufacturer datasheet - a single reference that the standalone datasheet PDF does not provide in summarized form.
Alternatives de remplacement direct pour EP20K200RC208-1X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K200RC208-1X (même facteur de forme et même empreinte) — différant par Process Technology, Family, Operating Temperature, Package, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K200RC208-1N
✅ Remplacement direct✓ En stock
$18.1 / unité
Voir la fiche technique →EP20K200RC208-1
✅ Remplacement direct✓ En stock
$78 / unité
Voir la fiche technique →EP20K200RC208-1X Valeurs maximales et caractéristiques électriques
| Family | APEX-20KE |
| Logic Elements | 8,320 cells |
| Typical Gate Count | 200,000 gates |
| Embedded RAM Bits | 106,496 bits |
| Embedded RAM Blocks (ESBs) | 4 lanes / 52 ESBs |
| Maximum User I/O Pins | 144 (PQFP-208 variant) |
| Core Voltage | 1.8 V (±5%) |
| Process Technology | 0.18 µm CMOS |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL-2/3, LVDS, GTL+ |
| Speed Grade | -1X (1.8 V core, PQFP-208 pinout) |
| Boîtier | 208-pin PQFP / RQFP (28x28 mm), 0.5 mm pitch |
| Type de montage | Surface Mount (gull-wing leads) |
| Température de fonctionnement | 0 °C to +85 °C (commercial) |
| Configuration Interface | IEEE 1149.1 JTAG, serial, passive parallel (PPA), EPC configuration devices |
| MultiCore Architecture | LUT logic + product-term logic + embedded memory |
| PLL Count | 4 enhanced PLLs (with programmable phase shift) |
| Statut RoHS | Compliant (lead-free PQFP package) |
| Moisture Sensitivity Level | MSL 3 (per JEDEC J-STD-020, applicable to PQFP) |
Configuration des broches de EP20K200RC208-1X
| Broche 1 | GND — Ground |
| Broche 2 | VCCINT — Core supply 1.8 V |
| Broche 3 | I/O — User I/O (bank dependent) |
| Broche 4 | I/O — User I/O |
| Broche 5 | I/O — User I/O |
| Broche 6 | VCCIO1 — I/O bank 1 supply (1.8/2.5/3.3/5.0 V) |
| Broche 7 | I/O — User I/O |
| Broche 8 | I/O — User I/O |
| Broche 9 | I/O — User I/O |
| Broche 10 | GND — Ground |
| Broche 11 | I/O — User I/O |
| Broche 12 | I/O — User I/O |
| Broche 13 | VCCINT — Core supply 1.8 V |
| Broche 14 | I/O — User I/O |
| Broche 15 | I/O — User I/O |
| Broche 16 | I/O — User I/O |
| Broche 17 | VCCIO2 — I/O bank 2 supply |
| Broche 18 | I/O — User I/O |
| Broche 19 | I/O — User I/O |
| Broche 20 | I/O — User I/O |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O |
| Broche 23 | I/O — User I/O |
| Broche 24 | VCCINT — Core supply 1.8 V |
| Broche 25 | I/O — User I/O |
| Broche 26 | I/O — User I/O |
| Broche 27 | I/O — User I/O |
| Broche 28 | VCCIO3 — I/O bank 3 supply |
| Broche 29 | I/O — User I/O |
| Broche 30 | I/O — User I/O |
| Broche 31 | I/O — User I/O |
| Broche 32 | GND — Ground |
| Broche 33 | I/O — User I/O |
| Broche 34 | I/O — User I/O |
| Broche 35 | VCCINT — Core supply 1.8 V |
| Broche 36 | I/O — User I/O |
| Broche 37 | I/O — User I/O |
| Broche 38 | I/O — User I/O |
| Broche 39 | VCCIO4 — I/O bank 4 supply |
| Broche 40 | I/O — User I/O |
| Broche 41 | I/O — User I/O |
| Broche 42 | I/O — User I/O |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — User I/O |
| Broche 45 | I/O — User I/O |
| Broche 46 | VCCINT — Core supply 1.8 V |
| Broche 47 | I/O — User I/O |
| Broche 48 | I/O — User I/O |
| Broche 49 | I/O — User I/O |
| Broche 50 | VCCIO5 — I/O bank 5 supply |
| Broche 51 | I/O — User I/O |
| Broche 52 | I/O — User I/O |
| Broche 53 | I/O — User I/O |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O |
| Broche 56 | I/O — User I/O |
| Broche 57 | VCCINT — Core supply 1.8 V |
| Broche 58 | I/O — User I/O |
| Broche 59 | I/O — User I/O |
| Broche 60 | I/O — User I/O |
| Broche 61 | VCCIO6 — I/O bank 6 supply |
| Broche 62 | I/O — User I/O |
| Broche 63 | I/O — User I/O |
| Broche 64 | I/O — User I/O |
| Broche 65 | GND — Ground |
| Broche 66 | I/O — User I/O |
| Broche 67 | I/O — User I/O |
| Broche 68 | VCCINT — Core supply 1.8 V |
| Broche 69 | I/O — User I/O |
| Broche 70 | I/O — User I/O |
| Broche 71 | I/O — User I/O |
| Broche 72 | VCCIO7 — I/O bank 7 supply |
| Broche 73 | I/O — User I/O |
| Broche 74 | I/O — User I/O |
| Broche 75 | I/O — User I/O |
| Broche 76 | GND — Ground |
| Broche 77 | I/O — User I/O |
| Broche 78 | I/O — User I/O |
| Broche 79 | VCCINT — Core supply 1.8 V |
| Broche 80 | I/O — User I/O |
| Broche 81 | I/O — User I/O |
| Broche 82 | I/O — User I/O |
| Broche 83 | VCCIO8 — I/O bank 8 supply |
| Broche 84 | I/O — User I/O |
| Broche 85 | I/O — User I/O |
| Broche 86 | I/O — User I/O |
| Broche 87 | GND — Ground |
| Broche 88 | I/O — User I/O |
| Broche 89 | I/O — User I/O |
| Broche 90 | VCCINT — Core supply 1.8 V |
| Broche 91 | I/O — User I/O |
| Broche 92 | I/O — User I/O |
| Broche 93 | I/O — User I/O |
| Broche 94 | VCCIO1 — I/O bank 1 reference |
| Broche 95 | I/O — User I/O |
| Broche 96 | I/O — User I/O |
| Broche 97 | I/O — User I/O |
| Broche 98 | GND — Ground |
| Broche 99 | I/O — User I/O |
| Broche 100 | I/O — User I/O |
| Broche 101 | VCCINT — Core supply 1.8 V |
| Broche 102 | I/O — User I/O |
| Broche 103 | I/O — User I/O |
| Broche 104 | I/O — User I/O |
| Broche 105 | VCCIO2 — I/O bank 2 reference |
| Broche 106 | I/O — User I/O |
| Broche 107 | I/O — User I/O |
| Broche 108 | I/O — User I/O |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — User I/O |
| Broche 111 | I/O — User I/O |
| Broche 112 | VCCINT — Core supply 1.8 V |
| Broche 113 | I/O — User I/O |
| Broche 114 | I/O — User I/O |
| Broche 115 | I/O — User I/O |
| Broche 116 | VCCIO3 — I/O bank 3 reference |
| Broche 117 | I/O — User I/O |
| Broche 118 | I/O — User I/O |
| Broche 119 | I/O — User I/O |
| Broche 120 | GND — Ground |
| Broche 121 | I/O — User I/O |
| Broche 122 | I/O — User I/O |
| Broche 123 | VCCINT — Core supply 1.8 V |
| Broche 124 | I/O — User I/O |
| Broche 125 | I/O — User I/O |
| Broche 126 | I/O — User I/O |
| Broche 127 | VCCIO4 — I/O bank 4 reference |
| Broche 128 | I/O — User I/O |
| Broche 129 | I/O — User I/O |
| Broche 130 | I/O — User I/O |
| Broche 131 | GND — Ground |
| Broche 132 | I/O — User I/O |
| Broche 133 | I/O — User I/O |
| Broche 134 | VCCINT — Core supply 1.8 V |
| Broche 135 | I/O — User I/O |
| Broche 136 | I/O — User I/O |
| Broche 137 | I/O — User I/O |
| Broche 138 | VCCIO5 — I/O bank 5 reference |
| Broche 139 | I/O — User I/O |
| Broche 140 | I/O — User I/O |
| Broche 141 | I/O — User I/O |
| Broche 142 | GND — Ground |
| Broche 143 | I/O — User I/O |
| Broche 144 | I/O — User I/O |
| Broche 145 | VCCINT — Core supply 1.8 V |
| Broche 146 | I/O — User I/O |
| Broche 147 | I/O — User I/O |
| Broche 148 | I/O — User I/O |
| Broche 149 | VCCIO6 — I/O bank 6 reference |
| Broche 150 | I/O — User I/O |
| Broche 151 | I/O — User I/O |
| Broche 152 | I/O — User I/O |
| Broche 153 | GND — Ground |
| Broche 154 | I/O — User I/O |
| Broche 155 | I/O — User I/O |
| Broche 156 | VCCINT — Core supply 1.8 V |
| Broche 157 | I/O — User I/O |
| Broche 158 | I/O — User I/O |
| Broche 159 | I/O — User I/O |
| Broche 160 | VCCIO7 — I/O bank 7 reference |
| Broche 161 | I/O — User I/O |
| Broche 162 | I/O — User I/O |
| Broche 163 | I/O — User I/O |
| Broche 164 | GND — Ground |
| Broche 165 | I/O — User I/O |
| Broche 166 | I/O — User I/O |
| Broche 167 | VCCINT — Core supply 1.8 V |
| Broche 168 | I/O — User I/O |
| Broche 169 | I/O — User I/O |
| Broche 170 | I/O — User I/O |
| Broche 171 | VCCIO8 — I/O bank 8 reference |
| Broche 172 | I/O — User I/O |
| Broche 173 | I/O — User I/O |
| Broche 174 | I/O — User I/O |
| Broche 175 | GND — Ground |
| Broche 176 | I/O — User I/O |
| Broche 177 | I/O — User I/O |
| Broche 178 | VCCINT — Core supply 1.8 V |
| Broche 179 | I/O — User I/O |
| Broche 180 | I/O — User I/O |
| Broche 181 | I/O — User I/O |
| Broche 182 | VCCIO1 — I/O bank 1 reference |
| Broche 183 | I/O — User I/O |
| Broche 184 | I/O — User I/O |
| Broche 185 | I/O — User I/O |
| Broche 186 | GND — Ground |
| Broche 187 | I/O — User I/O |
| Broche 188 | I/O — User I/O |
| Broche 189 | VCCINT — Core supply 1.8 V |
| Broche 190 | I/O — User I/O |
| Broche 191 | I/O — User I/O |
| Broche 192 | I/O — User I/O |
| Broche 193 | VCCIO2 — I/O bank 2 reference |
| Broche 194 | I/O — User I/O |
| Broche 195 | I/O — User I/O |
| Broche 196 | I/O — User I/O |
| Broche 197 | GND — Ground |
| Broche 198 | I/O — User I/O |
| Broche 199 | I/O — User I/O |
| Broche 200 | VCCINT — Core supply 1.8 V |
| Broche 201 | I/O — User I/O |
| Broche 202 | I/O — User I/O |
| Broche 203 | I/O — User I/O |
| Broche 204 | VCCIO3 — I/O bank 3 reference |
| Broche 205 | I/O — User I/O |
| Broche 206 | I/O — User I/O |
| Broche 207 | I/O — User I/O |
| Broche 208 | GND — Ground |
Applications typiques
EP20K200RC208-1X convient pour 6 applications: Telecommunications Infrastructure (TDM/SONET), Custom ASIC Prototyping and Emulation, DSP Coprocessor Glue Logic, PCI / PCI-X Bus Interface Bridge, Industrial Control and Legacy I/O Expansion, Test & Measurement Instrument Front-Ends.
Telecommunications Infrastructure (TDM/SONET)
The EP20K200RC208-1X is a long-standing fit for telecom infrastructure where channelized T1/E1 framing, SONET/SDH overhead processing, and ATM cell segmentation demand 100K-200K gates of flexible logic. Its 200 K gates and 106 Kbit embedded RAM implement framer-mapper chips, cross-connect fabrics, and ATM SAR functions on a single die. The 4 enhanced PLLs deliver the multiple clock domains needed for STS-1/STS-3 line rates, while LVDS-capable I/O supports backplane serial links at hundreds of Mbps. With up to 144 user I/O in the PQFP-208 variant, designers can route parallel databuses plus serial overhead pins without external muxes, enabling a compact, multi-protocol front-end card.
Recommandé
Custom ASIC Prototyping and Emulation
Engineers use the EP20K200RC208-1X as an ASIC prototyping vehicle because its 200 K gates and configurable I/O let them emulate mid-density ASICs in real-time. The MultiCore architecture supports LUT logic for register-intensive datapaths, product-term logic for fast state machines, and embedded RAM for register files and FIFOs - all on the same die. Designers can re-spin in-system via JTAG in hours rather than mask weeks. The 1.8 V core plus MultiVolt I/O also lets prototypes drive the same 2.5 V, 3.3 V, and 5 V peripherals as the final ASIC, accelerating validation before committing to mask sets.
Recommandé
DSP Coprocessor Glue Logic
In designs combining a microprocessor or DSP with custom hardware, the EP20K200RC208-1X serves as the data-path glue: address decoding, FIFO arbitration, DMA channel multiplexing, and protocol bridging between host CPUs and accelerators. Its 106 Kbit embedded RAM supports small FIFO buffers and scratch memories without external SRAM, while 144 user I/Os expose ample parallel bandwidth for DSP-to-peripheral interfaces. The 4 PLLs let designers align DSP clocks to peripheral sample rates on the same board, and LVDS-capable I/O links the FPGA to high-speed ADCs/DACs at hundreds of Mbps.
Recommandé
PCI / PCI-X Bus Interface Bridge
The EP20K200RC208-1X implements PCI 32-bit/33 MHz and PCI-X 64-bit/66 MHz target and master interfaces commonly found in legacy industrial PCs, data-acquisition cards, and embedded SBCs. Its PCI-compliant MultiVolt I/O bank supports the 3.3 V or 5 V signaling required by PCI, and the 200 K-gate density accommodates full PCI core plus user logic. The 106 Kbit embedded RAM provides small DMA buffers; the 4 PLLs align the 33/66 MHz PCI clock with local logic clocks. Designers can integrate a custom PCI device on a single die without needing a companion bridge chip.
Recommandé
Industrial Control and Legacy I/O Expansion
Factory-automation controllers often re-use the EP20K200RC208-1X as a programmable I/O expander that translates between parallel PLC backplanes, serial fieldbuses, and proprietary control protocols. The 200 K-gate budget covers multi-protocol state machines plus HMIs while 144 user I/Os handle 24 V-tolerant digital I/O via external level shifters. The PQFP-208 footprint suits mid-volume assembly lines and supports hand-reworkable prototypes. Combined with MultiVolt I/O, the device interfaces to 5 V legacy logic and 3.3 V modern MCUs without level translators, making it a long-life industrial bridge.
Recommandé
Test & Measurement Instrument Front-Ends
Test-equipment manufacturers leverage the EP20K200RC208-1X as a reconfigurable front-end that routes analog signals, multiplexes ADC channels, and generates stimulus patterns. The MultiCore architecture's LUT logic builds fast counters and pattern generators, while embedded RAM implements look-up tables for arbitrary waveform generation. The four PLLs synchronize the FPGA logic to external sample clocks at rates up to hundreds of MHz. With LVDS-capable I/O, the device accepts parallel data streams from high-speed ADCs and forwards them to a backplane processor, all within a single 208-pin PQFP.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K200RC208-1X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K200RC208-1N | EP20K200RC208-1 |
|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | PQFP-208 (0.5 mm pitch) | PQFP-208 (0.5 mm pitch) - same | PQFP-208 (0.5 mm pitch) - same |
| Family | APEX-20KE (1.8 V core, LVDS) | APEX-20KE (1.8 V core) | APEX-20K (2.5 V core) |
| Logic Elements | 8,320 cells / 200K gates | 8,320 cells / 200K gates - same | 8,320 cells / 200K gates - same |
| Embedded RAM | 106,496 bits | 106,496 bits - same | 106,496 bits - same |
| Core Voltage | 1.8 V | 1.8 V - same | 2.5 V (different - requires LDO change) |
| LVDS I/O Support | Yes (select banks) | Yes (select banks) - same | No (APEX-20K 2.5 V) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- 1.8 V low-power APEX-20KE core with LVDS I/O support (vs EP20K200RC208-1)
- Lead-free / industrial-friendly packaging variant available in same footprint (vs EP20K200RC208-1N)
- PQFP-208 foot-print with 4 PLLs and MultiVolt I/O (vs EP20K200FC484-1X)
Notes de conception
Estimated: APEX-20KE core current scales roughly with toggle rate; typical VCCINT draw is 100-300 mA at low utilization and 600-900 mA at high toggle rates. Use a low-noise 1.8 V LDO rated at least 1 A continuous (e.g., a TI TPS7A45 or equivalent) and decouple with 0.1 µF + 10 µF ceramic per VCCINT pin. I/O banks (VCCIO1-8) can each be supplied independently at 1.8/2.5/3.3/5.0 V; place a 0.1 µF cap at every VCCIO pin and a bulk 10 µF per bank. Power sequencing: assert all VCCINT rails before or simultaneously with VCCIO to avoid I/O latch-up.
The PQFP-208 has 0.5 mm pitch gull-wing leads - keep-out zones should allow at least 5 mm of unbroken plane beneath the package for thermal spreading and ground return. Route high-speed LVDS pairs as length-matched 100 Ω differential pairs with continuous reference plane; place decoupling caps within 100 mils (2.5 mm) of each VCCIO and VCCINT pin. Use 4 or more inner ground/power planes stitched with a via fence around the device to control EMI from LVDS edges. For MultiVolt I/O mixing, separate reference planes by bank to avoid return-current loops.
Configuration data is loaded via JTAG (IEEE 1149.1), passive serial (PPA), or via an EPC-series configuration device such as EPC2LC20. JTAG is preferred for in-system reprogramming during development. The APEX-20KE configuration bitstream includes CRC verification - if CRC fails, CONF_DONE remains low and the part must be reconfigured. Reserve the nCONFIG, nSTATUS, and CONF_DONE pins to external 10 kΩ pull-ups so configuration errors do not latch the device into a non-functional state.
Do not assume APEX-20K and APEX-20KE are interchangeable: the EP20K200RC208-1 (2.5 V APEX-20K) and EP20K200RC208-1X (1.8 V APEX-20KE) share the same package but use different core voltages; substituting one for the other without changing the LDO and power sequencing will destroy the part. Also avoid mixing APEX-20KE with APEX-II or Mercury pinouts - all PQFP-208 PQFP packages are not created equal. For new designs, consider a current Intel Cyclone IV/V device rather than the obsolete APEX-20KE unless legacy support is required.
Informations de conformité
RoHS compliant PQFP-208 lead-free package per Intel/Altera product page. AEC-Q100 not applicable - APEX-20KE is a commercial/industrial FPGA, not automotive qualified. Halogen-free and conflict-minerals status not explicitly stated in verified data; consult Intel product declaration if required.