EP20K400EBC652-2X - 400K Gates APEX-20KE FPGA 652-BGA | Altera/Intel
Référence : EP20K400EBC652-2X ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2 450,00 |
| 100 | $198 | $19 800,00 |
| 500 | $165 | $82 500,00 |
| 1 000 | $142 | $142 000,00 |
EP20K400EBC652-2X Présentation
An FPGA (Field-Programmable Gate Array) is a programmable logic device from the broader semiconductor category of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. Within the system hierarchy, the FPGA sits between fixed-function ASICs and software-driven processors, offering hardware-level parallelism with software-level design flexibility. The APEX 20KE family pioneered MultiCore integration, combining Look-Up Table (LUT) logic, embedded memory blocks (ESBs), and distributed arithmetic capability in a single fabric to support system-on-a-programmable-chip (SOPC) designs.
Key differentiating features include 4 PLLs for clock management, 1,664 logic macrocells, support for multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and HSTL, and a dedicated high-speed interconnect called the FastTrack. The device also includes a 4-bit CRC checker for configuration memory integrity and supports in-system programmability through JTAG and passive serial configuration schemes.
Architecturally, the APEX 20KE family uses a MultiCore fabric combining fine-grain LUTs with MegaLAB structures, each containing 16 Logic Elements (LEs), one ESB (Embedded System Block), and a MegaLAB interconnect. The ESBs can be configured as RAM, ROM, dual-port RAM, or CAM, with each block providing 2,048 bits of memory. Total embedded memory scales with device size, reaching 212,992 bits on the EP20K400E variant.
Typical applications include high-speed telecom line cards, ATM/SONET/SDH framers, multi-channel DSP preprocessing, PCI bus bridges, and high-throughput data acquisition front-ends. The combination of 400K gates, 488 I/O pins, and 223 MHz performance makes it well-suited to gate-array replacement and prototyping for ASIC designs in the early 2000s era.
When designing with this device, ensure that the printed circuit board layout uses a BGA socket or reflow process compatible with the 45 × 45 mm 652-ball package footprint. Configuration memory loading must use an Altera ByteBlaster, MasterBlaster, or compatible serial PROM (EPC2/EPC16). Thermal management should follow the JEDEC JESD51 series guidelines for BGA packages.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes not found in the original manufacturer datasheet.
Alternatives de remplacement direct pour EP20K400EBC652-2X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K400EBC652-2X (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Family, Process Technology, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K400EBC652-2
✅ Remplacement direct✓ En stock
$60 / unité
Voir la fiche technique →EP20K400EBC652-1X
✅ Remplacement direct✓ En stock
$92 / unité
Voir la fiche technique →EP20K400EBC652-1
✅ Remplacement direct✓ En stock
$110 / unité
Voir la fiche technique →EP20K400EBC652-2X Valeurs maximales et caractéristiques électriques
| Series | APEX-20KE |
| Family | APEX 20K |
| Logic Elements / Cells | 16,640 |
| Total RAM Bits | 212,992 |
| Number of Macros | 1,664 |
| Number of User I/O | 488 |
| Supply Voltage (Core) | 1.8 V |
| Supply Voltage (I/O) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage) |
| Process Technology | 0.22 µm CMOS |
| Operating Frequency (max) | 223 MHz |
| Propagation Delay | 2.5 ns |
| Number of PLLs | 4 |
| Package Type | 652-BGA |
| Package Dimensions | 45 × 45 mm |
| Température de fonctionnement | 0 °C to +85 °C |
| Type de montage | Surface Mount (BGA) |
| Configuration Interface | JTAG / Passive Serial / ByteBlaster |
Guide de configuration des broches du EP20K400EBC652-2X 45 × 45 mm
Configuration des broches du EP20K400EBC652-2X (boîtier 45 × 45 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP20K400EBC652-2X.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP20K400EBC652-2X convient pour 6 applications: Telecom Line Cards, Multi-Channel DSP Preprocessing, PCI Bus Bridges and ASIC Prototyping, High-Throughput Data Acquisition Front-Ends, Industrial Control and Automation, Network Switching and Routing.
Telecom Line Cards
The EP20K400EBC652-2X fits telecom line-card applications because its 400K-system-gate density, 488 user I/O pins, and 223 MHz internal performance can absorb framers, mappers, and time-slot crossbar logic in a single device. The 1.8V core with multi-voltage I/O (1.5V/2.5V/3.3V) interfaces directly to standard telecom PHY devices and external SSRAM/SDRAM buffers, while the four on-chip PLLs derive multiple reference rates from a single backplane clock, eliminating external clock-generation ASICs. Compared to a discrete gate-array + memory solution, the APEX-20KE MultiCore fabric reduces board area by roughly 40% and simplifies timing closure through the dedicated FastTrack interconnect.
Recommandé
Multi-Channel DSP Preprocessing
The EP20K400EBC652-2X is well suited to multi-channel DSP preprocessing because its 16,640 logic elements and 212,992 bits of embedded SRAM can hold filter coefficients, FIFOs, and sample-rate-converter state across many parallel channels. The four PLLs allow multiple sampling rates to be generated on-chip, while the 488 I/O pins aggregate digitized streams from front-end ADCs without external multiplexing. Power consumption at 223 MHz with typical 30-40% utilization stays below 3W, which is acceptable for the 45×45 mm 652-BGA footprint without forced-air cooling in a sealed chassis.
Recommandé
PCI Bus Bridges and ASIC Prototyping
For PCI bus bridges and ASIC prototyping, the EP20K400EBC652-2X offers 488 I/O pins with PCI-compliant drivers, JTAG and passive-serial configuration interfaces, and 1.8V/2.5V/3.3V I/O voltage mixing on a single device. Engineers use the APEX-20KE MultiCore fabric to model ASIC RTL before tape-out, validating timing closure and pin assignments on real silicon. The 652-BGA footprint matches the board area of the final ASIC package, enabling drop-in hardware reuse between prototype and pre-production builds and shrinking the overall verification cycle by weeks.
Recommandé
High-Throughput Data Acquisition Front-Ends
The EP20K400EBC652-2X supports high-throughput data-acquisition front-ends because its 488 user I/Os accommodate wide parallel buses from multi-channel ADCs, while the 212,992 bits of on-chip memory buffer bursts before DMA transfer. The 1.8V core keeps digital switching noise low, preserving analog SNR when the FPGA shares a board with sensitive front-end amplifiers. With four PLLs and a maximum operating frequency of 223 MHz, the device comfortably handles 16-bit @ 100 MSPS ADC streams for radar, sonar, and instrumentation front-ends in the early-2000s generation.
Recommandé
Industrial Control and Automation
In industrial control and automation, the EP20K400EBC652-2X provides the logic density to integrate multiple motor-control loops, encoder counters, and fieldbus interfaces (Profibus, CAN, RS-485) into a single device, with 488 I/Os allowing direct connection to many parallel sensor arrays. The four PLLs generate the precise PWM carrier frequencies needed for vector-control algorithms, while the 1.8V core reduces switching losses in enclosed cabinets. Designers value the 652-BGA package's mechanical robustness in vibration-prone factory environments compared to QFP packages of equivalent density.
Recommandé
Network Switching and Routing
The EP20K400EBC652-2X is frequently deployed in legacy network switches and edge routers because its 16,640 logic elements can implement packet classifiers, TCAM replacements, and queue managers in parallel hardware. With 488 I/O pins, the device supports multiple 10/100 Ethernet MACs plus a Gigabit uplink without external bus-switching logic, and the four PLLs derive independent timing domains for the switch fabric, PHY interfaces, and CPU bus. Compared to a multi-CPLD solution, the APEX-20KE cuts board area by approximately 50% and simplifies the timing-closure process via the FastTrack interconnect.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K400EBC652-2X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K400EBC652-2 | EP20K400EBC652-1X | EP20K400EBC652-1 |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 652-BGA (45x45 mm) | 652-BGA - same | 652-BGA - same | 652-BGA - same |
| Speed Grade | -2X (extended) | -2 (standard) | -1X (slow extended) | -1 (slowest) |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 |
| Macros | 1,664 | 1,664 | 1,664 | 1,664 |
| Embedded Memory (bits) | 212,992 | 212,992 | 212,992 | 212,992 |
| Maximum User I/O | 488 | 488 | 488 | 488 |
| Number of PLLs | 4 | 4 | 4 | 4 |
| Operating Temperature Range | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
Principaux différenciateurs
- Extended speed grade -2X vs standard -2 (vs EP20K400EBC652-2)
- Faster internal fMAX versus -1X grade (vs EP20K400EBC652-1X)
- Same-package compatibility with -1 grade enables cost-tier trade-off (vs EP20K400EBC652-1)
Notes de conception
Estimated: The 652-BGA at 45×45 mm requires a four-layer minimum PCB stack-up with two inner solid power/ground planes directly under the BGA. Use JEDEC MS-034 land pattern with NSMD (non-solder-mask-defined) pads to improve BGA joint reliability under thermal cycling. Escape routing for inner rows should use 0.2 mm microvias on a 1-6-1 stack-up, and matched-length tuning (±25 mil) is required on FastTrack global clock nets to meet 223 MHz timing closure.
Estimated: With a 0.22 µm CMOS core at 1.8V and 223 MHz operation, the EP20K400EBC652-2X typically dissipates 2.5–3.5 W at 30–40% logic utilization per Altera APEX 20KE power-estimation workbooks. The 652-BGA package's thermal resistance θJA is approximately 12 °C/W on a JEDEC four-layer test board, so a small heat-spreader or 200 LFM airflow is recommended in sealed chassis. Decoupling should include 0.1 µF X7R capacitors on every four VCCINT balls plus bulk 47 µF tantalum capacitors on each VCCIO bank to suppress simultaneous-switching noise.
Do not confuse the EP20K400EBC652-2X (commercial temperature, extended speed grade) with the EP20K400EBC652-2I or industrial-temperature variants — the bare -2X suffix implies commercial 0 °C to +85 °C operation per the Altera ordering code scheme. The configuration bitstream is sensitive to VCCIO bank voltage during JTAG programming; ensure VCCIO for the JTAG pins (typically bank 1) is at 2.5V or 3.3V before initiating ByteBlaster downloads. Finally, do not apply power in the wrong sequence — VCCINT (1.8V) must rise before or simultaneously with VCCIO, otherwise the I/O drivers may latch up.
Informations de conformité
Compliance status not confirmed in verified distributor data because the part is obsolete and predates standardized RoHS reporting. For lead-free requirements, request an 'N' suffix variant from Altera (Intel) and verify with the supplier before volume commitment.