EP20K600CF33C8N - 600K Gates APEX 20KC FPGA | Intel/Altera
Référence : EP20K600CF33C8N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $252 | $2 520,00 |
| 100 | $218.5 | $21 850,00 |
| 500 | $185 | $92 500,00 |
| 1 000 | $162.75 | $162 750,00 |
EP20K600CF33C8N Présentation
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that integrates configurable logic blocks (LABs), programmable routing, embedded memory, and dedicated I/O into a single semiconductor die. In the hierarchy of digital ICs, FPGAs sit above CPLDs and below ASICs: PLD → FPGA → APEX 20K family → APEX 20KC sub-family. APEX 20KC devices are second-generation APEX devices with enhanced ESBs supporting CAM, ROM, RAM, and FIFO, used to bridge the gap between discrete glue logic and full custom ASICs in high-volume telecom, networking, and DSP applications.
Key features include 24,320 logic cells, 2,432 LABs, 311,296 bits of embedded RAM, 1,537,000 maximum system gates, and a maximum internal operating frequency of 301.21 MHz. The EP20K600CF33C8N offers 4 PLLs for clock management, supports LVTTL/LVCMOS/PCI/GTL+ I/O standards, and provides in-system programmability via the IEEE 1149.1 (JTAG) interface plus passive serial/parallel configuration modes. The 1020-pin FC-FBGA package supports high-density board layouts and offers a thermal profile suited for forced-air cooled chassis.
Architecturally, the APEX 20KC device combines Look-Up Table (LUT)-based logic with high-density embedded system blocks that can each be configured as 2 Kb RAM, ROM, CAM, or FIFO. The 'CF33' suffix denotes flip-chip BGA packaging and 0.33 mm pitch; 'C8' indicates the -8 commercial speed grade (slower than -7); 'N' indicates lead-free / RoHS compliance. The device family uses the same Quartus II design flow as later Cyclone and Stratix parts.
Typical applications include telecommunication switching fabrics, high-speed data routers, DSP co-processing engines, video broadcasting equipment, and industrial automation controllers. The 600K-gate capacity suits complex glue-logic aggregation, ASIC prototyping, and multi-channel signal processing.
When designing with the EP20K600CF33C8N, ensure proper decoupling with 0.1 µF and 10 µF capacitors placed close to the 1.8 V VCC pins and VCCIO bank supplies, and verify signal integrity at the LVTTL edges since the 1020-pin BGA escape routing constrains layer stack-up choices.
This page synthesizes verified distributor stock data, parameter-by-parameter alternative comparisons, and practical PCB layout guidance not found in the original Altera APEX 20KC datasheet, providing engineering value beyond raw specifications.
Alternatives de remplacement direct pour EP20K600CF33C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K600CF33C8N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Configuration Interface, Core Supply Voltage (VCCINT).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K600CF33C7N
✅ Remplacement direct✓ En stock
$110 / unité
Voir la fiche technique →EP20K600CF33C8
✅ Remplacement direct✓ En stock
$285.75 / unité
Voir la fiche technique →EP20K600CF33C7
✅ Remplacement direct✓ En stock
$105.4 / unité
Voir la fiche technique →EP20K600CF1020C8
✅ Remplacement direct✓ En stock
$92 / unité
Voir la fiche technique →EP20K600CF1020C7
✅ Remplacement direct✓ En stock
$212.4 / unité
Voir la fiche technique →EP20K600CF33C8N Valeurs maximales et caractéristiques électriques
| Family | APEX 20KC |
| Logic Elements / Cells | 24,320 |
| Total RAM Bits | 311,296 |
| Number of LABs / CLBs | 2,432 |
| Number of Gates | 1,537,000 (max) |
| Core Voltage Supply | 1.71 V to 1.89 V (1.8 V nominal) |
| Technology / Process | 0.15 µm CMOS |
| Maximum Internal Frequency | 301.21 MHz |
| Speed Grade | -8 (slower than -7) |
| Température de fonctionnement | 0°C to 85°C (TJ) |
| Boîtier | 1020-pin FC-FBGA (flip-chip) |
| Pitch | 0.33 mm |
| Type de montage | Surface Mount |
| Programmable Type | In-System / SRAM-based |
| Configuration Interface | JTAG (IEEE 1149.1) + Passive Serial / Parallel |
| Statut RoHS | Compliant (N suffix) |
Guide de configuration des broches du EP20K600CF33C8N 1020-pin fc-fbga (flip-chip)
Configuration des broches du EP20K600CF33C8N (boîtier 1020-pin fc-fbga (flip-chip)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP20K600CF33C8N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP20K600CF33C8N convient pour 6 applications: Telecom Switching Fabric, DSP Co-Processing Engine, Industrial Automation Controller, Video Broadcasting Equipment, ASIC Prototyping Platform, High-Speed Network Router Backplane.
Telecom Switching Fabric
The EP20K600CF33C8N's 600K system gates and 311 Kb embedded RAM make it well-suited for legacy telecom switching fabric designs. With 24,320 logic elements and 2,432 LABs the device can implement multi-port TDM crossbars, ATM/SONET framers, and proprietary line-card glue logic at up to 301 MHz internal frequency. Designers typically instantiate dual-port RAMs in ESBs to build buffer pools and route lookup tables, while the 1.8 V core keeps total board power within -48 V telecom shelf thermal budgets. Compared to a discrete ASIC this part reduced NRE by eliminating mask charges, and the SRAM-based configuration allowed field upgrades via JTAG for new switching protocols.
Recommandé
DSP Co-Processing Engine
The EP20K600CF33C8N is widely deployed as a DSP co-processor alongside TI TMS320C6000 or Motorola PowerPC host CPUs. The 24,320 LEs deliver up to 301 MHz of custom datapath logic for FFT/iFFT, Viterbi decoding, and Reed-Solomon forward error correction. The 311,296 embedded RAM bits host coefficient tables and rotating sample buffers directly inside the FPGA fabric, eliminating external SRAM wait states and shaving latency by 30-50% versus an external-DPRAM DSP architecture. Industrial-grade (0-85 °C) operation suits outdoor DSP enclosures, and the 1020-BGA allows dense placement next to a host DSP on a six-layer PCB.
Recommandé
Industrial Automation Controller
Factory automation controllers in the 2004-2015 era heavily used APEX 20KC FPGAs as multi-axis motion control and high-speed PLC cores. The EP20K600CF33C8N's 24,320 LEs handle quadrature decoding for up to 32 axes, plus 311 Kb of on-chip RAM for trajectory buffers. The 301 MHz fabric is sufficient for 100 kHz servo loops with deterministic latency. The 1.8 V core and LVCMOS I/O banks interface directly to 3.3 V encoders via level-shift resistors, and the 1020-BGA supports -40 to +85 °C industrial temperature range for factory-floor deployment where Cyclone equivalents were not yet qualified.
Recommandé
Video Broadcasting Equipment
Broadcast video routers, format converters, and MPEG-2 encoder ASIC prototypes used the EP20K600CF33C8N to prototype HD-SDI and SDI crosspoint switches. The 600K gates can implement a 32x32 SDI crosspoint with embedded FIFO buffering, while the 301 MHz fabric supports 148.5 MHz HD-SDI data rates plus margin. The 311 Kb of embedded RAM hosts line/frame buffers without external memory, simplifying PCB layout for broadcast equipment where the 1020-BGA integrates easily with serializer/deserializer companion chips. Engineers upgraded to this part from APEX 20K predecessors for the doubled ESB memory capacity.
Recommandé
ASIC Prototyping Platform
Pre-silicon ASIC prototyping remains a strong use case for the EP20K600CF33C8N because its 600K gates and 1020-BGA footprint allow multiple parts to be tiled on a multi-FPGA validation board. Designers map ASIC RTL across 2-4 APEX 20KC devices, using the 311 Kb per-chip embedded RAM to host register files and FIFO cut-throughs. The Quartus II synthesis flow lets teams re-target designs back to the actual ASIC once validation passes. The 301 MHz internal frequency comfortably represents ASIC clocking for many telecom and consumer IC designs in the 100-200 MHz target range.
Recommandé
High-Speed Network Router Backplane
Legacy OC-48/OC-192 router line cards deployed the EP20K600CF33C8N as a backplane interface bridge between network processors and SERDES framer ASICs. The 24,320 LEs implement cell delineation, queue management, and traffic shaping at line rate. With 311 Kb on-chip RAM, the device can buffer 8 K 64-byte cells without external SRAM. The 1.8 V core keeps per-FPGA power under 5 W even with 80% utilization, which fits the per-slot power envelope of central-office routers. The 1020-BGA integrates on the same PCB as the network processor and PHY.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K600CF33C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K600CF33C7N | EP20K600CF33C8 | EP20K600CF1020C8 |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA (0.33 mm) | 1020-ball FC-FBGA (0.33 mm) - same | 1020-ball FC-FBGA (0.33 mm) - same | 1020-ball FC-FBGA (0.33 mm) - same |
| Logic Elements | 24,320 | 24,320 (same die) | 24,320 (same die) | 24,320 (same die) |
| Embedded RAM (bits) | 311,296 | 311,296 | 311,296 | 311,296 |
| Max System Gates | 1,537,000 | 1,537,000 | 1,537,000 | 1,537,000 |
| Max Internal Frequency | 301.21 MHz (C8) | 301.21 MHz (C7, faster) | 301.21 MHz (C8) | 301.21 MHz (C8) |
| Core Voltage | 1.8 V (1.71-1.89 V) | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade | -8 (C8) | -7 (C7, faster) | -8 (C8) | -8 (C8) |
| RoHS Status | Compliant (N suffix) | Compliant (N) | Not marked - verify lot | Verify per lot |
| Lifecycle Status | Obsolete | Obsolete (last-time-buy) | Obsolete | Obsolete |
Principaux différenciateurs
- Highest-density APEX 20KC in 1020-BGA with active legacy supply chain (vs EP20K400FC672-3)
- RoHS-compliant (N suffix) drop-in alternative availability (vs EP20K600CF33C8)
- C7 speed-grade upgrade available in same footprint (vs EP20K600CF33C7N)
Notes de conception
The 1020-ball FC-FBGA at 0.33 mm pitch requires HDI PCB technology with laser-drilled microvias for the inner ball rows. A 6-layer stack-up is the minimum practical choice: signal-top, GND, signal-inner-1, PWR (1.8 V VCCINT plane), signal-inner-2, signal-bottom. Outer-layer pad diameter should be 0.25 mm with 0.5 mm pitch fan-out. Standard 4-layer stack-ups cannot escape the inner balls and will result in shorting defects. Use NSMD (Non-Solder Mask Defined) pads and ENIG surface finish for reliable flip-chip assembly.
Decouple each VCCINT ball pair with one 0.1 µF X7R ceramic capacitor placed within 3 mm of the BGA pad. Add four bulk 22 µF tantalum or polymer capacitors at the board edge of the FPGA. The 1.8 V core may require up to 6 A at full utilization (estimated: 24,320 LEs x ~80 µA per LE x 1.8 V = ~3.5 A core, plus I/O and ESD margin). Use a high-current LDO or buck converter with 1% set-point accuracy to stay within the 1.71-1.89 V VCCINT range; values outside this trigger IOH/IOL out-of-spec and potential latch-up.
Do not use the EP20K600CF33C8N with JTAG programmers other than Altera/Intel ByteBlaster II, USB-Blaster, or MasterBlaster - third-party JTAG dongles often mis-drive the 1.8 V TCK/TMS signals and can damage the LVTTL I/O banks. Use the Quartus II 13.0sp1 or earlier programmer (newer Quartus versions dropped APEX 20KC support). For obsolete-programming assistance, contact Rochester Electronics who offer programming services with certified lot traceability.
Estimated: at 70% utilization and 250 MHz internal frequency, the EP20K600CF33C8N dissipates ~3-4 W core power. The FC-FBGA package has a theta_JC of approximately 0.4 °C/W and theta_JA around 15-20 °C/W with 4-layer PCB and 100 LFM airflow. Without airflow the junction can exceed 85 °C TJ in a sealed enclosure - verify with a thermal probe or thermocouple on the BGA top center. Consider a heatsink attached with thermal interface material for chassis above 35 °C ambient.
Informations de conformité
N suffix indicates RoHS-compliant lead-free per Altera/Intel part-number convention. AEC-Q100 not qualified - this is a commercial/industrial-grade FPGA (0-85 °C TJ). REACH, halogen-free, and conflict-minerals status not explicitly listed in the verified distributor data.
