EP2A40FB724C8 - APEX II FPGA 540 I/O 724-BGA | Altera (Intel)
Référence : EP2A40FB724C8 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2 650,00 |
| 100 | $240 | $24 000,00 |
| 500 | $220 | $110 000,00 |
| 1 000 | $205 | $205 000,00 |
EP2A40FB724C8 Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic blocks and interconnect via a hardware description language after manufacture. FPGAs occupy a hierarchical position from programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> programmable logic device family -> semiconductor. APEX II sits between older APEX 20K devices and the Stratix/GX families, offering a MultiCore architecture that combines look-up-table (LUT) logic with embedded system blocks (ESBs) for on-chip dual-port RAM, content-addressable memory, and FIFO functions.
Key features of the EP2A40FB724C8 include 540 user I/O pins, 655,360 bits of total RAM, 38,400 logic elements, an operating core voltage of 1.425 V to 1.575 V, a 724-ball FCBGA package measuring 35 mm x 35 mm, and a -8 speed grade designation. The MultiCore structure embeds up to 28,620 LUTs and dedicated carry/chain routing for high-speed arithmetic, while the embedded system blocks provide configurable dual-port SRAM with byte enables. JTAG (IEEE 1149.1) boundary-scan test is supported for board-level verification.
The architectural depth comes from combining fine-grained logic elements with coarse-grained ESBs, allowing engineers to map both random control logic and wide datapath or buffer memories without external components. The -8 speed grade designates a specific transistor-speed bin, with lower numbers indicating faster parts; system clocks and I/O toggling rates are defined per speed grade in the APEX II family datasheet.
Typical applications include high-speed telecommunication line cards, network switches and routers, ASIC prototyping, DSP co-processing front-ends, and large-format imaging or video processing pipelines. With 540 user I/O, the EP2A40FB724C8 supports wide external memory buses and multiple parallel interface standards. Designers should note the 724-BGA package requires multilayer PCB construction with controlled-impedance routing and BGA-specific fanout. Power estimation requires Quartus II power analyzer data, since APEX II core and I/O currents scale with toggle rate and logic utilization. This page synthesizes distributor availability, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP2A40FB724C8 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2A40FB724C8 (même facteur de forme et même empreinte) — différant par Operating Temperature, Process Technology, Family, Series, Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2A40B724C8
✅ Remplacement direct✓ En stock
$615 / unité
Voir la fiche technique →EP2A40B724I8
✅ Remplacement direct✓ En stock
$611 / unité
Voir la fiche technique →EP2A40B724C9
✅ Remplacement direct✓ En stock
$395.38 / unité
Voir la fiche technique →EP2A40B724C7
✅ Remplacement direct✓ En stock
$650 / unité
Voir la fiche technique →EP2A40B724I9
✅ Remplacement direct✓ En stock
$150 / unité
Voir la fiche technique →EP2A40FB724C9
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP2A40FB724C7
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP2A40FB724I8
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP2A40FB724C8 Valeurs maximales et caractéristiques électriques
| Family | APEX II |
| Device Logic Elements | 38,400 |
| Typical Gates | 40,000 |
| Total RAM Bits | 655,360 |
| User I/O Pins | 540 |
| Core Voltage | 1.425 V to 1.575 V |
| Boîtier | 724-BGA (FCBGA), 35 mm x 35 mm |
| Speed Grade | -8 |
| Température de fonctionnement | Commercial (0 C to +85 C) per suffix |
| Type de montage | Surface Mount (BGA) |
| Architecture | MultiCore (LUT + Embedded System Blocks) |
| Embedded System Blocks | Configurable dual-port SRAM / CAM / FIFO |
| Configuration Mode | JTAG / Passive Serial / Passive Parallel |
| Process Technology | CMOS, SRAM-based |
Guide de configuration des broches du EP2A40FB724C8 724-bga (fcbga), 35 mm x 35 mm
Configuration des broches du EP2A40FB724C8 (boîtier 724-bga (fcbga), 35 mm x 35 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2A40FB724C8.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2A40FB724C8 convient pour 6 applications: Telecommunication Line Cards, Network Switches and Routers, ASIC Prototyping and Emulation, DSP Co-Processing Front-Ends, Industrial Imaging and Machine Vision, Avionics and Military Communication Systems.
Telecommunication Line Cards
The EP2A40FB724C8 fits telecommunication line cards because its 540 user I/O pins can simultaneously drive wide parallel datapaths (UTOPIA, POS-PHY, or proprietary Fabric-to-Fabric interfaces) alongside external ZBT/QDR SRAM and DDR SDRAM memory buses. With 655,360 bits of on-chip dual-port RAM, designers can buffer ATM cells or IP packets at line rate without external memory, reducing BOM cost and PCB complexity. The MultiCore LUT architecture supports sustained DSP datapaths such as Reed-Solomon forward-error-correction or Viterbi decoding, while the -8 speed grade comfortably clocks system frequencies above 100 MHz on internal logic. Power estimation should use the Quartus II PowerPlay analyzer with realistic toggle rates, and a heat-spreader or thermal pad is recommended for fully utilized 38,400 logic elements.
Recommandé
Network Switches and Routers
In network switches and routers, the EP2A40FB724C8 acts as a backplane interface controller or queue manager, exploiting its 540 I/O to bridge multiple SGMII/SPI-3 or XSBI ports concurrently to a switch-fabric ASIC. The 38,400 logic elements provide ample capacity for header parsing, classification, and queue-management logic, while the 655,360-bit embedded system blocks serve as low-latency packet buffers. The -8 speed grade supports 133 MHz DDR SDRAM controllers, sufficient for gigabit-class forwarding engines. Board designers should allocate 8-12 PCB layers for the 724-FCBGA breakout with microvia fanout, and provide independent VCCIO banks (2.5 V / 3.3 V) to mix LVCMOS and LVTTL I/O standards. For new designs, migration to Cyclone V GT in an EQFP package is recommended given APEX II's obsolete status.
Recommandé
ASIC Prototyping and Emulation
The EP2A40FB724C8 is well suited for ASIC prototyping because it integrates 38,400 logic elements with 655,360 bits of dual-port memory, sufficient to map RTL blocks of 50K-80K gates with on-chip testbench memory. The 540 user I/O pins let designers map multi-standard SoC peripheral buses (AMBA, OCP, or proprietary) directly to testbench connectors. Quartus II synthesis maps RTL directly to LUTs with predictable timing closure in the -8 speed grade, and the embedded system blocks provide dual-port RAM models that match ASIC SRAM macros closely. Power and thermal should be analyzed with realistic vector-based activity; the 724-FCBGA package handles moderate 3-5 W dissipation without forced airflow if top-side thermal relief is provided.
Recommandé
DSP Co-Processing Front-Ends
As a DSP co-processing front-end, the EP2A40FB724C8 provides the high I/O count needed to ingest parallel ADC data streams and the embedded memory for coefficient storage. The 540 user I/O pins accept LVDS or LVCMOS pairs from multi-channel 14-/16-bit ADCs at sample rates to 200 MSPS, while the MultiCore architecture implements pipelined FIR/IIR filters, FFT engines, and digital down-converters efficiently. Embedded system blocks configured as dual-port RAM hold 16K complex FFT coefficients, allowing continuous overlap-save or overlap-add processing. The -8 speed grade sustains >150 MHz on the internal datapath, suitable for real-time baseband processing in software-defined radio and digital video broadcast receivers.
Recommandé
Industrial Imaging and Machine Vision
The EP2A40FB724C8 serves industrial imaging and machine vision pipelines by combining 540 I/O for multi-camera LVDS links with 655,360 bits of on-chip RAM for line buffers in Bayer demosaic or edge-detection pipelines. Its 38,400 logic elements implement high-throughput image processing such as 2D convolution, color-space conversion, and feature extraction in real time on megapixel streams. The -8 speed grade supports Camera Link interfaces at full 80 MHz pixel clock, while embedded system blocks provide FIFO buffers for line-scan or area-scan camera data without external SRAM. Industrial temperature variants (the EP2A40B724I8) extend operation to -40 C to +100 C for factory-floor deployments.
Recommandé
Avionics and Military Communication Systems
The EP2A40FB724C8 supports avionics and military communication systems requiring high logic density and wide interface flexibility. The 540 I/O pins connect to MIL-STD-1553, ARINC 429, or proprietary high-speed serial backplanes, while the 655,360-bit on-chip memory handles protocol buffers and error-correction tables. The MultiCore architecture implements encryption cores, FFT engines, and protocol stacks concurrently. Designers must select industrial or military temperature grades (-40 C to +125 C) - these typically carry the I-suffix and are available through Rochester Electronics for legacy aerospace programs. Boards should use controlled-impedance stripline routing, hermetic or ruggedized packaging, and conformal coating to meet MIL-STD-810 environmental stress requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2A40FB724C8 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2A40B724C8 | EP2A40B724I8 | EP2A40B724C9 | EP2A40B724C7 | EP2A40B724I9 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 724-BGA FCBGA (F-suffix, fine-pitch) | 724-BGA (standard pitch) - same | 724-BGA - same | 724-BGA - same | 724-BGA - same | 724-BGA - same |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| User I/O | 540 | 540 | 540 | 540 | 540 | 540 |
| Total RAM Bits | 655,360 | 655,360 | 655,360 | 655,360 | 655,360 | 655,360 |
| Speed Grade | -8 | -8 | -8 | -9 (slower) | -7 (faster) | -9 (slower) |
| Temperature Range | Commercial 0 C to +85 C | Commercial | Industrial -40 C to +100 C | Commercial | Commercial | Industrial -40 C to +100 C |
| Core Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Lifecycle Status | Obsolete | Obsolete (Rochester authorized) | Obsolete (Rochester authorized) | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price @ qty 1 (USD, 2026-09-08) | 285.00 | 270.00 | 310.00 | 260.00 | 295.00 | 300.00 |
Principaux différenciateurs
- Fine-pitch BGA (F-suffix) solder-ball geometry (vs EP2A40B724C8)
- Commercial temperature grade for cost-optimized designs (vs EP2A40B724I8)
- Balanced -8 speed grade for most designs (vs EP2A40B724C7)
Notes de conception
Estimated: APEX II EP2A40 core current at 100 MHz and 50% toggle rate is approximately 1.5-2.5 A at 1.5 V core, equivalent to 2.3-3.8 W core dissipation. Plus I/O banks at typical 50-100 mA each at 3.3 V, total board power reaches 4-6 W per device. Use a buck regulator with at least 1.5x headroom (e.g., 5 A rating) per FPGA. Sequence VCCIO before VCC_CORE to avoid I/O latch-up; the LM3880 sequencer or RC delay on each rail is recommended. Decoupling requires at least 4 x 100 uF bulk, 20 x 10 uF, and 60 x 0.1 uF X7R ceramics placed adjacent to each BGA ball pair on the top and bottom layers.
The 724-BGA FCBGA package requires a 10-12 layer PCB with sequential lamination and microvia (laser-drilled) technology to escape the inner rows of balls. Use a 4-4-4 mil trace/space geometry with 0.5 mm pitch BGA fanout. Maintain a continuous reference plane under each routing layer; signal layers should always be paired with a solid GND or VCC plane to control impedance at 50 ohm single-ended or 100 ohm differential. Add thermal vias in a 4 x 4 array under the center balls for heat dissipation. All BGA pads require ENIG or immersion-silver surface finish to prevent solder joint embrittlement from tin-lead alternatives.
Estimated: Three common pitfalls with APEX II designs are (1) leaving JTAG TCK pulled high or floating during configuration, which can lock the part into JTAG mode - tie TCK low via 1 kohm to GND if unused; (2) underestimating in-rush current when VCCIO banks power up simultaneously and CMOS inputs have no soft-start; (3) using Quartus Prime instead of Quartus II, which does not support APEX II. Designers must use Quartus II 13.0sp1 or earlier archived versions. Additionally, configure unused I/O pins as tri-stated inputs with weak pull-ups to reduce in-rush and EMI during configuration; the Quartus II Device options panel sets this default.
Place the EP2A40FB724C8 on the top side with all decoupling and configuration components within 25 mm of the BGA. Match the configuration EPC flash (EPCS4 or EPC16) trace length to the FPGA DCLK and DATA pins to within 1 cm to avoid setup/hold violations at 50 MHz configuration clock. For multi-FPGA designs, isolate configuration chains with a buffer per device; do not daisy-chain more than two APEX II devices on one JTAG chain without a re-driver. Use a 4-layer JTAG TAP topology if boundary-scan testing is required, and reserve a GND ring around the BGA for EMI suppression at high I/O toggle rates.
Informations de conformité
RoHS and REACH compliance are not explicitly stated in the verified distributor listings as of 2026-09-08. APEX II was introduced before widespread RoHS mandates - many date codes are lead-bearing. RoHS-compliant screened stock may be available through specialty distributors; request a current material declaration before procurement for EU-bound products. AEC-Q100 is not applicable since APEX II is a commercial/industrial FPGA family not qualified for automotive.
