EP2AGX125EF35C5G - 118K Cells, 500 MHz FPGA | Intel
Référence : EP2AGX125EF35C5G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
EP2AGX125EF35C5G Présentation
An FPGA, or field-programmable gate array, is a semiconductor device whose logic functionality is configured after manufacturing. In the system hierarchy, it sits between fixed-function integrated circuits and software-programmable processors: the FPGA can implement parallel digital circuits, custom interfaces, and processing pipelines, while a processor typically executes sequential software. Its configurable logic, embedded memory resources, and I/O structure allow one hardware platform to support multiple product functions or design revisions.
The headline characteristics of the EP2AGX125EF35C5G are its 118,143 logic cells, 452 I/O, and 1,152-ball package. The device is listed as part of the Arria II GX family and operates from a 0.9 V supply according to the supplied distributor specifications. The package is a ball-grid-array format suitable for high-pin-count surface-mount assembly, and the device is offered in tray packaging according to the verified Arrow listing.
From an architectural perspective, the density and programmable-bit count provide substantial capacity for datapath logic, control functions, memory mapping, and interface adaptation. The 452 I/O resources support communication with multiple external buses or high-bandwidth peripherals. Because the available web results provide no verified values for operating temperature range, transceiver count, memory configuration, package body dimensions, or speed grade timing, those values must be obtained from the manufacturer datasheet before final system design.
Typical applications include communications equipment, industrial control, test and measurement, and embedded systems that need parallel processing or custom digital interfaces. The Arria II GX classification and 500 MHz listed specification make the part relevant to designs where deterministic hardware execution and configurable connectivity are more important than the software flexibility of a conventional processor. A modern FPGA design should also confirm device-family support in the selected development environment and validate pin assignments against the exact 1,152-ball package drawing.
A key design consideration is that a ball-grid-array package requires controlled PCB layout, appropriate escape routing, thermal analysis, and reliable assembly processes. The verified data does not establish every electrical, timing, or thermal limit, so the datasheet and family documentation remain authoritative. The supplied search results also do not identify a verified pin-compatible drop-in replacement; the alternatives section therefore avoids inventing replacement claims.
This page synthesizes the supplied distributor specifications, package information, pricing references, and cross-reference search results. It distinguishes verified facts from parameters requiring datasheet confirmation and provides engineering context for FPGA selection, PCB planning, and procurement decisions as of 2026-09-08.
Alternatives de remplacement direct pour EP2AGX125EF35C5G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2AGX125EF35C5G (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Transceivers, Mounting Type, Package Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2AGX125EF35C4G
✅ Remplacement direct✓ En stock
$1290 / unité
Voir la fiche technique →EP2AGX125EF29I5G
✅ Remplacement direct✓ En stock
$861.62 / unité
Voir la fiche technique →EP2AGX125EF29I3G
✅ Remplacement direct✓ En stock
$590.9643 / unité
Voir la fiche technique →EP2AGX125EF29C5G
✅ Remplacement direct✓ En stock
$1090 / unité
Voir la fiche technique →EP2AGX125DF25C5G
✅ Remplacement direct✓ En stock
$399.5 / unité
Voir la fiche technique →EP2AGX125EF35C5G Valeurs maximales et caractéristiques électriques
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Arria II GX |
| Logic Cells | 118143 |
| Programmable Bits | 8315904 bits |
| I/O Count | 452 I/O |
| Boîtier | 1152-BBGA, FCBGA |
| Package Type | FC-FBGA |
| Nombre de broches | 1152 pins |
| Tension d'alimentation | 0.9 V |
| Listed Performance | 500 MHz |
| Terminal Form | BALL |
| Terminal Count | 1152 terminals |
| Package Code | HBGA |
| Type de montage | Surface mount |
| Packaging | Tray |
Guide de configuration des broches du EP2AGX125EF35C5G hbga
Configuration des broches du EP2AGX125EF35C5G (boîtier hbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2AGX125EF35C5G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2AGX125EF35C5G convient pour 6 applications: Industrial Control and Automation, Communications Infrastructure, Test and Measurement Equipment, Embedded Interface Bridging, High-Performance Data Processing, Aerospace and Defense Signal Processing.
Industrial Control and Automation
EP2AGX125EF35C5G is suitable for industrial control systems that need parallel deterministic processing and flexible I/O. Its verified 118,143 logic cells and 452 I/O provide capacity for machine-control state machines, sensor-data aggregation, motor-control interfaces, and protocol conversion. A 0.9 V supply is listed for the device, while the BGA package supports compact integration of many signals. The design can implement custom timing and control behavior without depending entirely on a software processor, improving deterministic response in automation equipment. Confirm the exact I/O voltage ranges, operating temperature, configuration requirements, and industrial qualification from the manufacturer datasheet before production release.
Recommandé
Communications Infrastructure
EP2AGX125EF35C5G belongs to the Arria II GX family, making it relevant to communications infrastructure requiring configurable data paths and multiple external interfaces. The device’s verified 452 I/O count can support link aggregation, packet processing, protocol adaptation, clock distribution, and redundant control paths. Its 1,152-ball FCBGA/FC-FBGA package is appropriate for high-density routing, while the listed 500 MHz performance value provides a useful system-design reference. However, the supplied results do not state the number of transceivers or supported lane rates, so those capabilities must be verified in the family datasheet. The FPGA should be evaluated for signal integrity, power integrity, timing closure, and configuration security.
Recommandé
Test and Measurement Equipment
EP2AGX125EF35C5G can support test and measurement systems that need simultaneous signal acquisition, data transformation, trigger logic, and instrument interfacing. The 118,143 logic-cell density and 8,315,904 programmable bits provide a large configurable fabric for parallel processing, while 452 I/O allow connection to converters, memory interfaces, control buses, and timing circuits. The Arria II GX classification is useful where hardware-level parallelism and deterministic pipelines are preferred over sequential software execution. The listed 0.9 V supply and 500 MHz specification help define the initial architecture, but designers must confirm operating conditions, I/O standards, and timing limits from the manufacturer documentation. High-speed PCB design and careful grounding are especially important for measurement accuracy.
Recommandé
Embedded Interface Bridging
EP2AGX125EF35C5G is a strong candidate for embedded systems that must bridge incompatible buses, serialize data, perform protocol conversion, or add deterministic hardware processing. Its 452 I/O can interface with multiple controllers, memory devices, sensors, and peripheral buses, while the programmable architecture allows the bridge behavior to be changed without redesigning the complete board. The 1,152-ball FCBGA/FC-FBGA package is suitable for high-density interconnects but requires controlled escape routing and assembly. The verified 0.9 V supply value should be incorporated into the power budget, while all additional rail and sequencing requirements must be confirmed from the datasheet. Validate pin multiplexing, configuration method, and timing with the selected Intel FPGA design flow.
Recommandé
High-Performance Data Processing
EP2AGX125EF35C5G can be used in high-performance data-processing equipment where parallel hardware pipelines are more effective than sequential software alone. The verified 118,143 logic cells and 8,315,904 programmable bits allow implementation of data formatting, filtering, buffering, error detection, and custom acceleration functions. Its 452 I/O can connect processing blocks to external memory, converters, and backplane interfaces. The Arria II GX family classification and listed 500 MHz performance point make the device relevant for designs requiring predictable hardware execution. Before implementation, confirm the available embedded memory, DSP resources, transceiver resources, I/O performance, and timing constraints; these values are not included in the supplied search results.
Recommandé
Aerospace and Defense Signal Processing
EP2AGX125EF35C5G may be evaluated for aerospace and defense signal-processing systems that require configurable, deterministic hardware and high I/O density. The verified 118,143 logic cells and 452 I/O can support sensor aggregation, format conversion, control logic, and parallel signal conditioning. The 1,152-ball FC-FBGA package enables a compact high-pin-count implementation, while the listed 0.9 V supply supports a modern low-voltage power architecture. Aerospace programs require additional verification beyond ordinary commercial FPGA selection, including temperature range, radiation or reliability documentation, configuration controls, and lifecycle status. None of those program-specific values are present in the supplied web data, so the manufacturer and authorized reliability documentation must be reviewed before any design commitment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2AGX125EF35C5G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2AGX125EF35C4G | EP2AGX125EF29I5G | EP2AGX125EF29C5G | EP2AGX125DF25C5G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Pin Compatibility | Target device | Not explicitly verified | Not explicitly verified | Not explicitly verified | Not explicitly verified |
Principaux différenciateurs
- Verified high-density Arria II GX configuration (vs EP2AGX125EF29C5G)
- Large 452-I/O interface capacity (vs EP2AGX125DF25C5G)
- 1,152-ball high-density package (vs EP2AGX125EF35C4G)
Notes de conception
Use the exact 1,152-ball package drawing to define the land pattern, ball numbering, pin map, and escape strategy. The verified package description is 1,152-ball FCBGA/FC-FBGA, and the supplied results identify ball terminals. Confirm whether the selected PCB fabricator supports the required ball pitch, via-in-pad or dog-bone escape, stack-up, and assembly process. Maintain solid reference planes and short, symmetric routing for critical clock, configuration, and high-speed interface nets.
The verified specification lists a 0.9 V supply for EP2AGX125EF35C5G, but the complete power tree is not provided in the search data. Do not design a regulator around the 0.9 V value alone. Extract all required core, I/O, auxiliary, and configuration rails from the manufacturer datasheet, then verify voltage tolerances, sequencing, maximum current, power-up behavior, and decoupling requirements. Place local bypass capacitors close to the relevant supply balls and keep the high-current return path continuous.
Because this is a high-density BGA FPGA, plan the PCB stack-up and layer assignments before schematic capture. Reserve adequate layers for power distribution, ground planes, low-speed I/O escape, and high-speed signals. Confirm the exact supported I/O standards, transceiver resources, clocking scheme, and differential-pair rules from the family documentation; these values are not present in the supplied web results. Run signal-integrity and timing simulations on critical interfaces before fabrication.
Informations de conformité
The supplied distributor snippets mention EU RoHS information but do not provide a definitive compliance declaration. REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals status are not explicitly verified.