EP2AGX190FF35I3N - Arria II GX FPGA, 181K LE, 612 I/O, FCBGA-1152 | Intel
Référence : EP2AGX190FF35I3N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1450 | $1 450,00 |
| 10 | $1390 | $13 900,00 |
| 25 | $1330 | $33 250,00 |
| 100 | $1255 | $125 500,00 |
| 250 | $1190 | $297 500,00 |
EP2AGX190FF35I3N Présentation
What is an FPGA? A Field-Programmable Gate Array is a programmable logic device that engineers configure after manufacturing using a hardware description language (HDL) such as Verilog or VHDL. FPGAs occupy the middle ground between fixed-function ASICs (high NRE cost, high volume) and microcontrollers (software-defined, lower throughput). The Arria II GX family sits in the "mid-range transceiver-equipped" tier of the Altera/Intel portfolio, between Cyclone (low-cost) and Stratix (high-performance), and is commonly used when a design needs integrated multi-gigabit transceivers without paying for full Stratix-class fabric.
Key features include integrated PCI Express Gen1/Gen2 hard IP blocks, up to 8.6 Gbps transceivers, dedicated DSP blocks for high-speed arithmetic, and on-chip memory with 9 Kbit M20K blocks. The device also provides hard memory controllers for DDR3 SDRAM and high-speed serial connectivity. Programmable logic resources reach 181,165 logic elements (LEs), supported by 1,036,800 bits of dedicated RAM.
Arria II GX architecture combines an 8-lane adaptive logic module (ALM) per LAB with rich DSP and memory resources, allowing efficient implementation of DSP pipelines and parallel processing. The 40 nm process provides a favorable logic-to-power ratio compared with the 65 nm Stratix IV generation, making the part attractive for power-constrained applications where transceiver throughput remains critical.
Typical applications include wireless baseband processing, broadcast video infrastructure, military radar and signal intelligence, medical imaging equipment, and high-speed serial protocol bridging. The combination of mid-range logic density and integrated transceivers makes it a common choice for PCI Express endpoint designs and proprietary backplane interfaces.
Designers should plan for an industrial temperature grade (-40 °C to +100 °C junction) and ensure a robust decoupling network on the 0.9 V core and 1.1 V/2.5 V/3.3 V auxiliary rails. Use the Quartus II design suite (latest service pack for Arria II GX) for synthesis, place-and-route, and timing closure; bitstream encryption and remote update via the dedicated configuration block are recommended for production.
This page synthesizes Intel distributor pricing, drop-in same-package alternatives from the Arria II family, and practical design guidance that is not collated in the manufacturer datasheet.
Alternatives de remplacement direct pour EP2AGX190FF35I3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2AGX190FF35I3N (même facteur de forme et même empreinte) — différant par Mounting Type, RoHS Status, Package, Operating Temperature, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2AGX190FF35I5N
✅ Remplacement direct✓ En stock
$1605 / unité
Voir la fiche technique →EP2AGX190FF35C7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP2AGX190FF35C6N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP2AGX190FF35I3G
✅ Remplacement direct✓ En stock
$1840 / unité
Voir la fiche technique →EP2AGX190FF35C5G
✅ Remplacement direct✓ En stock
$1245 / unité
Voir la fiche technique →EP2AGX190FF35I3N Valeurs maximales et caractéristiques électriques
| Family | Arria II GX |
| Logic Elements | 181,165 |
| Logic Array Blocks (LABs) | 7,612 |
| User I/O Pins | 612 |
| Process Technology | 40 nm TSMC low-power |
| Core Voltage | 0.9 V |
| Transceiver Speed (max) | 3.75 Gbps (data rate, per family datasheet) |
| Boîtier | 1152-ball FC-FBGA (FCBGA), 35 mm |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 °C to +100 °C (industrial, I3 grade) |
| Configuration | Serial / Parallel, supports encryption and remote update |
| Statut RoHS | Compliant (per Altera/Intel product page) |
Guide de configuration des broches du EP2AGX190FF35I3N 1152-ball fc-fbga (fcbga), 35 mm
Configuration des broches du EP2AGX190FF35I3N (boîtier 1152-ball fc-fbga (fcbga), 35 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2AGX190FF35I3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2AGX190FF35I3N convient pour 6 applications: Wireless Baseband Processing, PCI Express Endpoint Card, Broadcast Video Infrastructure, Military Radar and Signal Intelligence, Medical Imaging Equipment, High-Speed Serial Protocol Bridging.
Wireless Baseband Processing
The EP2AGX190FF35I3N's 181,165 logic elements and 7,612 LABs provide ample capacity to implement multi-carrier LTE and WiMAX PHY-layer pipelines including FFT/iFFT blocks, channel estimation, and turbo decoders. Its integrated transceivers (up to 3.75 Gbps per the Arria II GX family datasheet) handle CPRI/OBSAI fronthaul connectivity to radio units without an external PHY. Industrial-grade temperature (-40 to +100 °C) supports outdoor small-cell and macro-base-station deployment.
Recommandé
PCI Express Endpoint Card
Arria II GX integrates hard PCI Express Gen1/Gen2 IP blocks operating at 2.5/5.0 Gbps, eliminating soft-logic overhead for x1/x4/x8 endpoint designs. The 612 user I/O pins of the FF35 package give designers ample LVDS, DDR3 memory controller I/O, and general-purpose GPIO for instrumentation or data-acquisition PCIe cards. DDR3 memory controllers reach 800 MHz / 1600 Mbps, matching typical line-rate throughput requirements.
Recommandé
Broadcast Video Infrastructure
The Arria II GX transceiver performance and 3G-SDI/HD-SDI support make EP2AGX190FF35I3N well suited for broadcast routers, format converters, and video-over-IP gateways. The 181K logic elements handle multiple parallel video processing channels including scaling, de-interlacing, and color-space conversion at 1080p60 and beyond. Industrial temperature range supports un-cooled head-end chassis and outdoor transmitter sites.
Recommandé
Military Radar and Signal Intelligence
Mid-range logic density with high transceiver count suits phased-array radar beamforming and electronic-warfare SIGINT preprocessing. EP2AGX190FF35I3N handles real-time FFT, pulse compression, and DOA algorithms while streaming digitized IF to back-end processors via CPRI or 10 GbE. The industrial temperature range covers ground-mobile and shipboard applications; ruggedized variants with MIL-STD-883 processing are also available from third-party assembly houses.
Recommandé
Medical Imaging Equipment
Ultrasound, CT, and MRI front-end processors leverage the Arria II GX DSP blocks and parallel logic to run beamforming, image reconstruction, and real-time filtering. With 612 user I/O the FF35 package supports multi-channel ADC interfaces (LVDS up to 840 Mbps per pair) and DDR3 image buffers. Industrial temperature and long-life supply favor medical OEM designs with 10-15 year product cycles.
Recommandé
High-Speed Serial Protocol Bridging
Custom backplane and chip-to-chip protocols benefit from Arria II GX transceivers running proprietary or standard SERDES rates up to 3.75 Gbps. EP2AGX190FF35I3N bridges between RapidIO, Aurora, serial Fibre Channel, and custom LVDS interfaces in a single device, reducing board complexity. Industrial-grade operation supports factory-floor networking and process-control racks.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2AGX190FF35I3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2AGX190FF35I5N | EP2AGX190FF35C7N | EP2AGX190FF35C6N | EP2AGX190FF35I3G | EP2AGX190FF35C5G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (FF35, 35 mm) | 1152-ball FC-FBGA (FF35, 35 mm) - same | 1152-ball FC-FBGA (FF35, 35 mm) - same | 1152-ball FC-FBGA (FF35, 35 mm) - same | 1152-ball FC-FBGA (FF35, 35 mm) - same | 1152-ball FC-FBGA (FF35, 35 mm) - same |
| Logic Elements | 181,165 | 181,165 | 181,165 | 181,165 | 181,165 | 181,165 |
| Temperature Grade | Industrial (-40 to +100 °C) | Industrial | Commercial (0 to +85 °C) | Commercial (0 to +85 °C) | Industrial (-40 to +100 °C) | Commercial (0 to +85 °C) |
| Speed Grade | 3 | 5 (slower) | 7 (slowest) | 6 | 3 | 5 |
| LABs | 7,612 | 7,612 | 7,612 | 7,612 | 7,612 | 7,612 |
| User I/O | 612 | 612 | 612 | 612 | 612 | 612 |
| Lead-Free (Pb-Free) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (G suffix) | Yes (G suffix) |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Principaux différenciateurs
- Speed grade 3 is the fastest Arria II GX option for industrial temperature (vs EP2AGX190FF35I5N)
- Industrial temperature range supports un-cooled outdoor chassis (vs EP2AGX190FF35C6N)
- Same die and package as drop-in alternates, simplifying lifecycle planning (vs EP2AGX190EF29I5N)
Notes de conception
EP2AGX190FF35I3N requires multiple supply rails: 0.9 V core, 1.1 V PLL/auxiliary, 2.5 V/3.3 V I/O banks, and a 1.5 V/1.8 V transceiver analog supply. Use a dedicated LDO for the transceiver analog rail with <1 mV ripple; switching converters introduce phase noise that degrades SERDES jitter. Estimated: with all 612 I/O active and 50% transceiver utilization, total power consumption is approximately 8-12 W and requires 8-layer PCB with continuous power/ground planes.
The 35 mm FC-FBGA package has θJA of approximately 12 C/W with proper thermal vias and 8-layer PCB stack-up. At 10 W dissipation the junction-to-ambient rise is ~120 °C above ambient; an explicit heatsink or thermal pad is mandatory for industrial operation. Place 4 thermal vias (0.3 mm drill, 0.5 mm pad) in the central ball-grid region to conduct heat to the inner ground plane layer.
The 1.0 mm ball pitch requires microvia (laser-drilled, 0.1 mm stub) PCB technology for inner-layer escape. Avoid 1.6 mm standard vias in the BGA field; use stacked microvias. Maintain 100 Ω differential impedance for transceiver channels with reference to a continuous ground plane on layer 2. Per Arria II GX device handbook, length-matching tolerance between transceiver P and N is ±5 mil.
Do not apply power before the CONFIG_DONE pin goes high, and always observe the POR (power-on-reset) timing specified in the Arria II GX handbook (~100 ms minimum from VCC stable). Configuration failures are the most common reason for first-board failures - verify MSEL pin settings match your configuration scheme (AS, PS, JTAG, or FPP) before bringing up logic.
Informations de conformité
RoHS and REACH compliance per Intel/Altera material declaration. AEC-Q100 is not applicable (FPGA, not automotive qualified discrete). Halogen-free per JEDEC JS709B. Conflict minerals reporting on Intel's CMRT portal.
