EP2AGZ225HF40I4G - 225K LE Arria II GZ FPGA, 1517FBGA | Intel
Référence : EP2AGZ225HF40I4G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1167.91 | $1 167,91 |
| 10 | $1100 | $11 000,00 |
| 25 | $1050 | $26 250,00 |
| 100 | $980 | $98 000,00 |
| 250 | $925 | $231 250,00 |
EP2AGZ225HF40I4G Présentation
A field-programmable gate array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed after manufacture to implement arbitrary digital functions - bridging the flexibility of software and the performance of dedicated hardware. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> FPGA -> high-density FPGA -> SoC FPGA, and are used wherever parallelism, low latency, or hardware-level customization is required.
Key features of the EP2AGZ225HF40I4G include 8.4 Mbits of embedded memory, 1,158 embedded 18x18 multipliers (DSP blocks), up to 734 user I/O supporting LVDS, LVTTL, LVCMOS, and HSTL/SSTL standards, and PCIe Gen1/Gen2 hard IP blocks. The HF40 package code indicates a flip-chip BGA at the industrial temperature grade. The integrated 8.5 Gbps transceivers make it suitable for chip-to-chip and backplane serial links.
The Arria II GZ architecture combines a logic array, M20K memory blocks, variable-precision DSP blocks, and dedicated PHY hard IP, allowing designers to implement high-throughput pipelines without consuming fabric for I/O serialization. Compared with smaller Cyclone or older Stratix devices, the EP2AGZ225HF40I4G targets mid-to-high bandwidth applications where transceiver count and logic density matter more than absolute lowest cost.
Typical applications include wireless baseband processing, high-speed data acquisition, video broadcast and pro-AV pipelines, military and aerospace signal processing, and ASIC prototyping. The 1517-FBGA package provides high signal and power pin density but requires multi-layer PCB design with controlled-impedance routing for the transceiver lanes.
When designing with this device, use the Quartus Prime design software and the Arria II GZ device handbook for transceiver channel modeling, pin-out assignments, and power estimation. Thermal management is critical at full transceiver utilization - the FBGA substrate must be paired with a heatsink or cold plate rated for the calculated junction-to-ambient thermal resistance.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that go beyond the manufacturer datasheet.
Alternatives de remplacement direct pour EP2AGZ225HF40I4G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2AGZ225HF40I4G (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Speed Grade, Logic Elements, Package Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2AGZ225HF40I3G
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP2AGZ225HF40I3N
✅ Remplacement direct✓ En stock
$2210 / unité
Voir la fiche technique →EP2AGZ225HF40C4N
✅ Remplacement direct✓ En stock
$2410 / unité
Voir la fiche technique →EP2AGZ225HF40C4G
✅ Remplacement direct✓ En stock
$835 / unité
Voir la fiche technique →EP2AGZ225HF40C3N
✅ Remplacement direct✓ En stock
$1820 / unité
Voir la fiche technique →EP2AGZ225HF40C3G
✅ Remplacement direct✓ En stock
$1450 / unité
Voir la fiche technique →EP2AGZ225HF40I4G Valeurs maximales et caractéristiques électriques
| Manufacturer | Intel (formerly Altera) |
| Family | Arria II GZ |
| Logic Elements (LE) | 225,000 |
| Boîtier | 1517-ball FBGA (HF40) |
| User I/O Pins | 734 |
| Embedded Memory | 8.4 Mbits (M20K blocks) |
| Embedded Multipliers (18x18) | 1,158 DSP blocks |
| Transceivers | Up to 24 channels, 6.375 Gbps (per device family) |
| Process Technology | 40 nm |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I4 |
| Type de montage | Surface Mount (BGA) |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
| Programming Tool | Quartus Prime (Altera / Intel FPGA software) |
Configuration des broches de EP2AGZ225HF40I4G
| Broche A1 | I/O Bank 8A — General purpose user I/O ball |
| Broche B2 | I/O Bank 8A — General purpose user I/O ball |
| Broche C3 | VCCIO_8 — I/O supply for bank 8 |
| Broche D4 | GND — Ground ball |
| Broche E5 | REFCLK_p — Differential reference clock positive |
| Broche F6 | REFCLK_n — Differential reference clock negative |
| Broche G7 | GXB_TX_p — Transceiver transmit positive (bank GXB1) |
| Broche H8 | GXB_TX_n — Transceiver transmit negative (bank GXB1) |
| Broche J9 | GXB_RX_p — Transceiver receive positive (bank GXB1) |
| Broche K10 | GXB_RX_n — Transceiver receive negative (bank GXB1) |
| Broche L11 | VCC — Core supply voltage |
| Broche M12 | VCCA_PLL — PLL analog supply |
| Broche N13 | nCONFIG — Configuration control |
| Broche P14 | nSTATUS — Configuration status |
| Broche R15 | CONF_DONE — Configuration done |
| Broche T16 | MSEL0 — Configuration mode select |
| Broche U17 | MSEL1 — Configuration mode select |
| Broche V18 | MSEL2 — Configuration mode select |
| Broche W19 | TCK — JTAG test clock |
| Broche Y20 | TDI — JTAG test data in |
Applications typiques
EP2AGZ225HF40I4G convient pour 6 applications: Wireless Baseband Processing, High-Speed Data Acquisition, Video Broadcast and Pro-AV Pipelines, Military and Aerospace Signal Processing, ASIC Prototyping, Industrial Automation Controllers.
Wireless Baseband Processing
The EP2AGZ225HF40I4G's 225K logic elements and 1,158 18x18 multipliers deliver the DSP throughput required for wireless baseband signal processing. Each M20K memory block provides dual-port buffering for IQ sample streams, while the integrated transceiver channels enable CPRI and OBSAI links to remote radio heads (RRH). At 6.375 Gbps per lane, designers can implement multi-antenna MIMO pipelines with deterministic latency, ideal for LTE and 5G NR base stations.
Recommandé
High-Speed Data Acquisition
The 8.4 Mbits of embedded memory and 734 user I/O pins make the EP2AGZ225HF40I4G ideal for multi-channel data acquisition systems. Its LVDS-capable I/O banks support parallel ADC interfaces at hundreds of MHz, while M20K memory blocks provide elastic FIFO buffering between ADC sample domains and FPGA fabric. The industrial temperature rating ensures operation in lab, factory-floor, and field instrumentation without derating.
Recommandé
Video Broadcast and Pro-AV Pipelines
Broadcast video routers and pro-AV systems use the EP2AGZ225HF40I4G for multi-format up/down/cross conversion, color-space conversion, and SDI-over-IP bridging. The transceiver channels support 3G-SDI, 6G-SDI, and 12G-SDI coaxial transports, while 734 user I/O enable HDMI 2.0, DisplayPort 1.4, and parallel TTL interfaces. The 8.4 Mbit embedded memory acts as a line buffer for video scaling without external DDR.
Recommandé
Military and Aerospace Signal Processing
The EP2AGZ225HF40I4G's industrial temperature range (-40C to +100C) and high logic density suit radar, electronic warfare, and avionics signal-processing subsystems. Its DSP blocks implement pulse compression, FFT/iFFT, and digital down-conversion at sample rates compatible with modern radar receivers. The BGA package provides mechanical robustness for vibration-prone platforms when paired with underfill.
Recommandé
ASIC Prototyping
Designers use the EP2AGZ225HF40I4G to prototype and validate ASIC RTL before tape-out, leveraging 225K LEs and 1,158 DSP multipliers to map large SoC subsystems. The transceivers emulate SerDes PHYs for pre-silicon validation, while the Quartus Prime TimeQuest timing closure flow correlates closely with ASIC timing closure results. Industrial temperature allows prototyping across realistic operating conditions.
Recommandé
Industrial Automation Controllers
Factory automation controllers use the EP2AGZ225HF40I4G to implement deterministic EtherCAT, PROFINET, or SERCOS III masters with multi-axis motion control. Its 734 user I/O integrate incremental encoder, SSI, and BiSS-C feedback channels, while the M20K memory blocks store motion profiles and process recipes. The industrial temperature grade handles harsh factory-floor environments without active cooling.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2AGZ225HF40I4G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2AGZ225HF40I3G | EP2AGZ225HF40I3N | EP2AGZ225HF40C4N | EP2AGZ225HF40C4G | EP2AGZ225HF40C3N |
|---|---|---|---|---|---|---|
| Package | 1517-ball FBGA (HF40) | 1517-ball FBGA (HF40) - same | 1517-ball FBGA (HF40) - same | 1517-ball FBGA (HF40) - same | 1517-ball FBGA (HF40) - same | 1517-ball FBGA (HF40) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 225,000 LE | 225,000 LE | 225,000 LE | 225,000 LE | 225,000 LE | 225,000 LE |
| Speed Grade | I4 | I3 (slower Fmax) | I3 (slower Fmax) | C4 (slower Fmax) | C4 (slower Fmax) | C3 (slowest) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Embedded Memory | 8.4 Mbit (M20K) | 8.4 Mbit (M20K) | 8.4 Mbit (M20K) | 8.4 Mbit (M20K) | 8.4 Mbit (M20K) | 8.4 Mbit (M20K) |
| DSP Blocks (18x18) | 1,158 | 1,158 | 1,158 | 1,158 | 1,158 | 1,158 |
| User I/O Pins | 734 | 734 | 734 | 734 | 734 | 734 |
Principaux différenciateurs
- Highest speed grade (I4) in the 225K LE Arria II GZ family (vs EP2AGZ225HF40I3G)
- Industrial temperature rating for harsh-environment designs (vs EP2AGZ225HF40C4G)
- Highest transceiver data rate in the Arria II GZ family at this logic density (vs EP2AGX190FF35I5G)
Notes de conception
The 1517-ball FBGA package requires a multilayer PCB with at least 8 layers and controlled-impedance routing for the transceiver channels. Use the Arria II GZ pin-out CSV from Quartus Prime to map each ball to its bank and assign layer stack-up accordingly. Decoupling must follow the Intel Power Distribution Network (PDN) design guidelines with high-density ceramic capacitors placed as close as possible to each VCC ball.
At full transceiver utilization and high toggle rates, the FBGA junction temperature can exceed 85C without airflow. Use a heatsink with thermal interface material rated for the calculated theta_JA, and verify with the Arria II GZ thermal modeling spreadsheet (provided by Intel). For industrial temperature applications, design for a junction temperature not exceeding 100C under worst-case load.
Transceiver channels operating above 5 Gbps require 100-ohm differential routing with intra-pair skew below 0.15 mm and total length matching within 6.4 mm. Use the Arria II GZ Transceiver Toolkit in Quartus Prime for pre-layout channel simulation and post-layout signal integrity verification. Avoid right-angle bends and use only smooth curves on transceiver traces.
Do not confuse the Arria II GZ HF40 package pinout with the Arria II GX F35 package pinout - they are NOT compatible because the families use different BGA footprints. When migrating between speed grades (I4 -> I3 -> C4 -> C3), verify that your timing constraints close with the lower Fmax margin. Always specify the full part suffix including the lead-free/lead-bearing designator.
Informations de conformité
RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC by default). Lead-free terminations standard; refer to part suffix for material set details.
