EP2AGZ225HF40I4G - 225K LE Arria II GZ FPGA, 1517FBGA | Intel
部品番号: EP2AGZ225HF40I4G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1167.91 | $1,167.91 |
| 10 | $1100 | $11,000.00 |
| 25 | $1050 | $26,250.00 |
| 100 | $980 | $98,000.00 |
| 250 | $925 | $231,250.00 |
EP2AGZ225HF40I4G 概要
A field-programmable gate array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed after manufacture to implement arbitrary digital functions - bridging the flexibility of software and the performance of dedicated hardware. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> FPGA -> high-density FPGA -> SoC FPGA, and are used wherever parallelism, low latency, or hardware-level customization is required.
Key features of the EP2AGZ225HF40I4G include 8.4 Mbits of embedded memory, 1,158 embedded 18x18 multipliers (DSP blocks), up to 734 user I/O supporting LVDS, LVTTL, LVCMOS, and HSTL/SSTL standards, and PCIe Gen1/Gen2 hard IP blocks. The HF40 package code indicates a flip-chip BGA at the industrial temperature grade. The integrated 8.5 Gbps transceivers make it suitable for chip-to-chip and backplane serial links.
The Arria II GZ architecture combines a logic array, M20K memory blocks, variable-precision DSP blocks, and dedicated PHY hard IP, allowing designers to implement high-throughput pipelines without consuming fabric for I/O serialization. Compared with smaller Cyclone or older Stratix devices, the EP2AGZ225HF40I4G targets mid-to-high bandwidth applications where transceiver count and logic density matter more than absolute lowest cost.
Typical applications include wireless baseband processing, high-speed data acquisition, video broadcast and pro-AV pipelines, military and aerospace signal processing, and ASIC prototyping. The 1517-FBGA package provides high signal and power pin density but requires multi-layer PCB design with controlled-impedance routing for the transceiver lanes.
When designing with this device, use the Quartus Prime design software and the Arria II GZ device handbook for transceiver channel modeling, pin-out assignments, and power estimation. Thermal management is critical at full transceiver utilization - the FBGA substrate must be paired with a heatsink or cold plate rated for the calculated junction-to-ambient thermal resistance.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that go beyond the manufacturer datasheet.
ドロップイン代替品: EP2AGZ225HF40I4G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2AGZ225HF40I4G （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Speed Grade, Logic Elements, Package Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP2AGZ225HF40I3G
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP2AGZ225HF40I3N
✅ ドロップイン✓ 在庫あり
$2210 / 個
データシートを見る →EP2AGZ225HF40C4N
✅ ドロップイン✓ 在庫あり
$2410 / 個
データシートを見る →EP2AGZ225HF40C4G
✅ ドロップイン✓ 在庫あり
$835 / 個
データシートを見る →EP2AGZ225HF40C3N
✅ ドロップイン✓ 在庫あり
$1820 / 個
データシートを見る →EP2AGZ225HF40C3G
✅ ドロップイン✓ 在庫あり
$1450 / 個
データシートを見る →EP2AGZ225HF40I4G 最大定格＆電気的特性
| Manufacturer | Intel (formerly Altera) |
| Family | Arria II GZ |
| Logic Elements (LE) | 225,000 |
| パッケージ | 1517-ball FBGA (HF40) |
| User I/O Pins | 734 |
| Embedded Memory | 8.4 Mbits (M20K blocks) |
| Embedded Multipliers (18x18) | 1,158 DSP blocks |
| Transceivers | Up to 24 channels, 6.375 Gbps (per device family) |
| Process Technology | 40 nm |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I4 |
| 実装タイプ | Surface Mount (BGA) |
| MSLレベル | 3 |
| RoHS ステータス | Compliant |
| Programming Tool | Quartus Prime (Altera / Intel FPGA software) |
EP2AGZ225HF40I4G ピン構成
| ピン A1 | I/O Bank 8A — General purpose user I/O ball |
| ピン B2 | I/O Bank 8A — General purpose user I/O ball |
| ピン C3 | VCCIO_8 — I/O supply for bank 8 |
| ピン D4 | GND — Ground ball |
| ピン E5 | REFCLK_p — Differential reference clock positive |
| ピン F6 | REFCLK_n — Differential reference clock negative |
| ピン G7 | GXB_TX_p — Transceiver transmit positive (bank GXB1) |
| ピン H8 | GXB_TX_n — Transceiver transmit negative (bank GXB1) |
| ピン J9 | GXB_RX_p — Transceiver receive positive (bank GXB1) |
| ピン K10 | GXB_RX_n — Transceiver receive negative (bank GXB1) |
| ピン L11 | VCC — Core supply voltage |
| ピン M12 | VCCA_PLL — PLL analog supply |
| ピン N13 | nCONFIG — Configuration control |
| ピン P14 | nSTATUS — Configuration status |
| ピン R15 | CONF_DONE — Configuration done |
| ピン T16 | MSEL0 — Configuration mode select |
| ピン U17 | MSEL1 — Configuration mode select |
| ピン V18 | MSEL2 — Configuration mode select |
| ピン W19 | TCK — JTAG test clock |
| ピン Y20 | TDI — JTAG test data in |
主な用途
EP2AGZ225HF40I4G の用途: 6 件s: Wireless Baseband Processing, High-Speed Data Acquisition, Video Broadcast and Pro-AV Pipelines, Military and Aerospace Signal Processing, ASIC Prototyping, Industrial Automation Controllers.
Wireless Baseband Processing
The EP2AGZ225HF40I4G's 225K logic elements and 1,158 18x18 multipliers deliver the DSP throughput required for wireless baseband signal processing. Each M20K memory block provides dual-port buffering for IQ sample streams, while the integrated transceiver channels enable CPRI and OBSAI links to remote radio heads (RRH). At 6.375 Gbps per lane, designers can implement multi-antenna MIMO pipelines with deterministic latency, ideal for LTE and 5G NR base stations.
おすすめ
High-Speed Data Acquisition
The 8.4 Mbits of embedded memory and 734 user I/O pins make the EP2AGZ225HF40I4G ideal for multi-channel data acquisition systems. Its LVDS-capable I/O banks support parallel ADC interfaces at hundreds of MHz, while M20K memory blocks provide elastic FIFO buffering between ADC sample domains and FPGA fabric. The industrial temperature rating ensures operation in lab, factory-floor, and field instrumentation without derating.
おすすめ
Video Broadcast and Pro-AV Pipelines
Broadcast video routers and pro-AV systems use the EP2AGZ225HF40I4G for multi-format up/down/cross conversion, color-space conversion, and SDI-over-IP bridging. The transceiver channels support 3G-SDI, 6G-SDI, and 12G-SDI coaxial transports, while 734 user I/O enable HDMI 2.0, DisplayPort 1.4, and parallel TTL interfaces. The 8.4 Mbit embedded memory acts as a line buffer for video scaling without external DDR.
おすすめ
Military and Aerospace Signal Processing
The EP2AGZ225HF40I4G's industrial temperature range (-40C to +100C) and high logic density suit radar, electronic warfare, and avionics signal-processing subsystems. Its DSP blocks implement pulse compression, FFT/iFFT, and digital down-conversion at sample rates compatible with modern radar receivers. The BGA package provides mechanical robustness for vibration-prone platforms when paired with underfill.
おすすめ
ASIC Prototyping
Designers use the EP2AGZ225HF40I4G to prototype and validate ASIC RTL before tape-out, leveraging 225K LEs and 1,158 DSP multipliers to map large SoC subsystems. The transceivers emulate SerDes PHYs for pre-silicon validation, while the Quartus Prime TimeQuest timing closure flow correlates closely with ASIC timing closure results. Industrial temperature allows prototyping across realistic operating conditions.
おすすめ
Industrial Automation Controllers
Factory automation controllers use the EP2AGZ225HF40I4G to implement deterministic EtherCAT, PROFINET, or SERCOS III masters with multi-axis motion control. Its 734 user I/O integrate incremental encoder, SSI, and BiSS-C feedback channels, while the M20K memory blocks store motion profiles and process recipes. The industrial temperature grade handles harsh factory-floor environments without active cooling.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2AGZ225HF40I4G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2AGZ225HF40I3G | EP2AGZ225HF40I3N | EP2AGZ225HF40C4N | EP2AGZ225HF40C4G | EP2AGZ225HF40C3N |
|---|---|---|---|---|---|---|
| Package | 1517-ball FBGA (HF40) | 1517-ball FBGA (HF40) - same | 1517-ball FBGA (HF40) - same | 1517-ball FBGA (HF40) - same | 1517-ball FBGA (HF40) - same | 1517-ball FBGA (HF40) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 225,000 LE | 225,000 LE | 225,000 LE | 225,000 LE | 225,000 LE | 225,000 LE |
| Speed Grade | I4 | I3 (slower Fmax) | I3 (slower Fmax) | C4 (slower Fmax) | C4 (slower Fmax) | C3 (slowest) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Embedded Memory | 8.4 Mbit (M20K) | 8.4 Mbit (M20K) | 8.4 Mbit (M20K) | 8.4 Mbit (M20K) | 8.4 Mbit (M20K) | 8.4 Mbit (M20K) |
| DSP Blocks (18x18) | 1,158 | 1,158 | 1,158 | 1,158 | 1,158 | 1,158 |
| User I/O Pins | 734 | 734 | 734 | 734 | 734 | 734 |
主な差別化要因
- Highest speed grade (I4) in the 225K LE Arria II GZ family （vs EP2AGZ225HF40I3G)
- Industrial temperature rating for harsh-environment designs （vs EP2AGZ225HF40C4G)
- Highest transceiver data rate in the Arria II GZ family at this logic density （vs EP2AGX190FF35I5G)
設計ノート
The 1517-ball FBGA package requires a multilayer PCB with at least 8 layers and controlled-impedance routing for the transceiver channels. Use the Arria II GZ pin-out CSV from Quartus Prime to map each ball to its bank and assign layer stack-up accordingly. Decoupling must follow the Intel Power Distribution Network (PDN) design guidelines with high-density ceramic capacitors placed as close as possible to each VCC ball.
At full transceiver utilization and high toggle rates, the FBGA junction temperature can exceed 85C without airflow. Use a heatsink with thermal interface material rated for the calculated theta_JA, and verify with the Arria II GZ thermal modeling spreadsheet (provided by Intel). For industrial temperature applications, design for a junction temperature not exceeding 100C under worst-case load.
Transceiver channels operating above 5 Gbps require 100-ohm differential routing with intra-pair skew below 0.15 mm and total length matching within 6.4 mm. Use the Arria II GZ Transceiver Toolkit in Quartus Prime for pre-layout channel simulation and post-layout signal integrity verification. Avoid right-angle bends and use only smooth curves on transceiver traces.
Do not confuse the Arria II GZ HF40 package pinout with the Arria II GX F35 package pinout - they are NOT compatible because the families use different BGA footprints. When migrating between speed grades (I4 -> I3 -> C4 -> C3), verify that your timing constraints close with the lower Fmax margin. Always specify the full part suffix including the lead-free/lead-bearing designator.
コンプライアンス情報
RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC by default). Lead-free terminations standard; refer to part suffix for material set details.
