EP2S130F1020C5NRB - Stratix II FPGA, 132K LE, 1020-FBGA | Intel
Référence : EP2S130F1020C5NRB ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1750 | $17 500,00 |
| 50 | $1620 | $81 000,00 |
| 100 | $1480 | $148 000,00 |
| 250 | $1395 | $348 750,00 |
EP2S130F1020C5NRB Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit in the broader taxonomy of programmable logic devices (PLD), evolving from simple PAL/GAL devices toward complex SoC-class chips. FPGAs are widely used for ASIC prototyping, parallel DSP, custom I/O interfacing, and hardware acceleration in networking, video, and industrial systems where time-to-market and reconfigurability outweigh the per-unit cost of an ASIC.
Key features of the EP2S130F1020C5NRB include up to 742 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), embedded DSP blocks for high-throughput arithmetic, dedicated clock management with up to 12 PLLs, and a hard memory controller interface. The C5 speed grade and commercial 0C to +85C operating temperature make this variant suitable for laboratory, telecom, and embedded computing environments.
The Stratix II architecture introduced adaptive logic modules (ALMs) that combine the traditional 4-input LUT with dedicated arithmetic and carry-chain hardware, increasing effective logic density versus previous-generation FPGAs. The 1020-FBGA package provides high I/O density with controlled-impedance signal routing, but requires careful PCB layout with microvia or via-in-pad technology and matched-length traces for high-speed signals.
Typical applications include high-speed data acquisition systems, telecom baseband and channel-card designs, video broadcast and image processing pipelines, ASIC prototyping, military and aerospace signal processing (when the I-grade variant is selected), and high-performance DSP compute nodes. The 1020-FBGA footprint is shared across the Stratix II family, allowing drop-in migration between EP2S30, EP2S60, EP2S90, and EP2S130 density points within the same package.
When designing with this device, allocate at least 4 PCB layers for power and ground, use a 1.0 mm pitch BGA land pattern with microvias, and follow Intel AN 461 for power-rail decoupling. Thermal management requires thermal vias under the package center array and adequate airflow at full operating speed.
This page synthesizes distributor pricing, drop-in same-package Stratix II alternatives, and practical high-density FPGA layout guidance not found in the standalone manufacturer datasheet.
Alternatives de remplacement direct pour EP2S130F1020C5NRB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2S130F1020C5NRB (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Mounting Type, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2S130F1020C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1320 / unité
Voir la fiche technique →EP2S130F1020C5
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4100 / unité
Voir la fiche technique →EP2S130F1020C5ES
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1380 / unité
Voir la fiche technique →EP2S130F1020C4RB
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1310 / unité
Voir la fiche technique →EP2S130F1020C3NRB
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1245 / unité
Voir la fiche technique →EP2S130F1020C5NRB Valeurs maximales et caractéristiques électriques
| Series | Stratix II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 132,540 |
| Embedded Memory Bits | 6,747,840 |
| Total RAM Bits | 6,747,840 |
| User I/O Count | 742 |
| Boîtier | 1020-FBGA (33x33 mm) |
| Supplier Device Package | 1020-FBGA, 1.0 mm pitch |
| Type de montage | Surface Mount (BGA) |
| Core Voltage Supply | 1.15 V to 1.25 V |
| Température de fonctionnement | 0C to +85C (commercial) |
| Speed Grade | C5 |
| Statut RoHS | Compliant (verified via distributor listings) |
| Packaging | Tray |
| Process Technology | 90 nm |
Guide de configuration des broches du EP2S130F1020C5NRB 1020-fbga, 1.0 mm pitch
Configuration des broches du EP2S130F1020C5NRB (boîtier 1020-fbga, 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2S130F1020C5NRB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2S130F1020C5NRB convient pour 6 applications: ASIC Prototyping, High-Speed Telecom Baseband, Video Broadcast Processing, High-Performance DSP Compute, Military & Aerospace Signal Processing, Network Interface Card / Acceleration.
ASIC Prototyping
The EP2S130F1020C5NRB's 132,540 logic elements and 6,747,840 RAM bits provide ample capacity to prototype mid-to-large ASICs (500K-1M gate-class) in a single FPGA, cutting engineering risk before tape-out. Quartus II synthesis flow with TimeQuest timing closure maps ASIC RTL directly into Stratix II ALMs with comparable pre-silicon validation. The 742 user I/O pins allow full perimeter visibility for bring-up, and the C5 speed grade with 1.15-1.25 V core gives predictable timing margin for pre-layout feasibility studies on telecom, networking, and DSP ASICs.
Recommandé
High-Speed Telecom Baseband
Telecom baseband line cards running at multi-Gbps rates benefit from the EP2S130F1020C5NRB's combination of 742 LVDS-capable user I/O, embedded DSP blocks, and 12 PLLs for jitter-clean clock synthesis. The 1020-FBGA package exposes enough I/O for parallel multi-lane SERDES-style interconnect with external PHY devices, while the 6.7 Mbit embedded memory holds large FFT twiddle tables and channel-state buffers. Designers typically pair this FPGA with external DDR2/QDR-II SRAM for ping-pong buffering in WCDMA/LTE PHY designs.
Recommandé
Video Broadcast Processing
The EP2S130F1020C5NRB handles multi-stream HD-SDI/3G-SDI video processing, color-space conversion, and frame-rate conversion with line-rate performance impossible to achieve on DSPs. Its 132K LEs support dozens of FIR scalers and chroma-key compositors in parallel, while 6.7 Mbit embedded RAM buffers scan-line data without external SRAM round-trips. The 742 I/O accommodate parallel BT.1120/BT.656 video buses plus 10GigE or HDMI companion chips; 1020-FBGA routing keeps high-speed traces short.
Recommandé
High-Performance DSP Compute
Stratix II embedded DSP blocks at 250 MHz deliver up to ~64 GMACs of multiply-accumulate throughput in the EP2S130F1020C5NRB, suitable for radar beamforming, software-defined radio, and seismic processing front-ends. The device fits multi-antenna MIMO matrices or 4096-point FFT pipelines with comfortable margin, and 6.7 Mbit embedded memory holds FIR coefficient banks on-chip. Designers choose C5 speed grade for low-power industrial nodes and C3/C4 for maximum sample-rate military/aerospace SDR.
Recommandé
Military & Aerospace Signal Processing
While the EP2S130F1020C5NRB is commercial temperature, the same Stratix II die is offered in industrial and military grades under separate suffixes. Defense prime contractors use the 1020-FBGA package for compact VPX/OpenVPX signal-processing payloads where size, weight, and power (SWaP) drive part selection. Mission computers pair this FPGA with multi-gigabit serial links and ECC-protected SRAM for radar, electronic-warfare, and SIGINT workloads requiring deterministic throughput.
Recommandé
Network Interface Card / Acceleration
Datacenter NICs and storage accelerators leverage the EP2S130F1020C5NRB's 742 user I/O and embedded RAM to implement custom packet-processing pipelines, RDMA offload, or NVMe controller logic. PCIe hard IP (in supporting Stratix II variants) and abundant LVDS pairs let the device pair with 10/40/100GbE PHYs and SAS expanders. The 1020-FBGA footprint also enables dense lane-count routing on standard server-PCB stack-ups while maintaining signal-integrity margins on multi-GHz SerDes paths.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2S130F1020C5NRB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2S130F1020C5N | EP2S130F1020C5 | EP2S130F1020C5ES | EP2S130F1020C4RB | EP2S130F1020C3NRB |
|---|---|---|---|---|---|---|
| Package | 1020-FBGA (33x33) | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Embedded RAM Bits | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 |
| User I/O Pins | 742 | 742 | 742 | 742 | 742 | 742 |
| Speed Grade | C5 | C5 | C5 | C5 | C4 (faster) | C3 (fastest) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
Principaux différenciateurs
- Highest-density Stratix II member in 1020-FBGA (vs EP2S90F1020C5N)
- 742 user I/O pins support multi-protocol fan-out (vs EP2S60F1020C5N)
- C5 speed grade offers widest timing margin (vs EP2S130F1020C3NRB)
Notes de conception
Use a minimum 4-layer PCB with continuous ground and power planes beneath the 1020-FBGA footprint. The 1.0 mm BGA pitch requires microvia or via-in-pad technology (laser-drilled microvias preferred) to fan out to inner routing layers. Match trace lengths for DDR2/QDR-II and LVDS pairs per the Stratix II Device Handbook, and place reference planes unbroken beneath all high-speed signals. Intel AN 461 provides stack-up and decoupling guidance specific to 1020-FBGA packages.
The 1020-FBGA has limited top-side cooling area; provide a thermal via array under the package center BGA balls to conduct heat to the inner/outer ground planes. At full DSP utilization (~70% toggle rate) and 250 MHz, expect 4-6 W typical dissipation; commercial-temperature operation requires case-to-ambient thermal resistance below 10 C/W to maintain junction within spec. Add a heatsink or 200 LFM airflow for production deployment.
Do not omit the free-running clock input to the FPGA - even unused PLL inputs must be tied to a stable reference to prevent PLL self-oscillation during configuration. Verify that all I/O banks have correct VCCIO voltage before JTAG configuration - mismatched VCCIO can permanently damage the I/O cells. Always read the Quartus II pin-planner output before PCB fabrication; hand-typed pin assignments almost always contain errors on 1020-BGA parts.
Estimated: a Stratix II EP2S130 design at 1.20 V core with 50% toggle activity at 200 MHz draws approximately 2.5-3.5 A from VCCINT and 0.3-0.8 A from each active VCCIO bank. Designers should budget 5 A continuous and 8 A peak from a buck regulator with 1.5% accuracy; use bulk ceramic capacitors (4-6x 22 uF X5R) at the package plus 0.1 uF + 10 nF at every supply pin. The auxiliary VCCPD programming voltage pin must be ramped correctly to avoid configuration failure.
Informations de conformité
RoHS compliance verified from distributor listings. Halogen-free status not explicitly listed in verified data. AEC-Q100 not applicable for commercial-grade FPGA.
