EP2S130F1020C5 - 132K LEs, 742 I/O, 1020-BGA Stratix II FPGA | Intel
Référence : EP2S130F1020C5 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5630.89 | $5 630,89 |
| 10 | $5350 | $53 500,00 |
| 50 | $4890 | $244 500,00 |
| 100 | $4500 | $450 000,00 |
| 250 | $4100 | $1 025 000,00 |
EP2S130F1020C5 Présentation
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits using a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers. FPGAs occupy the highest tier of programmable logic in the semiconductor hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are reprogrammable in the field, making them ideal for prototyping, low-volume production, and applications with evolving standards.
The EP2S130F1020C5 is built on a 1.2 V, 90 nm all-layer copper SRAM process and supports internal clock rates up to 609.76 MHz. Key features include 252 dedicated 18x18 multipliers for DSP workloads, adaptive logic modules (ALMs) replacing traditional 4-input LUTs, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates high-speed DSP blocks, TriMatrix embedded memory blocks, and up to 12 dedicated clock pins with PLL support.
At the architectural level, the Stratix II family introduced ALMs that combine adaptive look-up tables (ALUTs) with adjacent logic, increasing effective logic density and timing predictability. The EP2S130F1020C5 supports DDR2 memory interfaces, SERDES-based gigabit transceivers, and external memory interfaces via dedicated DQS logic, making it well suited for data-path intensive designs.
Typical applications include high-performance digital signal processing, telecommunications baseband processing, video broadcast equipment, ASIC prototyping, and high-throughput data acquisition systems. The 742 I/O count also enables use as a system-on-chip (SoC) integration platform for industrial and medical imaging equipment.
When designing with this device, ensure 1.2 V core and 3.3 V/2.5 V/1.8 V auxiliary supplies are properly decoupled near the BGA balls. Thermal management is critical: at maximum toggle rate, junction temperature may require forced airflow. The 1020-ball FC-FBGA package requires Xilinx/Altera or third-party reflow profiling and an 8-layer or thicker PCB with microvia stack-ups for breakout routing.
This page synthesizes distributor pricing, drop-in alternatives within the Stratix II family, and practical design notes not found on a single datasheet page.
Alternatives de remplacement direct pour EP2S130F1020C5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2S130F1020C5 (même facteur de forme et même empreinte) — différant par Speed Grade, Operating Temperature, Package, RoHS Status, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2S130F1020C4
✅ Remplacement direct✓ En stock
$2800 / unité
Voir la fiche technique →EP2S130F1020C4N
✅ Remplacement direct✓ En stock
$2850 / unité
Voir la fiche technique →EP2S130F1020C3
✅ Remplacement direct✓ En stock
$1295 / unité
Voir la fiche technique →EP2S130F1020C3N
✅ Remplacement direct✓ En stock
$1095 / unité
Voir la fiche technique →EP2S130F1020C5G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP2S130F1020C4RB
✅ Remplacement direct✓ En stock
$1310 / unité
Voir la fiche technique →EP2S130F1020C3NRB
✅ Remplacement direct✓ En stock
$1245 / unité
Voir la fiche technique →EP2S130F1020C3NGA
✅ Remplacement direct✓ En stock
$1395 / unité
Voir la fiche technique →EP2S130F1020C5 Valeurs maximales et caractéristiques électriques
| Family | Stratix II |
| Logic Elements (LE) | 132,540 |
| Embedded Memory (bits) | 6,747,840 |
| User I/O Pins | 742 |
| Operating Frequency (max) | 609.76 MHz |
| Process Technology | 90 nm CMOS, all-layer copper |
| Core Voltage | 1.2 V |
| Number of Multipliers (18x18) | 252 |
| Boîtier | 1020-ball FC-FBGA |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (commercial) |
| Speed Grade | 5 |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
Guide de configuration des broches du EP2S130F1020C5 1020-ball fc-fbga
Configuration des broches du EP2S130F1020C5 (boîtier 1020-ball fc-fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2S130F1020C5.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2S130F1020C5 convient pour 6 applications: ASIC Prototyping and Emulation, Telecommunications Baseband Processing, High-Performance Digital Signal Processing, Video Broadcast and Imaging Equipment, Industrial Control and Factory Automation, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP2S130F1020C5's 132,540 logic elements and 6,747,840 bits of TriMatrix embedded memory make it well suited to ASIC prototyping and hardware emulation. Designers can map multi-million-gate ASICs onto a single Stratix II device, using the ALM-based logic fabric to preserve original ASIC timing. The 742 user I/O pins permit partitioning large designs across multiple FPGAs with high-bandwidth interconnect, and the 252 dedicated 18x18 multipliers accelerate DSP-heavy emulation workloads like CPU pipeline verification. Compared with newer Agilex devices, the EP2S130F1020C5 offers mature Quartus II tool support and abundant third-party IP cores for legacy ASIC verification flows.
Recommandé
Telecommunications Baseband Processing
The EP2S130F1020C5's 252 DSP blocks and 609.76 MHz internal clock deliver up to ~224 GMACS, enabling real-time baseband processing for WCDMA, LTE, and WiMAX systems. Combined with 742 I/O pins supporting LVDS and HSTL interfaces, the device can connect to multiple ADC/DAC channels, digital up/down converters, and SERDES-based framer ICs. The Stratix II TriMatrix memory provides low-latency buffering for symbol-rate processing, while the dedicated PLL network supports multi-clock-domain designs typical of radio base stations. For new 5G designs, Intel recommends migrating to Stratix 10 or Agilex, but the EP2S130F1020C5 remains deployed in installed 3G/4G infrastructure.
Recommandé
High-Performance Digital Signal Processing
Engineers deploy the EP2S130F1020C5 in DSP-intensive applications including real-time FFT processing, video transcoding, radar signal processing, and software-defined radio (SDR). The combination of 252 18x18 multipliers and 6.7 Mbits of embedded memory supports block-convolution, FIR filtering, and FFT butterfly operations at sample rates above 200 MHz. The ALM architecture provides fine-grained logic utilization, reducing wasted resources in irregular DSP data paths. The 1.2 V 90 nm process gives a favorable performance-per-watt ratio for legacy DSP boards in industrial and military systems where power budgets are constrained but raw DSP throughput is essential.
Recommandé
Video Broadcast and Imaging Equipment
The EP2S130F1020C5 supports multiple video standards simultaneously through its high I/O count and embedded memory bandwidth. Broadcast equipment such as SDI routers, video format converters, and multi-channel encoders leverage the device's 742 I/O to ingest and egress parallel video streams at rates up to 148.5 MHz per LVDS pair. The 6.7 Mbits of TriMatrix memory provides line, frame, and field buffers for deinterlacing, scaling, and chroma conversion. Industrial medical imaging systems also benefit from the deterministic latency of dedicated DSP blocks when processing ultrasound, CT, or MRI data streams in real time.
Recommandé
Industrial Control and Factory Automation
Industrial automation systems use the EP2S130F1020C5 as a high-speed deterministic controller for multi-axis motion control, machine vision inspection, and protocol bridging. The 742 I/O pins interface with industrial fieldbuses (EtherCAT, Profinet, CAN) through dedicated PHY ICs while the embedded processors (Nios II soft-core or ARM hard cores in later Stratix families) handle real-time control loops. The 1020-ball FC-FBGA package provides the mechanical robustness required for industrial temperature operation when paired with appropriate thermal management. Many existing PLC and SCADA platforms continue to deploy the EP2S130F1020C5 in long-lifecycle installations where re-validation costs are prohibitive.
Recommandé
Test and Measurement Instrumentation
Test equipment manufacturers deploy the EP2S130F1020C5 in high-end oscilloscopes, logic analyzers, and protocol testers where its 609.76 MHz internal clock and 6.7 Mbits of embedded memory enable deep capture buffers and real-time pattern generation. The dedicated PLL network supports precise trigger timing and frequency synthesis across multiple acquisition channels. The 742 I/O pins accommodate parallel LVDS acquisition buses at sample rates above 1 GSPS when combined with external ADC front-ends. For new T&M designs, the EP2S130F1020C5 remains a cost-effective mature platform with extensive reference designs and IP libraries available from Altera's design resources.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2S130F1020C5 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2S130F1020C4 | EP2S130F1020C3 | EP2S130F1020C5G | EP2S130F1020C4N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) |
| Logic Elements | 132,540 LEs | 132,540 LEs (same) | 132,540 LEs (same) | 132,540 LEs (same) | 132,540 LEs (same) |
| Embedded Memory | 6,747,840 bits | 6,747,840 bits (same) | 6,747,840 bits (same) | 6,747,840 bits (same) | 6,747,840 bits (same) |
| User I/O | 742 | 742 (same) | 742 (same) | 742 (same) | 742 (same) |
| Speed Grade | C5 (slower) | C4 (faster) | C3 (fastest) | C5 (same) | C4 (faster) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
Principaux différenciateurs
- C5 speed grade is the slowest Stratix II F1020 variant (vs EP2S130F1020C4)
- Same die and package as all other EP2S130F1020 variants (vs EP2S130F1020C5G)
- Smaller BGA than F1508 sibling, easier PCB layout (vs EP2S130F1508C5)
Notes de conception
The EP2S130F1020C5 in a 1020-ball FC-FBGA at high toggle rates can dissipate 5-10 W depending on utilization. Estimated: at 50% toggle rate and 85C ambient, junction-to-ambient thermal resistance requires either forced airflow (>= 200 LFM) or a heatsink with thermal interface material. The FC-BGA bottom must NOT be soldered to a thermal pad (it has center balls); use a top-mounted heatsink with epoxy or clip attachment.
The 1020-ball FC-FBGA at 1.0 mm pitch requires an 8-layer or thicker PCB with laser-drilled microvias for breakout. Signal layers must use 50 ohm controlled impedance for LVDS pairs. Decoupling capacitors (0.1 uF, 1 uF, 10 uF) should be placed within 100 mil of the BGA balls, with vias to inner ground/power planes. Multiple VTT termination resistors are required for DDR2 interfaces.
Stratix II EP2S130F1020C5 requires 1.2 V core, 3.3 V/2.5 V/1.8 V VCCIO banks, separate VCC_PLL for analog PLL supply, and VCCPD for pre-drivers. Estimated: full design power can exceed 8 W; use a multi-rail PMIC or discrete DC-DCs with soft-start. Power-on sequence (VCCINT before VCCIO) must follow Altera's specification to avoid latch-up; POR circuitry is built in but bank pre-drivers require proper sequencing.
Do not confuse the C5 speed grade with the C3 or C4 speed grades - they are timing binning only, not functional variants. The N suffix indicates lead-free and the G suffix indicates RoHS compliance, but the silicon is identical. Configuration via passive serial, fast passive parallel, or JTAG requires correct MSEL pin strapping. Active serial configuration via EPCS16/EPCS64 needs a separate 16-pin or 8-pin flash, not the FPGA itself.
Informations de conformité
Compliance status not explicitly stated in the verified web data. The C5G and C4N variants carry lead-free suffixes indicating RoHS compliance; the base C5 suffix alone does not specify lead-free status. AEC-Q100 not applicable as this is a commercial-grade FPGA.