EP2S130F1508C5N - Stratix II FPGA, 132K LE, 1508-FBGA | Intel
Référence : EP2S130F1508C5N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1725 | $17 250,00 |
| 100 | $1610 | $161 000,00 |
| 500 | $1495 | $747 500,00 |
| 1 000 | $1390 | $1 390 000,00 |
EP2S130F1508C5N Présentation
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as DSP blocks, block RAM, and high-speed transceivers. FPGAs occupy the tier between fixed-function ASICs and software-driven processors, offering hardware-level parallelism with software-level design flexibility. Stratix II is the second-generation high-performance FPGA family from what was Altera (now Intel PSG), succeeding the Stratix series and adding adaptive logic modules (ALMs) that improved area efficiency over the prior LE-based architecture.
Key features of the EP2S130F1508C5N include 132,600 LEs (largest member of the Stratix II family), 6,627 LABs, 1,126 user I/Os in a 1508-ball FC-FBGA package, and the -5 speed grade designation (mid-tier, faster than -6/-7/-8, slower than -3/-4 grades). The device also integrates up to 6.7 Mbits of TriMatrix on-chip RAM, dedicated 18x18 multiplier DSP blocks (up to 384 18x18 multipliers per family datasheet), and 12 full-duplex embedded transceiver channels supporting up to 6.375 Gbps operation. The FC-FBGA substrate provides enhanced thermal and electrical performance for high-pin-count designs.
The Stratix II architecture uses 8-input adaptive logic modules (ALMs) that pack variable ratios of combinational and register logic into a single structure, delivering higher effective logic density than the prior Stratix generation. Per the Altera/Intel datasheet, the 90 nm process and adaptive routing fabric deliver deterministic timing closure across complex multi-clock designs. Transceivers integrate clock-data-recovery and serializer/deserializer functions, allowing multi-gigabit serial links with minimal external PHY components.
Typical applications for the EP2S130F1508C5N include ASIC and ASSP prototyping, high-speed data-acquisition systems, telecom baseband processing, military and aerospace signal processing, and high-end digital test equipment. The 1,126 user I/Os make it suitable for designs requiring very wide parallel data buses or many control signals, while the transceiver channels support chip-to-chip or backplane serial links. The 1508-FBGA package requires multilayer PCB design with controlled-impedance routing and matched-length traces for high-speed interfaces.
Design consideration: The 1508-ball FC-FBGA package requires precise PCB footprint design with sub-millimeter ball pitch; ensure your PCB fab supports the required via-in-pad or microvia process. Plan decoupling capacitor placement and power-plane stack-up early, because post-layout rework on a 1508-ball BGA is impractical. The -C5 commercial temperature grade (0C to +85C) is suitable for lab and controlled-environment deployments; choose the -I industrial grade (EP2S130F1508I5N) for industrial temperature operation.
This page synthesizes distributor pricing, drop-in alternatives within the Stratix II family, and practical design notes not found in the manufacturer datasheet itself.
Alternatives de remplacement direct pour EP2S130F1508C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2S130F1508C5N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, RoHS Status, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2S130F1508C5
✅ Remplacement direct✓ En stock
$345 / unité
Voir la fiche technique →EP2S130F1508C4N
✅ Remplacement direct✓ En stock
$4435.83 / unité
Voir la fiche technique →EP2S130F1508C4
✅ Remplacement direct✓ En stock
$1295 / unité
Voir la fiche technique →EP2S130F1508C3N
✅ Remplacement direct✓ En stock
$270 / unité
Voir la fiche technique →EP2S130F1508C3
✅ Remplacement direct✓ En stock
$1350 / unité
Voir la fiche technique →EP2S130F1508C5N Valeurs maximales et caractéristiques électriques
| Family | Stratix II |
| Logic Elements (LE) | 132,600 |
| Logic Array Blocks (LABs) | 6,627 |
| User I/Os | 1,126 |
| Boîtier | 1508-ball FC-FBGA |
| Package Pin Count | 1508 |
| Operating Voltage (Core) | 1.2 V |
| Process Node | 90 nm |
| Speed Grade | -5 (C5) |
| Temperature Grade | Commercial (0C to +85C) |
| Transceivers | Up to 12 channels (family maximum) |
| Transceiver Data Rate (max) | Up to 6.375 Gbps (family spec) |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du EP2S130F1508C5N 1508
Configuration des broches du EP2S130F1508C5N (boîtier 1508). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2S130F1508C5N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2S130F1508C5N convient pour 7 applications: ASIC and ASSP Prototyping, High-Speed Data Acquisition Systems, Telecom Baseband and Packet Processing, Military and Aerospace Signal Processing, Digital Test and Measurement Equipment, High-End Imaging and Video Processing, Software-Defined Radio (SDR) Platforms.
ASIC and ASSP Prototyping
The EP2S130F1508C5N's 132,600 LEs and 6,627 LABs make it well-suited for prototyping large ASIC and ASSP designs where the gate count exceeds 1M equivalent gates. Engineers map RTL to the Stratix II ALM-based fabric and validate timing closure before committing to a foundry tapeout. The 1,126 user I/Os accommodate full-chip boundary-scan and wide parallel interfaces. Compared with a fixed-function ASIC, the EP2S130F1508C5N allows iterative design changes at zero NRE cost, accelerating pre-silicon verification. Pair it with Quartus II design software and a logic-analyzer debug probe for real-time signal observation. Expected performance supports DDR2 SDRAM controller operation at up to 200 MHz with proper PCB layout.
Recommandé
High-Speed Data Acquisition Systems
The EP2S130F1508C5N supports high-speed data-acquisition front ends where parallel ADC samples must be buffered, processed, and forwarded to a host CPU or DSP. The 1,126 user I/Os accept 18-24 bit parallel ADC buses at LVDS/SSTL/HSTL levels; the embedded TriMatrix RAM provides up to 6.7 Mbits of buffer memory for multi-channel capture. The device's 384 18x18 multipliers per Stratix II datasheet enable on-FPGA FIR filtering, FFT, and digital down-conversion, eliminating a separate DSP chip. In a typical 4-channel 250 MSPS design, the FPGA buffers 12 Gbps of streaming data and computes per-channel filters in real time. The -C5 grade provides sufficient timing margin for 200 MHz DDR2 interfaces when routed on a 6-layer PCB.
Recommandé
Telecom Baseband and Packet Processing
With up to 12 transceiver channels at 6.375 Gbps per Stratix II family specs, the EP2S130F1508C5N handles telecom baseband and packet-processing designs including OBSAI, CPRI, and proprietary backplane links. The 132,600 LEs implement layer-2/3 packet classification, QoS scheduling, and CRC engines; embedded transceivers eliminate the need for external PHY chips. Designers target the part for multi-standard base-station line cards where one FPGA replaces several discrete network processors. Power consumption under full transceiver load is documented in the Stratix II handbook and requires thermal management (heatsink or forced airflow) for the 1508-FBGA package. The -5 speed grade supports CPRI line rates up to 3.072 Gbps with deterministic latency.
Recommandé
Military and Aerospace Signal Processing
The Stratix II family supports ruggedized deployments in defense and aerospace signal-processing applications including radar, electronic warfare, and software-defined radio front ends. The 132,600-LE EP2S130F1508C5N implements multi-channel digital beamforming, pulse compression, and channelization in a single device. Designers target the part for airborne radar receivers where SWaP-C constraints demand high logic density per cubic inch; the 1508-FBGA package enables compact board layouts. For -55C to +125C military temperature operation, the EP2S130F1508I5N industrial variant or screened military-grade part is required; the -C5 commercial variant is acceptable for ground-station equipment. Conformal coating and hermetic packaging may be specified for flight hardware.
Recommandé
Digital Test and Measurement Equipment
Test-equipment manufacturers use the EP2S130F1508C5N as the central pattern-generator or response-analyzer engine in protocol analyzers, BERT testers, and logic analyzers. The 1,126 user I/Os support up to 144 channels of synchronous stimulus/response with per-channel timing generators, and the device's DSP blocks handle on-chip PRBS generation, error counting, and signal-conditioning math. Compared with fixed-function ASICs, the FPGA enables same-silicon support for multiple standards (PCIe Gen 1, SATA II, DisplayPort) by simply reloading the configuration bitstream. The 1508-FBGA package supports surface-mount rework during prototype iterations. For production test systems, migrate to Cyclone V GT or Stratix V to benefit from longer lifecycle and lower power.
Recommandé
High-End Imaging and Video Processing
The EP2S130F1508C5N's combination of 132,600 LEs, 6.7 Mbits of on-chip RAM, and 384 DSP blocks makes it suitable for high-end medical imaging, broadcast video processing, and machine-vision systems. The fabric implements multi-tap filters, color-space converters, and real-time image-pipeline functions including Bayer demosaicing and 2D convolutions. The 1,126 user I/Os accept multiple parallel camera interfaces (Camera Link, LVDS-based CoaXPress at low line rates) and drive HDMI/SDI outputs through companion serializer chips. In a typical 4K video pipeline design, the FPGA buffers full frames in external DDR2 memory and performs per-pixel operations at 150 MHz. The -C5 speed grade provides adequate timing margin for 150-200 MHz internal logic.
Recommandé
Software-Defined Radio (SDR) Platforms
The EP2S130F1508C5N serves as the processing engine in software-defined radio platforms for cellular base-station emulation, spectrum analyzers, and tactical communications. Its 12 transceivers handle multi-band RF digitization, while the 132,600-LE fabric runs channelization, decimation, and modulation/codec functions in real time. The 384 embedded 18x18 multipliers enable FPGA-based FFT engines up to 4096 points at full-rate processing. The part supports standards including GSM, UMTS, LTE physical-layer receive chains, and proprietary waveforms. Designers pair it with high-speed ADC/DAC converters such as the TI ADS62P49 or ADI AD9680 to digitize wide-band RF signals. For commercial SDR systems, migrate to Stratix V or Cyclone V GT families for longer lifecycle support.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2S130F1508C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2S130F1508C5 | EP2S130F1508C4N | EP2S130F1508C4 | EP2S130F1508C3N | EP2S130F1508C3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Logic Elements | 132,600 | 132,600 | 132,600 | 132,600 | 132,600 | 132,600 |
| Speed Grade | -5 (C5) | -5 | -4 (faster) | -4 (faster) | -3 (fastest) | -3 (fastest) |
| Lead-Free / -N Suffix | Yes (-N) | No | Yes | No | Yes | No |
| Pin-to-Pin Compatible | Yes (reference) | Yes | Yes | Yes | Yes | Yes |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Highest logic-element density in the Stratix II family (vs EP2S90F1508C3N (Stratix II 90K LE variant))
- Same-family speed grade variants available for drop-in upgrade (vs EP2S130F1508C3N (-3 fastest speed grade))
- Industrial temperature grade variant available for ruggedized deployments (vs EP2S130F1508I5N (industrial -40C to +100C))
Notes de conception
The 1508-ball FC-FBGA package requires a high-density PCB with microvia (laser-drilled) vias, sub-millimeter trace/spacing rules, and via-in-pad construction for the BGA ball-to-inner-layer escape routing. Per Altera/Intel package specifications, typical ball pitch is 1.0 mm. Use a 6-12 layer stack-up with dedicated power and ground planes; high-speed transceiver signals should reference unbroken reference planes. Plan the stack-up and BGA fan-out early in the design because rework on a 1508-ball BGA is impractical after assembly. Estimated: minimum 4 signal layers plus 2 power/ground planes are recommended for proper signal integrity on transceiver channels.
The 1508-FBGA package can dissipate 10-25 W under full transceiver and DSP utilization. Per Stratix II family datasheet thermal data, theta-JA for the FC-FBGA is in the 12-18 C/W range depending on PCB construction. Estimated: at 20 W dissipation and 25 C ambient with no airflow, junction temperature rise = 20 W x 15 C/W = 300 C above ambient (excessive); forced airflow (1-2 m/s) or a heatsink is required for sustained high utilization designs. For commercial-temperature operation, maintain Tj below 100 C; for industrial, below 125 C. Use the Stratix II PowerPlay early-power estimator in Quartus II to model worst-case junction temperature before PCB layout finalization.
Do not confuse the EP2S130F1508C5N's -5 speed grade with performance ranking; per Altera/Intel convention, lower numbers denote faster timing (C3 fastest, C8 slowest). Migrating from C5 to C4 or C3 yields Fmax improvements of 10-20% on internal paths but is a drop-in compatible change. Do not assume a Stratix III, IV, or V FPGA with the same BGA pin count is pin-compatible - their BGA ball assignments differ. Verify pinout against the Stratix II Device Handbook pin table before substituting any modern family part. Finally, note that the -N suffix denotes lead-free / RoHS-compliant finish; for non-RoHS designs the EP2S130F1508C5 (without -N) is pin-compatible and may be easier to source from legacy stocks.
The Stratix II EP2S130 requires a 1.2 V core supply (VCCINT) plus 3.3 V/2.5 V/1.8 V/1.5 V I/O bank supplies (VCCIO) plus 1.2 V/2.5 V PLL analog supplies (VCCA_PLL). Per the family datasheet, VCCINT must ramp monotonically and meet the Power-On Reset (POR) timing requirement before configuration begins. Use a TI TPS54xxx or equivalent DC-DC controller with soft-start and sequence control; power-up sequencing must satisfy VCCINT >= VCC_PLL >= VCCIO for reliable configuration. Estimated: at full utilization (100K LE + 12 transceivers), total board-level power consumption reaches 20-25 W; budget the power supply for 30 W to provide margin for in-rush during configuration.
Informations de conformité
RoHS compliance inferred from the -N suffix indicating lead-free / Pb-free finish per Altera/Intel naming convention. Reach compliance assumed for parts shipped after 2017. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC. Verify RoHS/Reach status on individual shipment documentation as obsolete inventory may include non-RoHS variants (e.g., EP2S130F1508C5 without -N suffix).