EP2S130F1508C5RB - Stratix II FPGA, 132K LE, 1508-BGA | Intel
Référence : EP2S130F1508C5RB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 10 | $2715 | $27 150,00 |
| 100 | $2520 | $252 000,00 |
| 500 | $2280 | $1 140 000,00 |
| 1 000 | $2050 | $2 050 000,00 |
EP2S130F1508C5RB Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells. Stratix II belongs to the high-performance programmable logic hierarchy: CLB -> LAB -> Logic Array -> FPGA -> Programmable Logic Device (PLD) -> Digital IC -> Semiconductor. The Stratix II family introduced an adaptive logic module (ALM) architecture that delivers higher logic efficiency than previous-generation LUT-based fabrics.
Key features include support for up to 12 embedded transceiver channels (not bonded out on the F1508 package), adaptive logic modules with 8-input fracturable look-up tables, on-chip termination (OCT), and dedicated DSP blocks for high-speed arithmetic. The device supports multiple I/O standards including LVDS, LVPECL, SSTL, HSTL, and PCI/PCI-X, with true LVDS support up to 840 Mbps per channel on dedicated differential I/O.
The EP2S130F1508C5RB is fabricated in a 90 nm CMOS process with 1.2 V core supply and operates over the commercial 0C to +85C junction temperature range. The 'C5' speed grade and 'RB' suffix indicate this variant ships in tray packaging as a commercial-temperature part.
Typical applications include high-speed DSP (radar, baseband, software-defined radio), ASIC prototyping, high-throughput data acquisition, and communications infrastructure. For PCB design, the F1508 FBGA requires multilayer high-speed PCB stack-up with microvia or via-in-pad technology to route the 1.5 mm pitch ball array effectively.
This page consolidates distributor pricing, same-brand Stratix II family drop-in alternatives, and design considerations not duplicated from the manufacturer datasheet, helping engineers accelerate procurement and design-in decisions.
Alternatives de remplacement direct pour EP2S130F1508C5RB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2S130F1508C5RB (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Process Technology, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2S130F1508C5
✅ Remplacement direct✓ En stock
$345 / unité
Voir la fiche technique →EP2S130F1508C5NRB
✅ Remplacement direct✓ En stock
$1990 / unité
Voir la fiche technique →EP2S130F1508C5N
✅ Remplacement direct✓ En stock
$1390 / unité
Voir la fiche technique →EP2S130F1508C4RB
✅ Remplacement direct✓ En stock
$1245 / unité
Voir la fiche technique →EP2S130F1508C4N
✅ Remplacement direct✓ En stock
$4435.83 / unité
Voir la fiche technique →EP2S130F1508C4
✅ Remplacement direct✓ En stock
$1295 / unité
Voir la fiche technique →EP2S130F1508C3N
✅ Remplacement direct✓ En stock
$270 / unité
Voir la fiche technique →EP2S130F1508C3
✅ Remplacement direct✓ En stock
$1350 / unité
Voir la fiche technique →EP2S130F1508C5RB Valeurs maximales et caractéristiques électriques
| Family | Stratix II |
| Logic Elements | 132,600 |
| Logic Array Blocks (LABs) | 6,727 |
| User I/Os | 1,126 |
| Embedded Memory | 6,747 Kbits (TriMatrix: MRAM/M4K/M512) |
| Embedded 18x18 Multipliers | 252 (504 9x9 equivalent) |
| Boîtier | 1508-ball FBGA (F1508), 40x40 mm, 1.5 mm pitch |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V (typical) |
| Speed Grade | 5 (C5, commercial) |
| Température de fonctionnement | 0C to +85C (commercial, junction) |
| Type de montage | Surface Mount (FBGA) |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Lifecycle | Not Recommended for New Designs (NRND) |
Guide de configuration des broches du EP2S130F1508C5RB 1508-ball fbga (f1508), 40x40 mm, 1.5 mm pitch
Configuration des broches du EP2S130F1508C5RB (boîtier 1508-ball fbga (f1508), 40x40 mm, 1.5 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2S130F1508C5RB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2S130F1508C5RB convient pour 6 applications: Software Defined Radio (SDR) Baseband, ASIC Prototyping, High-Speed DSP (Radar, Beamforming), Industrial Video Processing, Communications Infrastructure (Base Station), Test and Measurement Instrumentation.
Software Defined Radio (SDR) Baseband
The EP2S130F1508C5RB's 132,600 LEs and 252 18x18 multipliers support multi-channel SDR baseband processing at sample rates up to 200 MSPS. Its 6.7 Mbits of TriMatrix memory holds long filter chains and FFT twiddle tables with zero off-chip latency. Compared to ASICs, the FPGA enables post-deployment algorithm updates for evolving waveforms, and the 1.5 mm pitch FBGA footprint enables compact multi-board radio chassis.
Recommandé
ASIC Prototyping
With 132,600 LEs and up to 1,126 user I/Os, the EP2S130F1508C5RB provides sufficient density to prototype most sub-100M-gate ASICs. Engineers partition the ASIC RTL across multiple Stratix II FPGAs using TimeBridge multiplexing to validate pre-silicon functionality. The 1508-ball FBGA supports high pin-count ASIC prototyping, and the Quartus II synthesis flow mirrors ASIC synthesis to provide accurate timing correlation.
Recommandé
High-Speed DSP (Radar, Beamforming)
The 252 dedicated 18x18 multipliers deliver up to 224 GMACs of DSP throughput, ideal for radar pulse compression, FFT processing, and adaptive beamforming. The C5 speed grade supports 250 MHz DSP block operation, and 1,126 I/Os provide direct interface to multi-channel ADCs and DACs. The Stratix II ALM architecture enables efficient mapping of cascaded integrator-comb filters and Goertzel algorithms.
Recommandé
Industrial Video Processing
EP2S130F1508C5RB supports multi-stream HD video processing with on-chip buffering in MRAM blocks for frame-store applications. The high I/O count enables direct connection to multiple camera links, HDMI/DVI receivers, and DDR memory controllers. Compared to ASSP video processors, the FPGA allows custom color-space conversion and real-time overlay generation with deterministic latency for broadcast equipment.
Recommandé
Communications Infrastructure (Base Station)
With 132K LEs, the EP2S130F1508C5RB supports multi-carrier base station channel cards performing turbo decoding, channel estimation, and MIMO spatial multiplexing. The embedded MRAM blocks hold convolutional interleaver state with true dual-port access at 300 MHz. The commercial 0C to +85C junction range covers indoor base-station environments, and the 1508-FBGA enables compact ATCA/AdvancedTCA line cards.
Recommandé
Test and Measurement Instrumentation
The EP2S130F1508C5RB's parallel I/O bandwidth (1,126 pins) and 252 multipliers enable arbitrary waveform generators, logic analyzers, and protocol testers to push pattern rates beyond 1 Gbps. Engineers use the on-chip MRAM to store deep capture buffers with trigger logic, and the FPGA fabric implements custom protocols like PCIe Gen1, SATA, and serial RapidIO without external ASSPs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2S130F1508C5RB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2S130F1508C5 | EP2S130F1508C5NRB | EP2S130F1508C5N | EP2S130F1508C4RB | EP2S130F1508C4N | EP2S130F1508C4 | EP2S130F1508C3N | EP2S130F1508C3 |
|---|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-FBGA (F1508) | 1508-FBGA (F1508) - same | 1508-FBGA (F1508) - same | 1508-FBGA (F1508) - same | 1508-FBGA (F1508) - same | 1508-FBGA (F1508) - same | 1508-FBGA (F1508) - same | 1508-FBGA (F1508) - same | 1508-FBGA (F1508) - same |
| Speed Grade | C5 | C5 - same | C5 - same | C5 - same | C4 (slower) | C4 (slower) | C4 (slower) | C3 (slowest) | C3 (slowest) |
| Logic Elements | 132,600 | 132,600 | 132,600 | 132,600 | 132,600 | 132,600 | 132,600 | 132,600 | 132,600 |
| User I/Os | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 |
| Embedded Multipliers (18x18) | 252 | 252 | 252 | 252 | 252 | 252 | 252 | 252 | 252 |
| Lead-Free / RoHS | Yes (RB suffix) | Unknown finish | No (SnPb) | No (SnPb) | Yes (lead-free) | No (SnPb) | Unknown finish | No (SnPb) | Unknown finish |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
Principaux différenciateurs
- Highest-density Stratix II variant with 1,126 user I/Os (vs EP2S130F1020C5 (F1020 package, 1,020 I/Os))
- Lead-free (RB suffix) RoHS compliance for global market access (vs EP2S130F1508C5N (leaded, SnPb finish))
- C5 speed grade balances timing margin vs cost (vs EP2S130F1508C4RB (C4 speed grade))
Notes de conception
The F1508 1508-ball FBGA at 1.5 mm pitch requires a 6-8 layer PCB with microvia (0.1 mm laser-drilled) or via-in-pad technology for breakout. Estimated: standard 4-layer FR-4 stack-up with 0.2 mm vias cannot route the inner-row balls without violating 4-mil trace/space rules. Use sequential lamination with 0.5 oz copper on outer layers and 1 oz on inner power/ground planes; allocate at least 4 dedicated ground planes directly under the BGA to control return-current impedance.
Estimated: at full logic utilization (~70% LEs, 80% DSP blocks) the EP2S130F1508C5RB can dissipate up to 8-10 W. With a typical theta_JA of 12 C/W for the F1508 FBGA on a 1 sq inch copper pad, junction temperature rises 100 C above ambient. Mandatory: provide a continuous ground-pad thermal array directly under the package with thermal vias (0.3 mm pitch, 0.5 oz plating), and ensure ambient airflow of 1 m/s minimum in enclosed chassis.
Configure on-chip termination (OCT) for LVDS, SSTL, and HSTL I/O standards via Quartus II pin planner to suppress reflections on long PCB traces. The Stratix II supports series, parallel, and differential OCT modes. For DDR2 SDRAM interfaces up to 333 MHz, enable dynamic OCT in read cycles and calibrate drive strength using the OCT calibration block at FPGA power-up; failure to calibrate causes 15-20% timing margin loss.
Estimated: the Stratix II adaptive logic module (ALM) architecture is fundamentally different from Stratix I; register-rich legacy designs may compile with reduced Fmax or higher LE count. Use Quartus II 13.0 Service Pack 1 (the last version supporting Stratix II) and the legacy timing analyzer; do NOT migrate designs to the TimeQuest SDC flow without re-validating all timing constraints.
Informations de conformité
RoHS compliant per RB suffix designation on Intel/Altera datasheet. AEC-Q100 not applicable - commercial-temperature FPGAs are not qualified for automotive safety-critical applications. NRND status: Intel recommends Stratix IV or Stratix V for new designs.
