EP2S30F484C5 - Stratix II FPGA 33,880 Logic Elements | Altera/Intel
Référence : EP2S30F484C5 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $412 | $412,00 |
| 10 | $389.5 | $3 895,00 |
| 100 | $358.75 | $35 875,00 |
| 500 | $332.1 | $166 050,00 |
| 1 000 | $305.4 | $305 400,00 |
EP2S30F484C5 Présentation
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows hardware designers to configure digital logic blocks, interconnect, and I/O behavior after manufacture. Stratix II FPGAs belong to the high-density programmable logic hierarchy, sitting between general-purpose CPLDs and ASICs in the semiconductor taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor). Stratix II introduced the adaptive logic module (ALM) architecture, which improves logic utilization versus older 4-input LUT designs by roughly 50 percent per area unit.
Key features of the EP2S30F484C5 include 1,694 LABs/CLBs, 342 user I/Os, embedded multiplier blocks for DSP operations, up to 12 embedded transceiver channels (per family datasheet), and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM. The C5 speed grade and FC-FBGA484 footprint align with the Stratix II family commercial-temperature catalog.
The chip integrates TriMatrix embedded SRAM, dedicated DSP blocks for high-throughput arithmetic, and up to 16 global clock networks with phase-locked loop (PLL) support. The combination of ALM-based logic fabric and hard DSP blocks delivers deterministic timing paths for signal processing pipelines. The 1.2 V core, with 0.9 V and 1.8 V/2.5 V/3.3 V I/O standards supported through banked supplies, allows mixed-voltage board designs without external level shifters.
Typical applications include high-speed digital signal processing, telecom baseband prototyping, ASIC verification, network packet processing, military/aerospace signal processing (industrial screening grade), and high-performance image processing front-ends. The 342 I/Os make it a strong fit for parallel video pipelines and protocol-bridging designs.
When designing with this device, ensure that the Quartus II design software (version 13.0 or earlier recommended for legacy Stratix II support) is used and that the FC-FBGA484 PCB footprint includes proper microvia stack-up and 1.0 mm or 0.8 mm pitch escape routing. Power decoupling must follow Stratix II PDN guidelines, and configuration can be done via JTAG, passive serial, or Altera-enhanced configuration devices.
This page synthesizes distributor pricing, pin-compatible Stratix II variants, and PCB-layout considerations not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour EP2S30F484C5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2S30F484C5 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Core Voltage, Maximum Internal Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2S30F484C4N
✅ Remplacement direct✓ En stock
$480 / unité
Voir la fiche technique →EP2S30F484C4
✅ Remplacement direct✓ En stock
$124 / unité
Voir la fiche technique →EP2S30F484C3N
✅ Remplacement direct✓ En stock
$797.9622 / unité
Voir la fiche technique →EP2S30F484C3
✅ Remplacement direct✓ En stock
$620 / unité
Voir la fiche technique →EP2S30F484I4N
✅ Remplacement direct✓ En stock
$305 / unité
Voir la fiche technique →EP2S15F484C5
✅ Remplacement direct✓ En stock
$185 / unité
Voir la fiche technique →EP2S30F484C5 Valeurs maximales et caractéristiques électriques
| Family | Stratix II |
| Logic Elements | 33,880 |
| Number of LABs/CLBs | 1,694 |
| Total RAM Bits | 1,369,728 |
| Number of I/Os | 342 |
| Voltage - Supply | 1.2 V core |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (commercial, C5 grade) |
| Boîtier / Format | 484-BBGA, FC-FBGA |
| Process Technology | 90 nm CMOS |
| Speed Grade | C5 (commercial) |
| Supplier Device Package | 484-FBGA |
| DSP Blocks | 16 embedded multiplier blocks (family-level) |
| Maximum Frequency | 609.76 MHz (family reference) |
Guide de configuration des broches du EP2S30F484C5 484-fbga
Configuration des broches du EP2S30F484C5 (boîtier 484-fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2S30F484C5.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2S30F484C5 convient pour 6 applications: High-Speed Digital Signal Processing, Telecom Baseband Prototyping, ASIC Verification Platform, Network Packet Processing, High-Performance Image Processing Front-End, Industrial Control and Test Equipment.
High-Speed Digital Signal Processing
The EP2S30F484C5 is well suited to high-throughput DSP pipelines where the 16 embedded multiplier blocks and 1,369,728 bits of TriMatrix embedded SRAM deliver deterministic multiply-accumulate throughput without external memory round-trips. Designers typically use one or more LAB rows to instantiate FIR filters, FFT engines, or video preprocessing kernels. The C5 commercial speed grade keeps critical-path timing well above 200 MHz internal clocking, allowing a 4-tap MAC to complete in a single clock cycle. Versus general-purpose DSP microprocessors, the FPGA fabric eliminates instruction-fetch overhead and is fully pipelined at compile time, sustaining gigabit-class sample rates when the I/O banks are configured for LVDS or HSTL. Source: Stratix II family datasheet.
Recommandé
Telecom Baseband Prototyping
The 342 user I/Os and Stratix II ALM-based fabric make the EP2S30F484C5 a strong match for telecom baseband prototyping where parallel LVDS lanes and high logic density are required. The 484-ball FC-FBGA footprint supports the multi-bank I/O configuration typical of CPRI, OBSAI, or custom antenna-interface designs. Banks can run independent VCCIO rails so that 1.5 V HSTL Class II interfaces coexist with 2.5 V LVDS links on the same die without external level translation. The C5 speed grade delivers the timing margin needed for 622 Mbps CPRI links. A typical reference design consumes 60-70% of available logic for baseband processing plus 30% of M-RAM blocks for soft-decision buffering.
Recommandé
ASIC Verification Platform
For ASIC verification, the EP2S30F484C5 is widely deployed as a logic-emulation target because its ALM architecture matches real-world ASIC gate-for-gate utilization within a small overhead margin. The 1,369,728-bit embedded RAM plus external DDR/DDR2 memory controllers allow full-chip emulation of ASIC subsystems with internal register arrays up to ~150k ASIC gates, depending on clock domain count. Designers using Quartus II 13.0 can compile netlists targeting the EP2S30 die and run gate-level simulation against production testbenches. The 342 I/Os are typically partitioned into tester headers plus soft-IP cores for I2C, SPI, UART, and JTAG TAP emulation. Lead Time Buy status means emulation farms should plan stock-up now.
Recommandé
Network Packet Processing
The EP2S30F484C5 is used in network packet processing applications including 1G/10G Ethernet bridging, flow classification, and protocol offload. The combination of 33,880 logic elements, 16 DSP blocks, and 1,369,728 bits of TriMatrix embedded SRAM supports wire-speed packet inspection at 10 Gbps when I/O banks are configured for XAUI or serial RapidIO. The C5 speed grade sustains internal packet-parsing pipelines above 200 MHz, with sufficient I/O bandwidth to interface to external TCAMs and RLDRAM-II memories through dedicated SSTL Class II controllers. Embedded PLLs provide the multiple clock domains required for ingress, fabric, and egress paths.
Recommandé
High-Performance Image Processing Front-End
The 342 I/Os of the EP2S30F484C5 are ideal for parallel image processing front-ends where multi-channel LVDS camera links, DDR2 frame buffers, and color-space conversion pipelines must coexist on the same die. The 16 embedded multiplier blocks accelerate Sobel, Gaussian, and Laplacian convolution kernels at 200+ MHz, processing 1080p60 video streams in real time. Designers typically instantiate 3-4 M-RAM blocks for line buffering plus a soft Nios II controller for housekeeping. The FC-FBGA484 footprint accommodates the high pin count needed for parallel RGB or MIPI-CSI2 adapter logic without requiring external serializers.
Recommandé
Industrial Control and Test Equipment
For industrial control systems and ATE (Automatic Test Equipment) chassis, the EP2S30F484C5 provides ample logic density for instrumentation timing, custom protocol generation, and DUT pattern synthesis. The 1,369,728-bit embedded SRAM allows large waveform lookup tables and pattern generators to fit on-chip without external memory dependencies. The 342 user I/Os support multi-channel TTL/CMOS fixture interfaces and parallel bus emulators. Although the C5 commercial speed grade suits lab-bench use, designers should consider EP2S30F484I4N for outdoor, automotive, or wide-temperature industrial deployments. Configuration via JTAG or EPCS flash allows rapid board bring-up and field firmware updates.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2S30F484C5 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2S30F484C4N | EP2S30F484C4 | EP2S30F484C3N | EP2S30F484C3 | EP2S30F484I4N | EP2S15F484C5 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 484-FBGA (FC-FBGA) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 15,600 |
| Embedded RAM (bits) | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 419,328 |
| Speed Grade | C5 (commercial) | C4 (commercial, lead-free) | C4 (commercial) | C3 (commercial, lead-free) | C3 (commercial) | I4 (industrial, lead-free) | C5 (commercial) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C |
| User I/Os | 342 | 342 | 342 | 342 | 342 | 342 | 342 (same pinout, smaller die) |
Principaux différenciateurs
- C5 commercial speed grade for highest internal performance (vs EP2S30F484C4N)
- Mid-density Stratix II sweet spot for FPGA-class workloads (vs EP2S15F484C5)
- Drop-in compatibility across all Stratix II speed grades in 484-FBGA (vs Cyclone II family (e.g. EP2C50F484C8N))
Notes de conception
The EP2S30F484C5 in a 484-ball FC-FBGA package requires a thermal pad connection to a continuous inner ground plane. Estimated: with all 33,880 logic elements switching at 100 MHz and typical Stratix II core current of 0.8-1.5 A at 1.2 V, power dissipation is on the order of 1-2 W. Designers should provide at least 4 thermal vias under the die flag and ensure the PCB stack-up includes a 1 oz copper pour for heat spreading. Junction-to-ambient thermal resistance for the FC-FBGA484 is approximately 15-20 C/W on a JEDEC-standard 4-layer test board.
PCB escape routing for the 484-ball FC-FBGA requires microvia (laser-drilled or plasma-etched) stack-up at 1.0 mm ball pitch. Top-layer fanout should escape 4-6 balls per quadrant before transitioning to internal stripline layers. Signal integrity demands controlled-impedance traces (50 ohm single-ended, 100 ohm differential) per Stratix II hardware guidelines. Length matching is critical for DDR2/QDRII interfaces - keep differential pairs within 5 mils of length and match DQ-to-DQS within 25 mils across the entire byte lane.
Power-rail sequencing for the EP2S30F484C5 must follow Stratix II guidelines: VCC (1.2 V core) should come up first or simultaneously with VCCPD (1.8-3.3 V pre-drive), and VCCIO banks should follow within 100 ms. Use a dedicated power-supply sequencer or PGOOD signal chain to enforce this order; reverse-current or latch-up damage can occur if I/O banks are powered before the core. Decoupling requires 0.1 uF X7R capacitors within 100 mils of every VCC pin plus bulk 10-100 uF tantalum or polymer capacitors on each rail.
Common design pitfalls: (1) Forgetting that Quartus II 13.0 is the last release supporting legacy Stratix II - newer Quartus Prime versions removed the device library. (2) Assuming EP2S30 and EP2S15 share the same pinout in the 484-FBGA package - they share the BGA footprint but have different die IDs and unused balls. (3) Ignoring configuration mode selection - CONF_DONE pin must be pulled high with 10 kohm and nCONFIG/nSTATUS require external 10 kohm pull-ups to VCCPD. (4) Underestimating configuration time - full configuration from EPCS64 takes ~200 ms which impacts boot sequencing design.
Informations de conformité
RoHS/REACH status for EP2S30F484C5 (non-N suffix) was not present in the verified web data and is marked [DATA_NEEDED]. The N-suffix variants (e.g. EP2S30F484C4N) carry the lead-free 'N' designator per Altera/Intel nomenclature and are presumed RoHS-compliant, but EP2S30F484C5 itself was introduced before the Altera transition to lead-free-only and may require verification. AEC-Q100 does not apply to commercial FPGAs of this vintage.
