EP2SGX130GF40C5ES - Stratix II GX 132K LC FPGA, FC-FBGA-1508 | Altera
Référence : EP2SGX130GF40C5ES ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1750 | $17 500,00 |
| 100 | $1620 | $162 000,00 |
| 500 | $1495 | $747 500,00 |
| 1 000 | $1380 | $1 380 000,00 |
EP2SGX130GF40C5ES Présentation
An FPGA is a programmable logic device whose interconnect and logic resources are configured by the user after manufacture, falling into the broader taxonomy of programmable logic > logic IC > integrated circuit > semiconductor. FPGAs such as the EP2SGX130 are used to implement arbitrary digital state machines, DSP datapaths, bus bridges, and protocol controllers without resorting to custom ASIC silicon, trading per-unit cost for design flexibility and time-to-market. The Stratix II GX family in particular targets high-speed serial connectivity applications by combining general-purpose FPGA fabric with embedded multi-gigabit transceivers.
Key device features for the EP2SGX130 include 132,540 logic elements, 7,047 LABs, embedded transceiver support, a 609.76 MHz internal frequency ceiling, a 1.2 V core, 90 nm process technology, and commercial-extended (0C to 85C) operating temperature grading per the 'C' suffix. The package integrates 1,508 balls on 1 mm pitch in a flip-chip land-grid construction, allowing dense PCB escape routing for high I/O counts. The 'GF40' designator decodes as 'G' for the lead-free, halogen-free Pb-free ball finish, 'F' for flip-chip BGA, and '40' for the 40 mm body size.
The 'Stratix' architecture implements adaptive logic modules (ALMs) rather than classic 4-input LUTs, giving higher effective logic density per tile. The integrated transceiver block supports multiple serial protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI when paired with the appropriate Altera IP core, making the EP2SGX130 a drop-in building block for line cards, baseband processing, and protocol bridge designs. Configuration is loaded via JTAG, passive serial, or active serial configuration schemes supported by the device.
Typical applications include high-speed serial backplane interfaces on telecom line cards, PCIe endpoint and root-complex designs, radar and signal-processing front ends, broadcast video processing engines, and military/aerospace digital signal processing subsystems. The wide -C5 speed bin and commercial-extended temperature grading make it suitable for thermally-controlled industrial enclosures and lab-grade equipment.
When designing with this device, allocate at least 6 PCB layers for power, ground, and signal escape from the 1,508-ball FC-FBGA, and use Altera's Quartus II design suite (v7.2 or later for the Stratix II family) for synthesis, place-and-route, and power estimation. Decoupling follows the Stratix II GX Power Distribution Network (PDN) application note, typically requiring bulk, mid-frequency, and high-frequency ceramics distributed under the die shadow.
This page synthesizes distributor pricing, drop-in Altera/Intel speed-grade and package alternatives, and practical design notes not consolidated on the manufacturer product page.
Alternatives de remplacement direct pour EP2SGX130GF40C5ES — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX130GF40C5ES (même facteur de forme et même empreinte) — différant par Package, Speed Grade, DSP Blocks, Mounting Type, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX130GF40C5
✅ Remplacement direct✓ En stock
$1380 / unité
Voir la fiche technique →EP2SGX130GF40C5N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP2SGX130GF40C4ES
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP2SGX130GF40C4NES
✅ Remplacement direct✓ En stock
$1380 / unité
Voir la fiche technique →EP2SGX130GF40C3ES
✅ Remplacement direct✓ En stock
$1200 / unité
Voir la fiche technique →EP2SGX130GF40C3NES
✅ Remplacement direct✓ En stock
$124 / unité
Voir la fiche technique →EP2SGX130GF40C4NGB
✅ Remplacement direct✓ En stock
$640 / unité
Voir la fiche technique →EP2SGX130GF40C3N
✅ Remplacement direct✓ En stock
$1485 / unité
Voir la fiche technique →EP2SGX130GF40C5ES Valeurs maximales et caractéristiques électriques
| Family | Stratix II GX |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 7,047 |
| Internal Frequency (max) | 609.76 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage (nominal) | 1.2 V |
| Speed Grade | C5 (mid-upper) |
| Température de fonctionnement | 0C to +85C (Commercial Extended) |
| Boîtier | FC-FBGA-1508 (40 x 40 mm, 1 mm pitch) |
| Ball Count | 1508 |
| Package Type | Flip-Chip Fine-pitch BGA |
| Type de montage | Surface Mount |
| Lead-Free / Halogen-Free | Yes (G suffix) |
| Statut RoHS | Compliant |
| Configuration Interface | JTAG / Passive Serial / Active Serial |
Guide de configuration des broches du EP2SGX130GF40C5ES flip-chip fine-pitch bga
Configuration des broches du EP2SGX130GF40C5ES (boîtier flip-chip fine-pitch bga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2SGX130GF40C5ES.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2SGX130GF40C5ES convient pour 6 applications: High-Speed Serial Backplane Interface, PCI Express Endpoint and Bridge, Radar and Signal-Processing Front End, Broadcast Video Processing Engine, Telecom Line Card Aggregation, Industrial Test and Measurement Instrumentation.
High-Speed Serial Backplane Interface
The EP2SGX130GF40C5ES is well-matched to multi-gigabit backplane line cards because its embedded Stratix II GX transceivers support protocols such as XAUI, Serial RapidIO, and PCI Express when paired with the matching Altera IP. The 132,540 logic elements and 7,047 LABs provide ample fabric to implement MAC-layer state machines, buffer management, and PCS bridging alongside the serial interfaces. The 1508-ball FC-FBGA package with 1 mm pitch supports the high pin density required for multiple transceiver channels plus parallel data and clock pins. Compared with a discrete PHY plus ASIC, this part collapses the bill of materials and lets designers tune the digital datapath late in the cycle. Expect 3.125 Gbps class operation with the C5 speed grade and verify the Stratix II GX transceiver reference design for the target protocol stack.
Recommandé
PCI Express Endpoint and Bridge
The EP2SGX130GF40C5ES is a strong fit for PCI Express endpoint, root-complex, and bridge implementations because Stratix II GX transceivers include a hard PCIe physical layer that supports x1, x4, and x8 lane widths at Gen1 rates when configured with the Altera PCIe IP core. The 132K logic elements are sufficient to add protocol-aware DMA engines, MSI-X interrupt controllers, and user-application logic alongside the PCIe hard IP, while the 609.76 MHz internal frequency headroom enables tight pipeline timing. The 1508-ball FC-FBGA package provides the dedicated reference-clock and per-lane transceiver pins the PCIe block requires, plus generous I/O for parallel local-bus or memory interfaces. Designers should follow the Altera Stratix II GX PCIe x4/x8 reference design for board-level lane polarity and coupling-capacitor recommendations. Power estimation with the Quartus PowerPlay tool is essential because the transceivers dominate budget at PCIe rates.
Recommandé
Radar and Signal-Processing Front End
The EP2SGX130GF40C5ES is well-suited to radar, electronic-warfare, and baseband signal-processing front ends where 132,540 logic elements plus embedded DSP blocks implement wideband FIR/FFT datapaths at the C5 speed grade. The internal 609.76 MHz headroom, when paired with Stratix II GX DSP block latency, can sustain multi-hundred-MSPS sample rates for channelized receivers. High-speed serial transceivers deliver raw ADC/DAC data to and from the FPGA, and the 1508-ball FC-FBGA enables dense LVDS pairs to interface with leading-edge converters. For phased-array or DBF systems, the fabric also implements beam-steering weights and timing distribution. Use Quartus II TimeQuest with the DSP megafunctions and confirm timing closure against the device's -5 speed bin before tape-out. Thermal analysis at the 40 mm body is critical in sealed enclosures.
Recommandé
Broadcast Video Processing Engine
The EP2SGX130GF40C5ES fits broadcast video processing because its 132,540 logic elements drive multi-channel SD/HD/3G-SDI pipelines, color-space converters, frame buffers, and on-screen-display compositors. The embedded transceivers accept SDI-over-coax or optical inputs at 270 Mbps, 1.485 Gbps, and 2.97 Gbps standards, while the 1508-ball FC-FBGA breaks out sufficient parallel LVDS pairs for HDMI/DVI or DisplayPort bridges. The C5 speed grade maintains timing margin on the wide memory buses used to drive external DDR2 frame buffers. Compared to ASSPs, the FPGA adapts as broadcast standards evolve and supports per-channel firmware upgrades in the field. Use the Altera Video and Image Processing (VIP) megafunction suite and the SDI reference design for fastest path to working hardware.
Recommandé
Telecom Line Card Aggregation
The EP2SGX130GF40C5ES is appropriate for telecom line-card aggregation switches where its multi-gigabit transceivers terminate SPI-4.2, SFI-4, or XAUI links while the 132K-logic-element fabric implements packet classification, policing, and queue management. The 1508-ball FC-FBGA on 1 mm pitch allows the dense mixed-signal pin-out that line cards require: many high-speed serial lanes plus a wide external RLDRAM-II or QDR-II SRAM bus for table lookup. The C5 speed grade supports tight scheduling deadlines for cell/packet processing at line rate. Designers should review the Stratix II GX High-Speed Reference Design for board-level transmit pre-emphasis and receive-equalization settings. JTAG-based in-system programming is supported for field upgrades.
Recommandé
Industrial Test and Measurement Instrumentation
The EP2SGX130GF40C5ES is a strong choice for high-end test-and-measurement instruments such as protocol analyzers, logic-analyzers, and arbitrary-waveform generators because the 132K-logic-element fabric processes and formats captured data at line rate while the embedded transceivers acquire high-speed serial traffic. The 609.76 MHz internal frequency and C5 speed grade sustain real-time triggering and timestamping blocks, and the 1508-ball FC-FBGA exposes sufficient pins for high-channel-count front ends. The commercial-extended 0C to +85C temperature grading is suitable for laboratory and factory-floor environments. Pair with external ADC/DAC companion parts to complete the analog front end, and use the Quartus II SignalTap II logic analyzer for runtime debug. Power-supply decoupling must follow the Stratix II GX PDN application note for clean transceiver operation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX130GF40C5ES — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX130GF40C5 | EP2SGX130GF40C5N | EP2SGX130GF40C4ES | EP2SGX130GF40C4NES | EP2SGX130GF40C3ES | EP2SGX130GF40C3NES |
|---|---|---|---|---|---|---|---|
| Package | FC-FBGA-1508 (40x40 mm) | FC-FBGA-1508 (40x40 mm) - same | FC-FBGA-1508 (40x40 mm) - same | FC-FBGA-1508 (40x40 mm) - same | FC-FBGA-1508 (40x40 mm) - same | FC-FBGA-1508 (40x40 mm) - same | FC-FBGA-1508 (40x40 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | C5 | C5 | C5 | C4 (slower by 1 bin) | C4 (slower by 1 bin) | C3 (slower by 2 bins) | C3 (slower by 2 bins) |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Core Voltage (nominal) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded Transceivers | Yes (Stratix II GX) | Yes | Yes | Yes | Yes | Yes | Yes |
| Lead-Free Finish | Yes (G suffix) | Yes | Yes (N suffix) | Yes | Yes (N suffix) | Yes | Yes (N suffix) |
Principaux différenciateurs
- C5 speed grade offers higher Fmax than C3/C4 bins (vs EP2SGX130GF40C3ES)
- Same-die 1508-ball GF40 land pattern as other Stratix II GX speed grades (vs EP2SGX130GF40C4ES)
- Lead-free, halogen-free 1508-ball finish supports modern RoHS builds (vs EP2SGX130GF40C5N)
Notes de conception
The 1508-ball FC-FBGA on 1 mm pitch requires a high-layer-count PCB stack-up - plan at least 6 layers (4 signal, 2 ground/power) for fanout, with a 0.4 mm or finer BGA escape via pattern. Follow Altera's Stratix II GX pin connection guidelines to confirm each ball's allowed function, bank voltage tolerance, and reserved-pin treatment before final routing.
The EP2SGX130GF40C5ES requires a multi-rail power distribution network: 1.2 V core, 2.5 V or 3.3 V I/O banks, auxiliary PLL supplies, and dedicated transceiver supply rails. Apply the Stratix II GX Power Distribution Network (PDN) application note, which specifies bulk, mid-frequency, and high-frequency decoupling placement directly under the die shadow. Use PowerPlay early in the Quartus II flow to estimate worst-case current and select the right regulator headroom.
Estimated: at full fabric utilization with active transceivers, the 40x40 mm FC-FBGA can dissipate 10-15 W; verify with PowerPlay numbers and apply a thermal interface material plus heatsink or airflow to keep the junction temperature within the 0C to 85C commercial-extended operating range. Theta_JA values for the 1508-ball FC-FBGA are package-dependent and should be confirmed in the Stratix II GX packaging thermal model.
Estimated: do not assume EP2SGX130GF40C5, EP2SGX130GF40C5N, and EP2SGX130GF40C5ES are interchangeable without checking the Altera ordering-information table - trailing suffixes encode lead-finish, speed-bin, and ES options that may affect programming file compatibility. Also, configuration mode (JTAG vs Passive Serial vs Active Serial) must be set with MSEL pins at board reset; an incorrect MSEL strap prevents configuration.
Informations de conformité
RoHS-compliant per the G-suffix lead-free ball finish. Halogen-free per the same finish. Not AEC-Q100 qualified - this is a commercial-extended 0C to 85C part.
