EP2SGX60CF780I5N - Stratix II GX FPGA 60K LE FC-FBGA-780 | Altera
Référence : EP2SGX60CF780I5N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1750 | $17 500,00 |
| 100 | $1650 | $165 000,00 |
| 500 | $1500 | $750 000,00 |
| 1 000 | $1380 | $1 380 000,00 |
EP2SGX60CF780I5N Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and high-speed I/O that can be re-programmed to implement custom digital logic. FPGAs sit at the top of the programmable logic hierarchy (PAL -> CPLD -> FPGA) and are used when processors or ASICs cannot meet performance, latency, or parallelism requirements. The Stratix II GX family targets high-speed serial connectivity and signal-processing applications, placing this specific variant as a high-end member suitable for telecom backplanes, broadcast video, and high-end test equipment.
Key features of the EP2SGX60CF780I5N include 2,542 Kbits of embedded RAM distributed across TriMatrix memory blocks (M512, M4K, and M-RAM), 192 dedicated 18x18 multipliers for DSP operations, and a 1.2V core supply (1.15V to 1.25V operating range). It supports up to 12 full-duplex transceiver channels at data rates up to 3.125 Gbps, with some configurations reaching 6.375 Gbps depending on speed grade. The industrial temperature grade (-40C to +100C) and 90nm CMOS process technology make it suitable for demanding industrial and defense applications.
The architecture is based on Altera's adaptive logic module (ALM) fabric, which provides finer-grained lookup-table (LUT) packing than previous Stratix generations, increasing effective logic density by ~25%. The transceiver blocks include dedicated Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) hardware, supporting standards such as PCIe Gen1 (2.5 Gbps), XAUI (3.125 Gbps), and Serial RapidIO (1.25 to 3.125 Gbps). Programmable pre-emphasis and equalization compensate for channel loss on FR-4 backplanes up to 40 inches.
Typical applications include high-speed serial interface bridging, telecom line card prototyping, military signal processing, broadcast video routers, and high-performance computing (HPC) acceleration. The 780-ball FC-FBGA package (29 x 29 mm, 1 mm pitch) is designed for high-density PCB designs with controlled-impedance routing for the transceiver lanes, requiring dedicated ground and power planes plus matched-length differential pairs.
When designing with this device, allocate transceiver lanes first and route them on the top or bottom layers with continuous reference planes. Power supply decoupling requires at least 22 decoupling capacitors per power rail, plus bulk capacitors for the 1.2V core and PLL analog supplies. JTAG and configuration pins (MSEL[2:0], nCONFIG, nSTATUS, DONE) must be accessible for in-system programming.
This page synthesizes distributor pricing, drop-in alternative Stratix II GX variants, and practical PCB design considerations not found in the manufacturer datasheet alone, giving procurement and engineering teams a single source for component evaluation.
Alternatives de remplacement direct pour EP2SGX60CF780I5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX60CF780I5N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, DSP Blocks, Core Voltage, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX60CF780I4N
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP2SGX60CF780C5N
✅ Remplacement direct✓ En stock
$485 / unité
Voir la fiche technique →EP2SGX60CF780C7
✅ Remplacement direct✓ En stock
$215 / unité
Voir la fiche technique →EP2SGX60CF780C5
✅ Remplacement direct✓ En stock
$162 / unité
Voir la fiche technique →EP2SGX60CF780C4N
✅ Remplacement direct✓ En stock
$220 / unité
Voir la fiche technique →EP2SGX60CF780C4
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP2SGX60CF780I5N Valeurs maximales et caractéristiques électriques
| Device Type | FPGA (Field Programmable Gate Array) |
| Family | Stratix II GX |
| Logic Elements (LE) | 60,440 |
| Adaptive Logic Modules (ALM) | 60,440 |
| Embedded Memory | 2,542 Kbits |
| DSP Blocks | 192 (18x18 multipliers) |
| Maximum Operating Frequency | 622.08 MHz |
| Core Voltage | 1.2 V (1.15 V to 1.25 V) |
| Process Technology | 90 nm CMOS |
| Transceiver Channels | Up to 12 (up to 6.375 Gbps) |
| Package Type | FC-FBGA-780 |
| Package Dimensions | 29 x 29 mm |
| Ball Pitch | 1.0 mm |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Statut RoHS | Compliant (Lead-Free) |
| Configuration Mode | JTAG, Passive Serial, Fast Passive Parallel |
Guide de configuration des broches du EP2SGX60CF780I5N 29 x 29 mm
Configuration des broches du EP2SGX60CF780I5N (boîtier 29 x 29 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2SGX60CF780I5N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2SGX60CF780I5N convient pour 6 applications: High-Speed Serial Interface Bridging, Telecom Line Card Prototyping, Military Signal Processing, Broadcast Video Routing, High-Performance Computing Acceleration, Industrial Imaging and Machine Vision.
High-Speed Serial Interface Bridging
The EP2SGX60CF780I5N is ideally suited for high-speed serial bridge applications with its 12 integrated transceiver channels supporting up to 6.375 Gbps. The Stratix II GX PMA/PCS hard IP blocks enable drop-in implementation of PCIe Gen1 (2.5 Gbps), XAUI (3.125 Gbps), Serial RapidIO (1.25-3.125 Gbps), and CEI-6G protocols without consuming FPGA fabric resources. In a typical bridging design, the device converts between a serial backplane (e.g., XAUI on 10 Gigabit Ethernet) and a parallel local bus (e.g., SPI-4.2 or SFI-4.1), offloading the protocol processing from an external ASIC. The 60,440 LEs provide ample headroom for user logic such as packet buffers, encryption, or error correction. Programmable pre-emphasis and adaptive equalization compensate for FR-4 channel loss up to 40 inches.
Recommandé
Telecom Line Card Prototyping
The EP2SGX60CF780I5N is widely deployed in telecom line card prototyping for SDH/SONET and OTN (Optical Transport Network) applications. Its 60,440 LEs support complex traffic management, framer/mapper logic, and forward error correction (FEC) algorithms such as Reed-Solomon and Turbo coding. The 192 dedicated 18x18 DSP multipliers enable high-throughput channel coding at 10G+ line rates. The 2,542 Kbits of embedded RAM using TriMatrix blocks (M512, M4K, M-RAM) provide packet buffering with deterministic latency. Industrial temperature grade (-40C to +100C) supports central office and outside-plant deployments. Quartus II MegaCore IP libraries include ready-to-use framer, mapper, and FEC blocks that dramatically shorten development cycles.
Recommandé
Military Signal Processing
The EP2SGX60CF780I5N is suitable for military signal processing applications including radar, electronic warfare (EW), and software-defined radio (SDR). The combination of 60,440 LEs, 192 DSP blocks, and 12 transceiver channels supports multi-channel digital receiver designs with on-chip digital downconversion, pulse compression, and beamforming. The industrial temperature grade meets MIL-STD-810 shock and vibration requirements when paired with proper PCB stiffening. FPGA firmware can be updated in the field via JTAG, supporting software-defined mission profiles. The device is part of Altera/Intel's military product program with extended lifecycle support. Designers should use conformal coating and radiation-hardened-by-design (RHBD) considerations for high-altitude applications.
Recommandé
Broadcast Video Routing
The EP2SGX60CF780I5N is used in broadcast video routers and format converters supporting SDI (Serial Digital Interface) at 270 Mbps, HD-SDI at 1.485 Gbps, and 3G-SDI at 2.97 Gbps. The 12 integrated transceivers can handle multiple 3G-SDI streams simultaneously with on-chip clock recovery and descrambling. The 60,440 LEs provide logic for cross-point switching, color space conversion, and audio embedding/de-embedding. The 1.2V low-voltage operation reduces power consumption compared to older ASIC-based router designs, enabling higher-density matrix cards. Industrial temperature grade supports outdoor broadcast trucks and harsh venue environments. Quartus II supports SMPTE standards-compliant IP cores.
Recommandé
High-Performance Computing Acceleration
The EP2SGX60CF780I5N is used as an FPGA co-processor in high-performance computing (HPC) acceleration cards, providing hardware acceleration for genomics, financial analytics, and scientific computing workloads. The 192 DSP multipliers deliver ~38 GMACs of fixed-point arithmetic at full utilization, ideal for FFT, matrix multiplication, and cryptographic primitives. The transceiver channels enable high-bandwidth PCIe Gen1 x8 host interfaces at 20 Gbps aggregate. 60,440 LEs accommodate deep custom pipelines exceeding what CPUs can achieve at comparable power. Industrial temperature grade supports dense compute cluster deployments. The OpenCL and Altera SDK for OpenCL provide familiar C-based development flows for HPC users.
Recommandé
Industrial Imaging and Machine Vision
The EP2SGX60CF780I5N is used in industrial imaging systems for high-speed camera interfaces, image preprocessing, and real-time machine vision algorithms. Its transceiver channels support CoaXPress (up to 6.25 Gbps per lane) and Camera Link HS interfaces for high-resolution line-scan cameras. The 60,440 LEs and 192 DSP blocks enable real-time Bayer demosaicing, color correction, defect pixel correction, and edge detection at rates exceeding 100 frames per second at 4K resolution. Industrial temperature grade (-40C to +100C) supports factory floor and outdoor machine vision deployments. The 2,542 Kbits embedded RAM acts as multi-line frame buffers between camera input and host output.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX60CF780I5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX60CF780I4N | EP2SGX60CF780C5N | EP2SGX60CF780C7 | EP2SGX60CF780C5 | EP2SGX60CF780C4N | EP2SGX60CF780C4 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FC-FBGA-780 | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same |
| Logic Elements | 60,440 | 60,440 (same die) | 60,440 (same die) | 60,440 (same die) | 60,440 (same die) | 60,440 (same die) | 60,440 (same die) |
| Speed Grade | I5 (industrial, fast) | I4 (industrial, slower) | C5 (commercial, fast) | C7 (commercial, fastest) | C5 (commercial, fast) | C4 (commercial, slower) | C4 (commercial, slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Lead-Free (N suffix) | Yes | Yes | Yes | No (no N suffix) | No (no N suffix) | Yes | No (no N suffix) |
| Transceiver Channels | 12 | 12 (same) | 12 (same) | 12 (same) | 12 (same) | 12 (same) | 12 (same) |
Principaux différenciateurs
- Industrial temperature grade with full speed grade I5 rating (vs EP2SGX60CF780C5N)
- Lead-free (RoHS) compliance with N suffix (vs EP2SGX60CF780C7)
- Faster speed grade I5 vs I4 for tighter timing budgets (vs EP2SGX60CF780I4N)
Notes de conception
Estimated: the FC-FBGA-780 package requires a 12-layer PCB minimum with dedicated ground and 1.2V power planes. Transceiver channels demand tightly controlled 100-ohm differential impedance on the top or bottom layer, with via count minimized to avoid stubs. AC coupling capacitors (typically 100 nF X7R) are required on each transmit lane output and must be placed within 1 cm of the FPGA ball. Matched-length routing is mandatory for each transceiver pair, with 0.127 mm tolerance per pair to maintain eye-diagram compliance at 6.375 Gbps.
The EP2SGX60CF780I5N requires four supply rails: VCC (1.2V core, up to 3-5A under full utilization), VCCPD (3.3V I/O pre-driver), VCCIO (1.2V-3.3V bank I/O), and VCCA_PLL (1.2V analog PLL). Decoupling requires at least 22 ceramic capacitors per rail (mix of 100 nF and 4.7 uF), plus 220 uF bulk capacitance within 2 cm of the package. Power-on sequencing must follow VCCIO/VCCPD before VCC or risk latch-up; reference the Stratix II GX handbook for the recommended sequence. Use a dedicated power supervisor IC such as the LTC2923 to enforce sequencing.
Estimated: transceiver channel pre-emphasis must be tuned per board layout using Quartus II Transceiver Toolkit. Typical pre-emphasis settings of 6-9 dB at 6.375 Gbps compensate for FR-4 loss. Receiver equalization must be enabled for channels exceeding 10 inches of trace length. Use Time Domain Reflectometry (TDR) measurements or HyperLynx simulations to verify impedance continuity at via transitions, especially BGA breakout vias. Reference clocks must be routed with controlled 50-ohm impedance and isolated from noisy signals; jitter must be below 80 fs RMS for 6.375 Gbps operation.
Estimated: under full logic utilization with all 12 transceivers active, the EP2SGX60CF780I5N can dissipate 8-12W. The FC-FBGA-780 package has no integrated heat slug; thermal management relies on PCB copper spreading with at least 25 cm² of top-layer copper plus a thermal via array under the die. For applications exceeding 10W, attach a heatsink with thermal interface material rated for -40C to +125C operation. Junction-to-ambient thermal resistance (theta_JA) on a 12-layer JEDEC test board is approximately 15 C/W.
Informations de conformité
RoHS compliant per Altera/Intel product declaration; N suffix confirms lead-free ball finish. Not AEC-Q100 qualified - this is a commercial/industrial FPGA, not an automotive-grade device.
