EP3C25E144C7 - 24,624 Logic Elements FPGA | Altera
Référence : EP3C25E144C7 ✗ Fin de vieEP3C25E144C7 Présentation
A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O behavior are configured after manufacture. In the product hierarchy, an FPGA is a programmable-logic semiconductor and a more flexible alternative to application-specific integrated circuits. The Cyclone III family combines configurable logic blocks, embedded RAM, general-purpose I/O, and programmable interconnect resources within one device.
Key features include 24,624 logic elements, 1,539 logic array blocks, and 608,256 bits of embedded RAM. The device provides 82 user I/O and is available in a 144-pin exposed-pad package. Its listed 437.5 MHz maximum frequency gives designers a useful benchmark for clocked digital logic, although achievable system frequency depends on the selected logic path, I/O standard, timing constraints, and implementation.
The Cyclone III architecture organizes programmable resources into logic array blocks connected by general-purpose interconnect. Embedded memory allows designers to implement buffers, lookup tables, packet stores, and small data tables without using external memories. Its 82 I/O pins support integration with external processors, transceivers, converters, memory devices, and industrial interface components, subject to the voltage and timing constraints specified by the manufacturer datasheet.
Typical uses include industrial control, communications infrastructure, instrumentation, embedded signal processing, and general-purpose logic consolidation. The device can host parallel interfaces, control logic, protocol bridges, or embedded state machines where a programmable architecture simplifies updates compared with fixed logic. Its 144-pin exposed-pad package also supports board-level thermal management through the pad and associated PCB copper.
The primary design consideration is thermal management. The exposed pad must be connected to the required power and ground planes and thermally coupled to copper according to the package and board guidelines. Designers must also verify I/O voltage compatibility, pin constraints, power sequencing, memory initialization, and timing closure in the Quartus design environment.
This product record combines verified distributor specifications, source links, practical application guidance, and explicitly qualified drop-in alternatives. Alternative electrical data is left as where the supplied source material does not provide a verified value, allowing engineers to distinguish confirmed facts from items that still require datasheet validation.
Alternatives de remplacement direct pour EP3C25E144C7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C25E144C7 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Core Supply Voltage, Maximum Frequency, RoHS Status.
EP3C25E144I7N
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →EP3C25E144C8
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →EP3C25E144C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3C25E144I8
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3C25E144I8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3C25E144C7 Valeurs maximales et caractéristiques électriques
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III |
| Logic Elements | 24,624 |
| Logic Array Blocks | 1,539 |
| Embedded RAM | 608,256 bits |
| General-Purpose I/O | 82 |
| Maximum Frequency | 437.5 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Nominal Core Voltage | 1.2 V |
| Junction Temperature Range | 0°C to 85°C |
| Boîtier | 144-pin EQFP/LQFP with exposed pad |
| Number of Terminals | 144 |
| Package Form | Rectangular |
| Terminal Form | Gull wing |
| Type de montage | Surface mount |
| Programmability | User-programmable after manufacture |
Guide de configuration des broches du EP3C25E144C7 rectangular
Configuration des broches du EP3C25E144C7 (boîtier rectangular). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3C25E144C7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3C25E144C7 convient pour 6 applications: Industrial PLC and Automation Control, Communications Interface Bridging, Data Acquisition and Signal Conditioning, Embedded Instrumentation Control, Network Equipment Control Plane, Programmable Logic Consolidation.
Industrial PLC and Automation Control
The EP3C25E144C7 fits industrial programmable-logic controller and automation modules because it combines 24,624 logic elements, 1,539 logic array blocks, and 82 general-purpose I/O. Those resources can support parallel sequencing logic, machine-state machines, interlocks, counters, and communication-control functions. The 1.15 V to 1.25 V core range requires a compliant supply design, while the 608,256 bits of embedded RAM can implement small buffers or lookup tables. Its 144-pin exposed-pad package also requires a deliberate PCB thermal strategy.
Recommandé
Communications Interface Bridging
The EP3C25E144C7 is suitable for protocol conversion and communications preprocessing because its programmable logic can merge serial framing, packet filtering, buffering, and control functions into one device. The 608,256 bits of embedded RAM provides local storage for small packet queues or state tables, while the listed 437.5 MHz device frequency gives adequate margin for many parallel-logic implementations. The 82 user I/O allow direct connection to transceivers and level shifters. Actual line-rate performance still depends on I/O standards, timing constraints, and selected external components.
Recommandé
Data Acquisition and Signal Conditioning
The EP3C25E144C7 can implement digital signal conditioning around data-conversion systems, including sampling control, calibration tables, trigger logic, and data packing. Its 24,624 logic elements are useful for parallel datapaths and finite-state control, while the 608,256 bits of embedded RAM can hold calibration or lookup data. The device operates from a 1.15 V to 1.25 V core supply, leaving separate external handling for converter and interface voltages. Designers must establish complete timing constraints for acquisition clocks and validate analog isolation separately.
Recommandé
Embedded Instrumentation Control
The EP3C25E144C7 suits instrument-control logic that coordinates front-panel functions, calibration storage, status reporting, and measurement sequencing. Programmable I/O and logic blocks can implement custom test sequences and interface adaptation without a separate fixed-logic ASIC, while embedded RAM can support local measurement tables or command history. The 82 I/O offer connections to display, keypad, and communication circuitry, but voltage compatibility must be checked for every external device. The exposed pad should be tied and thermally coupled according to the manufacturer footprint.
Recommandé
Network Equipment Control Plane
The EP3C25E144C7 can implement control-plane, status, and management functions in network equipment where programmable logic accelerates packet classification or supervisory processing. Its 24,624 logic elements and 608,256 bits of RAM provide a compact resource base for finite-state machines, queues, and protocol parsing, while 82 I/O support PHY, transceiver, and management interfaces. The 437.5 MHz listed frequency is a device benchmark, not a guaranteed throughput figure. Line-rate closure depends on memory interfaces, routing congestion, and timing constraints.
Recommandé
Programmable Logic Consolidation
The EP3C25E144C7 is useful when consolidating glue logic, parallel datapaths, and small state machines into a single configurable device. Its 1,539 logic array blocks and 24,624 logic elements provide a substantially larger implementation surface than basic CPLDs, while 608,256 bits of RAM reduce the need for external buffers. The 144-pin package offers 82 general-purpose I/O, but not every package pin is necessarily available for general routing because configuration and power pins have fixed assignments. A complete Quartus fit, timing, and pin-placement review is required before committing to the design.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C25E144C7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C25E144I7N | EP3C25E144C8 | EP3C25E144C7N | EP3C25E144I8 | EP3C25E144I8N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-pin EQFP/LQFP with exposed pad | 144-pin EQFP/LQFP with exposed pad - same | 144-pin EQFP/LQFP with exposed pad - same | 144-pin EQFP/LQFP with exposed pad - same | 144-pin EQFP/LQFP with exposed pad - same | 144-pin EQFP/LQFP with exposed pad - same |
| Device Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Elements | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 |
| Logic Array Blocks | 1,539 | 1,539 | 1,539 | 1,539 | 1,539 | 1,539 |
| Embedded RAM | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits |
| General-Purpose I/O | 82 | 82 | 82 | 82 | 82 | 82 |
| Ordering-Grade Distinction | C7 commercial-temperature, speed-grade 7 ordering code | I7 industrial-temperature, speed-grade 7, lead-free N suffix | C8 commercial-temperature, speed-grade 8 ordering code | C7 commercial-temperature, speed-grade 7, lead-free N suffix | I8 industrial-temperature, speed-grade 8 ordering code | I8 industrial-temperature, speed-grade 8, lead-free N suffix |
Principaux différenciateurs
- Directly documented Intel/Altera listing (vs EP3C25E144I7N)
- Commercial-temperature ordering option (vs EP3C25E144I7N)
- Same-footprint configuration reuse (vs EP3C25E144C8)
- Lead-free ordering path without changing the package (vs EP3C25E144C7N)
Notes de conception
Treat the EP3C25E144C7 exposed pad as both an electrical and thermal connection. Follow the manufacturer package drawing for power and ground connectivity, then provide uninterrupted copper beneath and around the package. Use the published junction-temperature limit, device activity factor, and estimated FPGA core dissipation to calculate board temperature rise. Do not infer safe operation from the 0°C to 85°C junction range alone; junction temperature, not ambient temperature, is the controlling limit.
Implement the 1.15 V to 1.25 V core rail with low-noise, stable regulation and verify sequencing against the manufacturer power-up requirements. Place the core bypass capacitors directly at the relevant supply and ground pins using short, low-inductance paths. A Quartus power estimate should include logic, I/O, and configuration resources rather than relying only on the 437.5 MHz device benchmark. Margin for temperature, aging, and local supply tolerance should be established from the complete datasheet.
Preserve the 144-pin EQFP/LQFP footprint and exposed-pad geometry exactly, including pad dimensions, solder-mask definition, paste pattern, and copper thermal relief. Because an FPGA is not pin-compatible based on package name alone, verify the complete pin table, configuration pins, power pins, and I/O assignments against the selected ordering code. Route clocks and high-speed signals over continuous reference planes, keep the FPGA away from switching-node edges, and minimize vias in sensitive clock paths.
Do not treat EP3C25E144C7 and EP3C25E144I7N as unconditional equivalents. The C7 and I7 ordering identifiers encode different temperature-grade requirements, and adding an N suffix can identify lead-free termination rather than a functional change. Likewise, a speed-grade suffix can alter timing guarantees. Before substitution, compare the complete ordering table, absolute maximum ratings, recommended operating conditions, configuration behavior, package drawing, and lifecycle status in the manufacturer documentation.
Apply timing constraints to every clock, interface, and I/O path and complete post-fit timing analysis in the appropriate FPGA design tool. The listed 437.5 MHz maximum frequency is not a promise that every design will close at that frequency because logic depth, routing congestion, I/O standards, and memory usage affect timing. Reserve PLL outputs and dedicated clock pins where required, keep external clock jitter within the device budget, and validate external interface voltage levels independently of the 1.15 V to 1.25 V core supply.
Informations de conformité
The supplied web results do not provide explicit RoHS, REACH, halogen-free, or conflict-minerals declarations for EP3C25E144C7. The N suffix in related ordering codes is not sufficient to establish the target's compliance status without the manufacturer ordering and material-declaration documentation. AEC-Q100 is treated as not applicable because this industrial FPGA is not identified as an automotive-qualified product.
