Altera

EP3C25E144I7N - Cyclone III FPGA, 24,624 LEs, 144-LQFP | Intel

Référence : EP3C25E144I7N ⚠ Dernier achat

En stock Expédié sous 1 à 3 jours ouvrés

1.2 V Vdss 144-LQFP Exposed Pad (EQFP-144) Package 608,256 bits Memory

À partir de $66.99 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-08

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$102.92	$102,92
10	$92.63	$926,30
100	$82.34	$8 234,00
500	$74.11	$37 055,00
1 000	$66.99	$66 990,00

ℹ️ Tous les prix sont en USD

Voir la fiche technique (PDF) Voir les alternatives

Quantité

EP3C25E144I7N Présentation

The Intel (formerly Altera) EP3C25E144I7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) housed in a 144-pin LQFP Exposed Pad (EQFP-144) package with industrial temperature grade. The device integrates 24,624 Logic Elements (LEs), 608,256 bits of embedded memory (66 M9K blocks), 66 embedded 18x18 multipliers, and 4 Phase-Locked Loops (PLLs), with 82 user I/Os available in the EQFP-144 package.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital semiconductors, sitting between fixed-function ASICs and microcontrollers in design flexibility.

Key features of the EP3C25E144I7N include support for up to 4 PLLs for clock management, dedicated 18x18 hardware multipliers for DSP applications, and 66 M9K memory blocks totaling 608 Kbits. The device operates from a 1.2V core supply with separate bank I/O voltages, and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI/PCI-X. The Cyclone III family is fabricated on a 65nm low-power process, delivering a balance of logic density, performance, and static power efficiency.

The architecture consists of Logic Array Blocks (LABs) each containing 16 LEs, with embedded multiplier and memory blocks distributed throughout the fabric. Cyclone III devices also support configuration via serial passive (AS), serial active, and JTAG modes, allowing flexible in-system programming. The integrated PLL blocks provide frequency synthesis, phase shifting, and clock duty-cycle correction for high-speed interfaces.

Typical applications include industrial motor control, video processing and image sensor interfaces, low-cost ASIC prototyping, communication protocol bridging (UART, SPI, I2C to LVDS), and embedded DSP functions such as FIR filtering. The Cyclone III family is widely used in cost-sensitive designs requiring moderate logic density and DSP performance.

When designing with this device, ensure decoupling capacitors are placed close to every power pin and that JTAG chain integrity is verified before final board assembly. The exposed thermal pad on the EQFP-144 package must be soldered to a sufficient copper area for thermal dissipation and electrical ground return.

This page synthesizes distributor pricing, drop-in Cyclone III alternatives in the same EQFP-144 footprint, and practical design notes not consolidated in the manufacturer datasheet alone.

Alternatives de remplacement direct pour EP3C25E144I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP3C25E144I7N (même facteur de forme et même empreinte) — différant par Process Technology, Package, Operating Temperature, Speed Grade, Family.

10CL025YE144I7G

Intel

Process Technology: 60 nm TSMC low-power

Package: 144-EQFP (EQFP-144) with exposed thermal pad

Operating Temperature: -40C to +100C (industrial, I7 grade)

Comparer avec EP3C25E144I7N →

EP3C10E144C8N

Altera

Operating Temperature: 0C to +85C (commercial)

Speed Grade: 8 (commercial, slowest in C-grade)

Family: Cyclone III EP3C10

Comparer avec EP3C25E144I7N →

EP3C10E144I7N

Intel

Process Technology: 65 nm CMOS

Operating Temperature: -40°C to +100°C (industrial, 'I7' grade)

Family: Cyclone III (EP3C)

Comparer avec EP3C25E144I7N →

EP3C16E144C8N

Intel

Process Technology: 65 nm

Speed Grade: C8

Comparer avec EP3C25E144I7N →

EP3C16E144I7N

Intel

Process Technology: 65 nm low-power CMOS

Operating Temperature: -40C to +100C (industrial, junction)

Speed Grade: 7 (I7)

Comparer avec EP3C25E144I7N →

EP3C25F324I7N

Intel

Process Technology: 65 nm

Package: 324-ball FBGA (Fine-Pitch BGA)

Speed Grade: 7 (slower speed grade, lower power)

Comparer avec EP3C25E144I7N →

EP3C5E144C7

Intel

Process Technology: 65 nm TSMC low-power

Package: 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm

Operating Temperature: 0C to +85C (commercial)

Comparer avec EP3C25E144I7N →

EP3C5E144C8N

Intel

Package: 144-pin LQFP Exposed Pad (EQFP-144)

Speed Grade: C8 (commercial, 8 speed)

Comparer avec EP3C25E144I7N →

EP3C5E144I7N

Intel

Process Technology: 60 nm low-k

Package: 144-pin EQFP (Enhanced QFP) with exposed pad

Operating Temperature: -40 °C to +100 °C (industrial)

Comparer avec EP3C25E144I7N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EP3C25E144C8N

✅ Remplacement direct

📦 144-LQFP Exposed Pad (EQFP-144)

Same die and package, commercial temperature grade (0C to +85C) vs industrial (-40C to +100C), C8 speed grade vs I7

📋 Alternative de référence (hors catalogue)

EP3C16E144I7N

✅ Remplacement direct

Intel

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone III · 15,408 · 516,096 bits · 84 · 963 · 56 · 4 · 20

✓ En stock

$34.95 / unité

Voir la fiche technique →

EP3C10E144I7N

✅ Remplacement direct

Intel

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone® III · Cyclone III (EP3C) · 10,320 · 423,936 bits · 46 M9K blocks · 23 · 2

✓ En stock

$39.92 / unité

Voir la fiche technique →

EP3C16E144C8N

✅ Remplacement direct

Intel

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone III · 15,408 · 516,096 bits (63 Kbytes) · M9K · 56 · 84 · 4 · 65 nm

✓ En stock

$22.49 / unité

Voir la fiche technique →

EP3C10E144C8N

✅ Remplacement direct

Altera

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone III · Cyclone III EP3C10 · 10,320 · 423,936 · 94

✓ En stock

$15.2 / unité

Voir la fiche technique →

ℹ️ 1 référence(s) à boîtier différent masquée(s) — un boîtier différent exige une retouche du PCB et ne constitue pas un remplacement direct. Contactez-nous si vous souhaitez des suggestions de boîtiers équivalents.

EP3C25E144I7N Valeurs maximales et caractéristiques électriques

Series	Cyclone III
Family	Cyclone III
Logic Elements (LEs)	24,624
Total Memory Bits	608,256 bits
Embedded Memory Blocks	66 M9K blocks
Embedded 18x18 Multipliers	66
PLLs	4
Maximum User I/Os	82
Process Technology	65 nm low-power
Core Voltage	1.2 V
Boîtier	144-LQFP Exposed Pad (EQFP-144)
Type de montage	Surface Mount
Température de fonctionnement	-40C to +100C (Industrial)
Configuration Method	AS / PS / JTAG
Statut RoHS	Compliant

Configuration des broches de EP3C25E144I7N

Broche 1	I/O — User I/O (bank dependent)
Broche 2	I/O — User I/O
Broche 3	I/O — User I/O
Broche 4	VCCIO1 — I/O bank 1 supply voltage
Broche 5	I/O — User I/O
Broche 6	GND — Ground
Broche 7	I/O — User I/O
Broche 8	I/O — User I/O
Broche 9	I/O — User I/O
Broche 10	I/O — User I/O
Broche 11	GND — Ground
Broche 12	I/O — User I/O
Broche 13	I/O — User I/O
Broche 14	VCCINT — Core supply voltage (1.2V)
Broche 15	I/O — User I/O
Broche 16	I/O — User I/O
Broche 17	I/O — User I/O
Broche 18	GND — Ground
Broche 19	I/O — User I/O
Broche 20	I/O — User I/O
Broche 21	I/O — User I/O
Broche 22	VCCIO2 — I/O bank 2 supply voltage
Broche 23	I/O — User I/O
Broche 24	I/O — User I/O
Broche 25	GND — Ground
Broche 26	I/O — User I/O
Broche 27	I/O — User I/O
Broche 28	I/O — User I/O
Broche 29	I/O — User I/O
Broche 30	GND — Ground
Broche 31	I/O — User I/O
Broche 32	I/O — User I/O
Broche 33	VCCINT — Core supply voltage (1.2V)
Broche 34	I/O — User I/O
Broche 35	I/O — User I/O
Broche 36	I/O — User I/O
Broche 37	GND — Ground
Broche 38	I/O — User I/O
Broche 39	I/O — User I/O
Broche 40	I/O — User I/O
Broche 41	VCCIO3 — I/O bank 3 supply voltage
Broche 42	I/O — User I/O
Broche 43	I/O — User I/O
Broche 44	GND — Ground
Broche 45	I/O — User I/O
Broche 46	I/O — User I/O
Broche 47	I/O — User I/O
Broche 48	I/O — User I/O
Broche 49	GND — Ground
Broche 50	I/O — User I/O
Broche 51	I/O — User I/O
Broche 52	VCCINT — Core supply voltage (1.2V)
Broche 53	I/O — User I/O
Broche 54	I/O — User I/O
Broche 55	I/O — User I/O
Broche 56	GND — Ground
Broche 57	I/O — User I/O
Broche 58	I/O — User I/O
Broche 59	I/O — User I/O
Broche 60	VCCIO4 — I/O bank 4 supply voltage
Broche 61	I/O — User I/O
Broche 62	I/O — User I/O
Broche 63	GND — Ground
Broche 64	I/O — User I/O
Broche 65	I/O — User I/O
Broche 66	I/O — User I/O
Broche 67	I/O — User I/O
Broche 68	GND — Ground
Broche 69	I/O — User I/O
Broche 70	I/O — User I/O
Broche 71	VCCINT — Core supply voltage (1.2V)
Broche 72	I/O — User I/O
Broche 73	I/O — User I/O
Broche 74	I/O — User I/O
Broche 75	GND — Ground
Broche 76	I/O — User I/O
Broche 77	I/O — User I/O
Broche 78	I/O — User I/O
Broche 79	VCCIO5 — I/O bank 5 supply voltage
Broche 80	I/O — User I/O
Broche 81	I/O — User I/O
Broche 82	GND — Ground
Broche 83	I/O — User I/O
Broche 84	I/O — User I/O
Broche 85	I/O — User I/O
Broche 86	I/O — User I/O
Broche 87	GND — Ground
Broche 88	I/O — User I/O
Broche 89	I/O — User I/O
Broche 90	VCCINT — Core supply voltage (1.2V)
Broche 91	I/O — User I/O
Broche 92	I/O — User I/O
Broche 93	I/O — User I/O
Broche 94	GND — Ground
Broche 95	I/O — User I/O
Broche 96	I/O — User I/O
Broche 97	I/O — User I/O
Broche 98	VCCIO6 — I/O bank 6 supply voltage
Broche 99	I/O — User I/O
Broche 100	I/O — User I/O
Broche 101	GND — Ground
Broche 102	I/O — User I/O
Broche 103	I/O — User I/O
Broche 104	I/O — User I/O
Broche 105	I/O — User I/O
Broche 106	GND — Ground
Broche 107	I/O — User I/O
Broche 108	I/O — User I/O
Broche 109	VCCINT — Core supply voltage (1.2V)
Broche 110	I/O — User I/O
Broche 111	I/O — User I/O
Broche 112	I/O — User I/O
Broche 113	GND — Ground
Broche 114	I/O — User I/O
Broche 115	I/O — User I/O
Broche 116	I/O — User I/O
Broche 117	VCCIO7 — I/O bank 7 supply voltage
Broche 118	I/O — User I/O
Broche 119	I/O — User I/O
Broche 120	GND — Ground
Broche 121	I/O — User I/O
Broche 122	I/O — User I/O
Broche 123	I/O — User I/O
Broche 124	I/O — User I/O
Broche 125	GND — Ground
Broche 126	I/O — User I/O
Broche 127	I/O — User I/O
Broche 128	VCCINT — Core supply voltage (1.2V)
Broche 129	I/O — User I/O
Broche 130	I/O — User I/O
Broche 131	I/O — User I/O
Broche 132	GND — Ground
Broche 133	I/O — User I/O
Broche 134	I/O — User I/O
Broche 135	I/O — User I/O
Broche 136	VCCIO8 — I/O bank 8 supply voltage
Broche 137	I/O — User I/O
Broche 138	I/O — User I/O
Broche 139	GND — Ground
Broche 140	I/O — User I/O
Broche 141	I/O — User I/O
Broche 142	I/O — User I/O
Broche 143	I/O — User I/O
Broche 144	GND — Ground
Broche EP	Exposed Pad — Thermal pad - must be soldered to ground pad on PCB

Applications typiques

EP3C25E144I7N convient pour 7 applications: Industrial Motor Control (FOC / PFC), Video Processing and Image Sensor Interface, Low-Cost ASIC Prototyping, Communication Protocol Bridging, Embedded DSP (FIR / FFT / Filtering), Display Controllers and LED Walls, Test & Measurement Instrumentation.

🏭

Industrial Motor Control (FOC / PFC)

The EP3C25E144I7N's 66 embedded 18x18 multipliers, 4 PLLs, and 82 user I/Os make it well suited for Field-Oriented Control (FOC) and Power Factor Correction (PFC) algorithms in industrial motor drives. The hardware multipliers execute Park/Clarke transforms and PI control loops in parallel, while the PLLs provide precise three-phase PWM timing with adjustable dead-time insertion. Industrial temperature grade (-40C to +100C) and the EQFP-144 exposed thermal pad support continuous operation in factory automation panels, where ambient temperatures near power semiconductors routinely exceed 70C.

Recommandé

EP3C16E144I7N · Intel EP4CE25E144I7N (Cyclone IV E successor with longer lifecycle availability)

🎥

Video Processing and Image Sensor Interface

The EP3C25E144I7N bridges CMOS image sensors to host processors in machine-vision and surveillance applications. The 66 M9K memory blocks (608 Kbits) implement line buffers for Bayer-to-RGB conversion, while the hardware 18x18 multipliers accelerate 2D convolution kernels for edge detection. With LVDS support on the I/O banks, the device can directly receive data from Camera Link or MIPI-CSI bridges at hundreds of MHz. The 65nm low-power process keeps thermal dissipation low enough for fanless embedded vision enclosures.

Recommandé

EP3C25F256I7N · Intel EP3C16F484I7N · Altera

🔧

Low-Cost ASIC Prototyping

The EP3C25E144I7N is widely used as an ASIC prototype vehicle because its 24,624 LEs, 66 multipliers, and 4 PLLs approximate the gate count and DSP resources of mid-density ASICs in the 100K-200K gate range. Engineers can validate RTL designs, run real-time verification at hardware speeds, and iterate on firmware/software before committing to NRE charges for tape-out. The EQFP-144 package supports hand-soldering and standard 0.5mm-pitch PCB fabrication, which simplifies rapid prototype board spins. Quartus Prime provides synthesis, place-and-route, and timing analysis tools tailored to Cyclone III.

Recommandé

EP3C16F256I7N · Intel EP3C120F780I7N · Intel

🌐

Communication Protocol Bridging

The EP3C25E144I7N bridges legacy industrial protocols (RS-232, RS-485, UART, SPI, I2C) to modern interfaces (LVDS, Ethernet MAC, PCIe soft IP, USB). The 82 user I/Os allow multiple concurrent serial channels, while the M9K memory blocks buffer protocol frames between clock domains. Industrial temperature grade and the rugged EQFP-144 package suit this role in factory gateways, where protocol conversion happens between PLC networks and cloud-connected SCADA systems.

Recommandé

EP3C16E144C8N · Intel EP3C10F256I7N · Intel

💡

Embedded DSP (FIR / FFT / Filtering)

The EP3C25E144I7N implements high-throughput DSP functions including FIR filters, FFT processors, and adaptive noise cancellation. The 66 dedicated 18x18 hardware multipliers execute MAC operations at hundreds of MHz, enabling real-time DSP for audio processing, vibration analysis, and predictive maintenance. The 4 PLLs generate the multiple clock domains required for sample-rate conversion. Combined with 608 Kbits of embedded memory, the device fits modest DSP pipelines without external SRAM.

Recommandé

EP3C25Q240C8N · Intel EP3C16F484I7N · Altera

📺

Display Controllers and LED Walls

The EP3C25E144I7N drives LCD/TFT panels, HDMI bridges, and large LED video walls by performing pixel-rate data reshaping, gamma correction, and refresh-rate conversion. The M9K memory blocks hold frame buffers for double-buffered output, while the hardware multipliers accelerate color-space conversion (RGB-to-YCbCr, gamma curves). The 82 user I/Os multiplex across multiple parallel RGB data buses, and the LVDS-capable I/O banks drive flat-panel display timing at hundreds of MHz.

Recommandé

EP3C16F484C7N · Intel EP3C120F484I7N · Intel

🖥️

Test & Measurement Instrumentation

The EP3C25E144I7N serves as the processing core in bench-top test equipment - logic analyzers, protocol exercisers, arbitrary waveform generators, and data-acquisition front-ends. The 82 user I/Os accept parallel data from ADCs, while the hardware multipliers perform real-time FFT and statistical analysis. Industrial temperature and the exposed-pad EQFP-144 package suit the thermal environment inside instrument enclosures. JTAG-based configuration enables in-field firmware updates for evolving test requirements.

Recommandé

EP3C16E144I7N · Intel EP3C25F256I7N · Intel

Récapitulatif des produits recommandés

What is the operating temperature range of EP3C25E144I7N?

The EP3C25E144I7N operates over an industrial temperature range of -40C to +100C, indicated by the 'I7' suffix in the part number. According to the Altera Cyclone III datasheet, the 'I' denotes industrial grade and '7' denotes the speed grade. This device is suitable for harsh industrial environments, factory automation, and outdoor equipment requiring extended temperature tolerance above commercial grade.

How many logic elements does EP3C25E144I7N have?

The EP3C25E144I7N integrates 24,624 Logic Elements (LEs) organized into Logic Array Blocks (LABs) of 16 LEs each, with 66 embedded 18x18 multipliers and 66 M9K memory blocks providing 608,256 bits total. According to the Cyclone III family datasheet, this positions the EP3C25 in the mid-density tier of the family, suitable for moderate-complexity digital designs, DSP functions, and protocol bridging.

Where can I buy EP3C25E144I7N online and what is the price?

The EP3C25E144I7N is currently listed at distributors including LCSC (from $102.92 per unit), Heisener (from $77.02), Arrow Electronics, DigiKey, and Mouser as of 2026-09-09. Pricing varies by quantity break - bulk orders above 1,000 units can drop to approximately $66.99 per unit. Due to its last-time-buy status, lead times should be confirmed before placing production orders.

What is the lead time for EP3C25E144I7N?

Lead time for EP3C25E144I7N is approximately immediate to a few weeks as of 2026-09-09, with Heisener listing in stock and an estimated delivery window of July 31 to August 5. Because the part is in last-time-buy lifecycle, stocking distributors are recommended for prototype and short production runs, while long-term production should evaluate Cyclone IV or Cyclone 10 LP drop-in alternatives.

Is EP3C25E144I7N in stock?

Yes, the EP3C25E144I7N is currently in stock at multiple authorized distributors as of 2026-09-09, including LCSC, Heisener (17,040 units), Arrow Electronics, and Win Source. Because Intel has placed Cyclone III devices on last-time-buy, availability will deplete over time. For new designs, the Cyclone IV E or Cyclone 10 LP families provide pin-compatible migration paths in the same EQFP-144 footprint.

What is the best drop-in replacement for EP3C25E144I7N?

The best drop-in replacement in the same EQFP-144 footprint is the EP3C25E144C8N (commercial temperature grade, 8 speed grade) for applications where industrial temperature is not required, or the lower-density EP3C16E144I7N (24% fewer LEs) as a cost-optimized alternative. For new designs, the Cyclone IV EP4CE25E144I7N and Cyclone 10 LP 10CL25E144I7N offer equivalent LEs with improved process technology and longer lifecycle availability in the same EQFP-144 footprint.

What is the difference between EP3C25E144I7N and EP3C25E144I7?

The EP3C25E144I7N and EP3C25E144I7 are the same Cyclone III FPGA die in the EQFP-144 package - the 'N' suffix on EP3C25E144I7N indicates Pb-free (lead-free) reflow-compatible terminations per JEDEC J-STD-020. According to the Cyclone III datasheet, both parts share identical logic resources (24,624 LEs, 66 multipliers, 66 M9K, 4 PLLs, 82 I/Os) and are functionally interchangeable when the same RoHS-compliant assembly process is used.

What is the difference between EP3C25E144I7N and EP3C25Q240C8?

The EP3C25E144I7N is a Cyclone III FPGA in the EQFP-144 package (82 user I/Os) with industrial temperature grade, while the EP3C25Q240C8 is a Cyclone III variant in the Q240 package (240 pins, ~150 I/Os) with commercial temperature and C8 speed grade. Both use the same die (24,624 LEs, 66 multipliers, 4 PLLs), but the EQFP-144 and Q240 packages differ in pinout, so they are NOT pin-compatible drop-in alternatives - migration requires PCB redesign.

When should I choose EP3C25E144I7N over EP3C16E144I7N?

Choose the EP3C25E144I7N when your design requires more than 15,408 Logic Elements, more than 41 M9K memory blocks, or more than 56 hardware 18x18 multipliers - the EP3C25 provides approximately 60% more logic, 61% more memory, and 18% more multipliers than the EP3C16E144I7N in the same EQFP-144 footprint. If your design fits comfortably in 15K LEs with 56 multipliers, the EP3C16E144I7N offers cost savings with identical pin compatibility.

Is EP3C25E144I7N suitable for motor control applications?

Yes, the EP3C25E144I7N is well suited for industrial motor control applications. The 66 embedded 18x18 multipliers enable Field-Oriented Control (FOC) algorithms, the 4 PLLs provide precise PWM timing for three-phase inverter switching, and the 82 user I/Os can interface to encoder feedback, gate drivers, and protection circuitry. Industrial temperature grade (-40C to +100C) and the Cyclone III low-power 65nm process make it appropriate for continuous-operation industrial drives.

Where to download EP3C25E144I7N datasheet PDF?

The official EP3C25E144I7N datasheet can be downloaded from the Intel Cyclone III Device Datasheet page at intel.com/content/www/us/en/docs/programmable/683842/current/cyclone-iii-device-datasheet.html. The Cyclone III Device Handbook (volume 1) provides the complete pinout, timing, electrical characteristics, and configuration specifications. For legacy Altera-format documentation, the same datasheet is also available on the Altera literature archive.

Where to find EP3C25E144I7N pinout?

The EP3C25E144I7N pinout is documented in the Cyclone III Device Handbook Pin Information chapter and on the dedicated EQFP-144 pinout file, both available on the Intel FPGA documentation portal. The 144-pin LQFP Exposed Pad package uses a 20x20 mm body with 0.5 mm pitch and a 1.6 mm exposed thermal pad. The pin assignment table lists each of the 144 pins by name (I/O bank, GND, VCCINT, VCCIO, PLL, JTAG, configuration) and number.

What are the key specifications of EP3C25E144I7N that engineers should know?

The EP3C25E144I7N integrates 24,624 Logic Elements, 608,256 bits of embedded memory (66 M9K blocks), 66 dedicated 18x18 hardware multipliers, and 4 Phase-Locked Loops in a 144-pin LQFP Exposed Pad package. It operates from a 1.2V core supply with separate per-bank VCCIO for mixed-voltage I/O, supports JTAG/AS/PS configuration, and is qualified to the industrial temperature range of -40C to +100C. The Cyclone III family is fabricated on TSMC's 65nm low-power process.

What is the equivalent Lattice or Xilinx part for EP3C25E144I7N?

The closest cross-vendor equivalents to the EP3C25E144I7N (24,624 LEs, EQFP-144) are the Lattice ECP2-25 in the 144-pin TQFP package (around 25K LUTs, similar DSP and memory resources) and the Xilinx Spartan-3 XC3S400 in the TQG144 package (lower density, but same footprint family). However, none are pin-to-pin drop-in compatible - the LQFP-144 footprint differs between vendors. Migration to either requires PCB redesign, JTAG tool chain swap (Quartus -> Diamond or ISE), and HDL re-synthesis.

Is EP3C25E144I7N the same as EP3C25F256I7N?

No, the EP3C25E144I7N and EP3C25F256I7N use the same Cyclone III die (24,624 LEs, 66 M9K, 66 multipliers, 4 PLLs) but different packages - the 'E144' suffix denotes the 144-pin EQFP (82 user I/Os) while the 'F256' suffix denotes the 256-pin FBGA (148 user I/Os). They are NOT pin-compatible drop-in replacements; the F256 variant offers 66 additional I/Os at the cost of a smaller ball-grid footprint. Both are industrial temperature, I7 speed grade.

Données de référence d'ingénierie pour EP3C25E144I7N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EP3C25E144I7N when you need a Cyclone III FPGA with 24,624 LEs, 66 multipliers, and 66 M9K memory blocks in an industrial temperature grade for harsh-environment applications. The EQFP-144 package provides 82 user I/Os in a hand-solderable format - ideal for prototypes, low-volume production, and designs that need through-hole-compatible rework. For new designs, consider migrating to Cyclone IV E EP4CE25E144I7N or Cyclone 10 LP 10CL25E144I7N for longer lifecycle availability. Choose EP3C25E144C8N if industrial temperature is not required (cost savings). Choose EP3C16E144I7N if your design fits in 15,408 LEs (additional cost savings, same footprint). Choose EP3C25F256I7N if you need 148 I/Os and can accommodate a 256-ball FBGA footprint.

Comparaison avec les alternatives

Paramètre	Ce produit	EP3C25E144C8N	EP3C25F256I7N	EP3C16E144I7N	EP3C10E144I7N
Brand	Altera	Altera	Altera	Altera	Altera
Package	144-LQFP Exposed Pad (EQFP-144)	144-LQFP Exposed Pad (EQFP-144) - same	256-FBGA - different (NOT pin-compatible)	144-LQFP Exposed Pad (EQFP-144) - same	144-LQFP Exposed Pad (EQFP-144) - same
Logic Elements	24,624	24,624	24,624	15,408 (-37%)	10,320 (-58%)
Embedded Memory	608,256 bits (66 M9K)	608,256 bits (66 M9K)	608,256 bits (66 M9K)	516,096 bits (56 M9K)	423,936 bits (46 M9K)
18x18 Multipliers	66	66	66	56 (-15%)	46 (-30%)
PLLs	4	4	4	4	2 (-50%)
Maximum User I/Os	82	82	148 (+80%)	82	82
Temperature Grade	Industrial (-40C to +100C)	Commercial (0C to +85C)	Industrial (-40C to +100C)	Industrial (-40C to +100C)	Industrial (-40C to +100C)
Lifecycle Status	Last-time-buy	Last-time-buy	Last-time-buy	Last-time-buy	Last-time-buy

Principaux différenciateurs

Highest logic density in the Cyclone III EQFP-144 family (vs EP3C16E144I7N)
Industrial temperature grade for harsh environments (vs EP3C25E144C8N)
Smaller board footprint than F256 variant for I/O-constrained designs (vs EP3C25F256I7N)

Notes de conception

Estimated: Based on the Cyclone III datasheet, a fully utilized EP3C25E144I7N with all 24,624 LEs toggling at typical logic activity (12.5%) draws approximately 0.5-1.0W from VCCINT (1.2V core). Each of the 8 VCCIO banks should be decoupled with a 0.1uF ceramic capacitor placed within 5mm of the bank supply pins, plus a bulk 10-47uF tantalum or polymer capacitor per bank. VCCINT requires similar decoupling - 0.1uF within 5mm plus 10uF bulk. The exposed thermal pad must be soldered to a ground pour of at least 100 sq mm on the top layer for adequate heat dissipation.

Do not leave VCCIO bank supply pins floating - each bank must be powered even if its I/Os are unused, or unused banks should have VCCIO tied to a valid voltage (typically 1.5V-3.3V per I/O standard). The Cyclone III configuration interface pins (nCONFIG, nSTATUS, CONF_DONE, MSEL0/1/2, nCE) must be pulled to the proper logic levels during power-up. Always verify JTAG chain integrity with the Quartus Prime programmer before final board assembly to avoid difficult debug sessions later. The exposed thermal pad MUST be soldered - a dry joint here causes severe thermal runaway and erratic logic behavior.

Route all 8 VCCIO bank supply pins with a star topology back to the regulator output, never daisy-chain between banks. Place decoupling capacitors on the same layer as the FPGA pins to minimize loop inductance. The JTAG chain should use a dedicated 4-wire header (TCK, TMS, TDI, TDO) with 10K pull-ups on TCK, TMS, TDI per the IEEE 1149.1 standard. Differential I/O pairs (LVDS) should be routed with 100 ohm differential impedance and matched lengths within 150 mils. Avoid routing single-ended signals across the exposed pad on the top layer.

Informations de conformité

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sans plomb

Yes

Sans halogène

Unknown

Minerais de conflit

Compliant

RoHS compliant per Altera/Intel product page. Lead-free (Pb-free) terminations per JEDEC J-STD-020. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Halogen-free status not explicitly confirmed in available data.

Données vérifiées le : 2026-09-09 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Sources : Distributor, Distributor, Octopart, Manufacturer Datasheet, Distributor, Distributor

Recherches associées

EP3C25E144I7N EP3C25E144I7N datasheet Altera Cyclone III EP3C25 Cyclone III 24,624 logic elements FPGA EQFP-144 FPGA industrial temperature EP3C25E144I7N motor control FPGA EP3C25E144I7N vs EP3C25E144C8N EP3C25E144I7N drop-in replacement buy EP3C25E144I7N online what is the logic element count of EP3C25E144I7N Cyclone III EQFP-144 pinout low power FPGA industrial motor drive Cyclone III last time buy replacement EP3C25E144I7N price stock distributor

Composants & termes associés

Altera Intel EP3C25E144I7N EP3C25E144C8N EP3C25F256I7N EP3C16E144I7N EP3C10E144I7N Cyclone III FPGA Field Programmable Gate Array PLD Programmable Logic Device Logic Element M9K memory block 18x18 multiplier PLL Phase-Locked Loop LQFP-144 EQFP-144 Exposed Pad RoHS JEDEC J-STD-020 JTAG IEEE 1149.1 LVDS 65nm low-power process industrial motor control ASIC prototyping video processing protocol bridging