EP3C40F484C8 - Cyclone III FPGA, 39.6K LE, 484-BGA | Intel
Référence : EP3C40F484C8 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $116.74 | $116,74 |
| 10 | $110.5 | $1 105,00 |
| 100 | $98.2 | $9 820,00 |
| 250 | $92.4 | $23 100,00 |
| 500 | $88.1 | $44 050,00 |
EP3C40F484C8 Présentation
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic functions after PCB fabrication. The Cyclone III FPGA belongs to the broader taxonomy of semiconductor devices: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs sit alongside microcontrollers and DSPs in the digital signal processing hierarchy, offering parallel hardware execution that microcontrollers cannot match.
Key specifications of the EP3C40F484C8 include 4 PLL outputs for clock management, 56 embedded 18x18 multipliers (Cyclone III value line), 20 global clock networks, and 20 M9K memory blocks. The C8 speed grade denotes a commercial temperature range with mid-tier timing closure, while the F484 package uses Intel's FBGA-484 footprint with 1.0 mm ball pitch. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards for interfacing with DDR/DDR2 memory and high-speed parallel peripherals.
The Cyclone III architecture combines an LAB (Logic Array Block) structure of 16 logic elements per LAB with MultiTrack interconnect, providing efficient routing for medium-density designs. The 60-nm process node gives a favorable power-performance ratio versus earlier Cyclone II devices, making Cyclone III suitable for power-sensitive applications such as handheld test equipment and battery-powered industrial controllers.
Typical applications include motor control and industrial automation, video processing and image aggregation, software-defined radio (SDR) baseband, low-cost digital signal processing, and PCI/PCI Express endpoint bridging. The 484-BGA package offers ample I/O and signal integrity for multi-lane parallel buses, while the embedded M9K memory blocks simplify FIFO and dual-port buffer implementation.
Designers should consult the Cyclone III Device Handbook (Volume 1: Logic Elements, Volume 2: I/O and Memory) for Quartus II pin assignment and SignalTap II debugging guidance. When migrating from Cyclone II, verify I/O standard compatibility and re-validate timing in Quartus II version 9.0 or later.
This page synthesizes distributor pricing, drop-in same-package alternatives (EP3C16F484C8N, EP3C25F484C8N), and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EP3C40F484C8 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C40F484C8 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C40F484C8N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EP3C40F484C7N
✅ Remplacement direct✓ En stock
$264 / unité
Voir la fiche technique →EP3C40F484C6N
✅ Remplacement direct✓ En stock
$312.4 / unité
Voir la fiche technique →EP3C40F484I7N
✅ Remplacement direct✓ En stock
$118.5 / unité
Voir la fiche technique →EP3C25F484C8N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3C16F484C8N
✅ Remplacement direct✓ En stock
$29.95 / unité
Voir la fiche technique →EP3C40F484C8 Valeurs maximales et caractéristiques électriques
| Device Family | Cyclone III |
| Logic Elements (LE) | 39,600 |
| Logic Array Blocks (LAB) | 2,475 |
| Embedded Memory (bits) | 1,161,216 |
| M9K Memory Blocks | 126 |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Maximum User I/O | 331 |
| User I/O Banks | 8 |
| Boîtier | 484-ball FBGA (F484), 1.0 mm pitch, 23 x 23 mm |
| Speed Grade | C8 (commercial, mid-speed) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Process Node | 60 nm TSMC low-power CMOS |
| Supply Voltage (Core) | 1.2 V |
| Configuration Scheme | Active serial (AS), Passive serial (PS), JTAG |
| Statut RoHS | Compliant (lead-free FBGA) |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
Guide de configuration des broches du EP3C40F484C8 484-ball fbga (f484), 1.0 mm pitch, 23 x 23 mm
Configuration des broches du EP3C40F484C8 (boîtier 484-ball fbga (f484), 1.0 mm pitch, 23 x 23 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3C40F484C8.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3C40F484C8 convient pour 6 applications: Industrial Motor Control, Video Processing and Image Aggregation, Software Defined Radio (SDR) Baseband, PCI / PCI Express Endpoint Bridge, Low-Cost ASIC Prototyping, Test and Measurement Instrumentation.
Industrial Motor Control
The EP3C40F484C8's 39,600 logic elements, 56 embedded 18x18 multipliers, and 4 PLLs are well matched to multi-axis industrial motor control where the FPGA must execute Field-Oriented Control (FOC), PWM generation, and encoder decoding in parallel hardware. The Cyclone III 60-nm low-power process keeps typical dynamic power near 0.25 W, important for enclosed drives. With 331 user I/Os on the F484 package, designers can connect several resolver/encoder interfaces, gate-driver PWMs, and external ADC/DAC channels without bus multiplexing. Compared to a microcontroller-only solution, the FPGA offloads deterministic sampling and dead-time insertion, freeing the MCU for comms and supervisory tasks.
Recommandé
Video Processing and Image Aggregation
The EP3C40F484C8's 1.16 Mbit of M9K embedded memory and 331 I/Os make it a strong fit for multi-channel video aggregation and bridging designs. Designers commonly use the M9K blocks as line buffers, deinterlacer scratch memory, or LVDS deserializer FIFOs. The Cyclone III LVDS I/O supports up to 875 Mbps per channel, allowing direct interfacing with CMOS image sensors, HDMI transmitters, or flat-panel display timing controllers. Hardware-accelerated color-space conversion and chroma resampling fit comfortably within the 39.6K LE budget, and the 60-nm low-power process benefits fanless embedded video appliances.
Recommandé
Software Defined Radio (SDR) Baseband
For SDR baseband and digital signal processing, the EP3C40F484C8's 56 18x18 multipliers deliver up to 175 GMACs of DSP throughput when pipelined, sufficient for narrow-band digital downconversion, FIR filtering, and small FFT cores. The 4 PLLs generate multiple sample clocks for ADC and DAC synchronization, while the 331 user I/Os accept parallel LVDS ADC data and drive DAC outputs. The Cyclone III architecture balances cost with parallel processing; power consumption near 0.25 W is appropriate for portable SDR test gear. Designs that outgrow the EP3C40 density can migrate to Cyclone V GT in a compatible package family.
Recommandé
PCI / PCI Express Endpoint Bridge
The EP3C40F484C8 supports PCI 32/64-bit and PCI Express endpoint implementations via soft IP cores in Quartus II, leveraging 331 I/Os and 4 PLLs for clock-domain management. Designers use the M9K memory as transmit/receive FIFOs and the embedded multipliers for CRC and encryption engines. The F484 FBGA package provides sufficient signal integrity for 66 MHz PCI operation, and the C8 speed grade closes timing for 32-bit/33 MHz designs without penalty. For PCIe Gen1, an external PHY plus Altera soft IP completes the bridge.
Recommandé
Low-Cost ASIC Prototyping
The EP3C40F484C8 is widely used as an ASIC prototyping vehicle because 39.6K logic elements and 56 multipliers can host RTL subsystems for functional verification before tape-out. The F484 FBGA exposes all I/Os on 1.0 mm pitch, simplifying breakout to ASIC pin headers on prototype boards. Active-serial configuration allows fast PROM-based boot, and SignalTap II embedded logic analyzer aids debugging. Compared to ASIC iteration cost, the EP3C40-based prototype reduces risk dramatically at moderate volume.
Recommandé
Test and Measurement Instrumentation
For bench instruments and data-acquisition modules, the EP3C40F484C8 offers 39.6K logic elements for custom trigger logic, timing engines, and DSP pre-processing, plus 4 PLLs for ADC/DAC clock synthesis. The 1.16 Mbit embedded memory captures waveform segments on-chip, reducing host-side data movement. The 331 I/Os accept parallel ADC data and drive display/communication interfaces; LVDS support simplifies connection to high-speed ADCs. The Cyclone III low-power profile suits fanless portable instruments, and Quartus II integration with MATLAB/Simulink accelerates algorithm development.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C40F484C8 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C40F484C8N | EP3C40F484C7N | EP3C40F484I7N | EP3C25F484C8N | EP3C16F484C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 (F484), 1.0 mm pitch | FBGA-484 (F484), 1.0 mm pitch | FBGA-484 (F484), 1.0 mm pitch | FBGA-484 (F484), 1.0 mm pitch | FBGA-484 (F484), 1.0 mm pitch | FBGA-484 (F484), 1.0 mm pitch |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 24,624 | 15,408 |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 594,432 | 516,096 |
| 18x18 Multipliers | 56 | 56 | 56 | 56 | 66 | 56 |
| Maximum User I/O | 331 | 331 | 331 | 331 | 305 | 346 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | C8 (commercial) | C8 (commercial) | C7 (commercial, faster) | I7 (industrial) | C8 (commercial) | C8 (commercial) |
| Lead-Free / RoHS | No (SnPb finish) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
Principaux différenciateurs
- Same-density drop-in upgrade path with faster timing margin (vs EP3C40F484C8N)
- Higher DSP throughput per logic element versus lower-density variants (vs EP3C25F484C8N)
- Faster speed grade with identical pinout for timing-critical designs (vs EP3C40F484C7N)
- Larger 484-ball pin count versus smaller-package Cyclone III (vs EP3C40F324C8N)
Notes de conception
The Cyclone III core runs at 1.2 V; the EP3C40F484C8 supports 1.0 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, and 3.3 V I/O standards through separate VCCIO rails per bank. Estimated: a typical design using 60% of logic and I/O at 100 MHz toggling draws 0.25-0.5 W core. Provide at least 4 decoupling capacitors (0.1 uF, 0.01 uF, 0.001 uF, plus bulk) per VCC rail near the device, and route VCCINT/VCCIO/VCC_PLL/VCC_CHAIN planes with low-impedance copper pours.
The F484 FBGA package has 1.0 mm ball pitch. Use 4-6 layer PCB stack-up with continuous GND plane beneath the BGA for return-path integrity. Fanout should use via-in-pad or dog-bone pattern with 0.2 mm/0.4 mm trace/space. The exposed pad under the BGA must be soldered to a thermal copper pad with thermal via array (0.3 mm vias, 1.2 mm pitch) tied to GND for both electrical ground and heat dissipation. Estimated: a 4x4 via array gives theta_JB around 1.5 C/W.
Do not leave the MSEL[2:0] configuration-mode pins floating; tie them through 1 kohm to VCCIO or GND per the desired mode (AS/PS/JTAG). Unused I/O pins default to tri-stated input with weak pull-up; either explicitly set them in Quartus II to output-drive-low or leave them unconnected, never to a defined high without proper slew. Also confirm JTAG TCK pull-down and TMS/TDI pull-ups are populated for reliable boundary-scan.
Cyclone III LVDS inputs require 100 ohm differential termination across the receiver pair; place the resistor within 1 cm of the FPGA pin. LVDS channels with >200 Mbps toggling rates benefit from matched-length routing (within 0.5 mm intra-pair and 5 mm inter-pair). For DDR/DDR2 interfaces, use the dedicated DQS phase-shift circuitry in the I/O element, and route DQS with the same length as the longest DQ bit to maintain tDQS timing margins.
Place configuration PROM (EPCS) within 5 cm of the FPGA AS pins (nCSO, DCLK, ASDO) to avoid setup/hold violations. Series 33 ohm damping resistors on DATA/ASDO are recommended for designs with longer traces. JTAG chain TCK must be buffered if more than 3 devices are on the chain; the EP3C40 itself does not require buffering as a single device.
Informations de conformité
EP3C40F484C8 (no 'N' suffix) uses standard SnPb ball finish and is NOT RoHS compliant. For RoHS-compliant assembly use the EP3C40F484C8N variant. REACH status: per Intel product declaration, compliant. Not qualified to AEC-Q100 (Cyclone III family is not automotive grade).
