EP3C80F484C8N - 81K LE Cyclone III FPGA, 484-FBGA | Intel
Référence : EP3C80F484C8N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $308.9 | $308,90 |
| 10 | $278.1 | $2 781,00 |
| 100 | $248.5 | $24 850,00 |
| 500 | $225 | $112 500,00 |
| 1 000 | $208.75 | $208 750,00 |
EP3C80F484C8N Présentation
An FPGA is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. In the system hierarchy it sits between ASICs (highest performance, highest NRE) and microcontrollers (lowest flexibility, lowest unit cost) and is the workhorse for parallel data paths, custom interfaces, and DSP pipelines. The Cyclone III family specifically targets applications that need tens of thousands of logic elements, embedded memory and multipliers without the power and cost of a mid-range FPGA.
Key features include 81,264 logic elements, 2,810,880 RAM bits distributed in M9K blocks, 244 embedded 18 x 18 multipliers, four general-purpose PLLs, 20 global clock networks, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports up to 402 MHz internal operation and operates from a 1.2 V core supply. Configuration can be loaded through JTAG, Active Serial (AS), or Passive Serial (PS) modes using external flash.
Typical applications for the EP3C80F484C8N span industrial control and machine vision, video processing and display pipelines, telecommunications line cards, motor and motion control, test and measurement instrumentation, and entry-level DSP cards. The combination of embedded multipliers and distributed RAM allows designers to implement FIR filters, FFT engines, and image-processing kernels without external DSP chips.
When designing with this part, pay attention to the 484-FBGA ball pitch (typically 1.0 mm) and follow Intel's PCB layout and decoupling guidelines to maintain signal integrity on LVDS pairs. The device is lead-free / RoHS compliant and supports commercial (0 C to 85 C) operating temperature range as denoted by the 'C8' speed-grade suffix.
Alternatives de remplacement direct pour EP3C80F484C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C80F484C8N (même facteur de forme et même empreinte) — différant par Process Technology, Package, Operating Temperature, Speed Grade, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C80F484C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$306.54 / unité
Voir la fiche technique →EP3C80F484C6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$369.38 / unité
Voir la fiche technique →EP3C80F484I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$286.91 / unité
Voir la fiche technique →EP3C80F484C8
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$182.76 / unité
Voir la fiche technique →EP3C55F484C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$58.5 / unité
Voir la fiche technique →EP3C80F484C8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone III |
| Logic Elements | 81,264 |
| Embedded Memory (bits) | 2,810,880 |
| Embedded 18x18 Multipliers | 244 |
| User I/O | 295 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Maximum Operating Frequency | 402 MHz |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm |
| Boîtier | 484-FBGA |
| Type de montage | Surface Mount |
| Speed Grade | 8 |
| Température de fonctionnement | 0 C to +85 C (commercial) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du EP3C80F484C8N 484-fbga
Configuration des broches du EP3C80F484C8N (boîtier 484-fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3C80F484C8N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3C80F484C8N convient pour 6 applications: Industrial Machine Vision and Image Processing, Motor Control and Motion Drive Systems, Telecommunications Line Cards and Protocol Bridging, Test and Measurement Instrumentation, Video and Display Processing Pipelines, Embedded DSP and Signal Processing Cards.
Industrial Machine Vision and Image Processing
The EP3C80F484C8N is well matched to industrial camera and machine-vision pipelines. Its 244 embedded 18x18 hardware multipliers run convolutional kernels and Sobel edge-detection filters at real-time frame rates, while the 2.81 Mbit of distributed M9K RAM holds line buffers without external SRAM. The 295 user I/Os drive parallel image-sensor interfaces and the LVDS pairs support Camera Link at full 80 MHz pixel clock.
Recommandé
Motor Control and Motion Drive Systems
Three-phase motor drives benefit from the EP3C80F484C8N's combination of 402 MHz DSP performance and 244 multipliers. Field-oriented control (FOC) loops, space-vector PWM, and encoder decoding all run inside the fabric, freeing the host processor from microsecond-rate tasks. The device's industrial temperature tolerance and 295 LVCMOS I/Os accommodate multiple gate-driver, Hall-sensor, and resolver inputs on a single board.
Recommandé
Telecommunications Line Cards and Protocol Bridging
Telecom line cards use the EP3C80F484C8N to bridge legacy TDM/E1 streams to packet networks. The 81,264 logic elements are sufficient for HDLC controllers, TDM crossbars, and small packet-classification engines, while the embedded RAM stores jitter buffers. Four PLLs provide the multiple reference clocks required to lock onto independent E1/T1 streams simultaneously.
Recommandé
Test and Measurement Instrumentation
Digital storage oscilloscopes, logic analyzers, and protocol testers use the EP3C80F484C8N for real-time data capture and post-processing. The 295 user I/Os accept wide parallel busses from high-speed ADCs, while the 402 MHz fabric can run trigger engines, decoders, and compression algorithms in parallel. The 2.81 Mbit of embedded RAM pages acquired waveforms into host memory at full sample rate.
Recommandé
Video and Display Processing Pipelines
Video-converter boards and multi-display controllers use the EP3C80F484C8N to scale, deinterlace, and blend video streams. The 244 multipliers execute scaling coefficients in real time, and the device's LVDS pairs drive HDMI/DVI transmitter PHYs up to 1080p. The 295 I/Os are sufficient to support a 24-bit RGB interface plus a parallel camera input alongside the video output.
Recommandé
Embedded DSP and Signal Processing Cards
Software-defined radio, audio processing, and vibration-analysis cards rely on the EP3C80F484C8N's high multiplier count. FFT engines, FIR filters, and adaptive noise cancellers fit easily into the 81,264 logic elements and 244 multipliers. The device supports up to 805 Mbps LVDS, enabling direct connection to high-speed ADCs used in software-defined radio front-ends.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C80F484C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C80F484C7N | EP3C80F484C6N | EP3C80F484I7N | EP3C55F484C8N |
|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Elements | 81,264 | 81,264 | 81,264 | 81,264 | 55,000 (-32%) |
| Speed Grade | 8 | 7 | 6 | 7 | 8 |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C (industrial) | 0 C to +85 C |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,396,160 (-15%) |
| Embedded Multipliers (18x18) | 244 | 244 | 244 | 244 | 156 |
| User I/O | 295 | 295 | 295 | 295 | 314 (+6%) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Highest speed grade available for the EP3C80 family (vs EP3C80F484C7N)
- Commercial temperature range for cost-sensitive designs (vs EP3C80F484I7N)
- Full 81K logic element density versus smaller Cyclone III devices (vs EP3C55F484C8N)
- More embedded memory than lower-density same-package parts (vs EP3C55F484C8N)
Notes de conception
Estimated: with core VCCINT at 1.2 V and typical utilization around 50%, the EP3C80F484C8N draws approximately 0.6-0.9 A from the core rail and 50-200 mA from VCCAUX (2.5 V). Designers must provide at least 22 uF of bulk decoupling plus 0.1 uF and 0.01 uF high-frequency caps near each power pin group. Power sequencing should follow the Cyclone III handbook: VCCINT must come up before or simultaneously with VCCAUX and VCCIO to prevent latch-up.
The 484-FBGA uses 1.0 mm ball pitch and requires a 4-6 layer PCB with controlled-impedance routing for LVDS pairs (typically 100 ohm differential). Use micro-vias or sub-0.5 mm trace-and-space to fan-out the inner ball rows; keep all length matching within 150 mils for DDR-grade LVDS signals. Mount the device on a symmetrical land pattern and avoid routing high-speed signals under the package to reduce crosstalk and return-path discontinuity.
Do not assume all 484 BGA balls are usable I/O: roughly 25-30% are power, ground, configuration, or no-connects. Estimate: a typical 484-FBGA Cyclone III device exposes 295-314 user I/Os, with the remaining balls reserved. Also avoid placing the JTAG chain on a shared bus if any device is in reset, since the chain will appear broken to the programmer.
Estimated: at 1.2 V core and 0.8 A draw, power dissipation is approximately 1.0 W, plus dynamic power that scales with toggle rate and utilization. The 484-FBGA has a junction-to-ambient theta-JA around 15-20 C/W with standard JEDEC PCB, so a heatsink is usually not required but thermal vias under the package thermal pad are recommended to keep junction temperature below 85 C in commercial-temperature applications.
Informations de conformité
RoHS and lead-free per distributor listings (DigiKey, Mouser). Halogen-free and conflict-mineral status not explicitly stated in the verified data; set to unknown. AEC-Q100 not applicable - this is a commercial-grade FPGA.