EP4CE75F23C8N - 75K LE Cyclone IV E FPGA 484-BGA | Intel
Référence : EP4CE75F23C8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $73.96 | $73,96 |
| 10 | $67.5 | $675,00 |
| 100 | $58.2 | $5 820,00 |
| 500 | $49.8 | $24 900,00 |
| 1 000 | $42.3 | $42 300,00 |
EP4CE75F23C8N Présentation
A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacturing. FPGAs belong to the broader category of programmable logic devices (PLDs) and sit between fixed-function application-specific integrated circuits (ASICs) and software-driven processors in the design flexibility-versus-cost spectrum. Modern FPGAs like the Cyclone IV E integrate hard intellectual-property (IP) blocks for memory controllers, PLLs, and transceivers, while the remaining fabric is built from look-up tables, flip-flops, and routing matrices that implement arbitrary digital logic.
Key features of the EP4CE75F23C8N include 4 PLLs for robust clock management, up to 472.5 MHz internal operation, 426 user I/Os that provide abundant connectivity for parallel buses and high-speed interfaces, 4.7 Mbits of RAM with support for FIFO buffers and dual-port memory, and 274 hardware multipliers optimized for DSP applications such as finite impulse response (FIR) filtering and motor-control algorithms.
The Cyclone IV E architecture leverages a low-power 60 nm process, delivering competitive static and dynamic power figures for cost-sensitive high-volume applications. The device supports multiple I/O standards including LVDS, RSDS, mini-LVDS, LVPECL, HSTL, and SSTL, with per-pin dynamic phase alignment for source-synchronous interfaces. Configuration is handled through serial or parallel flash, JTAG, or Altera enhanced configuration devices, allowing flexible boot options across production environments.
Typical applications include industrial motor control, video surveillance and image processing, automotive driver-assistance systems (non-safety-critical paths), human-machine interface (HMI) controllers, and factory automation PLCs. The combination of mid-range logic capacity, generous embedded memory, and DSP blocks makes this device well suited for parallel data-path processing.
When designing with this FPGA, ensure the PCB stack-up accommodates the 1.0 mm ball pitch FBGA-484 footprint and provides sufficient decoupling around each power rail. Designers should use the Quartus II or Intel Quartus Prime design suite for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, same-brand drop-in alternatives from the Cyclone IV E family, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EP4CE75F23C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CE75F23C8N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Embedded 18x18 Multipliers, Speed Grade, Configuration Modes.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CE75F23C8LN
✅ Remplacement direct✓ En stock
$108.5 / unité
Voir la fiche technique →EP4CE75F23C8L
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP4CE75F23C8
✅ Remplacement direct✓ En stock
$159.4 / unité
Voir la fiche technique →EP4CE55F23C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$74 / unité
Voir la fiche technique →EP4CE115F23C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$145 / unité
Voir la fiche technique →EP4CE75F23C8N Valeurs maximales et caractéristiques électriques
| Series | Cyclone IV E |
| Logic Elements (LE) | 75,408 |
| Embedded Memory (bits) | 2,810,880 |
| Maximum User I/Os | 426 |
| Embedded 18x18 Multipliers | 274 |
| Number of PLLs | 4 |
| Boîtier | 484-BGA (FBGA-484) |
| Core Voltage | 1.15 V to 1.25 V |
| Température de fonctionnement | 0C to +85C (commercial) |
| Type de montage | Surface Mount |
| Maximum Operating Frequency | 472.5 MHz |
| I/O Standards Supported | LVDS, RSDS, mini-LVDS, LVPECL, HSTL, SSTL |
| Configuration Modes | Serial, Parallel, JTAG |
| Statut RoHS | Compliant |
| Process Technology | 60 nm low-power CMOS |
Guide de configuration des broches du EP4CE75F23C8N 484-bga (fbga-484)
Configuration des broches du EP4CE75F23C8N (boîtier 484-bga (fbga-484)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4CE75F23C8N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4CE75F23C8N convient pour 6 applications: Industrial Motor Control, Industrial Machine Vision, Human-Machine Interface (HMI) Controllers, Factory Automation PLC Backplanes, Video Format Conversion and Bridging, Test and Measurement Instrumentation.
Industrial Motor Control
The EP4CE75F23C8N fits industrial motor control designs because its 274 embedded 18x18 hardware multipliers accelerate field-oriented control (FOC) and space-vector PWM loops, while 4 PLLs generate precise multi-axis clocks for encoder and resolver feedback. The 75,408 logic elements handle state-machine sequencing for current sensing and fault diagnostics, and the 426 user I/Os connect directly to power-stage gate drivers via high-speed LVDS or single-ended I/O. Unlike fixed-function MCUs, this FPGA offloads DSP-intensive math, enabling faster control-loop rates for servo and stepper motor applications.
Recommandé
Industrial Machine Vision
The EP4CE75F23C8N suits machine vision pipelines because its 2,810,880 embedded memory bits buffer Bayer-to-RGB conversion and Sobel-edge-detection frames in real time without external SRAM. The 274 hardware multipliers implement convolution kernels for image preprocessing, while LVDS I/O standards interface with MIPI-CSI or LVDS image sensors at line rates exceeding 200 MHz. The 4 PLLs multiply a single 50 MHz reference into multiple pixel-clock domains, simplifying PCB clock routing across multi-camera systems in factory automation.
Recommandé
Human-Machine Interface (HMI) Controllers
The EP4CE75F23C8N fits HMI controller designs because its 426 user I/Os drive TFT-LCD panels with parallel RGB interfaces while handling capacitive touch-screen I2C/SPI scans and rotary encoder inputs in the same fabric. The 75K logic elements implement custom graphics acceleration routines for button rendering and multi-layer alpha blending. With 4 PLLs, designers can generate independent pixel clocks for the LCD, the touch controller, and the backlight PWM without external clock buffers.
Recommandé
Factory Automation PLC Backplanes
The EP4CE75F23C8N is well matched to PLC backplane controllers because its 426 I/Os and LVDS support multiple industrial fieldbus protocols (Modbus, Profibus, EtherCAT slave) implemented in soft logic. The 274 hardware multipliers accelerate closed-loop PID math for analog input modules, while 2.8 Mbits of embedded memory buffer high-speed digital input debounce queues without external SRAM. The 4 PLLs synthesize the 100 MHz EtherCAT PHY reference clock and the 48 MHz processor clock from a single crystal.
Recommandé
Video Format Conversion and Bridging
The EP4CE75F23C8N handles video protocol bridging because its 2,810,880 embedded memory bits line-buffer HD video frames for scaling and color-space conversion between HDMI, DVI, DisplayPort receivers, and LVDS panels. The 274 hardware multipliers implement poly-phase scalers and chroma upsamplers in real time. With 4 PLLs and 426 I/Os, the device accepts parallel RGB input from a video processor and outputs LVDS to a TFT panel using on-chip dynamic phase alignment, eliminating external serializer chips.
Recommandé
Test and Measurement Instrumentation
The EP4CE75F23C8N fits T&M instrument designs because its 426 user I/Os interface with high-speed ADCs and DACs using LVDS, while the 274 hardware multipliers implement real-time FFT, FIR filtering, and digital down-conversion. The 4 PLLs provide low-jitter clocks for ADC sampling rates up to 200 MSPS, and the 2.8 Mbits of embedded memory store sample windows for analysis. The device allows custom triggering logic and protocol-aware pattern generation in a single chip, reducing BOM cost in oscilloscope and logic-analyzer platforms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CE75F23C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CE75F23C8LN | EP4CE75F23C8 | EP4CE55F23C8N | EP4CE115F23C8N |
|---|---|---|---|---|---|
| Package | 484-BGA (FBGA-484) | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 75,408 | 75,408 | 75,408 | 55,856 (-26%) | 114,480 (+52%) |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,303,040 (-18%) | 3,981,312 (+42%) |
| Embedded Multipliers (18x18) | 274 | 274 | 274 | 156 (-43%) | 266 (-3%) |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 |
| Maximum User I/Os | 426 | 426 | 426 | 374 | 528 |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
Principaux différenciateurs
- Higher logic capacity than mid-range siblings in same package (vs EP4CE55F23C8N)
- Industrial temperature variant with identical pinout (vs EP4CE75F23C8LN)
- Right-sized option below 115K LE migration target (vs EP4CE115F23C8N)
Notes de conception
The 484-ball FBGA package uses a 1.0 mm ball pitch and requires a 4-6 layer PCB stack-up with a continuous ground plane beneath the device for signal integrity and thermal dissipation. Escape routing must use microvias (laser-drilled, 0.1 mm pad) to fan out from the inner rows. Place 0.1 uF and 10 uF decoupling capacitors on every power pin within 100 mils, with additional bulk capacitance near the regulator outputs.
Cyclone IV E devices require separate VCCINT (1.15-1.25 V core), VCCIO (1.2-3.3 V I/O banks), VCCA (2.5 V PLL analog), and VCCD_PLL (1.2 V PLL digital) rails. Use low-noise LDOs for the PLL analog supply - switching regulator ripple directly couples into PLL output jitter. Power-on sequencing is not strictly required but ramping all rails within 100 ms of each other prevents latch-up risk during cold-start.
A common mistake is to leave JTAG pins unconnected on production boards - this blocks boundary-scan debugging and reconfiguration. Always include a JTAG header (10-pin or 0.05-inch ribbon) even in production to enable field updates. Another pitfall: enabling dynamic phase alignment on LVDS outputs without calibrating termination impedance causes signal-integrity failures at >200 MHz.
Informations de conformité
RoHS and REACH compliant per manufacturer product declaration. Industrial temp variants available (EP4CE75F23C8LN). Not AEC-Q100 qualified - for automotive safety-critical paths, consult the manufacturer automotive-grade product portfolio.