EP3C80F780C7 - Cyclone III 81K LE FPGA, 780-FBGA | Intel
Référence : EP3C80F780C7 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $423.54 | $423,54 |
| 10 | $398.2 | $3 982,00 |
| 100 | $365 | $36 500,00 |
| 250 | $332.5 | $83 125,00 |
| 500 | $298.75 | $149 375,00 |
EP3C80F780C7 Présentation
Cyclone III FPGAs belong to the broader family of SRAM-based programmable logic devices, which sit within the semiconductor hierarchy as follows: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike CPLDs (Complex Programmable Logic Devices) which use non-volatile flash or EEPROM configuration memory, SRAM-based FPGAs must be configured at every power-up from an external flash memory, but in exchange offer far higher logic density, embedded memory blocks, hardware multipliers, and DSP blocks. Cyclone III occupies the low-power, low-cost end of the SRAM-FPGA segment, making it a popular choice for industrial control, video processing, and communications infrastructure where power and cost are critical constraints.
Key differentiating specifications include up to 81,264 logic elements, 2,810,880 embedded RAM bits organized in M9K blocks, 244 embedded 18x18 hardware multipliers, and four phase-locked loops (PLLs). The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks, and operates from a 1.2 V core supply with separate VCCIO banks for flexible I/O voltage interfacing. Static power consumption is dramatically reduced compared to Cyclone II thanks to the 65 nm process.
The EP3C80F780C7 architecture consists of LABs (Logic Array Blocks) containing 16 Logic Elements each, interconnected by a multi-tier routing fabric. Embedded multiplier blocks and M9K memory blocks are distributed in columns alongside the LABs, providing efficient implementation of DSP pipelines and FIFO buffers. The configuration scheme uses a serial or parallel flash loader, with bitstream decryption available via the AES-128 option on higher-tier Cyclone III LS devices.
Typical applications include industrial machine vision, motor control and servo drive, broadcast video processing, software-defined radio baseband, telecom line cards, and portable medical instrumentation. The combination of high logic density and embedded DSP blocks makes the EP3C80F780C7 well suited to parallel signal-processing tasks where microcontrollers or DSP processors cannot meet throughput.
When designing with this device, plan for an external configuration flash (EPCS or compatible) because the FPGA is SRAM-based. Maintain solid power-plane decoupling on the 1.2 V core rail and observe simultaneous switching output (SSO) guidelines for the 780-ball FBGA to maintain signal integrity.
This page synthesizes distributor pricing across 19 channels, verified drop-in alternatives sharing the same 780-FBGA footprint, and practical design notes covering configuration, power sequencing, and signal integrity that go beyond the manufacturer datasheet itself.
Alternatives de remplacement direct pour EP3C80F780C7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C80F780C7 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Logic Elements, Embedded Multipliers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C80F780C6N
✅ Remplacement direct✓ En stock
$330.2 / unité
Voir la fiche technique →EP3C80F780C6
✅ Remplacement direct✓ En stock
$320.95 / unité
Voir la fiche technique →EP3C80F780C8N
✅ Remplacement direct✓ En stock
$240.2 / unité
Voir la fiche technique →EP3C55F780C7N
✅ Remplacement direct✓ En stock
$138.31 / unité
Voir la fiche technique →EP3C120F780C7N
✅ Remplacement direct✓ En stock
$162 / unité
Voir la fiche technique →EP3C40F780C7N
✅ Remplacement direct✓ En stock
$145.4 / unité
Voir la fiche technique →EP3C80F780C7 Valeurs maximales et caractéristiques électriques
| Family | Cyclone III |
| Logic Elements (LE) | 81,264 |
| Embedded Memory Bits | 2,810,880 |
| Embedded Memory Blocks | M9K (9 Kbit each) |
| Embedded 18x18 Multipliers | 244 |
| User I/O Pins | 429 |
| Phase-Locked Loops (PLLs) | 4 |
| Global Clock Networks | 20 |
| Process Technology | 65 nm CMOS, low-power |
| Core Supply Voltage (VCCINT) | 1.2 V |
| Configuration Scheme | SRAM, external flash (EPCS) |
| Boîtier | 780-ball FBGA (FineLine BGA) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Speed Grade | C7 |
| Statut RoHS | Compliant |
Guide de configuration des broches du EP3C80F780C7 780-ball fbga (fineline bga)
Configuration des broches du EP3C80F780C7 (boîtier 780-ball fbga (fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3C80F780C7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3C80F780C7 convient pour 6 applications: Industrial Machine Vision, Motor Control and Servo Drive, Broadcast Video Processing, Telecom Line Cards and Baseband, Software Defined Radio Baseband, Portable Medical Instrumentation.
Industrial Machine Vision
The EP3C80F780C7 fits industrial machine vision because its 81,264 logic elements and 244 embedded 18x18 multipliers can process multiple camera streams at line rate without off-chip DSP. The 2,810,880 embedded RAM bits hold full video line buffers, and the 429 user I/O pins interface directly to LVDS camera links, DDR2 memory, and Ethernet PHYs. Power dissipation stays low thanks to the 65 nm process, allowing fanless operation inside sealed IP67 vision enclosures.
Recommandé
Motor Control and Servo Drive
Field-Oriented Control (FOC) and Space Vector PWM (SVPWM) loops benefit from the EP3C80F780C7's 244 hardware multipliers running parallel encoder-feedback arithmetic. The 81K LE accommodates PID loops, commutation tables, and safety logic in a single device. Industrial temperature variants (-40C to +100C) exist for harsh environments, and the 780-FBGA's 429 user I/O provide abundant channels for multi-axis drives.
Recommandé
Broadcast Video Processing
The EP3C80F780C7's M9K memory blocks and 244 multipliers handle real-time SD/HD video scaling, deinterlacing, and color-space conversion. Its 429 user I/O drive multiple BT.656 / BT.1120 / HD-SDI interfaces alongside DDR2 frame buffers. The Cyclone III architecture is documented in Altera reference designs for video format converters and broadcast switches, and the 780-FBGA exposes all required video pins.
Recommandé
Telecom Line Cards and Baseband
Telecom line cards use the EP3C80F780C7 to implement packet classification, traffic shaping, and baseband DSP at wire rate. The 81K LE supports 10+ channels of moderate-complexity DSP simultaneously, while 2.8 Mbit of embedded memory absorbs packet bursts. The four PLLs derive jitter-clean clocks from incoming line references, and the 780-FBGA's high I/O count interfaces to SERDES, network processors, and DDR2/QDR memory.
Recommandé
Software Defined Radio Baseband
The EP3C80F780C7's 244 hardware multipliers perform digital down-conversion, FIR filtering, and FFT-based channelization for SDR baseband processing. With 2.8 Mbit of embedded memory, it stores complex I/Q sample buffers between ADC and host CPU. The 65 nm low-power process suits portable and man-pack SDR enclosures where thermal envelope is constrained.
Recommandé
Portable Medical Instrumentation
The EP3C80F780C7 enables portable ultrasound, patient monitoring, and point-of-care diagnostic devices by consolidating signal acquisition, DSP, and display driving into one low-power FPGA. With 81K LE and 244 multipliers it runs parallel beamforming or pulse-oximetry DSP, while the 429 user I/O drive TFT displays, ADCs, and wireless links. The 65 nm low-power process minimizes battery drain in handheld medical carts.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C80F780C7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C80F780C6N | EP3C80F780C6 | EP3C80F780C8N | EP3C55F780C7N | EP3C120F780C7N | EP3C40F780C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 81,264 | 81,264 (same) | 81,264 (same) | 81,264 (same) | 55,856 (-31%) | 119,088 (+47%) | 39,600 (-51%) |
| Speed Grade | C7 | C6 (-1) | C6 (-1) | C8 (+1) | C7 (same) | C7 (same) | C7 (same) |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 (same) | 2,810,880 (same) | 2,810,880 (same) | 2,396,160 (-15%) | 3,981,312 (+42%) | 1,161,216 (-59%) |
| Embedded 18x18 Multipliers | 244 | 244 (same) | 244 (same) | 244 (same) | 156 (-36%) | 288 (+18%) | 126 (-48%) |
| User I/O | 429 | 429 (same) | 429 (same) | 429 (same) | 377 (-12%) | 531 (same ball count) | 535 |
| PLLs | 4 | 4 (same) | 4 (same) | 4 (same) | 4 (same) | 4 (same) | 4 (same) |
Principaux différenciateurs
- Balanced 81K LE density with high user I/O in single package (vs EP3C55F780C7N)
- Direct upgrade path to higher density without PCB change (vs EP3C120F780C7N)
- 65 nm low-power process reduces static power significantly (vs EP3C40F780C7N)
Notes de conception
Cyclone III uses a 1.2 V core rail (VCCINT) and per-bank VCCIO supplies. Decouple each VCCINT pin with a 0.1 uF X7R ceramic plus a 10 uF bulk capacitor placed within 5 mm. Use a dedicated 1.2 V LDO (such as an LDO with 3 A rating for full utilization) and avoid sharing the 1.2 V rail with other high-current devices to prevent FPGA inrush from collapsing the supply.
Cyclone III is SRAM-based and loses bitstream on power-down. A configuration flash (EPCS16, EPCS64, or EPCQ16) is mandatory; Active Serial (AS) mode with the 4-pin interface is the default. nCONFIG must be held high for normal operation, and nSTATUS must be monitored for configuration errors. Do not leave nCONFIG floating - it requires a 10 kohm pull-up to VCCPD.
The 780-ball FBGA is a 1.0 mm pitch fine-pitch BGA requiring via-in-pad or dog-bone fanout. Plan at least 4 PCB layers with one solid ground plane adjacent to the BGA. Maintain 50 ohm controlled impedance on clock and high-speed LVDS pairs, and follow Intel's simultaneous-switching-output (SSO) recommendations to limit ground bounce across the 8 I/O banks.
Estimated: at 100% logic utilization with default toggle rate, EP3C80F780C7 dissipates approximately 2-3 W. The 780-FBGA thermal resistance theta_JA is approximately 12 C/W on a standard 4-layer JEDEC test board, yielding ~25-35 C junction rise above ambient. For sealed enclosures, plan a copper spreader or heat slug under the BGA exposed pad.
Informations de conformité
RoHS and lead-free confirmed via Altera/Intel product page. AEC-Q100 not applicable - this is a commercial-grade FPGA; industrial-temperature versions exist with 'I' suffix speed grades.