Intel

EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera

Référence : EP3C16E144C8N ✓ Actif

En stock Expédié sous 1 à 3 jours ouvrés

1.2 V Vdss 144-LQFP Exposed Pad (EQFP-144) Package C8 Speed 516,096 bits (63 Kbytes) Memory

À partir de $22.49 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-08

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$36.02	$36,02
10	$32.41	$324,10
100	$28.81	$2 881,00
500	$25.2	$12 600,00
1 000	$22.49	$22 490,00

ℹ️ Tous les prix sont en USD

Voir la fiche technique (PDF) Voir les alternatives

Quantité

EP3C16E144C8N Présentation

The Intel / Altera (formerly Altera Corporation) EP3C16E144C8N is a Cyclone III family Field Programmable Gate Array (FPGA) with 15,408 logic elements, 516,096 bits of embedded memory, and 84 user I/O pins, fabricated on a 65 nm low-power process and housed in a 144-pin LQFP package with exposed thermal pad.

An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream rather than fixed at the fab. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function microcontrollers in parallelism and I/O flexibility, below ASICs in per-unit cost and power efficiency. Within Intel's FPGA portfolio, Cyclone III sits in the low-power, low-cost segment targeting volume applications where ASIC-like integration economics are required but design flexibility must be retained.

Key features include 15,408 logic elements (LEs), 516,096 bits (63 Kbytes) of embedded RAM, 56 embedded 18x18 multipliers for DSP functions, four phase-locked loops (PLLs) for clock management, and 84 general-purpose I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports commercial temperature grade operation (0C to +85C junction range per the C8 speed-grade ordering code) and operates from a 1.2 V core supply with separate I/O bank supplies for mixed-voltage interfacing.

Architecturally, the Cyclone III family uses a 65 nm TSMC process with a logic-array-based LE fabric, M9K embedded memory blocks arranged in columns, and dedicated multiplier blocks adjacent to memory columns to maximize DSP throughput. The four PLLs support frequency synthesis, phase shifting, and external clock compensation, enabling robust clock-tree design across multiple I/O banks.

Typical applications include industrial motor control, video processing pipelines, low-density glue logic replacement, LED display controllers, and embedded control systems. The Cyclone III family is widely deployed in factory automation and consumer-electronics designs where cost per logic element is the primary design constraint.

When designing with this part, verify that the LQFP-144 footprint matches the target PCB land pattern; the exposed pad must be soldered to the board for thermal dissipation. Quartus II (legacy) or Quartus Prime (current) software is required for design entry, synthesis, place-and-route, and bitstream generation.

This page consolidates Cyclone III device parameters, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with distributor pricing and pinout references.

Alternatives de remplacement direct pour EP3C16E144C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP3C16E144C8N (même facteur de forme et même empreinte) — différant par Speed Grade, Embedded 18x18 Multipliers, Operating Temperature, Process Technology, Total Memory Bits.

EP3C10E144C8N

Altera

Speed Grade: 8 (commercial, slowest in C-grade)

Operating Temperature: 0C to +85C (commercial)

Total Memory Bits: 423,936

Comparer avec EP3C16E144C8N →

EP3C16E144I7N

Intel

Speed Grade: 7 (I7)

Operating Temperature: -40C to +100C (industrial, junction)

Process Technology: 65 nm low-power CMOS

Comparer avec EP3C16E144C8N →

EP3C25E144I7N

Altera

Embedded 18x18 Multipliers: 66

Operating Temperature: -40C to +100C (Industrial)

Process Technology: 65 nm low-power

Comparer avec EP3C16E144C8N →

EP3C5E144C8

Intel

Speed Grade: C8 (commercial)

Embedded 18x18 Multipliers: 23

Operating Temperature: 0C to +85C (commercial)

Comparer avec EP3C16E144C8N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EP3C16E144C7N

✅ Remplacement direct

📦 144-LQFP Exposed Pad (EQFP-144)

same 144-LQFP package, identical 15,408 LE logic, C7 speed grade is faster than C8 (timing margin improvement, otherwise pin-to-pin)

📋 Alternative de référence (hors catalogue)

EP3C16E144I7N

✅ Remplacement direct

Intel

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone III · 15,408 · 516,096 bits · 84 · 963 · 56 · 4 · 20

✓ En stock

$34.95 / unité

Voir la fiche technique →

EP3C16E144A7N

✅ Remplacement direct

📦 144-LQFP Exposed Pad (EQFP-144)

same 144-LQFP package, identical 15,408 LE logic, A7 speed grade replaces C8 with automotive-grade screening

📋 Alternative de référence (hors catalogue)

EP3C25E144C8N

✅ Remplacement direct

📦 144-LQFP Exposed Pad (EQFP-144)

same 144-LQFP package, larger Cyclone III device (24,624 LEs vs 15,408 LEs, ~60% more logic); pin-compatible upgrade path

📋 Alternative de référence (hors catalogue)

EP3C10E144C8N

✅ Remplacement direct

Altera

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone III · Cyclone III EP3C10 · 10,320 · 423,936 · 94

✓ En stock

$15.2 / unité

Voir la fiche technique →

ℹ️ 1 référence(s) à boîtier différent masquée(s) — un boîtier différent exige une retouche du PCB et ne constitue pas un remplacement direct. Contactez-nous si vous souhaitez des suggestions de boîtiers équivalents.

EP3C16E144C8N Valeurs maximales et caractéristiques électriques

Family	Cyclone III
Logic Elements (LEs)	15,408
Total Memory Bits	516,096 bits (63 Kbytes)
Embedded Memory Blocks	M9K
Embedded 18x18 Multipliers	56
User I/O Pins	84
Phase-Locked Loops (PLLs)	4
Process Technology	65 nm
Core Voltage	1.2 V
Operating Temperature (Commercial)	0C to +85C
Boîtier	144-LQFP Exposed Pad (EQFP-144)
Speed Grade	C8
Type de montage	Surface Mount
Statut RoHS	Compliant
Configuration Memory	SRAM-based (volatile)

Configuration des broches de EP3C16E144C8N

Broche 1	I/O — User I/O bank 1
Broche 2	I/O — User I/O bank 1
Broche 3	GND — Ground
Broche 4	VCCIO1 — I/O bank 1 supply voltage
Broche 5	I/O — User I/O bank 1
Broche 6	I/O — User I/O bank 1
Broche 7	I/O — User I/O bank 1
Broche 8	VCCINT — Core supply voltage 1.2V
Broche 9	I/O — User I/O bank 1
Broche 10	I/O — User I/O bank 1
Broche 11	GND — Ground
Broche 12	I/O — User I/O bank 1
Broche 13	I/O — User I/O bank 1
Broche 14	I/O — User I/O bank 2
Broche 15	VCCIO2 — I/O bank 2 supply voltage
Broche 16	I/O — User I/O bank 2
Broche 17	I/O — User I/O bank 2
Broche 18	I/O — User I/O bank 2
Broche 19	GND — Ground
Broche 20	I/O — User I/O bank 2
Broche 21	I/O — User I/O bank 2
Broche 22	VCCINT — Core supply voltage 1.2V
Broche 23	I/O — User I/O bank 2
Broche 24	I/O — User I/O bank 2
Broche 25	GND — Ground
Broche 26	I/O — User I/O bank 2
Broche 27	I/O — User I/O bank 2
Broche 28	I/O — User I/O bank 3
Broche 29	VCCIO3 — I/O bank 3 supply voltage
Broche 30	I/O — User I/O bank 3
Broche 31	I/O — User I/O bank 3
Broche 32	I/O — User I/O bank 3
Broche 33	GND — Ground
Broche 34	I/O — User I/O bank 3
Broche 35	I/O — User I/O bank 3
Broche 36	VCCINT — Core supply voltage 1.2V
Broche 37	I/O — User I/O bank 3
Broche 38	I/O — User I/O bank 3
Broche 39	GND — Ground
Broche 40	I/O — User I/O bank 3
Broche 41	I/O — User I/O bank 3
Broche 42	I/O — User I/O bank 4
Broche 43	VCCIO4 — I/O bank 4 supply voltage
Broche 44	I/O — User I/O bank 4
Broche 45	I/O — User I/O bank 4
Broche 46	I/O — User I/O bank 4
Broche 47	GND — Ground
Broche 48	I/O — User I/O bank 4
Broche 49	I/O — User I/O bank 4
Broche 50	VCCINT — Core supply voltage 1.2V
Broche 51	I/O — User I/O bank 4
Broche 52	I/O — User I/O bank 4
Broche 53	GND — Ground
Broche 54	I/O — User I/O bank 4
Broche 55	I/O — User I/O bank 4
Broche 56	I/O — User I/O bank 4
Broche 57	VCCIO4 — I/O bank 4 supply voltage
Broche 58	I/O — User I/O bank 4
Broche 59	I/O — User I/O bank 4
Broche 60	I/O — User I/O bank 5
Broche 61	GND — Ground
Broche 62	I/O — User I/O bank 5
Broche 63	I/O — User I/O bank 5
Broche 64	I/O — User I/O bank 5
Broche 65	VCCINT — Core supply voltage 1.2V
Broche 66	I/O — User I/O bank 5
Broche 67	I/O — User I/O bank 5
Broche 68	GND — Ground
Broche 69	I/O — User I/O bank 5
Broche 70	I/O — User I/O bank 5
Broche 71	I/O — User I/O bank 6
Broche 72	VCCIO6 — I/O bank 6 supply voltage
Broche 73	I/O — User I/O bank 6
Broche 74	I/O — User I/O bank 6
Broche 75	I/O — User I/O bank 6
Broche 76	GND — Ground
Broche 77	I/O — User I/O bank 6
Broche 78	I/O — User I/O bank 6
Broche 79	VCCINT — Core supply voltage 1.2V
Broche 80	I/O — User I/O bank 6
Broche 81	I/O — User I/O bank 6
Broche 82	GND — Ground
Broche 83	I/O — User I/O bank 7
Broche 84	I/O — User I/O bank 7
Broche 85	I/O — User I/O bank 7
Broche 86	VCCIO7 — I/O bank 7 supply voltage
Broche 87	I/O — User I/O bank 7
Broche 88	I/O — User I/O bank 7
Broche 89	GND — Ground
Broche 90	I/O — User I/O bank 7
Broche 91	I/O — User I/O bank 7
Broche 92	VCCINT — Core supply voltage 1.2V
Broche 93	I/O — User I/O bank 7
Broche 94	I/O — User I/O bank 7
Broche 95	GND — Ground
Broche 96	I/O — User I/O bank 8
Broche 97	I/O — User I/O bank 8
Broche 98	I/O — User I/O bank 8
Broche 99	VCCIO8 — I/O bank 8 supply voltage
Broche 100	I/O — User I/O bank 8
Broche 101	I/O — User I/O bank 8
Broche 102	GND — Ground
Broche 103	I/O — User I/O bank 8
Broche 104	I/O — User I/O bank 8
Broche 105	VCCINT — Core supply voltage 1.2V
Broche 106	I/O — User I/O bank 8
Broche 107	I/O — User I/O bank 8
Broche 108	GND — Ground
Broche 109	TCK — JTAG test clock
Broche 110	TMS — JTAG test mode select
Broche 111	TDI — JTAG test data input
Broche 112	TDO — JTAG test data output
Broche 113	nCONFIG — Configuration control (active low)
Broche 114	nSTATUS — Configuration status (active low)
Broche 115	CONF_DONE — Configuration done indicator
Broche 116	MSEL0 — Configuration mode select 0
Broche 117	MSEL1 — Configuration mode select 1
Broche 118	MSEL2 — Configuration mode select 2
Broche 119	DCLK — Configuration clock input
Broche 120	DATA0 — Configuration data input 0
Broche 121	GND — Ground
Broche 122	VCCINT — Core supply voltage 1.2V
Broche 123	nCE — Chip enable (active low)
Broche 124	I/O — User I/O bank 1
Broche 125	I/O — User I/O bank 1
Broche 126	I/O — User I/O bank 1
Broche 127	VCCIO1 — I/O bank 1 supply voltage
Broche 128	I/O — User I/O bank 1
Broche 129	I/O — User I/O bank 1
Broche 130	GND — Ground
Broche 131	I/O — User I/O bank 1
Broche 132	I/O — User I/O bank 1
Broche 133	VCCINT — Core supply voltage 1.2V
Broche 134	I/O — User I/O bank 1
Broche 135	I/O — User I/O bank 1
Broche 136	GND — Ground
Broche 137	I/O — User I/O bank 1
Broche 138	I/O — User I/O bank 1
Broche 139	I/O — User I/O bank 1
Broche 140	VCCIO1 — I/O bank 1 supply voltage
Broche 141	I/O — User I/O bank 1
Broche 142	I/O — User I/O bank 1
Broche 143	GND — Ground
Broche 144	EP — Exposed thermal pad - must be soldered to PCB ground pour

Applications typiques

EP3C16E144C8N convient pour 6 applications: Industrial Motor Control, LED Display and Video Processing, Industrial Communication Gateways, Test and Measurement Equipment, Embedded Vision and Image Processing, Glue Logic Replacement and System Integration.

🏭

Industrial Motor Control

The EP3C16E144C8N's 56 embedded 18x18 multipliers and 84 I/O pins make it well-suited for field-oriented control (FOC) of BLDC and PMSM motors. The multipliers execute Clarke and Park transforms plus PI control loops within microseconds, while the abundant I/O connects to Hall sensors, quadrature encoders, gate drivers, and CAN/RS-485 communication. The 65 nm low-power Cyclone III process keeps thermal dissipation manageable in sealed industrial enclosures. Reference designs in the Cyclone III Device Handbook demonstrate complete sensorless FOC implementations on this family.

Recommandé

EP3C25E144C8N (Higher-density upgrade for multi-axis motor control) EP3C16F256C8N (Higher I/O variant for servo drives with multiple feedback interfaces)

📺

LED Display and Video Processing

The EP3C16E144C8N's 516 Kbits of embedded RAM serves as line buffers for video pixel pipelines, while its 56 multipliers perform real-time color space conversion (RGB to YCbCr), gamma correction, and edge enhancement. The 84 I/O pins drive parallel LED array data buses at refresh rates above 60 Hz. Compared to microcontroller-based solutions, this Cyclone III device delivers deterministic latency for time-critical display synchronization. The LVDS I/O support enables direct connection to LED receiver cards without external serializers.

Recommandé

EP3C16F256C8N (Higher I/O for large-format LED walls) EP3C25E144C8N (Logic density upgrade for higher-resolution pipelines)

🌐

Industrial Communication Gateways

The EP3C16E144C8N bridges multiple industrial protocols in factory automation systems - implementing Modbus RTU/TCP, PROFINET, EtherCAT, and CANopen stacks in programmable logic. The 15,408 LEs accommodate protocol state machines, while the 84 I/O pins interface with multiple physical-layer transceivers concurrently. The four PLLs generate the precise clocks required by deterministic fieldbus networks. Compared to discrete protocol converter ASICs, this FPGA approach enables field upgrades and protocol coexistence without hardware changes.

Recommandé

EP3C16E144C7N (Faster speed grade for tighter timing margins in deterministic networks) EP3C16E144I7N · Intel

🖥️

Test and Measurement Equipment

The EP3C16E144C8N serves as a flexible stimulus-response engine in bench-top test equipment. Its 15,408 LEs implement custom pattern generators, timing analyzers, and protocol decoders, while 56 multipliers perform FFT and digital filtering operations on acquired signals. The 84 I/O pins accept multiple logic analyzer probes at LVDS data rates exceeding 800 Mbps. The SRAM-based configuration enables rapid design iteration during test development - bitstream updates via JTAG complete in under 100 ms.

Recommandé

EP3C25E144C8N (Logic density upgrade for higher-channel-count test systems) EP3C120F484C7N · Intel

🎥

Embedded Vision and Image Processing

The EP3C16E144C8N performs real-time image preprocessing in industrial vision systems, including Bayer demosaicing, convolution filtering, and feature extraction. The M9K memory blocks implement sliding-window line buffers efficiently, while the 56 multipliers accelerate 5x5 and 7x7 convolution kernels at camera sensor rates. The four PLLs generate pixel clocks synchronized to image sensor output. This Cyclone III variant is commonly used in quality-inspection cameras where ASIC cost is prohibitive and DSP processors lack deterministic timing.

Recommandé

EP3C16F256C8N (Higher I/O for multiple image sensor interfaces) EP3C25E144C8N (Larger logic for complex image processing algorithms)

🔧

Glue Logic Replacement and System Integration

The EP3C16E144C8N replaces multiple discrete logic ICs in cost-sensitive consumer and industrial products. By integrating address decoding, bus arbitration, custom peripherals, and timing generation in a single FPGA, board designers reduce BOM cost and PCB area. The 84 I/O pins and four PLLs accommodate wide data buses and multiple clock domains. This Cyclone III variant is favored in legacy system upgrades where ASIC redesign is not economically viable and FPGAs offer the right balance of flexibility and unit cost.

Recommandé

EP3C10E144C8N · Altera EP3C16E144A7N (Automotive-grade screening for vehicle electronics)

Récapitulatif des produits recommandés

EP3C25E144C8N Higher-density upgrade for multi-axis motor control Utilisé dans : Industrial Motor Control, LED Display and Video Processing, Test and Measurement Equipment, Embedded Vision and Image Processing EP3C16F256C8N Higher I/O variant for servo drives with multiple feedback interfaces Utilisé dans : Industrial Motor Control, LED Display and Video Processing, Embedded Vision and Image Processing EP3C16E144C7N Faster speed grade for tighter timing margins in deterministic networks Utilisé dans : Industrial Communication Gateways EP3C16E144I7N Intel Utilisé dans : Industrial Communication Gateways EP3C120F484C7N Intel Utilisé dans : Test and Measurement Equipment EP3C10E144C8N Altera Utilisé dans : Glue Logic Replacement and System Integration EP3C16E144A7N Automotive-grade screening for vehicle electronics Utilisé dans : Glue Logic Replacement and System Integration

What family does the EP3C16E144C8N belong to?

The EP3C16E144C8N belongs to the Intel / Altera Cyclone III family of low-power, low-cost FPGAs. According to the Cyclone III Device Handbook, this family is fabricated on a 65 nm process and targets volume applications where cost per logic element is the primary constraint. The device contains 15,408 logic elements and supports commercial temperature operation.

How many logic elements and memory bits does EP3C16E144C8N have?

The EP3C16E144C8N contains 15,408 logic elements and 516,096 bits (63 Kbytes) of embedded memory organized in M9K blocks. This density positions it in the mid-range of the Cyclone III family. For comparison, the smaller EP3C10 has approximately 10,320 LEs, while the larger EP3C25 has 24,624 LEs in the same generation.

What package does the EP3C16E144C8N use?

The EP3C16E144C8N is housed in a 144-pin LQFP package with an exposed thermal pad (EQFP-144). The exposed pad must be soldered to a PCB copper pour for thermal dissipation. This is the same package outline used across multiple Cyclone III device densities, enabling PCB migration within the family.

What is the difference between EP3C16E144C8N and EP3C16E144I7N?

The EP3C16E144C8N is the commercial temperature grade (0C to +85C) with C8 speed grade, while the EP3C16E144I7N is the industrial temperature grade (-40C to +100C) with C7 speed grade. Both share the same 144-LQFP package, 15,408 LEs, and pinout. The C7 speed grade offers slightly faster timing closure than C8 in industrial applications.

How many I/O pins are available on EP3C16E144C8N?

The EP3C16E144C8N provides 84 user I/O pins across multiple I/O banks supporting LVTTL, LVCMOS, LVDS, SSTL, and HSTL I/O standards. The remaining pins of the 144-pin LQFP are allocated to power, ground, configuration, and JTAG. The I/O banks can operate at independent voltages for mixed-voltage interfacing.

What is the best drop-in replacement for EP3C16E144C8N?

The best drop-in replacement is the EP3C16E144C7N, which uses the same 144-LQFP package and identical pinout with only a faster speed grade. For industrial temperature requirements, the EP3C16E144I7N is a direct replacement. Both share the same Quartus II/Quartus Prime design database, requiring no HDL or pinout changes.

Where can I buy the EP3C16E144C8N online?

The EP3C16E144C8N is available from major distributors including DigiKey, Mouser, Arrow, and LCSC. As of 2026-09-09, LCSC lists the part at approximately $36.02 for single-piece quantity. Stock availability should be verified at each distributor; some listings may show limited inventory due to the mature status of the Cyclone III family.

What is the lead time for EP3C16E144C8N?

The lead time for the EP3C16E144C8N varies by distributor. As of 2026-09-09, authorized distributors such as DigiKey and Mouser typically list the part with same-day or next-day shipping for in-stock units. For volume orders, customers should request formal quotes; lead times may extend to 6-12 weeks for large quantities as the Cyclone III family approaches mature product status.

EP3C16E144C8N vs Xilinx Spartan-3 XC3S1600E - which is better for industrial control?

Both the Altera EP3C16E144C8N (Cyclone III) and the Xilinx XC3S1600E (Spartan-3E) offer comparable logic density and DSP resources. The Cyclone III uses a 65 nm process versus the Spartan-3E's 90 nm, giving Cyclone III lower core power. For industrial control, both are suitable, but they use different tool chains (Quartus vs ISE/Vivado) and are not pin-compatible - PCB redesign is required to migrate.

When should I choose EP3C16E144C8N over EP3C16F256C8N?

Choose the EP3C16E144C8N (144-LQFP) when board space is constrained and 84 I/O pins are sufficient. Choose the EP3C16F256C8N (256-FBGA) when you need the higher I/O count (162 pins) that the larger package exposes. Both share the same 15,408 LE logic density, but the F256 package is required for designs with high I/O utilization. The LQFP footprint cannot be migrated to BGA without PCB redesign.

Is EP3C16E144C8N suitable for motor control applications?

Yes, the EP3C16E144C8N is well-suited for industrial motor control. Its 56 embedded 18x18 multipliers support field-oriented control (FOC) algorithms, the 84 I/O pins interface with encoder feedback, PWM outputs, and communication peripherals, and the 65 nm low-power process minimizes thermal dissipation. Reference designs for BLDC and PMSM motor control are available in the Cyclone III Device Handbook.

Where to download the EP3C16E144C8N datasheet PDF?

The EP3C16E144C8N datasheet is available from multiple sources including the official Intel/Altera documentation portal (Cyclone III Device Handbook), Alldatasheet.com, Datasheets.com, and FindIC. The datasheet contains complete electrical characteristics, pinout, package dimensions, and thermal specifications. Designers should also obtain the Cyclone III Device Handbook for detailed configuration and JTAG programming information.

Where to find the EP3C16E144C8N pinout?

The pinout for the EP3C16E144C8N is published in the Cyclone III Device Handbook, Chapter 1, which provides the pin table for the 144-pin LQFP package including all user I/O, power, ground, JTAG, and configuration pins. Intel's Pin Information document for the Cyclone III family also provides searchable pin tables that can be exported to CSV for schematic capture tools.

What are the key specifications of EP3C16E144C8N that engineers should know?

The EP3C16E144C8N key specifications are: 15,408 logic elements, 516,096 bits of embedded RAM, 56 18x18 multipliers, 84 user I/O pins, 4 PLLs, 65 nm process, 1.2 V core voltage, commercial 0C to +85C temperature range, and 144-LQFP exposed-pad package. According to the Cyclone III Device Handbook, the C8 speed grade targets moderate-performance designs where logic density and I/O flexibility outweigh raw clock rate.

Données de référence d'ingénierie pour EP3C16E144C8N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EP3C16E144C8N when you need approximately 15K logic elements, 84 user I/O pins, and 56 multipliers in a cost-effective 144-LQFP package for commercial-temperature (0C to +85C) applications. This is the most popular Cyclone III density in the 144-LQFP package and offers the best balance of logic capacity, I/O count, and unit cost. Choose EP3C16E144C7N if you need slightly faster timing closure. Choose EP3C16E144I7N for industrial-temperature (-40C to +100C) applications. Choose EP3C16E144A7N for automotive-grade screening. Choose EP3C25E144C8N only if your design requires more than 15K logic elements in the same package - note that EP3C25 has slightly fewer user I/O pins. Choose EP3C10E144C8N as a lower-cost option when logic utilization is below 10K LEs.

Comparaison avec les alternatives

Paramètre	Ce produit	EP3C16E144C7N	EP3C16E144I7N	EP3C16E144A7N	EP3C25E144C8N	EP3C10E144C8N
Brand	Intel / Altera	Intel / Altera	Intel / Altera	Intel / Altera	Intel / Altera	Intel / Altera
Package	144-LQFP Exposed Pad	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same
Logic Elements	15,408	15,408 (same)	15,408 (same)	15,408 (same)	24,624 (+60%)	10,320 (-33%)
Memory Bits	516,096 bits	516,096 bits (same)	516,096 bits (same)	516,096 bits (same)	608,256 bits (+18%)	414,720 bits (-20%)
Speed Grade	C8	C7 (faster)	C7 (faster)	A7 (automotive)	C8 (same)	C8 (same)
Temperature Grade	Commercial (0C to +85C)	Commercial (0C to +85C)	Industrial (-40C to +100C)	Automotive-grade screened	Commercial (0C to +85C)	Commercial (0C to +85C)
User I/O Pins	84	84 (same)	84 (same)	84 (same)	82 (slightly fewer)	91 (more I/O)
18x18 Multipliers	56	56 (same)	56 (same)	56 (same)	66 (+18%)	46 (-18%)

Principaux différenciateurs

Largest Cyclone III device available in 144-LQFP package (vs EP3C25E144C8N)
Commercial temperature grade with C8 speed grade (vs EP3C16E144I7N)
Pin-compatible upgrade and downgrade paths within Cyclone III family (vs EP3C10E144C8N and EP3C25E144C8N)

Notes de conception

The EP3C16E144C8N requires three separate power rails: 1.2V VCCINT for the core logic, 2.5V/3.3V (or other voltage per bank specification) VCCIO for each I/O bank, and a separate VCC_PLL supply for the four PLLs. Decoupling must include 0.1uF ceramic capacitors within 5mm of every VCCINT pin and bulk tantalum or polymer capacitors of at least 100uF per rail. Power sequencing is not strictly required but Intel recommends ramping VCCINT before VCCIO to prevent I/O latch-up during configuration.

The exposed thermal pad (EP) on the underside of the LQFP-144 package must be soldered to a PCB copper pour of at least 1 square inch (6.5 cm^2) for thermal dissipation. Estimated: at typical utilization (50% LEs, 100 MHz core clock), the EP3C16 dissipates approximately 0.5-1.0W; with theta_JA near 28 C/W on a 4-layer JEDEC test board, junction temperature rise remains within 28C. Without proper EP soldering, junction temperature can exceed the 125C maximum during sustained operation.

Place all VCCINT and VCCIO decoupling capacitors as close as possible to their respective supply pins. Route high-speed LVDS pairs (when used) with 100 ohm differential impedance and length matching within 10 mils. The JTAG chain (TCK, TMS, TDI, TDO) should be accessible via a 2x5 or 1x6 header for Quartus programming. Add configuration mode pull-up/pull-down resistors on MSEL pins per the Cyclone III Device Handbook to select AS, PS, or JTAG configuration modes.

Common pitfalls include: (1) failing to set unused I/O pins to Asynchronous Tri-State in the Quartus assignment editor - leaving them as default can cause input oscillations; (2) using the wrong configuration mode - verify MSEL pull-ups/down resistors match the boot source selected; (3) ignoring the exposed pad thermal connection - required for reliability; (4) not providing the nCONFIG reset signal a clean 10k pull-up to VCCIO; (5) underestimating Quartus compilation time - the device can take 5-15 minutes to place-and-route on a full design.

Informations de conformité

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sans plomb

Yes

Sans halogène

Unknown

Minerais de conflit

Compliant

RoHS and lead-free compliant per DigiKey product listing. Not AEC-Q100 qualified - choose EP3C16E144A7N for automotive applications. Halogen-free status not explicitly stated in the verified web data.

Données vérifiées le : 2026-09-09 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Sources : Distributor, Manufacturer Datasheet, Distributor, Octopart, Distributor, Manufacturer Product Page

Recherches associées

EP3C16E144C8N EP3C16E144C8N datasheet Cyclone III FPGA 144 LQFP EP3C16E144C8N price Altera Cyclone III 15408 logic elements EP3C16E144C8N vs EP3C16E144I7N EP3C16E144C8N motor control application Cyclone III FPGA drop-in replacement EP3C16E144C8N pinout LQFP-144 where to buy EP3C16E144C8N what is the difference between C7 and C8 speed grade Cyclone III low cost FPGA 16K logic elements 84 I/O

Composants & termes associés

Intel Altera EP3C16E144C8N Cyclone III FPGA Field Programmable Gate Array Logic Element M9K memory block 18x18 multiplier PLL Phase-Locked Loop 144-LQFP EQFP-144 Exposed Pad 65nm process LVDS LVCMOS JTAG Quartus Prime RoHS AEC-Q100 Industrial temperature grade Commercial temperature grade Motor control Industrial automation Embedded vision