EP3CLS70F780C7 - Cyclone III LS FPGA, 70K LE, 780-FBGA | Intel
Référence : EP3CLS70F780C7 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $505.15 | $505,15 |
| 10 | $470 | $4 700,00 |
| 100 | $425 | $42 500,00 |
| 500 | $385 | $192 500,00 |
| 1 000 | $350 | $350 000,00 |
EP3CLS70F780C7 Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and (in Cyclone III LS) on-chip security features. FPGAs occupy the programmable logic tier in the digital design hierarchy between fixed-function ASICs and software-driven microcontrollers, giving engineers post-silicon re-programmability for parallel processing, custom interfacing, and hardware acceleration. The Cyclone III LS family specifically targets low-power, security-sensitive applications with bitstream encryption and JTAG protection.
Key features of the EP3CLS70F780C7 include up to 70,208 logic elements, 3,068,928 bits of embedded RAM (approximately 303 Kbit of M9K block memory equivalents), embedded 18 x 18 multipliers for DSP operations, and dedicated PLL and clock-management resources. The 780-FBGA package exposes 413 user I/O pins supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards with on-die termination. The LS variant adds advanced security features including configuration bitstream AES-256 encryption, JTAG tamper protection, and a robust volatile key storage block for IP protection.
Architecturally, the device combines an LUT-based logic fabric with hard memory blocks, hard multiplier blocks, and high-speed transceiver-free general-purpose I/O. The 65 nm process and the low-static-power option deliver a meaningful quiescent current reduction versus the standard Cyclone III family, which is critical in thermally constrained or fan-less embedded systems. The 780-ball FBGA also provides generous signal escape routing for high-speed parallel buses and memory interfaces such as DDR2/DDR3.
Typical applications include industrial motor control, factory automation I/O expansion, low-power portable test and measurement equipment, secure communications front-ends, video bridging and image preprocessing pipelines, and ASIC prototyping. The Cyclone III LS security features are particularly well suited to medical devices and defense systems where bitstream confidentiality is mandatory. When designing with this device, ensure the Quartus II design tool (13.0 or earlier) is used for synthesis and fitting, since later Quartus releases have deprecated Cyclone III LS support. Pay careful attention to decoupling (100 nF plus 10 uF per VCCINT/VCCIO rail) and thermal relief on the FBGA substrate for reliable operation above 85 C ambient.
Alternatives de remplacement direct pour EP3CLS70F780C7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3CLS70F780C7 (même facteur de forme et même empreinte) — différant par Process Technology, Package, RoHS Status, Family, Device Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C80F780C7
✅ Remplacement direct✓ En stock
$298.75 / unité
Voir la fiche technique →EP3CLS100F780C7
✅ Remplacement direct✓ En stock
$632.4 / unité
Voir la fiche technique →EP3CLS150F780C7
✅ Remplacement direct✓ En stock
$155 / unité
Voir la fiche technique →EP3CLS70F780C7N
✅ Remplacement direct✓ En stock
$318.75 / unité
Voir la fiche technique →EP3CLS200F780C7
✅ Remplacement direct✓ En stock
$102.4 / unité
Voir la fiche technique →EP3CLS70F780C7 Valeurs maximales et caractéristiques électriques
| Family | Cyclone III LS |
| Logic Elements | 70,208 |
| Embedded Memory Bits | 3,068,928 |
| User I/O Pins | 413 |
| Total I/O Pins | 780 (FBGA package) |
| Process Technology | 65 nm |
| Core Supply Voltage (VCCINT) | 1.2 V |
| Operating Frequency (max) | 437.5 MHz |
| Boîtier | 780-ball FBGA |
| Type de montage | Surface Mount |
| Speed Grade | C7 (commercial, low power) |
| Security Features | AES-256 bitstream encryption, JTAG protection, volatile key storage |
| Embedded Multipliers | 18 x 18 multipliers (DSP blocks) |
| PLLs | Yes (per PLL specification) |
| Statut RoHS | Compliant |
Guide de configuration des broches du EP3CLS70F780C7 780-ball fbga
Configuration des broches du EP3CLS70F780C7 (boîtier 780-ball fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3CLS70F780C7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3CLS70F780C7 convient pour 6 applications: Industrial Motor Control and Drive, Secure Communications Front-End, Medical Imaging Preprocessing, Video Bridging and Format Conversion, ASIC Prototyping and Emulation, Low-Power Test and Measurement Equipment.
Industrial Motor Control and Drive
The EP3CLS70F780C7 fits industrial motor control because its 70,208 logic elements and embedded 18x18 multipliers can implement field-oriented control (FOC), space-vector PWM, and encoder feedback loops in parallel without offloading to a microcontroller. The 413 user I/O pins accept multiple quadrature encoder inputs, Hall sensor banks, and PWM outputs to three-phase inverter bridges. The LS family AES-256 bitstream encryption protects proprietary motor-control IP from cloning, which matters for OEMs selling drives into competitive markets. Compared with a DSP-only solution, this FPGA cuts loop latency by an order of magnitude and consolidates commutation, protection, and interlock logic in one device.
Recommandé
Secure Communications Front-End
The EP3CLS70F780C7 is a strong fit for secure communications front-ends where data must be encrypted before RF upconversion. Its AES-256 bitstream encryption and JTAG tamper detection prevent unauthorized design extraction even if the board is captured. The 70K logic elements and DSP blocks can implement channel coding (Turbo, LDPC, or convolutional), scrambling, and preamble correlation at line rate without an external ASIC. The 780-FBGA exposes enough LVDS pairs to interface directly to high-speed ADCs and DACs used in software-defined radio. Power consumption remains modest thanks to the 65 nm LS process low-static-power option, important for portable or battery-backed comms gear.
Recommandé
Medical Imaging Preprocessing
The EP3CLS70F780C7 suits medical imaging preprocessing because its 3 Mbit of embedded M9K memory buffers ultrasound, endoscopy, or X-ray line-scan data before it crosses to the host processor. The 70K logic elements run real-time filters (FIR, median, Sobel) and color-space conversion at pixel-clock rates, offloading the application processor. The LS family security features are decisive in medical devices where bitstream protection is increasingly required by FDA cybersecurity guidance. The 780-FBGA exposes enough LVDS pairs for direct connection to CMOS image sensor data lanes and HDMI/DVI preview outputs. Compared with a discrete DSP plus FPGA split, the single-FPGA solution reduces BOM cost and board area for portable cart-based imaging systems.
Recommandé
Video Bridging and Format Conversion
The EP3CLS70F780C7 handles video bridging between Camera Link, LVDS, HDMI, MIPI-CSI, and parallel RGB interfaces without an external bridge chip. Its 413 user I/O pins accept the wide parallel buses required for 1080p60 video at 148.5 MHz pixel clock, and the embedded M9K memory tiles implement line buffers and frame stores. The 70K logic elements scale-frame, deinterlace, and color-space convert in real time. The LS security features protect proprietary scaling algorithms from competitors cloning the design. Compared with ASSP bridge ICs, this FPGA adapts to non-standard resolutions and emerging interface standards in days rather than waiting for a new ASSP.
Recommandé
ASIC Prototyping and Emulation
The EP3CLS70F780C7 is a cost-effective ASIC prototyping vehicle because its 70K logic elements, embedded multipliers, and 3 Mbit of block RAM approximate the gate count of a mid-complexity ASIC. Engineers map synthesized ASIC RTL into the FPGA using Quartus II 13.0 with the Cyclone III LS device library and run real-world software against the prototype months before silicon returns. The 780-FBGA exposes JTAG and external memory interfaces for in-circuit emulation. The LS security features ensure that the prototype bitstream cannot be lifted off the board to recover the pre-tapeout ASIC netlist. Compared with high-end Virtex or Stratix prototyping platforms, this part cuts per-board cost by 5-10x for sub-100K-gate designs.
Recommandé
Low-Power Test and Measurement Equipment
The EP3CLS70F780C7 fits portable test and measurement instruments because its low-static-power 65 nm LS process keeps quiescent draw low, while the 70K logic elements implement DSP-style signal processing (FFT, filtering, correlation) for oscilloscopes, logic analyzers, and protocol analyzers. The 413 user I/O pins accept multiple instrument input channels and expose USB/Ethernet/LCD interfaces to the host. The AES-256 bitstream encryption prevents cloning of proprietary calibration constants and measurement IP. Compared with DSP-plus-microcontroller architectures, the single FPGA integrates triggering, acquisition, and display pipelines at lower unit cost and shorter design cycle.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3CLS70F780C7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C80F780C7 | EP3CLS100F780C7 | EP3CLS150F780C7 | EP3CLS70F780C7N | EP3CLS200F780C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 70,208 | 80,640 (+15%) | 100,448 (+43%) | 150,848 (+115%) | 70,208 (same) | 198,464 (+183%) |
| Embedded Memory (bits) | 3,068,928 | 2,810,880 (-8%) | 3,888,896 (+27%) | 5,761,408 (+88%) | 3,068,928 (same) | 6,635,520 (+116%) |
| User I/O Pins | 413 | 428 (+4%) | 426 (+3%) | 347 (-16%) | 413 (same) | 500 (+21%) |
| Security Features (AES-256) | Yes (LS family) | No (standard Cyclone III) | Yes (LS family) | Yes (LS family) | Yes (LS family) | Yes (LS family) |
| Speed Grade | C7 (commercial, low power) | C7 (commercial, low power) | C7 (commercial, low power) | C7 (commercial, low power) | C7 (commercial, low power) | C7 (commercial, low power) |
Principaux différenciateurs
- LS family AES-256 bitstream encryption for IP protection (vs EP3C80F780C7)
- More embedded memory per logic element than the standard Cyclone III tier (vs EP3C80F780C7)
- Lower unit cost than higher-density LS siblings for cost-sensitive designs (vs EP3CLS200F780C7)
Notes de conception
The 780-FBGA package has a 1.0 mm ball pitch and requires a 6+ layer PCB with microvia stack-ups for fan-out. Place a continuous ground plane directly under the BGA to provide a low-impedance return path for the high-speed LVDS pairs. Decouple every VCCINT and VCCIO pin with a 100 nF X7R capacitor placed within 2 mm of the ball, and add four to eight 10 uF bulk capacitors distributed around the package perimeter. Estimated: at 1 A peak VCCINT current draw and the device's typical 1.2 V supply, total decoupling capacitance of approximately 80-120 uF per rail is recommended to hold ripple below 50 mV peak-to-peak during logic activity transients.
Cyclone III LS devices in the 780-FBGA package have a junction-to-ambient thermal resistance (theta_JA) of approximately 8-10 C/W with a properly designed 6-layer PCB and unbroken inner ground planes. At full logic utilization (~70K LE switching at 50% toggle rate), the device can dissipate 2-3 W, producing a junction temperature rise of 16-30 C above ambient. For commercial-temperature (0-85 C) operation this leaves roughly 55 C of ambient margin, but designers should still enforce FPGA activity-aware clock gating to hold quiescent dissipation low and keep the heatsink footprint optional.
Do not attempt to use Quartus Prime (any release after 13.0) for Cyclone III LS designs - the device support was retired. The correct toolchain is Quartus II version 13.0sp1 or earlier with the Cyclone III device library installed. A second common pitfall is attempting to use the LS security features without first generating a unique volatile key - without this, the AES-256 encryption falls back to a default key and the bitstream is effectively unencrypted. Third, do not omit the CRC error-checking block in the configuration bitstream; without it, single-event upsets in high-altitude or radiation-prone environments will not be detected at configuration time.
The 780-FBGA exposes LVDS pairs up to 840 Mbps per channel. Route each LVDS pair as length-matched (within 5 mils) differential traces over a continuous reference plane, with no more than two vias per trace and no splits in the ground plane beneath the pair. Series-stagger the on-die termination (OCT) calibration bits per the Quartus II pin planner to avoid simultaneous switching noise (SSN) when many LVDS outputs toggle in the same clock domain. For DDR2/DDR3 interfaces, use the dedicated DQS phase-shift circuitry and read-deskew calibration in the soft memory controller IP rather than relying on board-level trace matching alone.
Informations de conformité
RoHS and lead-free finish per Intel/Altera product marking; the C7 part has lead-free balls, while the C7N variant explicitly adds the lead-free / RoHS-compliant finish designation. AEC-Q100 not applicable for this FPGA in commercial temperature grade.