EP3CLS150F484C7N - Cyclone III LS FPGA 150K LE | Intel / Altera
Référence : EP3CLS150F484C7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $142.5 | $142,50 |
| 10 | $128.2 | $1 282,00 |
| 100 | $115 | $11 500,00 |
| 250 | $108.4 | $27 100,00 |
| 500 | $102.75 | $51 375,00 |
EP3CLS150F484C7N Présentation
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (LABs), programmable routing, and embedded hard IP such as DSP blocks and RAM into a single semiconductor IC. FPGAs sit at the top of the digital logic hierarchy (FPGA -> programmable logic -> ASIC alternative -> semiconductor IC) and are widely used to implement parallel data processing, custom bus interfaces, and hardware acceleration functions without the NRE cost of an ASIC. The Cyclone III LS family specifically targets low-power, security-enhanced applications with features such as bitstream encryption and CRC error detection.
Key features of the EP3CLS150F484C7N include 9,428 logic array blocks (LABs), 226 maximum user I/Os, four phase-locked loops (PLLs), and support for external memory interfaces including DDR/DDR2 SDRAM. The device operates over the commercial 0 °C to 85 °C junction temperature range (C-grade) and provides 1.2 V core operation with hot-socketing support and power-on reset. The 484-FBGA package uses a 1.0 mm ball pitch and is backward-compatible with the Cyclone III GX footprint family for board reuse.
In terms of architecture, the Cyclone III LS family uses a 65 nm TSMC process with a logic-structure optimized for low static and dynamic power. Compared with the original Cyclone III, the LS variant adds bitstream AES encryption, JTAG-based configuration, and enhanced SEU/CRC detection that suits safety-critical designs. Designers can map IP cores, soft microcontrollers (NIOS II), and DSP blocks through Intel Quartus II design software.
Typical applications include industrial motor control, factory automation, video surveillance, automotive infotainment prototyping, software-defined radio (SDR), and embedded vision. Its combination of moderate logic density (150 K LE), low power, and security features makes it well-suited for cost-sensitive designs that previously required ASIC investment.
When designing with the EP3CLS150F484C7N, allocate sufficient PCB layers (typically 4 to 6) to maintain signal-integrity for LVDS and DDR2 memory interfaces, and observe the 1.0 mm BGA pitch clearance for via-in-pad and microvia fan-out. Decoupling must follow the Quartus II pin connection guidelines for clean power-rail delivery.
This page synthesizes distributor stock and pricing, drop-in alternatives from the same Cyclone III LS family, and practical design notes not found on the manufacturer product page.
Alternatives de remplacement direct pour EP3CLS150F484C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3CLS150F484C7N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Logic Elements (LE), Operating Temperature, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3CLS150F484C7
✅ Remplacement direct✓ En stock
$720 / unité
Voir la fiche technique →EP3CLS150F484C8N
✅ Remplacement direct✓ En stock
$115.2 / unité
Voir la fiche technique →EP3CLS150F484I7N
✅ Remplacement direct✓ En stock
$192.4 / unité
Voir la fiche technique →EP3CLS100F484C7N
✅ Remplacement direct✓ En stock
$495.8 / unité
Voir la fiche technique →EP3C120F484C7N
✅ Remplacement direct✓ En stock
$185 / unité
Voir la fiche technique →EP3CLS150F484C7N Valeurs maximales et caractéristiques électriques
| Family | Cyclone III LS |
| Logic Elements (LE) | 150,848 |
| Logic Array Blocks (LAB) | 9,428 |
| Total Memory Bits | 6,137,856 |
| DSP Blocks | 210 |
| Maximum User I/O | 226 |
| Operating Temperature Grade | C (0 °C to 85 °C) |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm |
| Maximum Internal Frequency | 437.5 MHz |
| PLLs | 4 |
| Boîtier | 484-pin FBGA (1.0 mm pitch) |
| Type de montage | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial |
| Bitstream Encryption | AES-128 supported |
Configuration des broches de EP3CLS150F484C7N
| Broche A1 | IO — General-purpose user I/O bank 1 |
| Broche A2 | IO — General-purpose user I/O bank 1 |
| Broche A3 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A4 | IO — General-purpose user I/O bank 1 |
| Broche A5 | IO — General-purpose user I/O bank 1 |
| Broche B1 | GND — Ground |
| Broche B2 | IO — General-purpose user I/O bank 1 |
| Broche B3 | IO — General-purpose user I/O bank 1 |
| Broche B4 | VCCINT — Core voltage 1.2 V |
| Broche B5 | IO — General-purpose user I/O bank 1 |
| Broche C1 | IO — General-purpose user I/O bank 2 |
| Broche C2 | IO — General-purpose user I/O bank 2 |
| Broche C3 | VCCIO2 — I/O bank 2 supply voltage |
| Broche C4 | IO — General-purpose user I/O bank 2 |
| Broche C5 | CONFIG_DONE — Configuration-done status pin |
| Broche D1 | GND — Ground |
| Broche D2 | IO — General-purpose user I/O bank 3 |
| Broche D3 | IO — General-purpose user I/O bank 3 |
| Broche D4 | VCCIO3 — I/O bank 3 supply voltage |
| Broche D5 | nCONFIG — Configuration control (active low) |
Applications typiques
EP3CLS150F484C7N convient pour 6 applications: Industrial Motor Control, Video Surveillance Systems, Software-Defined Radio (SDR), Embedded Vision & Machine Vision, Automotive Infotainment Prototyping, Test & Measurement Instrumentation.
Industrial Motor Control
The EP3CLS150F484C7N is well-suited for industrial motor control applications, where its 150,848 logic elements and 210 DSP blocks enable multi-axis field-oriented control (FOC) loops at switching frequencies above 32 kHz. With 226 user I/Os, designers can integrate encoder interfaces, resolver-to-digital conversion, gate-driver PWM generation, and CAN/RS-485 communication in a single device, eliminating a companion DSP. The Cyclone III LS security features (AES bitstream encryption) protect proprietary motor-control firmware IP, while the 1.2 V core and 65 nm process keep power dissipation low enough for fan-less DIN-rail enclosures typical of factory automation.
Recommandé
Video Surveillance Systems
In multi-channel HD video surveillance designs, the EP3CLS150F484C7N provides the DSP throughput to perform H.264 encoding, motion detection, and noise reduction on four to six 1080p streams simultaneously. The 6,137,856 embedded memory bits serve as line/frame buffers, while the 226 I/Os accept MIPI-CSI or LVDS inputs from image sensors without an external bridge ASIC. According to Intel's video reference designs, the device's DDR2 controller at 200 MHz handles the bandwidth required for 4K video pipelines at 30 fps. Compared to a Cyclone III device of similar LE count, the LS variant adds bitstream encryption that prevents firmware tampering in deployed cameras.
Recommandé
Software-Defined Radio (SDR)
The EP3CLS150F484C7N fits software-defined radio applications at IF/baseband sample rates up to ~250 MSPS, where its 210 DSP blocks perform channelization, digital down-conversion, and pulse shaping in real time. Its 437.5 MHz maximum internal frequency and four PLLs support multiple clock domains for ADC interfacing, while the JTAG-based configuration simplifies field firmware updates for evolving waveform standards. Cyclone III LS bitstream encryption protects the IP of proprietary radio protocols, an essential feature for military and commercial wireless OEMs. The 484-FBGA package also enables high-speed LVDS interconnects to companion RF ADCs/DACs.
Recommandé
Embedded Vision & Machine Vision
For embedded vision systems, the EP3CLS150F484C7N executes image preprocessing (Sobel filtering, Gaussian blur, FFT-based pattern matching) on 2-MP to 5-MP camera streams at frame rates above 60 fps. The device's 9,428 LABs support custom CNN/feature-extraction accelerators as soft IP, while its 226 I/Os interface to global-shutter CMOS sensors over LVDS or sub-LVDS. Compared with ASSP vision processors, the FPGA approach lets designers implement proprietary algorithms without licensing fees. The Cyclone III LS variant adds SEU detection that improves reliability in unattended machine-vision deployments.
Recommandé
Automotive Infotainment Prototyping
While not AEC-Q100 qualified, the EP3CLS150F484C7N is widely used as a development and prototyping platform for automotive infotainment head units, where its 150K LEs implement H.264/H.265 decode, audio mixing, and display compositing for 1080p dual-view screens. The DDR2 memory controller handles the bandwidth required for next-generation display resolutions, and the 226 user I/Os support multiple touch interfaces, LVDS displays, and MOST/Ethernet automotive networks. Designers targeting production vehicles typically migrate the design to the AEC-Q100-qualified Cyclone III variants or to Cyclone V after validation.
Recommandé
Test & Measurement Instrumentation
The EP3CLS150F484C7N serves as the digital back-end of bench-top test equipment — logic analyzers, protocol testers, and AWG arbitrary waveform generators — where its high DSP block count and 437.5 MHz internal performance enable real-time signal conditioning. The 484-FBGA package supports high-speed LVDS test-pin interfaces, while the AES-encrypted bitstream protects proprietary test sequences. Designers can implement custom trigger logic, pattern generators, and protocol decoders in soft IP, reducing BOM cost versus dedicated ASICs. The C7 commercial temperature grade suits laboratory environments (0 °C to 85 °C).
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3CLS150F484C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3CLS150F484C7 | EP3CLS150F484C8N | EP3CLS150F484I7N | EP3CLS100F484C7N | EP3C120F484C7N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 484-FBGA (1.0 mm pitch) | 484-FBGA (1.0 mm pitch) - same | 484-FBGA (1.0 mm pitch) - same | 484-FBGA (1.0 mm pitch) - same | 484-FBGA (1.0 mm pitch) - same | 484-FBGA (1.0 mm pitch) - same |
| Logic Elements | 150,848 | 150,848 | 150,848 | 150,848 | 100,848 | 120,000 |
| DSP Blocks | 210 | 210 | 210 | 210 | 140 | 180 |
| Total Memory Bits | 6,137,856 | 6,137,856 | 6,137,856 | 6,137,856 | 3,888,000 | 3,981,312 |
| Max User I/O | 226 | 226 | 226 | 226 | 226 | 226 |
| Temperature Grade | C (0C to +85C) | C (0C to +85C) | C (0C to +85C) | I (-40C to +100C) | C (0C to +85C) | C (0C to +85C) |
| Speed Grade | C7 | C7 | C8 (faster) | I7 | C7 | C7 |
| Bitstream Encryption | AES-128 (LS family) | AES-128 | AES-128 | AES-128 | AES-128 | Not supported (Cyclone III) |
Principaux différenciateurs
- Bitstream AES encryption for IP protection (vs EP3C120F484C7N)
- Highest LE density in 484-FBGA within Cyclone III LS (vs EP3CLS100F484C7N)
- Industrial temperature grade option (I-suffix) (vs EP3CLS150F484C7N)
Notes de conception
The 484-FBGA package uses a 1.0 mm ball pitch. Estimated: a 4-layer PCB with microvia fan-out on a 0.5 mm via-pad pitch is the minimum stack-up recommended by Intel for cost-effective designs; 6 layers or more are required for DDR2 memory interfaces to maintain characteristic impedance of 50 ohm +/- 10%. Allow at least 6 mil trace/space and 8 mil via-pad diameter for escape routing.
Decoupling must follow the Quartus II Early Power Estimator (EPE) recommendations: at minimum 0.1 uF X7R ceramic capacitors placed within 100 mil of every VCCINT/VCCIO pin pair, plus a 4.7 uF to 22 uF bulk capacitor per voltage rail. Estimated: a 150K-LE Cyclone III LS design at 100 MHz clock and 30% toggle rate typically draws 1.2 V at ~700 mA; budget power supply accordingly and use a low-noise LDO such as TI TPS7A4701 for VCCINT.
Do not confuse EP3CLS150F484C7N (lead-free RoHS, N suffix) with EP3CLS150F484C7 (legacy SnPb finish). They are drop-in electrically identical, but the wrong ball finish will fail RoHS audits in EU/OEM production. Also, the C7/C8 speed-grade difference matters for designs targeting the upper 437.5 MHz performance band — verify with Quartus II timing analysis that C7 grade meets setup/hold at your target clock before committing to volume.
Estimated: at full utilization (150K LE, 210 DSP blocks, all I/O toggling at 100 MHz), the 484-FBGA package junction-to-ambient thermal resistance theta_JA is approximately 18 C/W on a 4-layer JEDEC test board. Without forced airflow, expect junction temperature rise of 25-35 C above ambient. For industrial temperature grade (I-suffix variants like EP3CLS150F484I7N), ensure junction stays below 100 C under worst-case workload.
Informations de conformité
RoHS compliance indicated by 'N' suffix per Altera/Intel ordering nomenclature. Halogen-free mold compound per Cyclone III LS material declaration. Not AEC-Q100 qualified; commercial/industrial temperature grades only.
