EP3CLS150F484C8N - Cyclone III LS FPGA, 150K LE, 484-FBGA | Intel
Référence : EP3CLS150F484C8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $168 | $168,00 |
| 10 | $152.4 | $1 524,00 |
| 100 | $138.6 | $13 860,00 |
| 500 | $125.5 | $62 750,00 |
| 1 000 | $115.2 | $115 200,00 |
EP3CLS150F484C8N Présentation
A Field Programmable Gate Array (FPGA) is a class of programmable logic device that allows engineers to implement arbitrary digital circuits through configuration of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP resources. The Cyclone III LS family sits in the hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. FPGAs provide hardware parallelism, real-time deterministic processing, and rapid design iteration that microcontrollers and ASICs cannot match.
Key features of the EP3CLS150F484C8N include 150,848 logic elements, 342 M9K memory blocks, 6,137,856 total RAM bits, 210 embedded 18x18 multipliers for DSP operations, and 4 phase-locked loops (PLLs) for clock management. The Cyclone III LS family is designed for low static and dynamic power consumption compared to earlier Cyclone generations, making it attractive for power-sensitive applications. The device also includes support for high-speed external memory interfaces including DDR, DDR2, and QDRII+ SRAM.
Architecturally, the EP3CLS150F484C8N uses a LUT-based logic fabric with dedicated routing resources, embedded memory blocks (M9K), embedded multipliers, and configurable I/O elements supporting multiple I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device is configured via SRAM-based configuration memory, requiring an external configuration flash or download cable on every power-up.
Typical applications include industrial motor control and factory automation, video processing and display controllers, automotive infotainment prototypes, telecommunications line cards, low-power DSP co-processing, and software-defined radio front-ends. Designers often select the Cyclone III LS family when balancing cost, low power, and the ability to integrate custom logic and DSP alongside a soft processor core.
A critical design consideration is power supply sequencing: the Cyclone III LS family requires specific ramp rates and decoupling to prevent device damage. Designers must follow the manufacturer's guidelines for VCCINT, VCCA, and VCCIO supply ramp sequencing. Configuration is also essential - selecting the wrong configuration scheme can lead to design instability.
Alternatives de remplacement direct pour EP3CLS150F484C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3CLS150F484C8N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Speed Grade, Logic Elements (LE).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3CLS150F484C8
✅ Remplacement direct✓ En stock
$119 / unité
Voir la fiche technique →EP3CLS150F484C7N
✅ Remplacement direct✓ En stock
$102.75 / unité
Voir la fiche technique →EP3CLS150F484C7
✅ Remplacement direct✓ En stock
$720 / unité
Voir la fiche technique →EP3CLS100F484C8N
✅ Remplacement direct✓ En stock
$115.4 / unité
Voir la fiche technique →EP3C120F484C7N
✅ Remplacement direct✓ En stock
$185 / unité
Voir la fiche technique →EP3CLS150F484C8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone III LS |
| Logic Elements (LE) | 150,848 |
| Total RAM Bits | 6,137,856 bits |
| Embedded Multipliers (18x18) | 210 |
| Logic Array Blocks (LABs) | 9,428 |
| PLLs | 4 |
| User I/O Pins | 226 (maximum) |
| Process Technology | 65 nm low-power |
| Core Voltage (VCCINT) | 1.2 V |
| Boîtier | 484-ball FBGA (FineLine BGA) |
| Speed Grade | 8 (commercial) |
| Maximum Operating Frequency | 402 MHz |
| Température de fonctionnement | 0C to +85C (commercial) |
| Type de montage | Surface Mount |
| Configuration Method | SRAM-based (external flash required) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du EP3CLS150F484C8N 484-ball fbga (fineline bga)
Configuration des broches du EP3CLS150F484C8N (boîtier 484-ball fbga (fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3CLS150F484C8N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3CLS150F484C8N convient pour 6 applications: Industrial Motor Control, Video Processing and Display Controllers, Software Defined Radio Front-End, Automotive Infotainment Prototype, Industrial Communication Gateways, Test and Measurement Instrumentation.
Industrial Motor Control
The EP3CLS150F484C8N is well-suited for industrial motor control applications where its 150,848 logic elements and 210 18x18 DSP multipliers enable high-resolution PWM generation, field-oriented control (FOC) algorithms, and encoder feedback processing. The 65nm low-power process keeps thermal dissipation manageable in sealed industrial enclosures, while the 226 user I/Os accommodate multiple feedback channels including Hall sensors, quadrature encoders, and resolver interfaces. The AES-encrypted bitstream protects proprietary motor control IP from cloning, and the 4 PLLs allow precise timing alignment of switching frequencies up to 402 MHz for IGBT and SiC gate drivers.
Recommandé
Video Processing and Display Controllers
For video processing applications, the EP3CLS150F484C8N's 6,137,856 bits of embedded RAM provide sufficient line buffers for HD video frame buffering, and the 226 user I/Os easily support parallel RGB/CMOS camera interfaces, HDMI/DVI output, and LVDS display links. The 210 DSP multipliers accelerate video scaling, color space conversion, and deinterlacing algorithms in real time. Designers commonly use the Cyclone III LS with the Altera VIP suite for video bridging and image signal processing in industrial inspection cameras, broadcast equipment, and digital signage controllers where the security features also protect custom IP.
Recommandé
Software Defined Radio Front-End
Software-defined radio applications benefit from the EP3CLS150F484C8N's 210 embedded 18x18 multipliers and 6.1 Mbit of embedded RAM to implement digital down/up-conversion (DDC/DUC), finite impulse response (FIR) filters, and channelization logic for narrowband receivers. The 4 PLLs enable flexible sample-rate clocking at 100-400 MHz for ADC/DAC interfaces, and the LVDS I/O support accommodates high-speed serial ADCs and DACs. The Cyclone III LS's low static power (under 0.5 W typical at 100 MHz) extends battery life in portable SDR equipment used in field testing, public safety radio, and tactical communications.
Recommandé
Automotive Infotainment Prototype
The EP3CLS150F484C8N is widely used as a prototyping platform for automotive infotainment systems, supporting multi-screen display controllers, audio DSP pipelines, and CAN/LIN bus bridges. Its 1.2 V core voltage aligns with modern automotive power rails, and the 226 user I/Os accommodate multiple touch panels, LVDS display links, and MOST bus interfaces. The hardware AES bitstream encryption prevents IP theft during development and production. However, for production automotive designs, designers typically migrate to AEC-Q100 qualified parts such as Cyclone IV E automotive variants (EP4CE40F23I7N) before deployment.
Recommandé
Industrial Communication Gateways
The EP3CLS150F484C8N enables multi-protocol industrial gateways by implementing Profibus, Profinet, EtherCAT, Modbus TCP, and serial protocols in a single programmable device. With 150K logic elements, designers can integrate protocol stacks, packet buffers, and a soft Nios II processor core for routing logic on a single chip. The 6 Mbit embedded RAM accommodates Ethernet frame buffering at line rate, and the 226 I/Os support multiple isolated RS-485, RS-232, and CAN ports. The bitstream encryption is critical for protecting vendor-specific industrial protocols against reverse engineering.
Recommandé
Test and Measurement Instrumentation
Test and measurement equipment such as bench oscilloscopes, logic analyzers, and protocol testers leverage the EP3CLS150F484C8N's 150K logic elements and 210 DSP multipliers for real-time signal processing, decimation, FFT computation, and trigger detection. The 226 user I/Os and LVDS support enable multi-channel data acquisition at rates up to 840 Mbps per LVDS pair. Designers pair the FPGA with high-speed ADCs and DACs to build arbitrary waveform generators, spectrum analyzers, and protocol analyzers used in R&D labs and manufacturing test floors, where the bitstream AES encryption also protects proprietary measurement algorithms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3CLS150F484C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3CLS150F484C8 | EP3CLS150F484C7N | EP3CLS150F484C7 | EP3CLS100F484C8N | EP3C120F484C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F484) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Logic Elements | 150,848 | 150,848 | 150,848 | 150,848 | 100,848 | 119,088 |
| Embedded RAM (bits) | 6,137,856 | 6,137,856 | 6,137,856 | 6,137,856 | 4,026,624 | 3,981,312 |
| DSP Multipliers (18x18) | 210 | 210 | 210 | 210 | 132 | 172 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | 8 | 8 | 7 | 7 | 8 | 7 |
| AES Bitstream Encryption | Yes (LS family) | Yes | Yes | Yes | Yes | No |
Principaux différenciateurs
- Hardware AES bitstream encryption protects proprietary IP (vs EP3C120F484C7N)
- Highest logic density in Cyclone III LS family with 484-FBGA package (vs EP3CLS100F484C8N)
- Faster speed grade (8) for higher fMAX timing margin (vs EP3CLS150F484C7N)
Notes de conception
Cyclone III LS devices require power supply sequencing: VCCINT (1.2 V), VCCA (2.5 V), and VCCIO (1.2-3.3 V) must ramp in a specific order to prevent device damage and high in-rush current. Intel recommends VCCA and VCCIO ramp before or simultaneously with VCCINT. Each supply rail should have its own decoupling network: 100 nF and 10 uF ceramic capacitors placed within 5 mm of each power pin, plus 100 uF bulk capacitors per power plane. Total decoupling capacitance budget is approximately 100 uF per supply rail for the 484-FBGA package.
The 484-FBGA package uses a 1.0 mm ball pitch with a 22x22 ball grid array. PCB design requires microvia (HDI) stack-up with at least 4 layers dedicated to ground and power planes for signal return paths. Via-in-pad or dog-bone fanout is recommended. The exposed die area beneath the BGA needs an unbroken GND copper pour stitched with thermal vias (0.2 mm diameter, 1.0 mm pitch) to provide thermal dissipation. Estimated: with the typical 65nm Cyclone III LS power of 1.5-2.5 W at 100 MHz, theta_JA is approximately 18 C/W on a 4-layer JEDEC test board.
Cyclone III LS FPGAs use SRAM-based configuration memory that must be loaded from an external non-volatile flash (EPCS or compatible) on every power-up. Configuration time is approximately 50 ms for the EP3CLS150F484C8N. Designers must implement the nCONFIG, nSTATUS, and CONF_DONE handshake lines correctly to detect configuration failures. Use the AS (active serial), PS (passive serial), FPP (fast passive parallel), or JTAG configuration mode per the application requirements. The AES-encrypted bitstream feature requires the on-chip decryption engine to be enabled in Quartus Prime settings.
Common mistakes when designing with the EP3CLS150F484C8N include: (1) exceeding the maximum I/O count of 226 by attempting to use JTAG pins as user I/O, (2) ignoring the 1.2 V VCCINT minimum during brown-out conditions which can cause configuration memory corruption, (3) omitting the required nCE (chip enable) and nCEO (chip enable output) chain pull-up resistors on multi-device configuration chains, and (4) using non-I/O-standard compliant LVDS signaling at 3.3 V VCCIO. Always consult the Cyclone III LS Device Handbook pin connection guidelines before PCB layout.
Informations de conformité
RoHS and lead-free compliant per Intel product page. Not AEC-Q100 qualified; for automotive applications use automotive-qualified variants or migrate to Cyclone IV E automotive family. Halogen-free status not explicitly stated in available data.