EP3CLS200F780C7N - 198K LE Cyclone III LS FPGA 780-BGA | Altera
Référence : EP3CLS200F780C7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $262.2 | $2 622,00 |
| 100 | $239.4 | $23 940,00 |
| 500 | $221.85 | $110 925,00 |
| 1 000 | $199.5 | $199 500,00 |
EP3CLS200F780C7N Présentation
A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and on-chip memory and DSP resources that the designer programs after manufacture. FPGAs sit hierarchically between ASICs (lower unit cost, higher NRE) and microcontrollers (lower flexibility, lower performance). The Cyclone III LS family is the low-power, security-enhanced successor to Cyclone II within Altera's mid-range portfolio, and it targets applications that need a balance of logic density, DSP throughput, and predictable power consumption.
Key features of the EP3CLS200F780C7N include 198,464 logic elements, 7,829 Kbit embedded RAM, 4 PLLs, 413 (18x18) hardware multipliers, and 20 global clock networks. The 780-BGA package exposes the maximum I/O count for this die (up to 429 user I/Os depending on configuration scheme), and the -7 speed grade places this part in the mid-speed bin of the family. Core supply is 1.2 V with separate VCCPD and VCCIO banks for I/O standards.
The Cyclone III LS architecture pairs the established Cyclone III logic fabric with on-die AES, SHA, and key-storage blocks together with JTAG tamper detection. This combination lets designers implement encryption, secure boot, and IP protection without external secure-elements, which is why the LS variant is widely deployed in industrial control, secure communications, and military/aerospace platforms that demand both high logic density and supply-chain assurance.
Typical applications include industrial motor control and factory automation, secure communications baseband, military and aerospace signal processing, video surveillance, and portable test and measurement equipment. The 198K-LE density tier positions this part above the Cyclone III LS EP3CLS100 and below the EP3CLS200 (same density) in larger packages, giving designers a common RTL target across board variants.
When designing with this device, pay close attention to the configuration scheme (AS, PS, JTAG, or FPP) because it changes which balls carry user I/O versus configuration pins. Use Quartus II (or the current Intel Quartus Prime Cyclone III support package) for synthesis, place-and-route, and power estimation, and follow Altera's PCB layout guidelines for fine-pitch BGA fan-out.
This page consolidates distributor pricing, same-die drop-in alternatives in alternative packages, and practical design notes that go beyond the manufacturer's datasheet table.
Alternatives de remplacement direct pour EP3CLS200F780C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3CLS200F780C7N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Logic Array Blocks (LABs), RoHS Status, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3CLS200F780C7
✅ Remplacement direct✓ En stock
$102.4 / unité
Voir la fiche technique →EP3CLS200F780I7N
✅ Remplacement direct✓ En stock
$240 / unité
Voir la fiche technique →EP3CLS200F780C8N
✅ Remplacement direct✓ En stock
$943.88 / unité
Voir la fiche technique →EP3CLS200F780I8N
✅ Remplacement direct✓ En stock
$495 / unité
Voir la fiche technique →EP3CLS150F780C7N
✅ Remplacement direct✓ En stock
$88.4 / unité
Voir la fiche technique →EP3CLS100F780C7N
✅ Remplacement direct✓ En stock
$298.75 / unité
Voir la fiche technique →EP3CLS200F780C7N Valeurs maximales et caractéristiques électriques
| Device Family | Cyclone III LS |
| Series | EP3CLS200 |
| Logic Elements (LE) | 198,464 |
| Logic Array Blocks (LAB) | 9,923 |
| Embedded Memory | 7,829 Kbit |
| Embedded Multipliers (18x18) | 413 |
| Phase-Locked Loops (PLL) | 4 |
| Global Clock Networks | 20 |
| Maximum User I/O | 429 |
| Core Voltage (VCCINT) | 1.2 V |
| Supply Voltage (Datasheet Reference) | 1.2 V |
| Package Type | FBGA-780 |
| Package Code | BGA |
| Speed Grade | C7 (commercial, -7 speed bin) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Statut RoHS | Compliant |
Guide de configuration des broches du EP3CLS200F780C7N bga
Configuration des broches du EP3CLS200F780C7N (boîtier bga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3CLS200F780C7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3CLS200F780C7N convient pour 6 applications: Industrial Motor Control and Factory Automation, Secure Communications Baseband, Military and Aerospace Signal Processing, Video Surveillance and Image Processing, Portable Test and Measurement Equipment, Medical Imaging and Diagnostic Equipment.
Industrial Motor Control and Factory Automation
The EP3CLS200F780C7N fits industrial motor control and factory-automation designs because its 198,464 LEs and 413 18x18 multipliers deliver enough parallel DSP throughput to implement field-oriented control (FOC), space-vector PWM, and multi-axis servo loops on a single FPGA. The Cyclone III LS security blocks enable secure firmware loaders and signed configuration images, which are increasingly required for OT/IT-converged plants. The 780-BGA package exposes up to 429 user I/Os, so engineers can wire the part directly to multi-encoder feedback chains and parallel ADC/DAC buses without external logic. Designers typically instantiate the Nios II embedded processor on this die for protocol stacks such as EtherCAT or PROFINET alongside the DSP pipeline.
Recommandé
Secure Communications Baseband
For secure-communications baseband, the EP3CLS200F780C7N pairs the Cyclone III LS AES-256 and SHA-256/384/512 accelerators with enough logic density to implement physical-layer modulation, encryption, and packet processing on a single die. The 7,829 Kbit of embedded RAM buffers symbols and cipher states at line rate, while the 413 18x18 multipliers handle channel coding such as Turbo or LDPC. Designers leverage the JTAG tamper detection to detect physical probing, which is critical for field-deployed radios. The 1.2 V core keeps power low enough that the part can be used in portable and vehicular manpack radios.
Recommandé
Military and Aerospace Signal Processing
The Cyclone III LS family is widely used in military and aerospace signal processing because it combines 198K LEs of logic density with hardware AES/SHA engines and on-die tamper detection, satisfying program-protection requirements. The EP3CLS200F780C7N's 413 hardware multipliers deliver enough DSP throughput for radar pulse compression, electronic-warfare channelization, or software-defined-radio FFTs at hundreds of MHz. Industrial-temperature variants are available in the same 780-BGA, so the same RTL can be retargeted across commercial and defense SKUs. Designers pair this part with high-speed ADCs and DACs via LVDS, which the I/O banks natively support.
Recommandé
Video Surveillance and Image Processing
The EP3CLS200F780C7N serves video-surveillance and image-processing platforms that need real-time H.264/H.265 pre-processing, motion detection, and analytics at the edge. The 198K LEs and 7,829 Kbit of embedded RAM hold multiple video frames in line buffers and run pixel-level pipelines that microcontrollers cannot sustain. The Cyclone III LS security engine encrypts the video stream before it leaves the camera, and the JTAG tamper detector flags enclosure-breach events. The 780-BGA package exposes wide LVDS buses that connect directly to image sensors without external deserialization.
Recommandé
Portable Test and Measurement Equipment
Portable oscilloscopes, logic analyzers, and protocol testers leverage the EP3CLS200F780C7N's high LE count for parallel sample aggregation and DSP-based triggering. The 413 18x18 multipliers run FIR filtering, FFTs, and modulation analysis in real time, while the embedded RAM buffers deep acquisitions without external memory. The 1.2 V core voltage keeps battery-powered instruments cool enough for fan-less enclosures, and the 780-BGA's 429 user I/Os accept wide LVDS or parallel CMOS probe inputs. The Cyclone III LS AES engine secures proprietary measurement IP, and the JTAG tamper detection protects calibration data.
Recommandé
Medical Imaging and Diagnostic Equipment
Medical imaging platforms such as ultrasound front-ends and patient-monitoring hubs adopt the EP3CLS200F780C7N for its combination of DSP multipliers, embedded memory, and on-die encryption for HIPAA-compliant data paths. The 198K LEs run beamforming pipelines for 32-to-128 channel ultrasound probes, and the 7,829 Kbit RAM stages channel data ahead of the host processor. Cyclone III LS AES-256 protects PHI at rest and in transit, while JTAG tamper detection supports FDA cybersecurity guidance for medical devices. The industrial-temperature -I7N variant in the same 780-BGA simplifies qualification for clinical environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3CLS200F780C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3CLS200F780C7 | EP3CLS200F780I7N | EP3CLS200F780C8N | EP3CLS200F780I8N | EP3CLS150F780C7N | EP3CLS100F780C7N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | FBGA-780 | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Logic Elements | 198,464 | 198,464 | 198,464 | 198,464 | 198,464 | 150,848 (-24%) | 88,208 (-55%) |
| Embedded Memory | 7,829 Kbit | 7,829 Kbit | 7,829 Kbit | 7,829 Kbit | 7,829 Kbit | 6,134 Kbit (-22%) | 3,888 Kbit (-50%) |
| 18x18 Multipliers | 413 | 413 | 413 | 413 | 413 | 320 (-23%) | 192 (-54%) |
| Speed Grade | C7 (commercial) | C7 (commercial) | I7 (industrial) | C8 (faster commercial) | I8 (faster industrial) | C7 (commercial) | C7 (commercial) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| Hardware Security (AES/SHA/JTAG Tamper) | Yes (Cyclone III LS) | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Highest-density Cyclone III LS in 780-BGA (vs EP3CLS150F780C7N)
- Drop-in faster speed grade available (vs EP3CLS200F780C8N)
- Industrial-temperature drop-in variant (vs EP3CLS200F780I7N)
Notes de conception
Configuration scheme choice (AS, PS, JTAG, or FPP) changes which balls are user I/O versus configuration pins, so pick the scheme before floor-planning the PCB. Mis-mapping MSEL[3:0] to the wrong mode is the single most common reason new Cyclone III LS boards fail to enumerate, and the symptoms (no response on JTAG, blank CONF_DONE) mimic a dead part.
The 780-ball FBGA requires controlled-impedance fan-out and matched-length routing on high-speed LVDS pairs. Follow Altera's Cyclone III LS board design guidelines for via-in-pad or microvia stack-up, and use at least 4 power planes (VCCINT, VCCPD, VCCIO per bank, GND) to keep core and I/O supplies decoupled. Skimping on decoupling capacitors at the BGA balls causes logic glitches that masquerade as soft configuration errors.
Estimated: at 100 percent logic utilization with all four PLLs enabled, the EP3CLS200 die dissipates approximately 1.5 to 2 W under typical toggle rates. With a 1.2 V core, this means tens of watts are NOT expected at the board level, but the 780-BGA still benefits from a thermal pad bonded to an inner copper pour. Industrial-temperature -I7N and -I8N variants share the same thermal envelope as commercial parts, so cooling does not need to be redesigned between SKUs.
Informations de conformité
RoHS and lead-free per Altera/Intel product page. Halogen-free status was not explicitly stated in the verified web data; consult the material declaration sheet on request. AEC-Q100 is not applicable (Cyclone III LS is qualified to industrial, not automotive, standards).
