EP3CLS200F780C8N - Cyclone III LS FPGA, 198K LE, 780-FBGA | Intel
Référence : EP3CLS200F780C8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1573.13 | $1 573,13 |
| 10 | $1415.82 | $14 158,20 |
| 100 | $1258.5 | $125 850,00 |
| 500 | $1101.19 | $550 595,00 |
| 1 000 | $943.88 | $943 880,00 |
EP3CLS200F780C8N Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy - above CPLDs and below ASICs - and allow hardware designers to implement arbitrary digital logic, custom processors, and parallel datapaths that can be reconfigured in the field. The Cyclone III LS family is the low-power, security-enhanced variant of Cyclone III, adding features such as bitstream encryption and configuration CRC for tamper-resistant designs.
Key features of the EP3CLS200F780C8N include 198,464 logic elements, 8,211,456 bits of embedded SRAM (approximately 1,008 Kbytes), 413 maximum user I/O pins, four phase-locked loops (PLLs), and dedicated hardware multipliers for DSP workloads. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, with on-chip termination for high-speed memory interfaces. Configuration can be loaded via JTAG, passive serial, or via a configuration flash, and the LS variant supports AES-128 bitstream decryption with tamper detection.
The Cyclone III LS architecture combines a fine-grained logic fabric with columnar M9K block RAM tiles and 18x18 hardware multipliers, enabling efficient implementation of DSP pipelines, video processing, and embedded microcontrollers (Nios II soft-core). The 65 nm process and low-static-power design keep typical quiescent draw below 1 W even at high logic utilization, while the 780-FBGA package provides ample signal integrity margin for DDR2/DDR3 memory interfaces.
Typical applications include industrial motor control, factory automation, video surveillance and image processing, automotive infotainment and driver-assist prototypes, medical imaging equipment, and software-defined radio baseband processing. The combination of high logic density and embedded multipliers makes it well-suited for parallel DSP algorithms such as FFTs, FIR filters, and forward error correction.
When designing with the EP3CLS200F780C8N, ensure that all power rails (VCCINT, VCCA, VCCD_PLL, and bank I/O supplies) are decoupled with 100 nF and bulk capacitors placed close to the balls as recommended in the Intel hardware design guidelines. The configuration scheme must be selected early in the design cycle, since JTAG-only configurations cannot self-boot without an external flash. Use the Quartus II / Quartus Prime design software for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet - including a parameter-by-parameter comparison against other Cyclone III and Cyclone IV devices and explicit guidance on selecting the correct speed/temperature grade for your application.
Alternatives de remplacement direct pour EP3CLS200F780C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3CLS200F780C8N (même facteur de forme et même empreinte) — différant par Process Technology, Package, Speed Grade, RoHS Status, Configuration Modes.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3CLS200F780C7N
✅ Remplacement direct✓ En stock
$199.5 / unité
Voir la fiche technique →EP3CLS200F780C8
✅ Remplacement direct✓ En stock
$1995 / unité
Voir la fiche technique →EP3CLS200F780C8ES
✅ Remplacement direct✓ En stock
$215 / unité
Voir la fiche technique →EP3CLS200F780C7
✅ Remplacement direct✓ En stock
$102.4 / unité
Voir la fiche technique →EP3CLS150F780C8N
✅ Remplacement direct✓ En stock
$205 / unité
Voir la fiche technique →EP3CLS100F780C8N
✅ Remplacement direct✓ En stock
$105.8 / unité
Voir la fiche technique →EP3CLS200F780I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$240 / unité
Voir la fiche technique →EP3CLS200F780I8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$495 / unité
Voir la fiche technique →EP3CLS200F780C8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone III LS |
| Logic Elements | 198,464 |
| Embedded Memory Bits | 8,211,456 bits (approximately 1008 Kbytes) |
| Maximum User I/O Pins | 413 |
| Number of PLLs | 4 |
| Number of Global Clock Networks | 20 |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V (typical) |
| Speed Grade | C8 (commercial, 8 ns) |
| Plage de température de fonctionnement | 0C to +85C (commercial) |
| Boîtier | 780-ball FBGA (FineLine BGA) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant (lead-free FBGA) |
| Bitstream Encryption | AES-128 (Cyclone III LS feature) |
| Configuration Modes | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP) |
| Multipliers (18x18) | 396 (Cyclone III LS family characteristic) |
Guide de configuration des broches du EP3CLS200F780C8N 780-ball fbga (fineline bga)
Configuration des broches du EP3CLS200F780C8N (boîtier 780-ball fbga (fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3CLS200F780C8N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3CLS200F780C8N convient pour 6 applications: Industrial Motor Control and Drive, Video Surveillance and Image Processing, Software-Defined Radio Baseband, Medical Imaging Equipment Prototypes, Factory Automation and Programmable Logic Controllers, Automotive Infotainment and Driver-Assist Prototyping.
Industrial Motor Control and Drive
The EP3CLS200F780C8N is well suited for industrial motor control, where its 198,464 logic elements and 396 18x18 hardware multipliers enable real-time implementation of field-oriented control (FOC), space-vector PWM, and encoder-feedback loops. The 413 user I/O pins provide ample headroom for multiple encoder interfaces (QEP, SSI, EnDat), PWM channels to three-phase IGBT bridges, and CAN/RS-485 industrial buses. Designers can implement the entire control loop plus a Nios II soft-core supervisory processor on a single FPGA, reducing BOM cost. The Cyclone III LS 1.2 V core at 65 nm keeps typical power below 1.5 W even at high logic utilization, important for sealed industrial cabinets.
Recommandé
Video Surveillance and Image Processing
For HD video surveillance pipelines, the EP3CLS200F780C8N's 8,211,456 bits of embedded block RAM can buffer multiple video frames while the 18x18 multipliers run real-time 2D FIR filters, motion-detection kernels, and JPEG/H.264 preprocessing. The 780-FBGA package supports multiple LVDS channels for direct camera-link or HDMI input, and the four PLLs allow independent clocking of the camera, memory, and display subsystems. The Cyclone III LS bitstream encryption prevents IP theft of proprietary image-processing algorithms - critical for security OEMs shipping product globally.
Recommandé
Software-Defined Radio Baseband
Software-defined radio (SDR) baseband processing maps efficiently to FPGA fabrics, and the EP3CLS200F780C8N with 198,464 logic elements and 396 hardware multipliers can implement a complete digital down-conversion chain, FFT bank, and channelizer for narrowband signals. The four PLLs provide the multiple clock domains required for ADC sampling, decimation, and host interface. The Cyclone III LS security features protect proprietary modem IP - a key concern for both military and commercial radio vendors. Use the 780-FBGA's LVDS I/O to interface directly to high-speed ADCs such as the AD9268 or AD9680 family.
Recommandé
Medical Imaging Equipment Prototypes
Ultrasound, endoscopy, and other medical imaging prototypes benefit from the EP3CLS200F780C8N's parallel DSP capability and large block-RAM buffers. The 198K logic elements can implement beamforming for 32-64 channel ultrasound probes, while the 8 Mbit of embedded memory holds multiple scan lines. The Cyclone III LS bitstream encryption with AES-128 helps satisfy FDA cybersecurity guidance for medical devices. Commercial temperature range is acceptable for equipment housed in climate-controlled clinical environments; portable/wearable variants should upgrade to EP3CLS200F780I7N industrial temperature.
Recommandé
Factory Automation and Programmable Logic Controllers
Programmable Logic Controllers (PLCs) and factory-automation controllers require deterministic response times and flexible I/O - the EP3CLS200F780C8N delivers both via 413 user I/O supporting Profibus, EtherCAT, RS-485, and discrete industrial I/O. The Cyclone III LS family's tamper-resistant bitstream encryption protects proprietary ladder-logic and motion-control IP from cloning. The 65 nm low-power process keeps the FPGA cool in sealed DIN-rail enclosures without forced-air cooling. Designers can integrate multi-axis motion control, vision-guided robotics, and safety logic on a single FPGA.
Recommandé
Automotive Infotainment and Driver-Assist Prototyping
Pre-production automotive infotainment and ADAS (advanced driver-assist systems) prototyping leverages the EP3CLS200F780C8N's processing density to emulate multiple camera inputs, sensor fusion, and HMI rendering in parallel. The four PLLs support independent timing for camera sensors, MIPI-CSI bridges, and display outputs, while the 8 Mbit of block RAM holds frame buffers and lookup tables. Note that production automotive deployments should move to AEC-Q100 qualified parts - the EP3CLS200F780C8N is commercial grade and intended for development/prototype use only.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3CLS200F780C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3CLS200F780C7N | EP3CLS200F780C8 | EP3CLS200F780C8ES | EP3CLS150F780C8N | EP3CLS100F780C8N | EP3CLS200F780I7N | EP3CLS200F780I8N |
|---|---|---|---|---|---|---|---|---|
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 198,464 | 198,464 (identical) | 198,464 (identical) | 198,464 (identical) | 150,720 (-24%) | 100,448 (-49%) | 198,464 (identical) | 198,464 (identical) |
| Embedded Memory Bits | 8,211,456 | 8,211,456 (identical) | 6,127,104 (-25%) | 3,888,000 (-53%) | 8,211,456 (identical) | |||
| User I/O Pins | 413 | 413 (identical) | 347 (-16%) | 283 (-31%) | 413 (identical) | |||
| Speed Grade | C8 (commercial) | C7 (faster) | I7 industrial (-40C to +100C) | I8 industrial (-40C to +100C) | ||||
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial, same) | ||||
| AES-128 Bitstream Encryption | Yes (Cyclone III LS) | Yes (identical) | Yes (identical) | Yes (LS family) |
Principaux différenciateurs
- Highest logic density in the Cyclone III LS family at the 780-FBGA package (vs EP3CLS150F780C8N)
- Cyclone III LS adds hardware bitstream encryption vs standard Cyclone III (vs EP3C120F780C8N)
- Faster speed grade option available as pin-compatible upgrade (vs EP3CLS200F780C7N)
Notes de conception
The EP3CLS200F780C8N requires four separate power rails: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), VCCD_PLL (1.2 V PLL digital), and per-bank VCCIO supplies (1.2/1.5/1.8/2.5/3.3 V depending on I/O standard). Use a dedicated LDO for VCCA to minimize PLL jitter - shared switching regulators will degrade timing margin. Bulk-decouple each rail with 220 uF tantalum or polymer plus 10 uF and 100 nF ceramics placed within 5 mm of each BGA ball row. Total quiescent current at full utilization can reach 1.5 A on VCCINT alone at typical 25C junction.
The 780-FBGA package has a 1.0 mm ball pitch and demands a 6-layer PCB minimum with microvia (laser-drilled) stackup to fan out the inner rows. Use the Intel Cyclone III hardware design guidelines reference stackup (4 signal + 2 plane layers is typical). Matched-length impedance control (50 ohm single-ended, 100 ohm differential) is required for all DDR2/DDR3 interfaces; assign LVDS pairs in adjacent BGA balls whenever possible to minimize skew. Do not route high-speed signals under the BGA shadow area on the top layer.
Common design mistakes include: (1) failing to enable the Cyclone III LS configuration CRC check in Quartus - this defeats the tamper-detection feature; (2) using C8 timing models for a design that will be migrated to C7 (overly pessimistic timing closure, but this is safe); (3) neglecting to drive unused I/O banks to a defined voltage - floating VCCIO causes high quiescent draw; (4) configuring dual-purpose pins (DPP) without setting the correct mode in the Quartus device options, which can result in configuration failure; (5) using passive serial configuration without a pull-up on the CONF_DONE line.
Estimated: at full logic utilization (198K LE, 100% toggle rate) the EP3CLS200F780C8N dissipates approximately 1.2 W typical quiescent plus dynamic power that scales with clock frequency and toggle rate. The 780-FBGA's theta_JA is approximately 18 C/W with a standard JEDEC 4-layer test board (no airflow). At 1.5 W total dissipation, junction temperature rise above ambient is approximately 27 C, leaving adequate margin within the 85 C commercial limit. For sealed enclosures, derate junction-to-ambient by 5-10 C or add thermal vias under the package center thermal pad.
Informations de conformité
RoHS compliant per Intel/Altera FBGA package marking. AEC-Q100 not qualified - this is a commercial-grade part. For automotive deployments, an AEC-Q100 qualified FPGA such as a Cyclone IV or Cyclone V automotive variant is required. Halogen-free status not explicitly stated in the datasheet.