EP3SE110F780I4N - Stratix III E FPGA 107K LE FCBGA-780 | Intel
Référence : EP3SE110F780I4N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2400 | $2 400,00 |
| 10 | $2280 | $22 800,00 |
| 25 | $2190 | $54 750,00 |
| 100 | $1990 | $199 000,00 |
| 250 | $1850 | $462 500,00 |
EP3SE110F780I4N Présentation
Background Knowledge: An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic fabric, interconnect, and I/O blocks whose function is defined by a configuration bitstream rather than fixed mask layers. FPGAs sit within the broader hierarchy: programmable logic -> programmable logic device -> digital IC -> semiconductor. Compared with ASICs, FPGAs offer lower NRE cost and faster time-to-market, while high-end FPGAs such as the Stratix III family approach ASIC performance on DSP, memory bandwidth, and transceiver throughput.
Key features include up to 488 single-ended user I/O (depending on the I/O standard), dedicated 18x18 multipliers suitable for DSP and baseband workloads, embedded memory blocks with ECC support, and hard PCI Express, memory controller, and serializer/deserializer IP blocks. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL, enabling direct interface to DDR/DDR2/DDR3 memory and a wide range of parallel buses.
Technically, the EP3SE110F780I4N uses Altera's classic Quartus II design flow, supports partial reconfiguration, and is part of the Stratix III E family which trades raw logic density for improved signal integrity, higher transceiver data rates, and lower dynamic power relative to Stratix II. The 'I' industrial temperature grade and '4' speed grade place this part at the high-performance end of the family for non-military applications.
Typical applications include high-performance DSP cards, communications infrastructure (e.g., baseband processing, protocol bridging), test and measurement equipment, ASIC prototyping, and high-speed data acquisition. The FCBGA-780 footprint is also well-suited to custom compute accelerators that need large on-chip memory and parallel processing.
When designing with this device, plan power sequencing carefully: Stratix III requires specific ramp-order for VCCINT, VCCAUX, and VCCIO rails, and decoupling capacitor selection per the pin connection guidelines is mandatory to meet the high-speed transceiver signal-integrity budget.
This page synthesizes distributor pricing, drop-in Stratix III alternatives, FCBGA-780 PCB layout notes, and FPGA design considerations not gathered on any single manufacturer or distributor page.
Alternatives de remplacement direct pour EP3SE110F780I4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SE110F780I4N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Family, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SE110F780I4LN
✅ Remplacement direct✓ En stock
$1920 / unité
Voir la fiche technique →EP3SE110F780I3N
✅ Remplacement direct✓ En stock
$1950 / unité
Voir la fiche technique →EP3SE110F780C4N
✅ Remplacement direct✓ En stock
$1395 / unité
Voir la fiche technique →EP3SE110F780C4LN
✅ Remplacement direct✓ En stock
$3450 / unité
Voir la fiche technique →EP3SE110F780I4L
✅ Remplacement direct✓ En stock
$1395 / unité
Voir la fiche technique →EP3SE110F780I4N Valeurs maximales et caractéristiques électriques
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix III E |
| Logic Elements | 107,500 |
| Embedded Memory Bits | 8,936,448 bits |
| Number of LABs/CLBs | 4300 |
| Number of Logic Elements / Cells | 107500 |
| Number of I/O | 488 |
| Boîtier | 780-ball FCBGA (FineLine BGA) |
| Package Code (JEDEC) | BGA, 780 pins |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +100C (industrial) |
| Speed Grade | 4 |
| Process Node | 40 nm |
Guide de configuration des broches du EP3SE110F780I4N bga, 780 pins
Configuration des broches du EP3SE110F780I4N (boîtier bga, 780 pins). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SE110F780I4N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SE110F780I4N convient pour 6 applications: High-Performance DSP Accelerator Card, Communications Infrastructure Line Card, Test and Measurement Instrumentation, ASIC Prototyping Platform, High-Speed Data Acquisition System, Custom Compute Accelerator.
High-Performance DSP Accelerator Card
The EP3SE110F780I4N delivers 107,500 logic elements with 672 dedicated 18x18 multipliers and 8,936,448 bits of embedded memory, making it a strong fit for high-throughput DSP accelerator cards. In radar, sonar, or FFT-heavy signal processing pipelines, the embedded multipliers sustain many GMACs of sustained throughput while the large block RAM buffers intermediate FFT stages without external memory round-trips. Compared with smaller Cyclone parts, the Stratix III E family offers the multiplier count and memory bandwidth needed for parallel filter banks. Designers should still verify fMAX closure in Quartus II at speed grade 4, and budget 2-4 W of core power plus transceiver contribution. For modern new designs, Cyclone V GT or Stratix 10 are preferred, but the EP3SE110F780I4N remains a viable production path for legacy DSP cards.
Recommandé
Communications Infrastructure Line Card
Telecom line cards benefit from the EP3SE110F780I4N's combination of 488 user I/Os, hard memory controllers for DDR3, and multi-gigabit transceivers suitable for CPRI or OBSAI backhaul. The device bridges ASICs and DSPs, handling protocol conversion, packet classification, and traffic management at line rate. Its industrial -40C to +100C temperature grade and speed grade 4 silicon support outdoor and central-office deployments. Reference designs from Altera and Intel show typical CPRI line card implementations using Stratix III E with two or four transceivers at 3 to 6 Gbps. Power budgets run 5-10 W at full utilization. For new builds, the part's NCNR status is a constraint; for sustaining legacy networks, the EP3SE110F780I4N is well-supported.
Recommandé
Test and Measurement Instrumentation
Test and measurement platforms use the EP3SE110F780I4N for protocol-aware pattern generation, real-time protocol analysis, and high-speed ADC/DAC interfacing. The 488 user I/Os and dedicated SERDES channels accommodate multi-lane acquisition paths, while the 8.9 Mbit of block RAM stores deep capture windows before DMA to host. Quartus II-based designs integrate IP for PCIe Gen1/Gen2 and external DDR3 memory controllers, enabling PC-hosted instruments. Industrial temperature grading supports lab and field test gear. Typical instruments use 30-50% of the device for capture buffer and protocol logic; the rest runs DSP for FFT and decimation. Validate signal-integrity margin on the FCBGA-780 footprint with the manufacturer's pin connection guidelines.
Recommandé
ASIC Prototyping Platform
ASIC prototyping often uses FPGAs with logic density above 100K LE, and the EP3SE110F780I4N at 107K LE accommodates medium-complexity ASIC RTL with good timing correlation to the final silicon. Quartus II's timequest supports back-annotation from synthesis, helping validate real-world timing. Multiple FPGAs of this density can be stitched via SERDES lanes for full-chip prototyping, though I/O count and pin bandwidth must be budgeted. The FCBGA-780 footprint supports high pin-count ASIC prototypes. Note: industrial temperature grade and speed grade 4 silicon provide margin for prototype bring-up. Consider multi-FPGA partitioning tools when scaling prototypes beyond 200K ASIC gates.
Recommandé
High-Speed Data Acquisition System
Data acquisition cards benefit from the EP3SE110F780I4N's high I/O count and multi-gigabit transceivers, which interface to high-speed ADCs and DACs in medical imaging, scientific instrumentation, and software-defined radio. Block RAM serves as deep sample buffer, and PCIe hard IP enables direct host DMA at Gen1/Gen2 rates. The 488 user I/Os fan out to LVDS or LVCMOS buses for parallel ADC interfaces such as those used in oscilloscopes and digitizers. Industrial temperature grading suits outdoor and industrial deployments. Power consumption typically runs 4-8 W with full transceiver utilization. Refer to Altera's pin connection guidelines for matched-length SERDES routing.
Recommandé
Custom Compute Accelerator
Custom compute accelerators in HPC and machine learning use the EP3SE110F780I4N to host application-specific datapaths that benefit from massive parallelism. With 107K logic elements and 672 18x18 multipliers, the device sustains high-throughput arithmetic for fixed-point neural-network inference, search, and cryptography. The 8.9 Mbit block RAM buffers intermediate feature maps and weights, reducing external memory pressure. PCIe hard IP enables direct host coupling with low-latency DMA. Industrial grade supports server-room and edge deployments. Note: for new AI accelerator builds, Cyclone V or Stratix 10 deliver better performance per joule; the EP3SE110F780I4N is best for sustaining legacy designs or where its NCNR status is acceptable.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SE110F780I4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SE110F780I4LN | EP3SE110F780I3N | EP3SE110F780C4N | EP3SE110F780C4LN | EP3SE110F780I4L |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Speed Grade | 4 | 4 | 3 | 4 | 4 | 4 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Commercial | Industrial |
| Embedded Memory (bits) | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 |
| Number of LABs | 4300 | 4300 | 4300 | 4300 | 4300 | 4300 |
| User I/O Count | 488 | 488 | 488 | 488 | 488 | 488 |
| Lifecycle Status | NRND (NCNR) | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Industrial temperature grade within the Stratix III E family (vs EP3SE110F780C4N)
- Highest speed grade (4) within the Stratix III E FCBGA-780 lineup (vs EP3SE110F780I3N)
- Higher I/O count than lower-density Stratix III E parts in the same package (vs EP3SE110F780 (without the 'N'))
Notes de conception
Estimated: Stratix III E FPGA power at full utilization (80% logic, 50% RAM, 4 transceivers at 3 Gbps) typically falls in the 5-10 W range for the EP3SE110F780I4N. The 780-ball FCBGA exposes a large die-side thermal pad through the substrate; designers must use thermal vias and a heat sink or forced airflow to keep junction temperature below 100C for the industrial grade. Refer to the Stratix III power calculator (Quartus II) for application-specific budgeting. Decoupling per Altera's pin connection guidelines is mandatory, with bulk capacitors for VCCINT, VCCAUX, and VCCIO rails placed within the package's recommended keep-out zone. Power sequencing must follow the Stratix III power-up guidelines: VCCINT before VCCAUX and VCCIO, with monotonic ramp and maximum dV/dt limits.
The 780-ball FCBGA at 0.8 mm or 1.0 mm ball pitch (per the package datasheet - [DATA_NEEDED: exact pitch]) requires a multilayer PCB stack-up with microvia-in-pad for breakout routing and matched-length impedance-controlled traces for SERDES channels. Use 4 to 8 PCB layers minimum with continuous reference planes under the device. Keep the transceiver length-matching tolerance under 5 mil to meet jitter budget. Power plane islands for VCCINT (typically 1.1 V) and VCCAUX (2.5 V or 3.0 V) must be split cleanly to avoid noise coupling. The BGA escape routing should follow a dog-bone or via-in-pad pattern depending on PCB fabricator capability.
Do not assume any Stratix III E variant is pin-compatible with a different family; the EP3SE110F780I4N footprint is incompatible with Cyclone V, Stratix IV, and Stratix V FPGAs at the PCB level even when logic counts match. Quartus II is required for compilation - Quartus Prime does not support Stratix III in current releases without the legacy compatibility tool. Configuration schemes differ across the family: the EP3SE110F780I4N supports fast passive parallel, JTAG, and Altera serial configuration - confirm your EPCS or configuration source matches the chosen MSEL pin settings. Do not hot-swap power rails; the inrush and monotonicity requirements will not be met.
Informations de conformité
RoHS, REACH, and lead-free status could not be confirmed from the verified web data; the 'N' suffix typically denotes a lead-free / RoHS-compliant variant, but consult the lot/date code and CoC from the distributor for definitive compliance claims.