EP3SL70F780C2G - Stratix III L FPGA 67.5K LE 780-FCBGA | Intel
Référence : EP3SL70F780C2G ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1675 | $16 750,00 |
| 100 | $1485 | $148 500,00 |
| 500 | $1320 | $660 000,00 |
| 1 000 | $1185 | $1 185 000,00 |
EP3SL70F780C2G Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as DSP blocks, block RAM (BRAM), PLLs, and high-speed serializer/deserializer (SerDes) transceivers. Within the broader taxonomy, an FPGA sits inside the programmable logic -> logic IC -> integrated circuit hierarchy, and is used to implement arbitrary digital hardware without the cost and lead time of an ASIC. Stratix III L parts were engineered for high-throughput signal processing and high-speed I/O while reducing power relative to the original Stratix III series.
Key features of the EP3SL70F780C2G include 67,500 logic elements, 2,699,264 embedded memory bits, 488 user I/O, dedicated DSP blocks, programmable power technology with hot-socketing capability, and support for external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II. The device operates from a 0.9 V core supply (VCC) with auxiliary supplies for I/O banks and transceivers, and supports commercial (0 C to 85 C) junction temperature grades under the C2 speed grade designation.
Architecturally, the part uses ALM-based logic elements (Adaptive Logic Modules), real-time fractional PLLs for clock management, and hard PCIe Gen1/Gen2 IP blocks. The C2 speed grade places it in the medium-performance bin relative to other Stratix III L devices, balancing timing margin against achievable Fmax. The 780-ball FCBGA package integrates the silicon, decoupling, and high-pin-count escape routing required for the 488 user I/Os plus transceiver and supply balls.
Typical applications include high-speed data acquisition, medical imaging front-ends, wireless baseband processing, software-defined radio, broadcast video processing, and ASIC prototyping where 67.5K logic elements are sufficient. Designers select this part when they need Stratix III's transceiver and DSP capability at lower static power than the standard Stratix III series.
When designing with this part, engineers should use Intel Quartus II design software (version 9.1 SP2 or later Stratix III service packs), follow the Stratix III PowerPlay early power estimator guidance, and observe PCB layout rules for FCBGA packages including via-in-pad and microvia stackups. The C2 speed grade affects timing closure; lower temperature grades (-40 C to 100 C, I-suffix) are recommended for industrial applications.
This page synthesizes distributor pricing, Stratix III L family drop-in alternatives with matching FCBGA-780 footprint, and practical PCB design notes not consolidated in any single manufacturer document.
Alternatives de remplacement direct pour EP3SL70F780C2G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SL70F780C2G (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Process Technology, Operating Temperature, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SL70F780C2
✅ Remplacement direct✓ En stock
$1245.75 / unité
Voir la fiche technique →EP3SL70F780I4N
✅ Remplacement direct✓ En stock
$875.4 / unité
Voir la fiche technique →EP3SL50F780C2G
✅ Remplacement direct✓ En stock
$264.9 / unité
Voir la fiche technique →EP3SL50F780C2
✅ Remplacement direct✓ En stock
$199.95 / unité
Voir la fiche technique →EP3SL70F484C2G
✅ Remplacement direct✓ En stock
$240 / unité
Voir la fiche technique →EP3SL70F780C2G Valeurs maximales et caractéristiques électriques
| Family | Stratix III L |
| Logic Elements | 67,500 |
| Embedded Memory | 2,699,264 bits |
| User I/O Count | 488 |
| Boîtier | 780-ball FCBGA (FineLine BGA) |
| Speed Grade | C2 (medium) |
| Temperature Grade | Commercial (0 C to 85 C) |
| Process Node | 40 nm low-power CMOS |
| Core Voltage (VCC) | 0.9 V |
| DSP Blocks | Yes (dedicated) |
| Memory Interfaces Supported | DDR3, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | Gen1/Gen2 |
| PLLs | Fractional PLLs |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Guide de configuration des broches du EP3SL70F780C2G 780-ball fcbga (fineline bga)
Configuration des broches du EP3SL70F780C2G (boîtier 780-ball fcbga (fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SL70F780C2G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SL70F780C2G convient pour 7 applications: High-Speed Data Acquisition Systems, Wireless Baseband Processing, Medical Imaging Front-Ends, Broadcast Video Processing, Software-Defined Radio (SDR), ASIC Prototyping, Industrial Control and Motor Drive.
High-Speed Data Acquisition Systems
The EP3SL70F780C2G's 67,500 logic elements, dedicated DSP blocks, and 488 user I/Os make it well-suited for high-channel-count data acquisition front-ends in test and measurement equipment. Its dedicated DDR3/QDR II+ controllers handle high-throughput ADC buffering, while the 40 nm low-power CMOS process reduces thermal load in dense multi-channel chassis. Designers typically pair it with high-speed ADCs and use the PCIe Gen2 hard IP for host transfer. Compared with smaller Cyclone family parts, the Stratix III L device supports deeper on-chip buffering and more parallel DSP pipelines without external co-processors.
Recommandé
Wireless Baseband Processing
The EP3SL70F780C2G's DSP blocks and high-speed transceiver support make it a fit for wireless baseband processing in LTE and WiMAX reference designs of its era. Its 67.5K logic elements accommodate multi-channel FFT/iFFT blocks, channel estimators, and MAC-layer state machines within a single device. The 780-ball FCBGA package provides the I/O density needed to interface with multiple RF front-ends, while the Stratix III L sub-family's reduced static power helps in chassis designs with constrained airflow.
Recommandé
Medical Imaging Front-Ends
Medical imaging systems such as ultrasound beamformers and CT reconstruction boards benefit from the EP3SL70F780C2G's parallel DSP capability and abundant block RAM. The 488 user I/Os accommodate multi-channel transducer arrays, while DDR2/DDR3 controllers buffer raw ADC data streams in real time. The C2 speed grade provides deterministic timing closure for beamforming algorithms, and the Stratix III L device's reduced power dissipation supports thermally constrained cart-mounted and portable systems.
Recommandé
Broadcast Video Processing
Broadcast video processing designs for SD/HD/UHD up/down/cross-conversion and frame-rate conversion leverage the EP3SL70F780C2G's parallel DSP and 488 user I/Os. The device supports multiple parallel video processing pipelines, while dedicated memory controllers feed DDR3 SDRAM buffers for frame storage. The C2 commercial speed grade and 0 C to 85 C junction range suit studio and headend equipment, and the FCBGA-780 package integrates cleanly into 12-layer video switcher boards.
Recommandé
Software-Defined Radio (SDR)
Software-defined radio platforms use the EP3SL70F780C2G to implement digital down/up-conversion (DDC/DUC), channelization, and protocol stack processing in a single device. The 67.5K logic elements plus DSP blocks fit mid-tier waveforms such as wideband tactical radios, while the transceiver support and PCIe Gen2 IP provide flexible host connectivity. Compared with DSP-only processor solutions, the FPGA implementation delivers lower latency and deterministic timing for real-time SDR workloads.
Recommandé
ASIC Prototyping
The EP3SL70F780C2G serves as a mid-density target for ASIC prototyping where 67.5K logic elements, dedicated DSP blocks, and 488 user I/Os fit designs mapping from gate-level ASIC netlists. Quartus II Design Assistant for ASIC prototyping supports gate-level mapping and clock-domain conversion. The 780-ball FCBGA package exposes sufficient I/O to emulate real-world ASIC pin behavior, and the C2 commercial speed grade offers adequate timing margin for verification at near-target clock rates.
Recommandé
Industrial Control and Motor Drive
Industrial motion controllers benefit from the EP3SL70F780C2G's combination of 67.5K logic elements, dedicated DSP blocks for current/voltage loop computation, and 488 user I/Os to interface with multi-axis servo drives. The DDR3 controllers support high-bandwidth feedback loops, while the 40 nm low-power CMOS process keeps chassis thermals manageable in 24/7 factory automation. The Stratix III L sub-family suits designs that must operate continuously without active heatsinking.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SL70F780C2G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SL70F780C2 | EP3SL70F780I4N | EP3SL50F780C2G | EP3SL50F780C2 | EP3SL70F484C2G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 484-ball FCBGA - different |
| Logic Elements | 67,500 | 67,500 | 67,500 | 50,000 | 50,000 | 67,500 |
| Speed Grade | C2 (commercial medium) | C2 (same) | I4 (industrial medium) | C2 (same) | C2 (same) | C2 (same) |
| Temperature Grade | Commercial 0 C to 85 C | Commercial 0 C to 85 C | Industrial -40 C to 100 C | Commercial 0 C to 85 C | Commercial 0 C to 85 C | Commercial 0 C to 85 C |
| User I/O Count | 488 | 488 | 488 | 488 | 488 | 296 |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 | 2,699,264 | 2,106,624 | 2,106,624 | 2,699,264 |
| RoHS / Pb-Free | Yes (G suffix) | No G suffix - verify | Yes | Yes (G suffix) | No G suffix - verify | Yes (G suffix) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Higher logic density than EP3SL50F780C2G at same FCBGA-780 footprint (vs EP3SL50F780C2G)
- Commercial C2 speed grade vs industrial I4 grade (vs EP3SL70F780I4N)
- Pb-free RoHS-compliant terminal finish (G suffix) (vs EP3SL70F780C2)
Notes de conception
The 780-ball FCBGA package uses a fine-pitch BGA (typically 1.0 mm pitch for Stratix III L). PCB layout requires microvia stack-up construction, via-in-pad plating for the BGA escape, and high-density interconnect (HDI) layers. Reference Intel's Stratix III Board Design Guidelines for via diameters, antipad dimensions, and breakout routing rules. Skipping microvia stack-up will force dog-bone fan-out routing that breaks escape routing under the BGA and risks signal-integrity failures on high-speed memory interfaces.
Estimated: At full utilization of 67.5K logic elements plus active DSP blocks at a typical 200 MHz operation, the device may dissipate 3 to 5 W of power. The FCBGA package relies on PCB copper pour and bottom-side thermal vias for heat removal, not an integrated heatsink. Designers should provide at least 4 thermal via arrays under the center thermal pad and follow Intel's PowerPlay Early Power Estimator guidance to validate junction temperature remains under 85 C with the commercial temperature grade.
Stratix III family has independent VCC (core, 0.9 V), VCCAUX (auxiliary), VCCPD (I/O pre-driver), and per-bank VCCIO supplies. Power sequencing requirements differ between Stratix III and Stratix III L and across hot-socketing-capable variants - consult the Stratix III handbook before modifying a reference design. Misordering VCC ramp-up can cause latch-up during power-up. The C2 speed grade may not match timing closure expectations when migrating an I4 design without re-running TimeQuest timing analysis.
For DDR3 interfaces, follow Intel's external memory interface pin-out guidelines to ensure DQS/DQ byte lane matching, and use the Stratix III memory controller IP with calibrated termination. Series resistors or on-chip termination (OCT) settings should match the topology selected in Quartus II. Skipping OCT calibration causes setup/hold failures that are intermittent and difficult to debug. PCIe Gen2 interfaces require 100 ohm differential routing with 5 mil trace width on top of the reference stack-up.
Informations de conformité
RoHS compliance inferred from G suffix per distributor listings; halogen-free status not stated in available data and set to unknown. AEC-Q100 not applicable for industrial/commercial FPGAs. Conflict minerals compliance per Intel corporate policy.