EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel
Référence : EP3SE260F1517C2N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5800 | $5 800,00 |
| 10 | $5500 | $55 000,00 |
| 100 | $5200 | $520 000,00 |
| 250 | $4950 | $1 237 500,00 |
| 500 | $4750 | $2 375 000,00 |
EP3SE260F1517C2N Présentation
An FPGA (Field-Programmable Gate Array) is a reprogrammable logic device that combines configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit between general-purpose processors and ASICs in the semiconductor hierarchy, offering parallel processing capability, hardware-timed determinism, and post-production reconfigurability. Within Intel's programmable-logic family, the Stratix III E series targets high-performance applications such as 40G/100G wireline transceivers, ASIC prototyping, and high-throughput digital signal processing, where logic density, memory bandwidth, and pin count dominate the design trade-offs.
Key specifications include 10200 Logic Array Blocks (LABs) in the Mouser and Arrow datasheet listings, up to 16.67 Mbits of embedded memory, embedded DSP blocks supporting variable-precision multiplication, and dedicated clock management via PLLs. The device integrates high-speed serial transceivers optimized for backplane and chip-to-chip links, and supports LVDS, LVTTL, LVCMOS, and SSTL I/O standards. A rich set of intellectual property cores is available through Intel's Quartus II design suite, simplifying the implementation of memory controllers, PCIe endpoints, and protocol stacks.
Typical applications include 40G/100G optical transport line cards, ASIC prototyping and emulation, high-performance digital signal processing for radar and beamforming, broadcast video processing pipelines, and military/aerospace signal processing. Designers select this part when logic density, memory capacity, and I/O count are the primary constraints and when migration to a later Intel FPGA family such as Stratix IV, V, or 10 is not yet justified by the application's power budget.
When designing with this part, plan for a multi-rail power architecture (1.1 V core, 2.5 V/3.3 V I/O, PLL analog supply) and verify DDR3 memory interface timing in the Quartus II TimeQuest analyzer before committing the PCB layout. Thermal management at full logic utilization is critical; a heatsink and forced-air cooling are typical for production deployments.
Alternatives de remplacement direct pour EP3SE260F1517C2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SE260F1517C2N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Family, Process Node, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SE260F1517C2G
✅ Remplacement direct✓ En stock
$2050 / unité
Voir la fiche technique →EP3SE260F1517C2
✅ Remplacement direct✓ En stock
$15800 / unité
Voir la fiche technique →EP3SE260F1517C2N Valeurs maximales et caractéristiques électriques
| Family | Stratix III E |
| Logic Elements | 255,000 |
| Logic Array Blocks (LABs) | 10,200 |
| Total Memory Bits | 16,672,768 |
| Maximum User I/Os | 976 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Maximum Core Frequency | 600 MHz |
| Boîtier | 1517-ball FC-BGA |
| Type de montage | Surface Mount |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Configuration Interface | Passive Serial, Fast Passive Parallel, JTAG, Active Serial |
| Lead Free | Yes |
| Statut RoHS | Compliant |
| Speed Grade | C2 |
Guide de configuration des broches du EP3SE260F1517C2N 1517-ball fc-bga
Configuration des broches du EP3SE260F1517C2N (boîtier 1517-ball fc-bga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SE260F1517C2N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SE260F1517C2N convient pour 6 applications: 40G/100G Optical Transport Line Card, ASIC Prototyping and Emulation, Radar and Beamforming DSP, Broadcast Video Processing, Industrial Automation and Machine Vision, Military and Aerospace Signal Processing.
40G/100G Optical Transport Line Card
The EP3SE260F1517C2N is well matched to 40G and 100G optical transport line cards because its integrated multi-gigabit transceivers support backplane and chip-to-chip serial links, and its 16.67 Mbit embedded memory provides buffering for MAC-layer, OTN framer, and traffic-manager functions. The 255,000 logic elements accommodate packet-processing pipelines, FEC encoders, and OTU/ODU mapping in a single device. Designers use the device alongside external SFP+/QSFP+ optical modules; the 976 user I/Os permit a wide external data-path without bridge chips. Reference designs in Quartus II simplify OTU4/100G Ethernet MAC implementation.
Recommandé
ASIC Prototyping and Emulation
The 255,000 logic elements and 10,200 LABs of the EP3SE260F1517C2N allow partitioning of mid-size ASIC RTL into multiple Stratix III E devices for in-system emulation. The 16.67 Mbit embedded memory maps into on-chip SRAM models and transaction recorders, while 976 user I/Os support multi-FPGA interconnect topologies. The C2 speed grade maintains the timing margin required for clock-by-clock ASIC-equivalent verification. Quartus II's TimeQuest analyzer provides gate-level timing reports compatible with the ASIC sign-off flow.
Recommandé
Radar and Beamforming DSP
The EP3SE260F1517C2N's dedicated variable-precision DSP blocks and 16.67 Mbit embedded memory enable real-time FFT, pulse compression, and digital beamforming for phased-array radar systems. At 600 MHz core operation, each DSP block performs 18x18 or 27x27 multiplications per cycle, supporting 40+ Gops aggregate throughput when pipelined. The 976 user I/Os connect to multiple ADC/DAC channels and LVDS sample streams from the antenna array. Designers exploit the deterministic hardware timing to meet the latency budget of adaptive beamforming algorithms.
Recommandé
Broadcast Video Processing
The EP3SE260F1517C2N handles uncompressed 3G-SDI and 4K/UHD video processing pipelines, including deinterlacing, scaling, frame-rate conversion, and overlay composition. Its 255,000 logic elements implement multi-channel video processing in a single device, while the 16.67 Mbit embedded memory serves as line and frame buffers. The C2 speed grade meets the 148.5 MHz pixel clock requirement of 1080p60, and 976 user I/Os interface to HDMI, SDI, and DisplayPort bridge chips. Quartus II video IP cores reduce time-to-market for broadcast OEMs.
Recommandé
Industrial Automation and Machine Vision
The EP3SE260F1517C2N is suitable for high-throughput machine-vision systems that aggregate multiple Camera Link or CoaXPress camera streams and run real-time image processing. The 16.67 Mbit embedded memory holds line and tile buffers, and the dedicated DSP blocks accelerate convolution, edge detection, and pattern-matching kernels. The 976 user I/Os support parallel LVDS and HSMC breakout configurations, simplifying multi-camera topologies. Deterministic latency and the C2 speed grade are critical for closed-loop motion-control applications where vision drives actuator feedback.
Recommandé
Military and Aerospace Signal Processing
The EP3SE260F1517C2N supports cryptographic, secure-radio, and electronic-warfare subsystems where the 255,000 logic elements implement waveform synthesis, channelization, and encryption pipelines. The 16.67 Mbit embedded memory provides packet and symbol buffering, while integrated transceivers drive secure datalinks. Designers select the commercial grade for ground-station equipment and the industrial-grade -I variants for airborne platforms. Quartus II supports the IP security and tamper-detection features required for defense applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SE260F1517C2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SE260F1517C2G | EP3SE260F1517C2 | EP3SE260F1152C2N | EP3SE110F1152C2N |
|---|---|---|---|---|---|
| Package | 1517-ball FC-BGA | 1517-ball FC-BGA - same | 1517-ball FC-BGA - same | 1152-ball FC-BGA | 1152-ball FC-BGA |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 110,000 |
| Memory Bits | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 9,732,096 |
| Maximum User I/Os | 976 | 976 | 976 | 744 | 744 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Speed Grade | C2 | C2 | C2 | C2 | C2 |
| RoHS Status | Compliant (Pb-free) | Compliant (Pb-free) | Non-RoHS (SnPb) | Compliant (Pb-free) | Compliant (Pb-free) |
Principaux différenciateurs
- Same 1517-ball FC-BGA footprint with finish-code-only difference (vs EP3SE260F1517C2G)
- Highest I/O count in the Stratix III E family (vs EP3SE260F1152C2N)
- Maximum logic density for the Stratix III E speed grade (vs EP3SE110F1152C2N)
Notes de conception
The EP3SE260F1517C2N requires a multi-rail power architecture: 1.1 V core, 2.5 V or 3.3 V I/O banks, and a dedicated 2.5 V PLL analog supply. Use a sequencer such as the LTC2923 to enforce power-up order, since driving I/O before the core rail can trigger latch-up. Decoupling follows the Stratix III PowerPlay recommendations: bulk caps on each rail, ceramic 0.1 uF/1 uF/10 uF mix per bank, and a 1 mF reservoir cap per Quartus II PowerPlay Early Power Estimator result.
Estimated: at full logic utilization with typical toggle rates the EP3SE260F1517C2N dissipates approximately 15 to 20 W. The 1517-ball FC-BGA has a theta_JA around 0.5 C/W with the recommended heatsink and 200 LFM airflow. Without a heatsink the device exceeds commercial junction temperature (100C) at moderate utilization. A copper-spreader lid, thermal interface material, and forced-air cooling are mandatory for production deployments.
The 1517-ball FC-BGA requires a high-density PCB stack-up: microvia build-up (e.g. 4-2-4 or 6-2-6) with 1.0 mm ball pitch escape. Differential pairs for transceivers and external memory must be length-matched to within 25 mils to meet DDR3 and OTU4 timing. Use the Quartus II Pin Planner to assign pins per bank and the IBIS model for signal-integrity simulation before committing the layout. Match the reference-stackup in the Stratix III device handbook to the PCB fabricator's process capability.
Do not select the C2 speed grade if a higher-grade part is available - the C2 grade is the slowest commercial tier and limits timing margin. Confirm that the Quartus II version supports the device (version 13.1 with legacy device support is the last release). For Last Time Buy production, secure a multi-year inventory buffer and identify a drop-in alternative such as the EP3SE260F1517C2G before issuing the BOM.
Informations de conformité
RoHS compliance indicated by the 'N' suffix in the part number. AEC-Q100 not applicable for FPGAs. REACH, halogen-free, and conflict-minerals statements should be requested from Intel or the franchised distributor for the specific date code.
