EP3SL150F1152I3N - Stratix III L FPGA 142.5K LE | Intel | 1152-FCBGA
Référence : EP3SL150F1152I3N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1725 | $17 250,00 |
| 100 | $1595 | $159 500,00 |
| 250 | $1495 | $373 750,00 |
| 500 | $1395 | $697 500,00 |
EP3SL150F1152I3N Présentation
What is a Stratix III FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor that lets designers implement arbitrary digital logic, memory, and DSP functions through a programmable interconnect fabric. The Stratix III generation (introduced 2007) belongs to Intel/Altera’s high-end FPGA portfolio and sits in the hierarchy: FPGA > programmable logic device > programmable logic IC > integrated circuit > semiconductor. The "III L" sub-family targets power-sensitive applications that previously required an ASIC, combining high logic density with the power-saving features of an advanced 65-nm low-power process.
Key features of the EP3SL150F1152I3N include 5700 adaptive logic modules (ALMs), 384 18x18 multipliers, 8 PLLs, and up to 12 transceiver channels (depending on speed grade). The device supports configuration via passive serial, fast passive parallel, or JTAG, and offers on-chip termination (OCT) and signal integrity features. Its 1152-ball FCBGA package is approximately 35 mm x 35 mm with a 1.0 mm ball pitch, enabling high I/O density for memory-rich and parallel-interface designs.
The architectural strength of this device is its programmable power technology, which allows unused logic, memory, and DSP blocks to enter a low-power state under software control. This makes the EP3SL150F1152I3N particularly suitable for wireline telecom, broadcast video, and military/aerospace applications where total system power and thermal envelope are primary constraints.
Typical applications include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, ASIC prototyping, and digital signal processing front-ends. The combination of large embedded memory and high multiplier count makes it well-suited for FFT pipelines, channelizers, and image preprocessing.
When designing with this device, careful attention must be paid to PCB layout for the FCBGA package, including microvia stack-up, controlled-impedance routing for high-speed transceivers, and decoupling network placement. Quartus II (or newer Intel Quartus Prime) is required for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives from the same Intel/Altera Stratix III family, and practical design notes not found on any single distributor page.
Alternatives de remplacement direct pour EP3SL150F1152I3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SL150F1152I3N (même facteur de forme et même empreinte) — différant par Speed Grade, Family, Logic Elements, RoHS Status, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SL150F1152C4N
✅ Remplacement direct✓ En stock
$2150 / unité
Voir la fiche technique →EP3SL150F1152I4N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3SL150F1152C2N
✅ Remplacement direct✓ En stock
$1280 / unité
Voir la fiche technique →EP3SL110F1152I3N
✅ Remplacement direct✓ En stock
$335 / unité
Voir la fiche technique →EP3SL150F1152I3N Valeurs maximales et caractéristiques électriques
| Series | Stratix III L |
| Family | Stratix III (Low-Power variant) |
| Logic Elements | 142,500 |
| Adaptive Logic Modules (ALMs) | 5,700 |
| Embedded Memory (bits) | 6,543,360 |
| Number of I/O Pins | 744 |
| Number of LABs/CLBs | 5,700 |
| Voltage - Supply | 0.85 V to 1.1 V core (per datasheet) |
| Température de fonctionnement | -40C to +100C (industrial) |
| Speed Grade | 3 (mid) |
| Type de montage | Surface Mount |
| Boîtier / Format | 1152-BBGA, FCBGA |
| Number of Transceivers | 12 (high-speed serial, speed-grade dependent) |
| Number of PLLs | 8 |
| Total Multipliers (18x18) | 384 |
| Process Technology | 65 nm |
| Statut RoHS | Compliant (per Altera/Intel product page) |
Guide de configuration des broches du EP3SL150F1152I3N 1152-bbga, fcbga
Configuration des broches du EP3SL150F1152I3N (boîtier 1152-bbga, fcbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SL150F1152I3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SL150F1152I3N convient pour 6 applications: ASIC Prototyping and Emulation, Software-Defined Radio (SDR) Baseband, High-Speed Data Acquisition Systems, Broadcast Video Processing, Military and Aerospace Signal Processing, Medical Imaging Front-Ends.
ASIC Prototyping and Emulation
The EP3SL150F1152I3N's 142,500 logic elements and 6.54 Mbits of embedded memory make it well-suited as a multi-FPGA ASIC prototyping platform. Designers map RTL from the target ASIC into multiple Stratix III devices using time-domain multiplexing or direct pin mapping; the 744 user I/O pins support high-fanout connections between FPGAs on the prototyping board. Programmable power technology reduces total platform power versus standard Stratix III at equivalent logic utilization, allowing denser boards with simpler cooling. Compared with newer emulation ASICs, the device's mature Quartus II tool flow and proven timing closure methodology accelerate bring-up of large SoC designs.
Recommandé
Software-Defined Radio (SDR) Baseband
The 384 18x18 multipliers and high logic density of the EP3SL150F1152I3N support multi-channel SDR baseband processing, including FFT/iFFT pipelines, channelizers, and digital down-conversion. The 6.54 Mbits of TriMatrix memory provides ample buffering between FIR/FFT stages without external SRAM, reducing BOM and board complexity. The 1152-FCBGA package routes 744 user I/O pins to ADC/DAC interfaces, antenna switches, and high-speed digital data paths. Its low-power Stratix III L architecture suits portable or size-constrained SDR platforms where total system power and thermal envelope are critical design constraints.
Recommandé
High-Speed Data Acquisition Systems
The EP3SL150F1152I3N's combination of 12 high-speed transceivers, large embedded memory, and 744 user I/O pins makes it a strong fit for multi-channel high-speed DAQ systems. Designers can implement custom FIR filters, pulse compression, and event detection directly in the FPGA fabric, offloading processing from downstream DSPs or processors. The 6.54 Mbit on-chip memory accommodates deep sample buffers for radar, lidar, or scientific instrumentation applications. Industrial temperature grade (-40C to +100C) of the I3 variant enables deployment in factory-floor or outdoor instrumentation without additional thermal conditioning.
Recommandé
Broadcast Video Processing
Broadcast video infrastructures (SD/HD/3G-SDI routing, conversion, and processing) leverage the EP3SL150F1152I3N's high logic density and embedded memory to implement multi-channel video processing pipelines. The 1152-FCBGA package provides ample user I/O for multiple SDI inputs and outputs, while the 6.54 Mbit memory supports line and frame buffers for format conversion and frame-rate translation. The Stratix III L low-power process reduces heat dissipation in dense rack-mounted broadcast equipment. Industrial temperature variants support reliable operation in uncontrolled environment broadcast head-ends.
Recommandé
Military and Aerospace Signal Processing
The industrial temperature range, high logic density, and proven reliability of the EP3SL150F1152I3N make it suitable for defense signal-processing applications including electronic countermeasures, radar processing, and secure communications. The 65-nm low-power process reduces thermal load in sealed enclosures with limited airflow, while the mature Quartus II tool flow with DO-254 certifiable IP supports safety-critical design verification. Designers should note that this part is Last Time Buy; long-term defense programs should plan migration to Stratix V, Stratix 10, or Microsemi/RTAX equivalents that offer continued production support and MIL-PRF-38535 qualification.
Recommandé
Medical Imaging Front-Ends
Ultrasound, CT, and MRI front-end systems use the EP3SL150F1152I3N to perform beamforming, image reconstruction, and real-time signal processing. The 384 18x18 multipliers enable parallel beamforming across 64 to 128 channels, while the 6.54 Mbit embedded memory accommodates raw RF sample buffers. Low-power Stratix III L operation reduces thermal load in patient-adjacent equipment where heat dissipation affects imaging sensor noise. The 1152-FCBGA package routes enough I/O for multi-channel ADC interfaces plus image data outputs to downstream display or storage subsystems.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SL150F1152I3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SL150F1152C4N | EP3SL150F1152I4N | EP3SL150F1152C2N | EP3SL110F1152I3N |
|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 142,500 | 142,500 | 142,500 | 142,500 | 110,000 (-23%) |
| Embedded Memory | 6,543,360 bits | 6,543,360 bits | 6,543,360 bits | 6,543,360 bits | 5,594,880 bits (-14%) |
| User I/O | 744 | 744 | 744 | 744 | 744 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | 3 (mid) | 4 (slower) | 4 (slower) | 2 (fastest) | 3 (mid) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principaux différenciateurs
- Low-power 65-nm process with programmable power gating (vs Standard Stratix III (non-L) devices)
- Identical package as the 110K LE variant enables flexible density scaling (vs EP3SL110F1152I3N)
- Industrial temperature grade in same package as commercial variants (vs EP3SL150F1152C4N (commercial temp))
Notes de conception
Estimated: Stratix III L devices can dissipate 5-15 W typical and up to 25 W worst-case at high utilization. The 1152-FCBGA package has a typical theta_JA of approximately 8-10 C/W with a properly designed thermal via array under the die. Design the PCB with a 4x4 or denser microvia-in-pad array connecting the central BGA balls to internal copper planes; without this, junction temperature can exceed 100C in still air. Estimate: at 10 W dissipation, junction temperature rise above ambient is approximately 80-100C — verify with the Stratix III power calculator and characterize in-system with thermal sensors.
The 1152-ball FCBGA at 1.0 mm pitch requires a high-density PCB stack-up, typically 8 to 12 layers with laser-drilled microvias and sequential lamination. Route high-speed transceiver channels with 100-ohm differential impedance and length matching within 5 mils; reference each transceiver pair to a solid ground plane and avoid crossing splits. Decoupling network must include bulk, mid-frequency, and high-frequency capacitors placed as close as practical to the relevant power pins. Use the Altera/Altera-provided board design guidelines in the Stratix III handbook for via-in-pad recommendations.
Stratix III transceivers support data rates up to 6.375 Gbps depending on speed grade; AC-coupling capacitors must be placed within 100 mils of the receiver pins. Use on-chip termination (OCT) for single-ended I/O to eliminate external resistors and improve signal integrity. For DDR2/DDR3 memory interfaces, follow the Stratix III external memory interface handbook for DQ/DQS group length matching within 20 ps skew. IBIS models are available from Intel for SI simulation; back-annotate board parasitics from the final PCB into Quartus timing analysis for accurate slack prediction.
Do not assume Last Time Buy parts are unavailable — they are still in production through the LTB notification window, and authorized distributors carry inventory. However, avoid specifying the EP3SL150F1152I3N for new designs; plan migration to Stratix IV/V or Cyclone V/10 to avoid future supply disruption. Configuration pins MSEL[0..3] must be tied to the correct logic levels per the configuration scheme selected (AS, PS, FPP, JTAG); incorrect MSEL settings will prevent the device from configuring. Finally, the device requires multiple voltage rails (VCC, VCCPD, VCCPT, VCCA_PLL, VCCAUX, VCCIO); verify all rails reach nominal voltage before releasing the configuration DONE pin.
Informations de conformité
RoHS and lead-free per Altera/Intel product page. AEC-Q100 not applicable for FPGAs. Halogen-free status not explicitly stated in verified data; confirm with manufacturer if required.