EP3SL200F1517I3N - Stratix III L FPGA 200K LE, 1517-FCBGA | Intel
Référence : EP3SL200F1517I3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2100 | $2 100,00 |
| 10 | $1995 | $19 950,00 |
| 100 | $1850 | $185 000,00 |
| 500 | $1725 | $862 500,00 |
| 1 000 | $1620 | $1 620 000,00 |
EP3SL200F1517I3N Présentation
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and embedded memory and DSP resources that can be customized after manufacturing to implement arbitrary digital logic, DSP pipelines, or interface protocols. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs -> high-performance FPGAs, offering the highest logic density and the highest I/O count among programmable devices, second only to ASICs in raw performance-per-watt.
Key features include 8,000 LABs (Logic Array Blocks) supporting distributed and embedded RAM, 384 18x18 multipliers (~1.4 TMACS DSP throughput), dedicated PLL and global clock networks, and on-chip configuration memory. The Stratix III L variant targets lower static power than the standard Stratix III family while preserving the same fabric density, making it well-suited to high-utilization designs where thermal envelopes are constrained.
Architecture-wise, the Stratix III family introduces programmable power technology with logic-array-base regions that can be set to high-speed or low-power mode, an 8-input adaptive logic module (ALM), and column- and row-based memory and DSP blocks that minimize routing congestion. The 1517-pin FCBGA exposes 976 user I/O pins across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL signaling, plus configurable PCIe, DDR2/DDR3 memory controllers hardened in the silicon.
Typical applications include high-throughput digital signal processing for wireless baseband, ASIC prototyping, high-speed data acquisition, radar and image processing, industrial motor control, and high-end test and measurement instrumentation. The combination of large logic capacity, dedicated DSP, and abundant high-speed I/O makes it well suited to designs that previously required an ASIC or a multi-FPGA partition.
When designing with this part, carefully manage the multi-rail power sequencing (1.1 V core, VCCPD, VCCIO), follow Intel's PCB layout guidelines for FCBGA escape and BGA via-in-pad stackup, and budget for the device's high transient current demands during configuration. Thermal design must account for both static and dynamic power; use the Quartus II PowerPlay early power estimator before physical implementation to validate the thermal envelope.
Alternatives de remplacement direct pour EP3SL200F1517I3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SL200F1517I3N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Family, Logic Elements, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SL200F1517C4N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3SL200F1517C3N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3SL200F1517C2N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3SL200F1517I3
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3SL200F1517C4LN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3SL200F1517I3N Valeurs maximales et caractéristiques électriques
| Family | Stratix III L |
| Logic Elements | 200,000 |
| Number of LABs | 8000 |
| Total Memory Bits | 10,901,504 |
| User I/Os | 976 |
| Number of Logic Cells | 200000 |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Maximum Internal Frequency | 500 MHz |
| Boîtier | 1517-BBGA, FCBGA (FC-FBGA) |
| Type de montage | Surface Mount (BGA) |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Supplier Device Package | 1517-FBGA |
| Statut RoHS | Compliant |
| Configuration Memory | SRAM-based |
| Number of 18x18 Multipliers | 384 |
Guide de configuration des broches du EP3SL200F1517I3N 1517-fbga
Configuration des broches du EP3SL200F1517I3N (boîtier 1517-fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SL200F1517I3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SL200F1517I3N convient pour 7 applications: ASIC Prototyping, Wireless Baseband Signal Processing, High-Speed Data Acquisition, Radar and Image Processing, Industrial Motor Control and Drive, Test and Measurement Instrumentation, High-Performance Computing / Compute Acceleration.
ASIC Prototyping
The EP3SL200F1517I3N's 200,000 logic elements and 10.9 Mbit of embedded memory make it well suited to ASIC prototyping of large multi-million-gate designs that previously required multi-FPGA partitions. The 8000 LABs and 384 18x18 multipliers provide ample DSP and logic capacity for validating SoC subsystems, and the 976 user I/Os enable full visibility of internal nets on logic-analyzer headers. According to the Intel Stratix III handbook, designers typically target 60-70% utilization at this density to preserve timing closure margin during RTL iteration cycles.
Recommandé
Wireless Baseband Signal Processing
The 384 dedicated 18x18 multipliers, high-speed DSP blocks, and 500 MHz fabric of the EP3SL200F1517I3N make it a strong fit for wireless baseband processing including channel estimation, FFT/iFFT engines, and MIMO detection pipelines. The 10.9 Mbit of embedded memory plus MLAB distributed RAM enable double-buffered sample streams at LTE and early-5G sampling rates. According to the Intel Stratix III device handbook, the DSP blocks support multiply-accumulate chains with rounding and saturation, simplifying fixed-point baseband implementation.
Recommandé
High-Speed Data Acquisition
With 976 user I/Os supporting LVDS and DDR3 interfaces, the EP3SL200F1517I3N can aggregate multiple high-speed ADC and DAC data streams into a single processing domain for radar, sonar, and scientific data acquisition systems. The LVDS channels can be paired as 488 LVDS pairs at up to 1 Gbps, enabling multi-channel ADCs to be sampled into a single FPGA. The abundant LAB and memory resources allow multi-stage FIR filtering and decimation to be performed before transferring data to a host processor.
Recommandé
Radar and Image Processing
The combination of 384 multipliers, high-density embedded memory, and 976 user I/Os makes the EP3SL200F1517I3N a strong choice for synthetic aperture radar (SAR) back-end processing, real-time image enhancement, and video analytics. The embedded memory supports line buffers for 2D convolution and FFT/iFFT engines for range-Doppler maps, while the 500 MHz fabric closes timing on high-throughput pixel pipelines. Industrial temperature range (-40C to +100C) permits deployment in outdoor and avionics-grade enclosures.
Recommandé
Industrial Motor Control and Drive
The EP3SL200F1517I3N's industrial temperature grade and high I/O count are well matched to multi-axis servo drive and industrial motor control platforms requiring encoder interfaces, PWM generators, and current-sense processing in a single device. The DSP blocks accelerate field-oriented control (FOC) and space-vector PWM loops, while the 976 user I/Os can simultaneously drive multiple resolver excitation channels, gate-driver signals, and isolation barriers. Industrial-grade -40C to +100C operation supports deployment in factory-floor cabinets.
Recommandé
Test and Measurement Instrumentation
The high logic density of the EP3SL200F1517I3N allows it to host multiple instrument subsystems - arbitrary waveform generators, protocol analyzers, and digitizer firmware - within a single FPGA fabric, simplifying test and measurement platform architecture. The 384 multipliers support real-time DSP for FIR/IIR filtering and spectral analysis, and the 10.9 Mbit of memory allows deep sample buffers without external SRAM. Industrial temperature grade plus the 1517-FCBGA footprint allow dense instrument front-end designs with thousands of signal pins.
Recommandé
High-Performance Computing / Compute Acceleration
The 200K logic elements and 384 multipliers of the EP3SL200F1517I3N enable OpenCL-style and HDL compute kernels to be accelerated in a reconfigurable fabric for scientific and engineering workloads. The 976 user I/Os allow multiple DDR2/DDR3 memory channels to be attached directly to the FPGA, providing high-bandwidth memory access for compute kernels. Industrial temperature operation and large embedded memory support stream-processing architectures where data must be buffered before kernel execution.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SL200F1517I3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SL200F1517C4N | EP3SL200F1517C3N | EP3SL200F1517C2N | EP3SL200F1517I3 | EP3SL200F1517C4LN |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1517-FCBGA (FC-FBGA) | 1517-FCBGA (FC-FBGA) - same | 1517-FCBGA (FC-FBGA) - same | 1517-FCBGA (FC-FBGA) - same | 1517-FCBGA (FC-FBGA) - same | 1517-FCBGA (FC-FBGA) - same |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| LABs | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Embedded Memory Bits | 10,901,504 | 10,901,504 | 10,901,504 | 10,901,504 | 10,901,504 | 10,901,504 |
| User I/Os | 976 | 976 | 976 | 976 | 976 | 976 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Speed Grade | 3 | 4 (slower) | 3 (same) | 2 (faster) | 3 (same) | 4 (slower) |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Lowest-power Stratix III variant in the 200K-LE density (vs EP3SL200F1517C4N (commercial variant))
- Industrial temperature support in the 1517-FCBGA class (vs EP3SL200F1517C4N (commercial temp 0-85C))
- Highest DSP block density among Stratix III L variants (vs EP3SL150F1152I3N (lower-density 150K-LE))
Notes de conception
Estimated: Stratix III devices with 200K LE and full I/O utilization can demand 3-5A peak on the 1.1 V VCCINT rail during configuration, plus 0.5-1A on VCCPD. Use a 4-layer PCB with at least 1 oz copper and multiple decoupling capacitors (0.1 uF X7R plus 10 uF bulk) within 5 mm of each power pin. Follow Intel's Stratix III Hardware Reference Manual sequence: VCCINT ramps first, then VCCPD, then VCCIO; failure to maintain sequencing risks permanent damage or current latch-up.
Estimated: at 80% utilization with default speed settings, the EP3SL200F1517I3N dissipates approximately 8-12 W of dynamic power plus 0.5-1.5 W static power. The 1517-FCBGA's theta_JA is approximately 10 C/W with standard 4-layer JEDEC test board; with that figure the junction-to-ambient rise is 85-135 C, so airflow or a heatsink is required. Use the Quartus II PowerPlay early power estimator before physical implementation to validate the thermal envelope.
The 1517-FCBGA package has 1.0 mm ball pitch and requires via-in-pad or microvia stack-up for BGA escape. Recommended stackup: 8-12 layer PCB with HDI (laser-drilled microvias) per Intel's Stratix III Board Design Guidelines. Trace impedance must be 50 ohm single-ended / 100 ohm differential for LVDS; length-match within 50 mils intra-pair and 100 mils inter-pair. All decoupling capacitors should be 0402 or smaller to maximize placement density under the BGA footprint.
Common pitfalls: (1) Driving MSEL pins to the wrong state selects the wrong configuration mode - verify with the Intel Configuration Handbook table; (2) Using POR circuit reset before VCCINT stabilizes causes re-configuration loops; (3) JTAG chain length with multiple devices can exceed TCK frequency limits - use a buffered JTAG topology for chains longer than 4 devices; (4) Confusing the C4LN variant with the C4N variant - LN suffix denotes lead-free and may affect solder profile.
Informations de conformité
RoHS and lead-free compliance indicated by the 'N' suffix in the ordering code per Intel's Stratix III ordering information. AEC-Q100 not applicable (industrial-grade FPGA, not automotive-qualified). Halogen-free status not stated in the verified data.
