EP3SL200F1517I3N vs EP3SL200F1517I4LN Comparaison
Comparaison détaillée côte à côte de EP3SL200F1517I3N par Intel et EP3SL200F1517I4LN par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SL200F1517I3N | EP3SL200F1517I4LN |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 620,00 | $6 300,00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| Number of LABs | 8000 | — |
| Total Memory Bits | 10,901,504 | — |
| User I/Os | 976 | — |
| Number of Logic Cells | 200000 | — |
| Process Technology | 65 nm | 65 nm TSMC low-power |
| Core Voltage | 1.1 V | — |
| Maximum Internal Frequency | 500 MHz | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | — |
| Boîtier | 1517-BBGA, FCBGA (FC-FBGA) | 1517-BBGA, FCBGA |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Température de fonctionnement | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Supplier Device Package | 1517-FBGA | — |
| Statut RoHS | Compliant | Compliant |
| Configuration Memory | SRAM-based | — |
| Number of 18x18 Multipliers | 384 | — |
| Embedded Memory Bits | — | 10,901,504 |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/O Pins | — | 976 |
| Lead-Free | — | Yes |
| Niveau MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: max transceiver rate] |
| DSP Blocks (18x18 multipliers) | — | 384 |
| DSP Performance | — | 288 GMACS |
| Configuration Method | — | Passive Parallel / Active Serial / JTAG |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 40 mm x 40 mm |