EP3SL340F1760I4 - 337500 Cells, 1120 I/O Stratix III L FPGA | Intel
Référence : EP3SL340F1760I4 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $16715.7355 | $16 715,74 |
| 10 | $15640 | $156 400,00 |
| 100 | $14550 | $1 455 000,00 |
| 500 | $13420 | $6 710 000,00 |
| 1 000 | $12750 | $12 750 000,00 |
EP3SL340F1760I4 Présentation
An FPGA (Field Programmable Gate Array) is a type of integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the hierarchy of digital semiconductors. Stratix III devices use a logic-rich architecture combined with dedicated DSP blocks, embedded memory, and high-speed transceivers, making them a top-tier member of the programmable logic family tree: PLD -> CPLD/FPGA -> SRAM-based FPGA -> Stratix III L family.
Key features include up to 13,500 Logic Array Blocks (LABs), 1120 general-purpose I/Os, integrated PLL and IOE resources, support for DDR/DDR2/DDR3/QDRII/QDRII+/RLDRAM II external memory interfaces, and a rich DSP block population suitable for high-throughput FIR filters and FFT engines. The 'I' speed grade and '4' core voltage/temperature tier designate an industrial-temperature operation with an enhanced core voltage.
The Stratix III L architecture pairs a programmable logic fabric with hard memory blocks (M144K/M9K), dedicated 18x18 multipliers, and an extensive global clock network. The 1760-ball FC-FBGA package supports high-speed differential I/O and serial transceivers operating up to several Gbps, which is essential for wireline and wireless baseband designs. The device is configured via SRAM cells, allowing in-field reconfiguration.
Typical applications include wireless baseband and RF card signal processing, high-end image processing pipelines, ASIC prototyping and emulation, high-speed network switches and routers, and military/aerospace DSP subsystems. The 1,120 user I/Os and ~18.8 Mbit embedded memory make it especially well-suited to designs that have outgrown mid-density FPGAs but do not yet need the largest Stratix V/10 parts.
Designers should plan PCB layout with extensive decoupling (typically 0402/0201 ceramics distributed across the BGA footprint), a minimum of 6 to 8 PCB layers for power/signal integrity, and thermal vias under the exposed die region of the FC-FBGA. Always use Intel's Quartus II design software (Stratix III device support) to verify pin assignments and timing closure before tape-out.
This page consolidates distributor pricing, parametric drop-in alternatives, and practical design guidance not available from a single datasheet - complementing the official Intel Stratix III device handbook.
Alternatives de remplacement direct pour EP3SL340F1760I4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SL340F1760I4 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Embedded Memory Bits, Process Technology, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SL340F1760I3N
✅ Remplacement direct✓ En stock
$3150 / unité
Voir la fiche technique →EP3SL340F1760I3
✅ Remplacement direct✓ En stock
$1450 / unité
Voir la fiche technique →EP3SL340F1760C4N
✅ Remplacement direct✓ En stock
$1820 / unité
Voir la fiche technique →EP3SL340F1760C4LN
✅ Remplacement direct✓ En stock
$15200 / unité
Voir la fiche technique →EP3SL340F1760C4L
✅ Remplacement direct✓ En stock
$3100 / unité
Voir la fiche technique →EP3SL340F1760C3N
✅ Remplacement direct✓ En stock
$2950 / unité
Voir la fiche technique →EP3SL340F1760I4 Valeurs maximales et caractéristiques électriques
| Series | Stratix III L |
| Logic Elements / Cells | 337,500 |
| Total RAM Bits | 18,821,144 bits |
| Number of LABs/CLBs | 13,500 |
| Number of Logic Elements / Cells | 337,500 |
| Number of I/O | 1,120 |
| Voltage - Supply | 1.1 V core |
| Température de fonctionnement | -40C to +100C (industrial) |
| Type de montage | Surface Mount (BGA) |
| Boîtier / Format | 1760-BBGA, FCBGA (flip-chip fine-pitch BGA) |
| Process Technology | 65 nm TSMC |
| Maximum Frequency | 450 MHz |
| Speed Grade | I4 (industrial) |
| Configuration Method | SRAM (in-system reconfigurable) |
| Statut RoHS | Compliant (lead-free) |
Guide de configuration des broches du EP3SL340F1760I4 1760-bbga, fcbga (flip-chip fine-pitch bga)
Configuration des broches du EP3SL340F1760I4 (boîtier 1760-bbga, fcbga (flip-chip fine-pitch bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SL340F1760I4.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SL340F1760I4 convient pour 6 applications: Wireless Baseband Signal Processing, ASIC Prototyping and Emulation, High-Speed Network Switching and Routing, High-Performance Image Processing, Military and Aerospace DSP Subsystems, High-Speed Data Acquisition and Test Equipment.
Wireless Baseband Signal Processing
The EP3SL340F1760I4 fits wireless baseband card designs because its 337,500 logic elements and dedicated 18x18 multipliers can implement 100s of simultaneous FIR filters, channelizers, and FFT engines. The 18.8 Mbit embedded memory holds multiple LTE/eNodeB symbol buffers without external SRAM, and the 1,120 user I/Os drive wide parallel CPRI/OBSAI links to RFICs. Designers typically achieve 200+ MHz fMAX on DSP pipelines, enabling multi-carrier 4G and early 5G baseband channels on a single device. Compared to mid-density FPGAs, the SL340 variant eliminates the need to split the design across multiple chips, reducing PCB area and inter-chip latency.
Recommandé
ASIC Prototyping and Emulation
The EP3SL340F1760I4 is widely used for ASIC prototyping because its large logic capacity and abundant user I/Os can partition and validate multi-million-gate ASIC designs. The 65 nm process preserves accurate timing correlation with the production ASIC, while Quartus II's incremental compilation enables multi-engineer team workflows. Designers map large ASIC blocks to the SL340 using the FPGA's 13,500 LABs and route signals across the 1,120 I/O to daughter-card expansion headers. Speed grades above I4 are sometimes used for ASIC prototyping where timing closure is critical.
Recommandé
High-Speed Network Switching and Routing
The EP3SL340F1760I4 supports high-end wireline networking because its high pin count drives multiple 10G/40G Ethernet lanes, while the 65 nm fabric enables line-rate packet classification and forwarding table lookups. The embedded 18.8 Mbit memory holds TCAM shadow tables and queue descriptors, and the DSP blocks accelerate hash-based routing calculations. Compared to ASIC-based switching, the SL340 offers in-system reprogrammability for rapid feature rollouts. Industrial temperature grade suits outdoor edge routers and central office equipment.
Recommandé
High-Performance Image Processing
The EP3SL340F1760I4 fits medical imaging, machine vision, and broadcast video pipelines because its DSP blocks and parallel fabric implement real-time 2D convolution, color-space conversion, and motion estimation at full HD or 4K resolutions. The 18.8 Mbit embedded memory buffers multiple video frames in tile, while the 1,120 I/Os support multi-lane MIPI-CSI, LVDS, and HDMI input streams. Industrial temperature grade suits factory-floor machine vision installations. The 'I4' speed grade achieves ~10% faster fMAX on critical paths, sustaining 150+ MHz pixel clocks.
Recommandé
Military and Aerospace DSP Subsystems
The EP3SL340F1760I4's industrial temperature range and radiation-tolerant characteristics (with appropriate screening) make it suitable for military radar, electronic warfare, and avionics DSP subsystems. The 337,500 logic elements implement pulse-Doppler processing, SAR imaging, and beamforming across thousands of channels simultaneously. The 65 nm process offers favorable SEU/SEL resilience versus older 90 nm and 130 nm FPGAs. Designers rely on Quartus II's incremental compile and SEU-aware implementation flow for mission-critical aerospace paths.
Recommandé
High-Speed Data Acquisition and Test Equipment
The EP3SL340F1760I4 fits high-end oscilloscopes, protocol analyzers, and ATE because its parallel I/O bandwidth and DSP throughput support multi-channel simultaneous sampling at GS/s rates. The abundant LABs and memory implement real-time triggering, deep record buffers, and PCIe Gen2 host links to test CPUs. Industrial temperature grade suits production-floor ATE deployment, and the obsolete-status mature silicon reduces per-unit risk for spares replacement. Designers use Quartus II's PCIe hard IP block to connect to test host processors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SL340F1760I4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SL340F1760I3N | EP3SL340F1760I3 | EP3SL340F1760C4N | EP3SL340F1760C4LN | EP3SL340F1760C4L | EP3SL340F1760C3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA - same | 1760-BBGA, FCBGA - same | 1760-BBGA, FCBGA - same | 1760-BBGA, FCBGA - same | 1760-BBGA, FCBGA - same | 1760-BBGA, FCBGA - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Speed Grade | I4 | I3 (slower) | I3 (slower) | C4 | C4L | C4L | C3 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Total RAM Bits | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 |
| User I/O Pins | 1,120 | 1,120 | 1,120 | 1,120 | 1,120 | 1,120 | 1,120 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Same-package speed grade flexibility (vs EP3SL340F1760I3N)
- Industrial temperature support (vs EP3SL340F1760C4N)
- High logic density in 65 nm process (vs EP3SL110F1152I3N)
Notes de conception
The 1760-ball FC-FBGA package requires a minimum 8-layer PCB with dedicated power/ground planes. Use 1.0 mm ball pitch BGA fanout with 0.5 mm trace width and 0.5 mm spacing. Implement a 4-6 mil diameter microvia stack with depth-controlled backdrilling for high-speed transceiver pairs (which require 85 ohm differential impedance with 6% tolerance).
Estimated: at full fabric utilization (~80% logic + transceiver activity), the EP3SL340F1760I4 dissipates approximately 15 to 20 W. The flip-chip BGA package requires thermal vias (12-mil pitch, 0.3 mm finished hole) connecting the die-side ball array to a copper heat spreader. Without active cooling, the junction-to-ambient thermal resistance theta_JA is approximately 12 to 18 C/W. A heat sink with thermal interface material is recommended for industrial-temperature applications.
The EP3SL340F1760I4 requires multiple supply rails: 1.1 V core, 2.5 V or 3.0 V PLL analog, 1.5 V/1.8 V/2.5 V/3.3 V I/O banks (each independently configurable), and an auxiliary supply for transceiver PLLs. Decoupling requires 0402/0201 ceramic capacitors distributed across the BGA footprint - typically 100 to 200 capacitors total, with bulk decoupling on each rail. Use Intel's PowerPlay early power estimator (EPE) spreadsheet to validate regulator sizing before tape-out.
High-speed LVDS and transceiver pairs require length-matched routing with controlled differential impedance (85 ohm for transceivers, 100 ohm for LVDS). Keep matched-pair length mismatch below 0.5 mm for transceivers operating above 3 Gbps. Use separate ground return paths for each channel pair, and avoid routing high-speed traces over split power planes. Quartus II's TimeQuest timing analyzer should be used to validate setup/hold margins post-route.
Common design errors include: insufficient power decoupling (only 1 uF ceramics vs the 100s of decoupling caps needed), missing MSEL configuration mode pull resistors, incorrect JTAG chain ordering when multiple devices share the chain, and overlooking the 1.5 V/2.5 V/3.3 V I/O bank power sequencing requirement (all bank supplies must ramp together within 100 ms). Always validate the design with Quartus II's PowerPlay and SignalTap II debug tools before fabrication.
Informations de conformité
RoHS and lead-free confirmed per Intel product page. REACH, halogen-free, and conflict minerals status not explicitly stated in verified web data and marked as unknown. AEC-Q100 not applicable as this is an industrial-grade FPGA, not automotive-qualified.
