EP3SL340F1760C3N - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
Référence : EP3SL340F1760C3N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3850 | $3 850,00 |
| 10 | $3650 | $36 500,00 |
| 100 | $3300 | $330 000,00 |
| 250 | $3100 | $775 000,00 |
| 500 | $2950 | $1 475 000,00 |
EP3SL340F1760C3N Présentation
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that lets designers implement arbitrary digital circuits - from simple glue logic to full processors, DSP pipelines, and high-speed protocol bridges - in silicon via a hardware description language such as Verilog or VHDL. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic device (CPLD) -> field-programmable gate array (FPGA) -> semiconductor. Stratix III L specifically targets the power-optimized branch of the Stratix III family, trading some maximum frequency for substantially lower static and dynamic power versus the standard Stratix III E parts.
Key features include up to 500 MHz core fabric operation, dedicated DSP blocks capable of delivering hundreds of GMACs of multiply-accumulate throughput, embedded memory organized in M9K/M144K blocks, multiple PLLs, and high-speed transceivers supporting multi-gigabit serial protocols. The 1760-BGA package exposes 1120 general-purpose user I/Os plus dedicated configuration, clock, and transceiver pins, enabling dense board designs without external bus-multiplexing logic.
Typical applications include high-definition video broadcast, medical imaging systems, military signal intelligence, high-frequency trading accelerator cards, and high-port-count network switching. The combination of dense logic, large on-die memory, and 65 nm low-power silicon makes this part suitable for systems that need Stratix-class DSP horsepower with tighter thermal envelopes than the higher-bin Stratix V or Arria 10 families.
When designing with the EP3SL340F1760C3N, verify the FBGA ball pattern against your PCB footprint - the 1760-ball package is unique to this device family. Quartus II software is required for synthesis, place-and-route, and configuration bitstream generation; legacy designs may also use the older Quartus subscription. Provide at least eight PCB decoupling capacitors around the device and follow Intel's Stratix III L Hardware Reference Manual for power-sequencing requirements.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations that go beyond the manufacturer datasheet, giving engineers a one-stop reference for selecting, sourcing, and laying out the EP3SL340F1760C3N.
Alternatives de remplacement direct pour EP3SL340F1760C3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SL340F1760C3N (même facteur de forme et même empreinte) — différant par Operating Temperature, Speed Grade, Package, Embedded Memory Bits, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SL340F1760C3
✅ Remplacement direct✓ En stock
$12480 / unité
Voir la fiche technique →EP3SL340F1760C2
✅ Remplacement direct✓ En stock
$18500 / unité
Voir la fiche technique →EP3SL340F1760I3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3150 / unité
Voir la fiche technique →EP3SL340F1760C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1820 / unité
Voir la fiche technique →EP3SL340F1517C3N
✅ Remplacement direct✓ En stock
$3750 / unité
Voir la fiche technique →EP3SL340F1760C3G
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3SL340F1760C3N Valeurs maximales et caractéristiques électriques
| Family | Stratix III L |
| Series | Stratix III L |
| Logic Elements | 337,500 |
| Embedded Memory (bits) | 18,822,144 |
| Total Memory Bits | 18,822,144 |
| Number of LABs/CLBs | 13,500 |
| Number of I/O | 1120 |
| Boîtier | 1760-BBGA, FCBGA |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Maximum Operating Frequency | 500 MHz |
| Statut RoHS | Compliant |
| Manufacturer | Intel / Altera |
Guide de configuration des broches du EP3SL340F1760C3N 1760-bbga, fcbga
Configuration des broches du EP3SL340F1760C3N (boîtier 1760-bbga, fcbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SL340F1760C3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SL340F1760C3N convient pour 6 applications: High-Definition Video Broadcast, Medical Imaging Systems, Military Signal Intelligence (SIGINT), High-Frequency Trading Accelerator, Multi-Port Network Switching / NPUs, Industrial Test & Measurement.
High-Definition Video Broadcast
The EP3SL340F1760C3N's 337,500 LEs and 18.8 Mbit embedded SRAM make it ideal for HD-SDI video broadcast infrastructure. The FPGA can process 4-8 channels of uncompressed 3G-SDI video simultaneously, performing real-time color-space conversion, frame-rate adaptation, and overlay compositing with deterministic latency. The wide 1120-I/O bus exposes enough pins for parallel SDI deserializer/serializer interfaces without external muxing, while dedicated DSP blocks accelerate chroma-key blending and motion-adaptive deinterlacing. Stratix III L's 65 nm low-power silicon keeps chassis thermal envelopes manageable in master-control switchers and broadcast encoder racks.
Recommandé
Medical Imaging Systems
In diagnostic imaging modalities such as CT, MRI, and ultrasound front-ends, the EP3SL340F1760C3N serves as a real-time beamformer and image-processing engine. The 337K LEs execute FIR filter banks, Hilbert transforms, and envelope-detection pipelines at sample frequencies above 200 MHz, while 18.8 Mbit embedded memory holds line buffers and lookup tables for windowing and log-compression. Industrial temperature grading (0C to +85C) supports cart-based ultrasound enclosures. The wide user-I/O count accommodates 16-32 channel ADC interfaces at LVDS rates, reducing or eliminating external buffer logic.
Recommandé
Military Signal Intelligence (SIGINT)
The EP3SL340F1760C3N is well matched to wideband SIGINT receivers requiring real-time FFT processing across hundreds of MHz of instantaneous bandwidth. Its DSP blocks deliver hundreds of GMACs of multiply-accumulate throughput, ideal for channelization, pulse compression, and direction-finding algorithms. 18.8 Mbit of embedded memory supports sliding-window FFTs and overlap-save convolution without spilling to external DDR. The 1760-BGA package accommodates 1120 user I/Os for parallel ADC/DAC links and high-speed serial transceivers up to 6.375 Gbps for sensor aggregation. Designers typically combine the FPGA with external ADC/DAC companion chips for the RF front-end.
Recommandé
High-Frequency Trading Accelerator
Latency-sensitive HFT gateways leverage the EP3SL340F1760C3N's 500 MHz fabric to accelerate market-data parsing, order-book maintenance, and FIX/protocol serialization in hardware. The deterministic 65 nm logic fabric delivers sub-microsecond tick-to-trade latency at lower power than software stacks. Embedded M9K/M144K blocks store per-symbol order books in on-die memory, while 1120 user I/Os fan out to multiple 10 G Ethernet MACs and PCIe Gen2 endpoints. The low-power Stratix III L bin keeps per-card power below typical switch-fabric ASIC envelopes, enabling dense co-location deployments.
Recommandé
Multi-Port Network Switching / NPUs
Network processing units built around the EP3SL340F1760C3N handle L2-L4 classification, deep-packet inspection, and QoS scheduling for 10G/40G aggregation switches. The 337K LEs map to multiple parallel pipeline stages that sustain 40 Gbps line rate even with complex ACL lookups. 18.8 Mbit on-die SRAM holds TCAM-equivalent hash tables and flow counters, reducing external memory accesses. The 1760-BGA exposes enough I/Os for multi-lane SFP+/QSFP cages alongside Interlaken or SPI4.2 fabric interfaces, replacing legacy ASIC NPUs with programmable logic.
Recommandé
Industrial Test & Measurement
Automated Test Equipment (ATE) and high-channel-count oscilloscopes rely on the EP3SL340F1760C3N for timing-critical waveform generation and correlation. The FPGA drives hundreds of LVDS pattern-generator pins while the DSP fabric executes real-time FFT, eye-diagram analysis, and protocol-decode algorithms. 18.8 Mbit embedded SRAM caches deep acquisition memory windows, and 1120 user I/Os support mixed-signal test pin electronics. The 0C to +85C operating range and robust Stratix III L silicon ensure 24/7 production-floor reliability across temperature-cycled environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SL340F1760C3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SL340F1760C3 | EP3SL340F1760C2 | EP3SL340F1760C4N | EP3SL340F1760I3N | EP3SL340F1517C3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA (same) | 1760-BBGA, FCBGA (same) | 1760-BBGA, FCBGA (same) | 1760-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (different footprint) |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Embedded Memory | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits |
| Speed Grade | C3 | C3 | C2 (slower) | C4 (faster) | I3 (industrial temp) | C3 |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C |
| Lead-Free / RoHS | Yes (N suffix) | Finish variant | Yes | Yes | Yes | Yes |
| Quartus II Support | Yes (v13.1 and earlier) | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Highest-density Stratix III L member with 337.5K LEs (vs EP3SL200F1760C3N)
- Low-power Stratix III silicon at 1.1 V core (vs EP3SE260F1760C3N)
- C3 speed grade balances timing margin and cost (vs EP3SL340F1760C2)
Notes de conception
Estimated: Stratix III L FPGAs draw significant transient current during configuration and at clock edges. Place at least 8 to 12 low-ESR 0.1 uF and 10 uF decoupling capacitors within 5 mm of the FBGA-1760 balls, distributed across VCCINT (1.1 V), VCCAUX, and VCCIO banks. Use a 4-layer PCB with dedicated power planes; voltage-regulator ripple must stay below 30 mV peak-to-peak on VCCINT to meet jitter specifications. Power sequencing per the Stratix III L Hardware Reference Manual (VCCINT before VCCAUX before VCCIO) is mandatory.
Estimated: With 337,500 LEs running at 500 MHz, junction temperature can approach 95C under worst-case vectors. The 1760-BGA exposes the die through the package substrate, so attach a heatsink via thermal interface material (TIM) and ensure at least 400 LFM airflow in chassis designs. Designers targeting 0C to +85C ambient should budget junction-to-ambient theta-JA of approximately 8-12 C/W with the recommended heatsink; verify in-situ with on-die temperature diode.
The 1760-ball FBGA package has a 1.0 mm or 0.8 mm pitch - confirm the exact pitch from the Altera package symbol before PCB layout. Use microvia-in-pad or stacked-via technology to fan out inner balls, with via-in-pad plating filled and capped to prevent solder wicking. Match differential-pair lengths within 5 mils for high-speed transceiver lanes and reference-clock traces; impedance-controlled stack-up (typically 50 ohm SE / 100 ohm diff) is mandatory for rates above 1 Gbps.
Do not assume the EP3SL340F1760C3N bitstream is interchangeable with the EP3SL340F1760C4N bitstream - speed-grade differences alter timing-closure behavior. Verify JTAG chain integrity before configuring in production; the 1760-BGA exposes TCK/TMS/TDO/TDI on dedicated configuration pins that share a bank with user I/O and must be left floating or pulled per the handbook. Finally, install Quartus II 13.0sp1 or 13.1 final patch before generating bitstreams; later Quartus versions dropped Stratix III support.
Informations de conformité
N-suffix indicates lead-free (Pb-free) finish and RoHS compliance per Altera product page. Halogen-free status not confirmed in provided data.
