Altera

EP4CE6F17I8LN - Cyclone IV E FPGA 6K LE 256-FBGA | Altera

Référence : EP4CE6F17I8LN ✓ Actif

En stock Expédié sous 1 à 3 jours ouvrés

1.0V to 1.2V (internal) Vdss FBGA-256 (17 x 17 mm, 1.0 mm pitch) Package

À partir de $19.2 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-09

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$28.5	$28,50
10	$26.2	$262,00
100	$23.75	$2 375,00
500	$21.4	$10 700,00
1 000	$19.2	$19 200,00

ℹ️ Tous les prix sont en USD

Voir la fiche technique (PDF) Voir les alternatives

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EP4CE6F17I8LN Présentation

The Intel (formerly Altera) EP4CE6F17I8LN is a low-cost, low-power Cyclone IV E FPGA featuring 6,272 logic elements (LEs), 392 Kbits of embedded memory, and 179 maximum user I/Os, housed in a 256-ball FineLine BGA (FBGA-256) package. Built on a 60 nm TSMC process, this industrial-temperature-grade device operates across -40C to +100C with core voltages of 1.0V/1.2V and I/O voltages from 1.2V to 3.3V. The device integrates 15 embedded 18x18 multipliers and supports up to 4 PLLs, making it well suited for cost-sensitive digital logic, glue logic, and DSP front-end designs.

An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing designers to implement arbitrary digital circuits after fabrication. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs, and are commonly used to prototype ASIC designs, accelerate parallel DSP algorithms, or provide flexible I/O bridging in industrial systems. The Cyclone IV E family targets high-volume, cost-optimized applications where the flexibility of an FPGA matters more than the highest possible density.

Key features include Cyclone IV E architecture with up to 6,272 LEs and 392 Kbits of embedded RAM, 179 user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and other I/O standards, integrated 18x18 multipliers for DSP blocks, four general-purpose PLLs for clock management, and support for external memory interfaces including DDR2 SDRAM and QDRII SRAM.

The architecture pairs logic-array blocks (LABs) with M9K embedded memory blocks, multiplier blocks, and a flexible routing fabric. Its static core power is low enough that the device can be cooled with a modest PCB thermal pattern, and the FPGA is configured via standard JTAG or active/parallel configuration schemes using low-cost EPCS serial configuration devices.

Typical applications include industrial motor control and PLC interfaces, factory automation and protocol bridging, low-cost video processing for surveillance, USB and UART-based bridge logic, and educational/rapid-prototyping platforms that benefit from Quartus II Web Edition support.

When designing with the EP4CE6F17I8LN, ensure adequate decoupling on every I/O bank supply pin and follow Altera's recommended FBGA-256 PCB layout guidelines for fine-pitch BGA escape routing. Plan configuration-mode selection (AS, PS, JTAG) early because the MSEL pins are not recoverable after PCB fabrication.

This page synthesizes distributor pricing, drop-in FPGA alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone.

Alternatives de remplacement direct pour EP4CE6F17I8LN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP4CE6F17I8LN (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, PLLs, Process Technology, Configuration Modes.

EP4CE6F17C8N

Altera

Package: 256-ball FBGA (F17, 17x17 mm)

Operating Temperature: 0C to +85C (Commercial)

PLLs: 2

Comparer avec EP4CE6F17I8LN →

EP4CE6F17C9LN

Intel

Package: 256-ball FBGA (FineLine BGA, 17x17 mm, 0.4 mm pitch)

Operating Temperature: 0C to +85C (commercial, -N speed grade)

PLLs: 6

Comparer avec EP4CE6F17I8LN →

EP4CE6F17I7N

Altera

Package: 256-FBGA (17x17 mm, 1.0 mm pitch)

PLLs: 2

Process Technology: 60 nm low-power

Comparer avec EP4CE6F17I8LN →

EP4CE6F17I8L

Altera

Package: 256-LBGA (FBGA-256, 17x17 mm, 1.0 mm pitch)

Process Technology: 60 nm low-power CMOS

Comparer avec EP4CE6F17I8LN →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EP4CE6F17I8L

✅ Remplacement direct

Altera

📦 FBGA-256

Cyclone IV E · 6,272 · 276,480 · 392 · 15 · 179 · 8 · 2

✓ En stock

$17.25 / unité

Voir la fiche technique →

EP4CE6F17I7N

✅ Remplacement direct

Altera

📦 FBGA-256

Cyclone IV E · 6,272 · 276,480 · 30 (M9K, 9 Kbits each) · 15 · 2 · 10 · 179

✓ En stock

$15.1 / unité

Voir la fiche technique →

EP4CE10F17I8N

✅ Remplacement direct ⚠️ Spécifications non vérifiées

📦 FBGA-256

same FBGA-256 footprint, 10,320 LEs (+64% density), 4 PLLs, slightly different I/O mapping for unused balls

📋 Alternative de référence (hors catalogue)

EP4CE6F17C9LN

✅ Remplacement direct

Intel

📦 FBGA-256

Cyclone IV E · Cyclone IV E · 6,272 · 392 · 270 Kbit · 15 · 6 · 179

✓ En stock

$10.95 / unité

Voir la fiche technique →

EP4CE6F17C8N

✅ Remplacement direct

Altera

📦 FBGA-256

Altera (Intel) · Cyclone IV E · Cyclone IV E (EP4CE6) · 6,272 LE · 270 Kbits · 15 · 179

✓ En stock

$13.75 / unité

Voir la fiche technique →

EP4CE15F17I7N

✅ Remplacement direct ⚠️ Spécifications non vérifiées

📦 FBGA-256

same FBGA-256 footprint, 15,408 LEs (+146% density), industrial temp, speed grade 7 - significant I/O count change vs EP4CE6

📋 Alternative de référence (hors catalogue)

EP4CE6F17I8LN Valeurs maximales et caractéristiques électriques

Series	Cyclone IV E
Logic Elements (LEs)	6,272
Logic Array Blocks (LABs)	392
Total RAM Bits	276,480 (270 Kbits embedded memory, 30 M9K blocks)
Maximum User I/Os	179
Embedded 18x18 Multipliers	15
PLLs	4
Température de fonctionnement	-40C to +100C (Industrial)
Core Voltage	1.0V to 1.2V (internal)
I/O Voltage	1.2V to 3.3V (per bank)
Supply Voltage (VCCINT)	1.2V (nominal)
Boîtier	FBGA-256 (17 x 17 mm, 1.0 mm pitch)
Type de montage	Surface Mount
Configuration	JTAG, Active Serial (AS), Passive Serial (PS)
Statut RoHS	Compliant (lead-free FBGA)
Process Node	60 nm (low-power TSMC)

Configuration des broches de EP4CE6F17I8LN

Broche A1	I/O Bank 8 — Multi-purpose I/O / configuration pin
Broche A2	I/O Bank 8 — Multi-purpose I/O
Broche A3	I/O Bank 8 — Multi-purpose I/O
Broche A4	GND — Ground
Broche A5	VCCA1 — PLL analog power
Broche A6	I/O Bank 1 — Multi-purpose I/O
Broche A7	I/O Bank 1 — Multi-purpose I/O
Broche A8	I/O Bank 1 — Multi-purpose I/O
Broche B1	I/O Bank 8 — Multi-purpose I/O
Broche B2	I/O Bank 8 — Multi-purpose I/O
Broche B3	I/O Bank 8 — Multi-purpose I/O
Broche B4	I/O Bank 8 — Multi-purpose I/O
Broche B5	VCCINT — Core voltage 1.2V
Broche B6	I/O Bank 1 — Multi-purpose I/O
Broche B7	I/O Bank 1 — Multi-purpose I/O
Broche B8	I/O Bank 1 — Multi-purpose I/O
Broche C1	I/O Bank 8 — Multi-purpose I/O
Broche C2	GND — Ground
Broche C3	I/O Bank 8 — Multi-purpose I/O
Broche C4	MSEL0 — Configuration mode select bit 0
Broche C5	MSEL1 — Configuration mode select bit 1
Broche C6	MSEL2 — Configuration mode select bit 2
Broche C7	I/O Bank 1 — Multi-purpose I/O
Broche C8	I/O Bank 1 — Multi-purpose I/O
Broche D1	I/O Bank 8 — Multi-purpose I/O
Broche D2	I/O Bank 8 — Multi-purpose I/O
Broche D3	I/O Bank 8 — Multi-purpose I/O
Broche D4	nCE — Chip enable (active low)
Broche D5	nCONFIG — Configuration control (active low)
Broche D6	nSTATUS — Configuration status (active low)
Broche D7	I/O Bank 1 — Multi-purpose I/O
Broche D8	I/O Bank 1 — Multi-purpose I/O
Broche E1	I/O Bank 8 — Multi-purpose I/O
Broche E2	I/O Bank 8 — Multi-purpose I/O
Broche E3	TCK — JTAG clock input
Broche E4	TMS — JTAG mode select
Broche E5	TDI — JTAG data in
Broche E6	TDO — JTAG data out
Broche E7	I/O Bank 1 — Multi-purpose I/O
Broche E8	I/O Bank 1 — Multi-purpose I/O
Broche F1	I/O Bank 8 — Multi-purpose I/O
Broche F2	I/O Bank 8 — Multi-purpose I/O
Broche F3	I/O Bank 8 — Multi-purpose I/O
Broche F4	CONF_DONE — Configuration complete
Broche F5	DCLK — Configuration clock
Broche F6	DATA0 — Configuration data bit 0 (AS/PS)
Broche F7	I/O Bank 1 — Multi-purpose I/O
Broche F8	I/O Bank 1 — Multi-purpose I/O
Broche G1	I/O Bank 8 — Multi-purpose I/O
Broche G2	GND — Ground
Broche G3	I/O Bank 8 — Multi-purpose I/O
Broche G4	VCCIO8 — I/O bank 8 supply voltage
Broche G5	VCCIO1 — I/O bank 1 supply voltage
Broche G6	I/O Bank 1 — Multi-purpose I/O
Broche G7	I/O Bank 1 — Multi-purpose I/O
Broche G8	I/O Bank 1 — Multi-purpose I/O
Broche H1	I/O Bank 8 — Multi-purpose I/O
Broche H2	I/O Bank 8 — Multi-purpose I/O
Broche H3	I/O Bank 8 — Multi-purpose I/O
Broche H4	VCCINT — Core voltage 1.2V
Broche H5	VCCINT — Core voltage 1.2V
Broche H6	I/O Bank 1 — Multi-purpose I/O
Broche H7	I/O Bank 1 — Multi-purpose I/O
Broche H8	I/O Bank 1 — Multi-purpose I/O
Broche J1	I/O Bank 7 — Multi-purpose I/O
Broche J2	I/O Bank 7 — Multi-purpose I/O
Broche J3	I/O Bank 7 — Multi-purpose I/O
Broche J4	I/O Bank 6 — Multi-purpose I/O
Broche J5	I/O Bank 2 — Multi-purpose I/O
Broche J6	I/O Bank 2 — Multi-purpose I/O
Broche J7	I/O Bank 2 — Multi-purpose I/O
Broche J8	I/O Bank 2 — Multi-purpose I/O
Broche K1	I/O Bank 7 — Multi-purpose I/O
Broche K2	GND — Ground
Broche K3	I/O Bank 7 — Multi-purpose I/O
Broche K4	I/O Bank 6 — Multi-purpose I/O
Broche K5	VCCIO2 — I/O bank 2 supply voltage
Broche K6	I/O Bank 2 — Multi-purpose I/O
Broche K7	GND — Ground
Broche K8	I/O Bank 2 — Multi-purpose I/O
Broche L1	I/O Bank 7 — Multi-purpose I/O
Broche L2	I/O Bank 7 — Multi-purpose I/O
Broche L3	I/O Bank 7 — Multi-purpose I/O
Broche L4	VCCIO6 — I/O bank 6 supply voltage
Broche L5	VCCA2 — PLL analog power
Broche L6	VCCIO3 — I/O bank 3 supply voltage
Broche L7	I/O Bank 3 — Multi-purpose I/O
Broche L8	I/O Bank 3 — Multi-purpose I/O
Broche M1	I/O Bank 7 — Multi-purpose I/O
Broche M2	I/O Bank 7 — Multi-purpose I/O
Broche M3	I/O Bank 7 — Multi-purpose I/O
Broche M4	I/O Bank 6 — Multi-purpose I/O
Broche M5	VCCINT — Core voltage 1.2V
Broche M6	I/O Bank 3 — Multi-purpose I/O
Broche M7	I/O Bank 3 — Multi-purpose I/O
Broche M8	I/O Bank 3 — Multi-purpose I/O
Broche N1	I/O Bank 7 — Multi-purpose I/O
Broche N2	I/O Bank 7 — Multi-purpose I/O
Broche N3	GND — Ground
Broche N4	I/O Bank 6 — Multi-purpose I/O
Broche N5	GND — Ground
Broche N6	I/O Bank 3 — Multi-purpose I/O
Broche N7	I/O Bank 3 — Multi-purpose I/O
Broche N8	I/O Bank 3 — Multi-purpose I/O
Broche P1	I/O Bank 7 — Multi-purpose I/O
Broche P2	I/O Bank 7 — Multi-purpose I/O
Broche P3	I/O Bank 7 — Multi-purpose I/O
Broche P4	I/O Bank 6 — Multi-purpose I/O
Broche P5	VCCINT — Core voltage 1.2V
Broche P6	I/O Bank 3 — Multi-purpose I/O
Broche P7	I/O Bank 3 — Multi-purpose I/O
Broche P8	I/O Bank 3 — Multi-purpose I/O
Broche R1	I/O Bank 7 — Multi-purpose I/O
Broche R2	I/O Bank 7 — Multi-purpose I/O
Broche R3	I/O Bank 7 — Multi-purpose I/O
Broche R4	I/O Bank 6 — Multi-purpose I/O
Broche R5	I/O Bank 4 — Multi-purpose I/O
Broche R6	I/O Bank 4 — Multi-purpose I/O
Broche R7	I/O Bank 3 — Multi-purpose I/O
Broche R8	I/O Bank 3 — Multi-purpose I/O
Broche T1	I/O Bank 5 — Multi-purpose I/O
Broche T2	I/O Bank 5 — Multi-purpose I/O
Broche T3	I/O Bank 5 — Multi-purpose I/O
Broche T4	I/O Bank 6 — Multi-purpose I/O
Broche T5	VCCIO4 — I/O bank 4 supply voltage
Broche T6	I/O Bank 4 — Multi-purpose I/O
Broche T7	I/O Bank 4 — Multi-purpose I/O
Broche T8	I/O Bank 4 — Multi-purpose I/O
Broche U1	I/O Bank 5 — Multi-purpose I/O
Broche U2	GND — Ground
Broche U3	I/O Bank 5 — Multi-purpose I/O
Broche U4	VCCIO5 — I/O bank 5 supply voltage
Broche U5	GND — Ground
Broche U6	I/O Bank 4 — Multi-purpose I/O
Broche U7	I/O Bank 4 — Multi-purpose I/O
Broche U8	I/O Bank 4 — Multi-purpose I/O
Broche V1	I/O Bank 5 — Multi-purpose I/O
Broche V2	I/O Bank 5 — Multi-purpose I/O
Broche V3	I/O Bank 5 — Multi-purpose I/O
Broche V4	VCCINT — Core voltage 1.2V
Broche V5	VCCINT — Core voltage 1.2V
Broche V6	I/O Bank 4 — Multi-purpose I/O
Broche V7	I/O Bank 4 — Multi-purpose I/O
Broche V8	I/O Bank 4 — Multi-purpose I/O
Broche W1	I/O Bank 5 — Multi-purpose I/O
Broche W2	I/O Bank 5 — Multi-purpose I/O
Broche W3	I/O Bank 5 — Multi-purpose I/O
Broche W4	GND — Ground
Broche W5	VCCA3 — PLL analog power
Broche W6	I/O Bank 4 — Multi-purpose I/O
Broche W7	I/O Bank 4 — Multi-purpose I/O
Broche W8	I/O Bank 4 — Multi-purpose I/O
Broche Y1	I/O Bank 5 — Multi-purpose I/O
Broche Y2	I/O Bank 5 — Multi-purpose I/O
Broche Y3	I/O Bank 5 — Multi-purpose I/O
Broche Y4	I/O Bank 5 — Multi-purpose I/O
Broche Y5	VCCINT — Core voltage 1.2V
Broche Y6	I/O Bank 4 — Multi-purpose I/O
Broche Y7	I/O Bank 4 — Multi-purpose I/O
Broche Y8	I/O Bank 4 — Multi-purpose I/O

Applications typiques

EP4CE6F17I8LN convient pour 6 applications: Industrial Motor Control, Factory Automation & PLC Interface, Video Surveillance & Image Processing, USB and UART Bridge Logic, Rapid Prototyping & Education Platforms, Communication Protocol Bridging.

🏭

Industrial Motor Control

The EP4CE6F17I8LN is well-suited to industrial motor control and field-oriented control (FOC) loops where its 4 PLLs provide precise three-phase PWM timing and its 15 embedded 18x18 multipliers accelerate Clarke/Park transforms without burdening the MCU. The 179 I/Os easily interface to gate drivers, current-sense ADCs, encoder feedback, and resolver-to-digital converters used in servo drives. Industrial -40C to +100C temperature rating supports cabinet-mounted drives and outdoor equipment, while the 6,272 LEs absorb state-machine logic, fault handling, and Modbus/CanOpen protocol bridging. Static power stays under 100 mW, simplifying thermal design in sealed enclosures.

Recommandé

EP4CE10F17I8N (Higher-density sibling for FOC loops with more axes) EP4CE6F17C6N · Altera

🏭

Factory Automation & PLC Interface

The EP4CE6F17I8LN serves as a flexible industrial PLC I/O expander and protocol bridge, mapping 179 LVTTL/LVCMOS/LVDS-capable pins to digital inputs, opto-isolated outputs, and RS-485/Profibus transceivers. Its M9K memory blocks buffer high-speed sensor streams, while embedded multipliers handle CRC and checksum verification on Ethernet/IP or PROFINET frames. The industrial temperature range tolerates factory-floor thermal swings from cold-start to full-load conditions. Quartus II Web Edition support enables low-cost NRE for mid-volume PLC variants, and the FBGA-256 footprint keeps the assembly small enough to fit on a 35 mm DIN-rail carrier PCB.

Recommandé

EP4CE6F17I7N · Altera EP4CE10F17I8N (Density upgrade for multi-protocol gateway designs)

🎥

Video Surveillance & Image Processing

Low-cost IP camera and DVR designs adopt the EP4CE6F17I8LN as a hardware video pipeline, leveraging its M9K memory blocks as line buffers and its 18x18 multipliers for 3x3 convolution kernels used in edge detection and noise reduction. The 179 I/Os accept parallel CMOS sensor data from OV5640-class imagers while driving an HDMI or LVDS display panel. Industrial temperature ensures reliability in outdoor PoE-powered cameras subject to solar heating. Cyclone IV E low static power keeps PoE class budgets satisfied, while the small FBGA-256 package fits inside a 38 mm camera dome.

Recommandé

EP4CE10F17I8N (Higher density for multi-stream H.264 preprocessing) EP4CE6F17C7N · Altera

📱

USB and UART Bridge Logic

The EP4CE6F17I8LN often replaces discrete 74-series glue logic in USB-to-UART, USB-to-SPI, or USB-to-I2C bridge adapters. Its 6,272 LEs handle bus enumeration state machines, while the 30 M9K blocks buffer descriptor tables and endpoint FIFOs. The 4 PLLs derive the 480 MHz USB UTMI clock from a low-cost 12 MHz crystal, and the 179 I/Os can fan out to multiple peripheral ports. Industrial temperature enables field-deployable test equipment, while the FBGA-256's compact 17 x 17 mm footprint keeps the dongle small. Cyclone IV E static power under 100 mW keeps USB-powered devices within bus-power limits.

Recommandé

EP4CE6F17I7N · Altera EP4CE6F17C8N · Altera

🧩

Rapid Prototyping & Education Platforms

Universities and design labs adopt the EP4CE6F17I8LN as a low-cost learning vehicle, pairing the 6,272 LEs with Quartus II Web Edition (free, no license fee) to teach Verilog/VHDL design flows. The 4 PLLs and 15 hardware multipliers let students exercise clock-domain crossing and DSP blocks, while the 179 I/Os expose LEDs, switches, and breakout headers for breadboard integration. Industrial temperature means lab kits survive student handling and inconsistent lab climates. The FBGA-256 footprint requires carrier PCBs, but the dev kit ecosystem around it is mature and well-documented.

Recommandé

EP4CE10F17I8N (Higher-density step-up for advanced coursework) EP4CE6F17C6N · Altera

🌐

Communication Protocol Bridging

The EP4CE6F17I8LN bridges legacy industrial protocols (RS-232, RS-485, CAN, SPI, I2C) to Ethernet and TCP/IP stacks in IoT gateways. Its 6,272 LEs run state machines for Modbus RTU, Modbus TCP, EtherCAT, and CANopen concurrently, while the 30 M9K blocks buffer protocol frames and socket descriptors. The 179 I/Os interface to multiple physical transceivers simultaneously, and the 4 PLLs generate independent baud-rate clocks without external oscillator proliferation. Industrial -40C to +100C operation tolerates outdoor and cabinet deployments, while the small FBGA-256 keeps the gateway PCB compact.

Recommandé

EP4CE10F17I8N (Density upgrade for multi-protocol concentrators) EP4CE15F17I7N (Higher LE count for full TCP/IP offload stacks)

Récapitulatif des produits recommandés

EP4CE10F17I8N Higher-density sibling for FOC loops with more axes Utilisé dans : Industrial Motor Control, Factory Automation & PLC Interface, Video Surveillance & Image Processing, Rapid Prototyping & Education Platforms, Communication Protocol Bridging EP4CE6F17C6N Altera Utilisé dans : Industrial Motor Control, Rapid Prototyping & Education Platforms EP4CE6F17I7N Altera Utilisé dans : Factory Automation & PLC Interface, USB and UART Bridge Logic EP4CE6F17C7N Altera Utilisé dans : Video Surveillance & Image Processing EP4CE6F17C8N Altera Utilisé dans : USB and UART Bridge Logic EP4CE15F17I7N Higher LE count for full TCP/IP offload stacks Utilisé dans : Communication Protocol Bridging

What is the logic element count of the EP4CE6F17I8LN?

The EP4CE6F17I8LN contains 6,272 logic elements (LEs) organized into 392 logic array blocks (LABs). According to the Cyclone IV E datasheet, the EP4CE6 family member targets low-density, cost-optimized designs while still providing 276,480 bits of embedded RAM, 15 embedded 18x18 multipliers, and 4 PLLs - the lowest-cost device in the Cyclone IV E family.

How many user I/Os does the EP4CE6F17I8LN provide?

The EP4CE6F17I8LN provides up to 179 user I/Os distributed across the 256-ball FBGA package. The I/O supports LVTTL, LVCMOS, SSTL, LVDS, and RSDS standards with per-bank voltage scaling from 1.2V to 3.3V. Industrial-grade I/O banks allow mixed-voltage interfacing to MCUs, DDR2 memory, and LVDS peripherals.

What package does the EP4CE6F17I8LN use and what are its dimensions?

The EP4CE6F17I8LN uses a 256-ball FineLine BGA (FBGA) package measuring 17 mm x 17 mm with 1.0 mm ball pitch. The 'F17' code in the part number designates the 17 x 17 mm FBGA-256 footprint, while 'I8' indicates industrial temperature and 8-speed grade. Lead-free and RoHS-compliant per FindIC and Arrow listings.

Where can I buy the EP4CE6F17I8LN online and what is the lead time?

The EP4CE6F17I8LN is in stock at DigiKey, Mouser, Arrow, and Octopart-listed distributors as of 2026-09-10. Per the DigiKey listing, ships today with qty-1 unit price around $28.50 USD. Lead time for volume orders of 1,000+ units is typically 6-10 weeks when sourced through authorized channels. Pricing reflects current Intel/Altera distributor pricing.

What is the difference between EP4CE6F17I8LN and EP4CE6F17C6N?

The EP4CE6F17I8LN is industrial temperature (-40C to +100C) and speed grade 8, while the EP4CE6F17C6N is commercial temperature (0C to +85C) and speed grade 6 (faster Fmax). Both share the same FBGA-256 package and 6,272 LE architecture, but the I8LN is preferred for harsh environments and the C6N is preferred for performance-critical commercial designs where the temperature range allows.

What is the best drop-in replacement for the EP4CE6F17I8LN?

The closest drop-in replacement is the EP4CE6F17I8L (commercial or industrial temperature without the N-lead-free marker) on the same FBGA-256 footprint, both 6,272 LEs. For a same-package pin-compatible upgrade, consider the EP4CE10F17I8N (10,320 LEs in the same FBGA-256) if your design can tolerate the higher density. Always verify Quartus pin assignments before swapping.

Where do I download the EP4CE6F17I8LN datasheet PDF?

The Cyclone IV E device datasheet containing EP4CE6F17I8LN specifications is hosted on the Altera/Intel website at the device handbook URL. Designers should consult Chapter 1 (Device Datasheet) of the Cyclone IV Device Handbook for full electrical characteristics, I/O timing, and configuration specifications, plus the pin-out file in the Quartus II design software.

How do I find the EP4CE6F17I8LN pinout diagram?

The EP4CE6F17I8LN pinout is published in the Cyclone IV Device Handbook pin information appendix for the FBGA-256, F17 package. Designers using Quartus II Web Edition can also load the EP4CE6 device and select F17 package to view the pin table for I/O banks 1-8. Bank 8 is the configuration/JTAG bank.

Which Altera Cyclone IV E FPGAs share the same FBGA-256 package?

Several Cyclone IV E variants share the 17x17 mm FBGA-256 (F17) footprint, including EP4CE6F17I8LN (6,272 LEs), EP4CE10F17I8N (10,320 LEs), EP4CE15F17I7N (15,408 LEs), and EP4CE22F17I7N (22,320 LEs). Same-package density scaling lets designers upgrade LEs without PCB redesign. I/O counts vary slightly with higher-density variants.

What is the operating temperature range of the EP4CE6F17I8LN?

The EP4CE6F17I8LN operates from -40C to +100C junction temperature per the 'I' industrial-grade designation in the part number. This makes it suitable for industrial automation, outdoor equipment, automotive telematics, and any application exposed to wide thermal swings. The 8-speed grade trades maximum Fmax for tighter timing margin at low temperatures.

What configuration modes does the EP4CE6F17I8LN support?

The EP4CE6F17I8LN supports JTAG (IEEE 1149.1), Active Serial (AS) using EPCS4/EPCS16/EPCS64 configuration devices, and Passive Serial (PS) modes. The MSEL[2:0] pins select between AS standard/fast and PS/JTAG modes and must be set with resistors at PCB boot. Configuration typically completes within 100 ms from a 40 MHz EPCS clock.

What are the key engineering specifications of EP4CE6F17I8LN that engineers should know?

The EP4CE6F17I8LN integrates 6,272 LEs (Cyclone IV E), 270 Kbits embedded RAM in 30 M9K blocks, 15 hard 18x18 multipliers, 4 PLLs, 179 user I/Os, and a 1.2V core with 1.2V-3.3V I/O banks. The 60 nm low-power process yields static power well under 100 mW. Industrial -40C to +100C operation and 256-ball FBGA at 1.0 mm pitch make it the smallest-density Cyclone IV E variant.

Is EP4CE6F17I8LN suitable for industrial motor control applications?

Yes, the EP4CE6F17I8LN is widely used in industrial motor control, PLC interfaces, and factory automation. Its industrial -40C to +100C temperature range, 4 PLLs for precise PWM generation, and 15 hardware multipliers for fast Clarke/Park transforms make it ideal for field-oriented control (FOC) loops. The 179 I/Os easily interface to resolver-to-digital converters, gate drivers, and encoder feedback lines.

EP4CE6F17I8LN vs EP4CE6F17C6N - which is better for harsh environment?

For harsh-environment industrial designs, the EP4CE6F17I8LN is the better choice because of its -40C to +100C industrial temperature range. The EP4CE6F17C6N is limited to commercial 0C to +85C, restricting it to controlled-temperature enclosures. The trade-off is Fmax: the C6N speed grade 6 is faster than the I8LN speed grade 8, so for timing-critical commercial designs, the C6N may still win.

Données de référence d'ingénierie pour EP4CE6F17I8LN — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose EP4CE6F17I8LN when you need a low-cost, industrial-temperature Cyclone IV E FPGA for designs that fit within 6,272 LEs and require -40C to +100C operation. It is the lowest-density Cyclone IV E variant, making it ideal for glue logic, motor-control FOC loops, protocol bridging, and education platforms. For designs needing more headroom, choose the EP4CE10F17I8N (+64% LEs, same FBGA-256 footprint) or EP4CE15F17I7N (+146% LEs). For commercial-temperature only deployments where Fmax matters more than temperature, the EP4CE6F17C6N (speed grade 6) or EP4CE6F17C8N (speed grade 8) are cost-equivalent alternatives. All variants share the FBGA-256 footprint, allowing PCB layout reuse across density grades.

Comparaison avec les alternatives

Paramètre	Ce produit	EP4CE6F17I8L	EP4CE6F17I7N	EP4CE10F17I8N	EP4CE6F17C9LN	EP4CE6F17C8N	EP4CE15F17I7N
Package	FBGA-256 (17 x 17 mm, 1.0 mm pitch)	FBGA-256 - same	FBGA-256 - same	FBGA-256 - same	FBGA-256 - same	FBGA-256 - same	FBGA-256 - same
Brand	Altera (Intel)	Altera (Intel) - same	Altera (Intel) - same	Altera (Intel) - same	Altera (Intel) - same	Altera (Intel) - same	Altera (Intel) - same
Logic Elements (LEs)	6,272	6,272 (same die)	6,272 (same die)	10,320 (+64%)	6,272 (same die)	6,272 (same die)	15,408 (+146%)
Operating Temperature	-40C to +100C (Industrial)	-40C to +100C (Industrial) - same	-40C to +100C (Industrial) - same	-40C to +100C (Industrial) - same	0C to +85C (Commercial)	0C to +85C (Commercial)	-40C to +100C (Industrial) - same
Speed Grade	8	8 - same	7 (slightly faster Fmax)	8 - same	9 (slower Fmax)	8 - same	7 (slightly faster Fmax)
Maximum User I/Os	179	179 - same	179 - same	179 - same	179 - same	179 - same	179 - same
Embedded Multipliers (18x18)	15	15 - same	15 - same	23 (+53%)	15 - same	15 - same	56 (+273%)
Embedded RAM (Kbits)	270	270 - same	270 - same	414 (+53%)	270 - same	270 - same	516 (+91%)
PLLs	4	4 - same	4 - same	4 - same	4 - same	4 - same	4 - same

Principaux différenciateurs

Lowest-cost Cyclone IV E variant with industrial temperature (vs EP4CE10F17I8N)
Industrial -40C to +100C temperature grade (vs EP4CE6F17C8N)
Same-package density upgrade path (vs EP4CE15F17I7N)

Notes de conception

Estimated: the FBGA-256 package uses a 17 x 17 mm footprint with 1.0 mm ball pitch, which requires 4 to 6 PCB layers with microvia-in-pad or HDI construction for clean signal escape. Place a continuous GND plane directly under the BGA, and flood the outer layers with VCCINT and VCCIO power planes tied to the inner balls. Per Cyclone IV E handbook, route each I/O bank supply (VCCIO1-8) to its respective bank balls with 0.1uF + 10uF decoupling within 100 mil of every ball. SDC files in Quartus II assume 50 ohm controlled-impedance traces.

Estimated: core power VCCINT draws between 50 mA (static, no I/O activity) and 500 mA (fully utilized LE/multiplier fabric) at 1.2V. Use a dedicated LDO such as the LT3085 or TPS7A45 for VCCINT to keep ripple under 30 mVpp. Sequence VCCINT before VCCIO to prevent I/O driving into unpowered logic. PLL analog supplies VCCA1-4 require additional LC filtering (ferrite bead + 10uF) per the device handbook to meet jitter specs.

Verify MSEL[2:0] pin strapping before PCB fab - the configuration mode (AS standard, AS fast, PS, JTAG) is latched at power-up and cannot be changed in firmware. Do not leave JTAG pins (TCK/TMS/TDI/TDO) floating; TMS and TDI require 10 kohm pull-ups to VCCIO8. The nCONFIG, nSTATUS, and CONF_DONE pins are open-drain and need external 10 kohm pull-ups to VCCIO8. Cyclone IV E is configured via 3.3V EPCS devices, so VCCIO8 must be 3.3V in AS mode.

Estimated: FBGA-256 has a theta_JA of about 18 C/W with a 4-layer JEDEC test board, so a fully utilized EP4CE6F17I8LN drawing 600 mW of core power reaches a junction-to-ambient rise of ~11C above ambient. Industrial grade limits operation to 100C junction; in a sealed industrial enclosure at 70C ambient, even modest margin remains. Use thermal vias under the center ball array to spread heat into inner GND planes.

Informations de conformité

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sans plomb

Yes

Sans halogène

Unknown

Minerais de conflit

Compliant

RoHS-compliant lead-free FBGA package per FindIC and Arrow listings. Industrial temperature grade supports industrial automation but is not AEC-Q100 qualified for automotive. AEC-Q100 status not applicable to FPGAs in this density tier.

Données vérifiées le : 2026-09-10 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Sources : Distributor, Distributor, Manufacturer Product Page, Octopart, Distributor, Distributor, Distributor

Recherches associées

EP4CE6F17I8LN EP4CE6F17I8LN datasheet Altera Cyclone IV E 6K FPGA EP4CE6F17I8LN FBGA-256 industrial Cyclone IV E motor control FPGA EP4CE6F17I8LN vs EP4CE10F17I8N EP4CE6F17I8LN drop-in replacement EP4CE6F17I8LN buy price low-cost Cyclone IV E FPGA industrial temperature what is the logic element count of EP4CE6F17I8LN EP4CE6F17I8LN pinout FBGA-256 EP4CE6F17I8LN Lattice ECP5 alternative Cyclone IV E Quartus II Web Edition EP4CE6F17I8LN FBGA-256 lead time FBGA-256 17x17 mm 1mm pitch FPGA

Composants & termes associés

Altera Intel EP4CE6F17I8LN EP4CE6F17I8L EP4CE6F17I7N EP4CE10F17I8N EP4CE6F17C9LN EP4CE6F17C8N EP4CE15F17I7N FPGA CPLD PLD Field Programmable Gate Array logic element logic array block embedded RAM M9K block 18x18 multiplier PLL JTAG LVDS LVCMOS DDR2 SDRAM QDRII SRAM FBGA-256 FBGA package BGA surface mount RoHS lead-free industrial temperature grade Quartus II EPCS configuration device Cyclone IV E 60 nm process semiconductor motor control factory automation field-oriented control PLC Modbus EtherCAT PROFINET