Altera

EP4CE6F17I8LN - Cyclone IV E FPGA 6K LE 256-FBGA | Altera

MPN: EP4CE6F17I8LN ✓ Aktif

1.0V to 1.2V (internal) Vdss FBGA-256 (17 x 17 mm, 1.0 mm pitch) Package

Ajukan Diskon

MOQ: 1 |

Lihat Datasheet (PDF) Lihat Alternatif

Kuantitas

EP4CE6F17I8LN Ringkasan

The Intel (formerly Altera) EP4CE6F17I8LN is a low-cost, low-power Cyclone IV E FPGA featuring 6,272 logic elements (LEs), 392 Kbits of embedded memory, and 179 maximum user I/Os, housed in a 256-ball FineLine BGA (FBGA-256) package. Built on a 60 nm TSMC process, this industrial-temperature-grade device operates across -40C to +100C with core voltages of 1.0V/1.2V and I/O voltages from 1.2V to 3.3V. The device integrates 15 embedded 18x18 multipliers and supports up to 4 PLLs, making it well suited for cost-sensitive digital logic, glue logic, and DSP front-end designs.

An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing designers to implement arbitrary digital circuits after fabrication. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs, and are commonly used to prototype ASIC designs, accelerate parallel DSP algorithms, or provide flexible I/O bridging in industrial systems. The Cyclone IV E family targets high-volume, cost-optimized applications where the flexibility of an FPGA matters more than the highest possible density.

Key features include Cyclone IV E architecture with up to 6,272 LEs and 392 Kbits of embedded RAM, 179 user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and other I/O standards, integrated 18x18 multipliers for DSP blocks, four general-purpose PLLs for clock management, and support for external memory interfaces including DDR2 SDRAM and QDRII SRAM.

The architecture pairs logic-array blocks (LABs) with M9K embedded memory blocks, multiplier blocks, and a flexible routing fabric. Its static core power is low enough that the device can be cooled with a modest PCB thermal pattern, and the FPGA is configured via standard JTAG or active/parallel configuration schemes using low-cost EPCS serial configuration devices.

Typical applications include industrial motor control and PLC interfaces, factory automation and protocol bridging, low-cost video processing for surveillance, USB and UART-based bridge logic, and educational/rapid-prototyping platforms that benefit from Quartus II Web Edition support.

When designing with the EP4CE6F17I8LN, ensure adequate decoupling on every I/O bank supply pin and follow Altera's recommended FBGA-256 PCB layout guidelines for fine-pitch BGA escape routing. Plan configuration-mode selection (AS, PS, JTAG) early because the MSEL pins are not recoverable after PCB fabrication.

This page synthesizes distributor pricing, drop-in FPGA alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone.

Alternatif penggantian untuk EP4CE6F17I8LN — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EP4CE6F17I8LN (sama faktor bentuk dan footprint) — berbeda di dalam Package, Operating Temperature, PLLs, Process Technology, Configuration Modes.

EP4CE6F17C8N

Altera

Package: 256-ball FBGA (F17, 17x17 mm)

Operating Temperature: 0C to +85C (Commercial)

PLLs: 2

Bandingkan dengan EP4CE6F17I8LN →

EP4CE6F17C9LN

Intel

Package: 256-ball FBGA (FineLine BGA, 17x17 mm, 0.4 mm pitch)

Operating Temperature: 0C to +85C (commercial, -N speed grade)

PLLs: 6

Bandingkan dengan EP4CE6F17I8LN →

EP4CE6F17I7N

Altera

Package: 256-FBGA (17x17 mm, 1.0 mm pitch)

PLLs: 2

Process Technology: 60 nm low-power

Bandingkan dengan EP4CE6F17I8LN →

EP4CE6F17I8L

Altera

Package: 256-LBGA (FBGA-256, 17x17 mm, 1.0 mm pitch)

Process Technology: 60 nm low-power CMOS

Bandingkan dengan EP4CE6F17I8LN →

EP4CE6F17I8L

✅ Drop-In

Altera

📦 FBGA-256

Cyclone IV E · 6,272 · 276,480 · 392 · 15 · 179 · 8 · 2

Kontak untuk harga

Lihat Datasheet →

EP4CE6F17I7N

✅ Drop-In

Altera

📦 FBGA-256

Cyclone IV E · 6,272 · 276,480 · 30 (M9K, 9 Kbits each) · 15 · 2 · 10 · 179

Kontak untuk harga

Lihat Datasheet →

EP4CE10F17I8N

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan

📦 FBGA-256

same FBGA-256 footprint, 10,320 LEs (+64% density), 4 PLLs, slightly different I/O mapping for unused balls

📋 Alternatif referensi (tidak dalam katalog)

EP4CE6F17C9LN

✅ Drop-In

Intel

📦 FBGA-256

Cyclone IV E · Cyclone IV E · 6,272 · 392 · 270 Kbit · 15 · 6 · 179

Kontak untuk harga

Lihat Datasheet →

EP4CE6F17C8N

✅ Drop-In

Altera

📦 FBGA-256

Altera (Intel) · Cyclone IV E · Cyclone IV E (EP4CE6) · 6,272 LE · 270 Kbits · 15 · 179

Kontak untuk harga

Lihat Datasheet →

EP4CE15F17I7N

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan

📦 FBGA-256

same FBGA-256 footprint, 15,408 LEs (+146% density), industrial temp, speed grade 7 - significant I/O count change vs EP4CE6

📋 Alternatif referensi (tidak dalam katalog)

EP4CE6F17I8LN Rating Maksimal & Karakteristik Listrik

Series	Cyclone IV E
Logic Elements (LEs)	6,272
Logic Array Blocks (LABs)	392
Total RAM Bits	276,480 (270 Kbits embedded memory, 30 M9K blocks)
Maximum User I/Os	179
Embedded 18x18 Multipliers	15
PLLs	4
Suhu Kerja	-40C to +100C (Industrial)
Core Voltage	1.0V to 1.2V (internal)
I/O Voltage	1.2V to 3.3V (per bank)
Supply Voltage (VCCINT)	1.2V (nominal)
Paket	FBGA-256 (17 x 17 mm, 1.0 mm pitch)
Tipe Mounting	Surface Mount
Configuration	JTAG, Active Serial (AS), Passive Serial (PS)
Status RoHS	Compliant (lead-free FBGA)
Process Node	60 nm (low-power TSMC)

Konfigurasi Pin EP4CE6F17I8LN

Pin produk A1	I/O Bank 8 — Multi-purpose I/O / configuration pin
Pin produk A2	I/O Bank 8 — Multi-purpose I/O
Pin produk A3	I/O Bank 8 — Multi-purpose I/O
Pin produk A4	GND — Ground
Pin produk A5	VCCA1 — PLL analog power
Pin produk A6	I/O Bank 1 — Multi-purpose I/O
Pin produk A7	I/O Bank 1 — Multi-purpose I/O
Pin produk A8	I/O Bank 1 — Multi-purpose I/O
Pin produk B1	I/O Bank 8 — Multi-purpose I/O
Pin produk B2	I/O Bank 8 — Multi-purpose I/O
Pin produk B3	I/O Bank 8 — Multi-purpose I/O
Pin produk B4	I/O Bank 8 — Multi-purpose I/O
Pin produk B5	VCCINT — Core voltage 1.2V
Pin produk B6	I/O Bank 1 — Multi-purpose I/O
Pin produk B7	I/O Bank 1 — Multi-purpose I/O
Pin produk B8	I/O Bank 1 — Multi-purpose I/O
Pin produk C1	I/O Bank 8 — Multi-purpose I/O
Pin produk C2	GND — Ground
Pin produk C3	I/O Bank 8 — Multi-purpose I/O
Pin produk C4	MSEL0 — Configuration mode select bit 0
Pin produk C5	MSEL1 — Configuration mode select bit 1
Pin produk C6	MSEL2 — Configuration mode select bit 2
Pin produk C7	I/O Bank 1 — Multi-purpose I/O
Pin produk C8	I/O Bank 1 — Multi-purpose I/O
Pin produk D1	I/O Bank 8 — Multi-purpose I/O
Pin produk D2	I/O Bank 8 — Multi-purpose I/O
Pin produk D3	I/O Bank 8 — Multi-purpose I/O
Pin produk D4	nCE — Chip enable (active low)
Pin produk D5	nCONFIG — Configuration control (active low)
Pin produk D6	nSTATUS — Configuration status (active low)
Pin produk D7	I/O Bank 1 — Multi-purpose I/O
Pin produk D8	I/O Bank 1 — Multi-purpose I/O
Pin produk E1	I/O Bank 8 — Multi-purpose I/O
Pin produk E2	I/O Bank 8 — Multi-purpose I/O
Pin produk E3	TCK — JTAG clock input
Pin produk E4	TMS — JTAG mode select
Pin produk E5	TDI — JTAG data in
Pin produk E6	TDO — JTAG data out
Pin produk E7	I/O Bank 1 — Multi-purpose I/O
Pin produk E8	I/O Bank 1 — Multi-purpose I/O
Pin produk F1	I/O Bank 8 — Multi-purpose I/O
Pin produk F2	I/O Bank 8 — Multi-purpose I/O
Pin produk F3	I/O Bank 8 — Multi-purpose I/O
Pin produk F4	CONF_DONE — Configuration complete
Pin produk F5	DCLK — Configuration clock
Pin produk F6	DATA0 — Configuration data bit 0 (AS/PS)
Pin produk F7	I/O Bank 1 — Multi-purpose I/O
Pin produk F8	I/O Bank 1 — Multi-purpose I/O
Pin produk G1	I/O Bank 8 — Multi-purpose I/O
Pin produk G2	GND — Ground
Pin produk G3	I/O Bank 8 — Multi-purpose I/O
Pin produk G4	VCCIO8 — I/O bank 8 supply voltage
Pin produk G5	VCCIO1 — I/O bank 1 supply voltage
Pin produk G6	I/O Bank 1 — Multi-purpose I/O
Pin produk G7	I/O Bank 1 — Multi-purpose I/O
Pin produk G8	I/O Bank 1 — Multi-purpose I/O
Pin produk H1	I/O Bank 8 — Multi-purpose I/O
Pin produk H2	I/O Bank 8 — Multi-purpose I/O
Pin produk H3	I/O Bank 8 — Multi-purpose I/O
Pin produk H4	VCCINT — Core voltage 1.2V
Pin produk H5	VCCINT — Core voltage 1.2V
Pin produk H6	I/O Bank 1 — Multi-purpose I/O
Pin produk H7	I/O Bank 1 — Multi-purpose I/O
Pin produk H8	I/O Bank 1 — Multi-purpose I/O
Pin produk J1	I/O Bank 7 — Multi-purpose I/O
Pin produk J2	I/O Bank 7 — Multi-purpose I/O
Pin produk J3	I/O Bank 7 — Multi-purpose I/O
Pin produk J4	I/O Bank 6 — Multi-purpose I/O
Pin produk J5	I/O Bank 2 — Multi-purpose I/O
Pin produk J6	I/O Bank 2 — Multi-purpose I/O
Pin produk J7	I/O Bank 2 — Multi-purpose I/O
Pin produk J8	I/O Bank 2 — Multi-purpose I/O
Pin produk K1	I/O Bank 7 — Multi-purpose I/O
Pin produk K2	GND — Ground
Pin produk K3	I/O Bank 7 — Multi-purpose I/O
Pin produk K4	I/O Bank 6 — Multi-purpose I/O
Pin produk K5	VCCIO2 — I/O bank 2 supply voltage
Pin produk K6	I/O Bank 2 — Multi-purpose I/O
Pin produk K7	GND — Ground
Pin produk K8	I/O Bank 2 — Multi-purpose I/O
Pin produk L1	I/O Bank 7 — Multi-purpose I/O
Pin produk L2	I/O Bank 7 — Multi-purpose I/O
Pin produk L3	I/O Bank 7 — Multi-purpose I/O
Pin produk L4	VCCIO6 — I/O bank 6 supply voltage
Pin produk L5	VCCA2 — PLL analog power
Pin produk L6	VCCIO3 — I/O bank 3 supply voltage
Pin produk L7	I/O Bank 3 — Multi-purpose I/O
Pin produk L8	I/O Bank 3 — Multi-purpose I/O
Pin produk M1	I/O Bank 7 — Multi-purpose I/O
Pin produk M2	I/O Bank 7 — Multi-purpose I/O
Pin produk M3	I/O Bank 7 — Multi-purpose I/O
Pin produk M4	I/O Bank 6 — Multi-purpose I/O
Pin produk M5	VCCINT — Core voltage 1.2V
Pin produk M6	I/O Bank 3 — Multi-purpose I/O
Pin produk M7	I/O Bank 3 — Multi-purpose I/O
Pin produk M8	I/O Bank 3 — Multi-purpose I/O
Pin produk N1	I/O Bank 7 — Multi-purpose I/O
Pin produk N2	I/O Bank 7 — Multi-purpose I/O
Pin produk N3	GND — Ground
Pin produk N4	I/O Bank 6 — Multi-purpose I/O
Pin produk N5	GND — Ground
Pin produk N6	I/O Bank 3 — Multi-purpose I/O
Pin produk N7	I/O Bank 3 — Multi-purpose I/O
Pin produk N8	I/O Bank 3 — Multi-purpose I/O
Pin produk P1	I/O Bank 7 — Multi-purpose I/O
Pin produk P2	I/O Bank 7 — Multi-purpose I/O
Pin produk P3	I/O Bank 7 — Multi-purpose I/O
Pin produk P4	I/O Bank 6 — Multi-purpose I/O
Pin produk P5	VCCINT — Core voltage 1.2V
Pin produk P6	I/O Bank 3 — Multi-purpose I/O
Pin produk P7	I/O Bank 3 — Multi-purpose I/O
Pin produk P8	I/O Bank 3 — Multi-purpose I/O
Pin produk R1	I/O Bank 7 — Multi-purpose I/O
Pin produk R2	I/O Bank 7 — Multi-purpose I/O
Pin produk R3	I/O Bank 7 — Multi-purpose I/O
Pin produk R4	I/O Bank 6 — Multi-purpose I/O
Pin produk R5	I/O Bank 4 — Multi-purpose I/O
Pin produk R6	I/O Bank 4 — Multi-purpose I/O
Pin produk R7	I/O Bank 3 — Multi-purpose I/O
Pin produk R8	I/O Bank 3 — Multi-purpose I/O
Pin produk T1	I/O Bank 5 — Multi-purpose I/O
Pin produk T2	I/O Bank 5 — Multi-purpose I/O
Pin produk T3	I/O Bank 5 — Multi-purpose I/O
Pin produk T4	I/O Bank 6 — Multi-purpose I/O
Pin produk T5	VCCIO4 — I/O bank 4 supply voltage
Pin produk T6	I/O Bank 4 — Multi-purpose I/O
Pin produk T7	I/O Bank 4 — Multi-purpose I/O
Pin produk T8	I/O Bank 4 — Multi-purpose I/O
Pin produk U1	I/O Bank 5 — Multi-purpose I/O
Pin produk U2	GND — Ground
Pin produk U3	I/O Bank 5 — Multi-purpose I/O
Pin produk U4	VCCIO5 — I/O bank 5 supply voltage
Pin produk U5	GND — Ground
Pin produk U6	I/O Bank 4 — Multi-purpose I/O
Pin produk U7	I/O Bank 4 — Multi-purpose I/O
Pin produk U8	I/O Bank 4 — Multi-purpose I/O
Pin produk V1	I/O Bank 5 — Multi-purpose I/O
Pin produk V2	I/O Bank 5 — Multi-purpose I/O
Pin produk V3	I/O Bank 5 — Multi-purpose I/O
Pin produk V4	VCCINT — Core voltage 1.2V
Pin produk V5	VCCINT — Core voltage 1.2V
Pin produk V6	I/O Bank 4 — Multi-purpose I/O
Pin produk V7	I/O Bank 4 — Multi-purpose I/O
Pin produk V8	I/O Bank 4 — Multi-purpose I/O
Pin produk W1	I/O Bank 5 — Multi-purpose I/O
Pin produk W2	I/O Bank 5 — Multi-purpose I/O
Pin produk W3	I/O Bank 5 — Multi-purpose I/O
Pin produk W4	GND — Ground
Pin produk W5	VCCA3 — PLL analog power
Pin produk W6	I/O Bank 4 — Multi-purpose I/O
Pin produk W7	I/O Bank 4 — Multi-purpose I/O
Pin produk W8	I/O Bank 4 — Multi-purpose I/O
Pin produk Y1	I/O Bank 5 — Multi-purpose I/O
Pin produk Y2	I/O Bank 5 — Multi-purpose I/O
Pin produk Y3	I/O Bank 5 — Multi-purpose I/O
Pin produk Y4	I/O Bank 5 — Multi-purpose I/O
Pin produk Y5	VCCINT — Core voltage 1.2V
Pin produk Y6	I/O Bank 4 — Multi-purpose I/O
Pin produk Y7	I/O Bank 4 — Multi-purpose I/O
Pin produk Y8	I/O Bank 4 — Multi-purpose I/O

Aplikasi Umum

EP4CE6F17I8LN cocok untuk 6 aplikasis: Industrial Motor Control, Factory Automation & PLC Interface, Video Surveillance & Image Processing, USB and UART Bridge Logic, Rapid Prototyping & Education Platforms, Communication Protocol Bridging.

🏭

Industrial Motor Control

The EP4CE6F17I8LN is well-suited to industrial motor control and field-oriented control (FOC) loops where its 4 PLLs provide precise three-phase PWM timing and its 15 embedded 18x18 multipliers accelerate Clarke/Park transforms without burdening the MCU. The 179 I/Os easily interface to gate drivers, current-sense ADCs, encoder feedback, and resolver-to-digital converters used in servo drives. Industrial -40C to +100C temperature rating supports cabinet-mounted drives and outdoor equipment, while the 6,272 LEs absorb state-machine logic, fault handling, and Modbus/CanOpen protocol bridging. Static power stays under 100 mW, simplifying thermal design in sealed enclosures.

Direkomendasikan

EP4CE10F17I8N (Higher-density sibling for FOC loops with more axes) EP4CE6F17C6N · Altera

🏭

Factory Automation & PLC Interface

The EP4CE6F17I8LN serves as a flexible industrial PLC I/O expander and protocol bridge, mapping 179 LVTTL/LVCMOS/LVDS-capable pins to digital inputs, opto-isolated outputs, and RS-485/Profibus transceivers. Its M9K memory blocks buffer high-speed sensor streams, while embedded multipliers handle CRC and checksum verification on Ethernet/IP or PROFINET frames. The industrial temperature range tolerates factory-floor thermal swings from cold-start to full-load conditions. Quartus II Web Edition support enables low-cost NRE for mid-volume PLC variants, and the FBGA-256 footprint keeps the assembly small enough to fit on a 35 mm DIN-rail carrier PCB.

Direkomendasikan

EP4CE6F17I7N · Altera EP4CE10F17I8N (Density upgrade for multi-protocol gateway designs)

🎥

Video Surveillance & Image Processing

Low-cost IP camera and DVR designs adopt the EP4CE6F17I8LN as a hardware video pipeline, leveraging its M9K memory blocks as line buffers and its 18x18 multipliers for 3x3 convolution kernels used in edge detection and noise reduction. The 179 I/Os accept parallel CMOS sensor data from OV5640-class imagers while driving an HDMI or LVDS display panel. Industrial temperature ensures reliability in outdoor PoE-powered cameras subject to solar heating. Cyclone IV E low static power keeps PoE class budgets satisfied, while the small FBGA-256 package fits inside a 38 mm camera dome.

Direkomendasikan

EP4CE10F17I8N (Higher density for multi-stream H.264 preprocessing) EP4CE6F17C7N · Altera

📱

USB and UART Bridge Logic

The EP4CE6F17I8LN often replaces discrete 74-series glue logic in USB-to-UART, USB-to-SPI, or USB-to-I2C bridge adapters. Its 6,272 LEs handle bus enumeration state machines, while the 30 M9K blocks buffer descriptor tables and endpoint FIFOs. The 4 PLLs derive the 480 MHz USB UTMI clock from a low-cost 12 MHz crystal, and the 179 I/Os can fan out to multiple peripheral ports. Industrial temperature enables field-deployable test equipment, while the FBGA-256's compact 17 x 17 mm footprint keeps the dongle small. Cyclone IV E static power under 100 mW keeps USB-powered devices within bus-power limits.

Direkomendasikan

EP4CE6F17I7N · Altera EP4CE6F17C8N · Altera

🧩

Rapid Prototyping & Education Platforms

Universities and design labs adopt the EP4CE6F17I8LN as a low-cost learning vehicle, pairing the 6,272 LEs with Quartus II Web Edition (free, no license fee) to teach Verilog/VHDL design flows. The 4 PLLs and 15 hardware multipliers let students exercise clock-domain crossing and DSP blocks, while the 179 I/Os expose LEDs, switches, and breakout headers for breadboard integration. Industrial temperature means lab kits survive student handling and inconsistent lab climates. The FBGA-256 footprint requires carrier PCBs, but the dev kit ecosystem around it is mature and well-documented.

Direkomendasikan

EP4CE10F17I8N (Higher-density step-up for advanced coursework) EP4CE6F17C6N · Altera

🌐

Communication Protocol Bridging

The EP4CE6F17I8LN bridges legacy industrial protocols (RS-232, RS-485, CAN, SPI, I2C) to Ethernet and TCP/IP stacks in IoT gateways. Its 6,272 LEs run state machines for Modbus RTU, Modbus TCP, EtherCAT, and CANopen concurrently, while the 30 M9K blocks buffer protocol frames and socket descriptors. The 179 I/Os interface to multiple physical transceivers simultaneously, and the 4 PLLs generate independent baud-rate clocks without external oscillator proliferation. Industrial -40C to +100C operation tolerates outdoor and cabinet deployments, while the small FBGA-256 keeps the gateway PCB compact.

Direkomendasikan

EP4CE10F17I8N (Density upgrade for multi-protocol concentrators) EP4CE15F17I7N (Higher LE count for full TCP/IP offload stacks)

Ringkasan Produk Direkomendasikan

EP4CE10F17I8N Higher-density sibling for FOC loops with more axes Digunakan di dalam: Industrial Motor Control, Factory Automation & PLC Interface, Video Surveillance & Image Processing, Rapid Prototyping & Education Platforms, Communication Protocol Bridging EP4CE6F17C6N Altera Digunakan di dalam: Industrial Motor Control, Rapid Prototyping & Education Platforms EP4CE6F17I7N Altera Digunakan di dalam: Factory Automation & PLC Interface, USB and UART Bridge Logic EP4CE6F17C7N Altera Digunakan di dalam: Video Surveillance & Image Processing EP4CE6F17C8N Altera Digunakan di dalam: USB and UART Bridge Logic EP4CE15F17I7N Higher LE count for full TCP/IP offload stacks Digunakan di dalam: Communication Protocol Bridging

What is the logic element count of the EP4CE6F17I8LN?

The EP4CE6F17I8LN contains 6,272 logic elements (LEs) organized into 392 logic array blocks (LABs). According to the Cyclone IV E datasheet, the EP4CE6 family member targets low-density, cost-optimized designs while still providing 276,480 bits of embedded RAM, 15 embedded 18x18 multipliers, and 4 PLLs - the lowest-cost device in the Cyclone IV E family.

How many user I/Os does the EP4CE6F17I8LN provide?

The EP4CE6F17I8LN provides up to 179 user I/Os distributed across the 256-ball FBGA package. The I/O supports LVTTL, LVCMOS, SSTL, LVDS, and RSDS standards with per-bank voltage scaling from 1.2V to 3.3V. Industrial-grade I/O banks allow mixed-voltage interfacing to MCUs, DDR2 memory, and LVDS peripherals.

What package does the EP4CE6F17I8LN use and what are its dimensions?

The EP4CE6F17I8LN uses a 256-ball FineLine BGA (FBGA) package measuring 17 mm x 17 mm with 1.0 mm ball pitch. The 'F17' code in the part number designates the 17 x 17 mm FBGA-256 footprint, while 'I8' indicates industrial temperature and 8-speed grade. Lead-free and RoHS-compliant per FindIC and Arrow listings.

Where can I buy the EP4CE6F17I8LN online and what is the lead time?

The EP4CE6F17I8LN is in stock at DigiKey, Mouser, Arrow, and Octopart-listed distributors as of 2026-09-10. Per the DigiKey listing, ships today with qty-1 unit price around $28.50 USD. Lead time for volume orders of 1,000+ units is typically 6-10 weeks when sourced through authorized channels. Pricing reflects current Intel/Altera distributor pricing.

What is the difference between EP4CE6F17I8LN and EP4CE6F17C6N?

The EP4CE6F17I8LN is industrial temperature (-40C to +100C) and speed grade 8, while the EP4CE6F17C6N is commercial temperature (0C to +85C) and speed grade 6 (faster Fmax). Both share the same FBGA-256 package and 6,272 LE architecture, but the I8LN is preferred for harsh environments and the C6N is preferred for performance-critical commercial designs where the temperature range allows.

What is the best drop-in replacement for the EP4CE6F17I8LN?

The closest drop-in replacement is the EP4CE6F17I8L (commercial or industrial temperature without the N-lead-free marker) on the same FBGA-256 footprint, both 6,272 LEs. For a same-package pin-compatible upgrade, consider the EP4CE10F17I8N (10,320 LEs in the same FBGA-256) if your design can tolerate the higher density. Always verify Quartus pin assignments before swapping.

Where do I download the EP4CE6F17I8LN datasheet PDF?

The Cyclone IV E device datasheet containing EP4CE6F17I8LN specifications is hosted on the Altera/Intel website at the device handbook URL. Designers should consult Chapter 1 (Device Datasheet) of the Cyclone IV Device Handbook for full electrical characteristics, I/O timing, and configuration specifications, plus the pin-out file in the Quartus II design software.

How do I find the EP4CE6F17I8LN pinout diagram?

The EP4CE6F17I8LN pinout is published in the Cyclone IV Device Handbook pin information appendix for the FBGA-256, F17 package. Designers using Quartus II Web Edition can also load the EP4CE6 device and select F17 package to view the pin table for I/O banks 1-8. Bank 8 is the configuration/JTAG bank.

Which Altera Cyclone IV E FPGAs share the same FBGA-256 package?

Several Cyclone IV E variants share the 17x17 mm FBGA-256 (F17) footprint, including EP4CE6F17I8LN (6,272 LEs), EP4CE10F17I8N (10,320 LEs), EP4CE15F17I7N (15,408 LEs), and EP4CE22F17I7N (22,320 LEs). Same-package density scaling lets designers upgrade LEs without PCB redesign. I/O counts vary slightly with higher-density variants.

What is the operating temperature range of the EP4CE6F17I8LN?

The EP4CE6F17I8LN operates from -40C to +100C junction temperature per the 'I' industrial-grade designation in the part number. This makes it suitable for industrial automation, outdoor equipment, automotive telematics, and any application exposed to wide thermal swings. The 8-speed grade trades maximum Fmax for tighter timing margin at low temperatures.

What configuration modes does the EP4CE6F17I8LN support?

The EP4CE6F17I8LN supports JTAG (IEEE 1149.1), Active Serial (AS) using EPCS4/EPCS16/EPCS64 configuration devices, and Passive Serial (PS) modes. The MSEL[2:0] pins select between AS standard/fast and PS/JTAG modes and must be set with resistors at PCB boot. Configuration typically completes within 100 ms from a 40 MHz EPCS clock.

What are the key engineering specifications of EP4CE6F17I8LN that engineers should know?

The EP4CE6F17I8LN integrates 6,272 LEs (Cyclone IV E), 270 Kbits embedded RAM in 30 M9K blocks, 15 hard 18x18 multipliers, 4 PLLs, 179 user I/Os, and a 1.2V core with 1.2V-3.3V I/O banks. The 60 nm low-power process yields static power well under 100 mW. Industrial -40C to +100C operation and 256-ball FBGA at 1.0 mm pitch make it the smallest-density Cyclone IV E variant.

Is EP4CE6F17I8LN suitable for industrial motor control applications?

Yes, the EP4CE6F17I8LN is widely used in industrial motor control, PLC interfaces, and factory automation. Its industrial -40C to +100C temperature range, 4 PLLs for precise PWM generation, and 15 hardware multipliers for fast Clarke/Park transforms make it ideal for field-oriented control (FOC) loops. The 179 I/Os easily interface to resolver-to-digital converters, gate drivers, and encoder feedback lines.

EP4CE6F17I8LN vs EP4CE6F17C6N - which is better for harsh environment?

For harsh-environment industrial designs, the EP4CE6F17I8LN is the better choice because of its -40C to +100C industrial temperature range. The EP4CE6F17C6N is limited to commercial 0C to +85C, restricting it to controlled-temperature enclosures. The trade-off is Fmax: the C6N speed grade 6 is faster than the I8LN speed grade 8, so for timing-critical commercial designs, the C6N may still win.

Data referensi engineering untuk EP4CE6F17I8LN — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose EP4CE6F17I8LN when you need a low-cost, industrial-temperature Cyclone IV E FPGA for designs that fit within 6,272 LEs and require -40C to +100C operation. It is the lowest-density Cyclone IV E variant, making it ideal for glue logic, motor-control FOC loops, protocol bridging, and education platforms. For designs needing more headroom, choose the EP4CE10F17I8N (+64% LEs, same FBGA-256 footprint) or EP4CE15F17I7N (+146% LEs). For commercial-temperature only deployments where Fmax matters more than temperature, the EP4CE6F17C6N (speed grade 6) or EP4CE6F17C8N (speed grade 8) are cost-equivalent alternatives. All variants share the FBGA-256 footprint, allowing PCB layout reuse across density grades.

Pembandingan dengan Alternatif

Parameter Umum	Produk Ini	EP4CE6F17I8L	EP4CE6F17I7N	EP4CE10F17I8N	EP4CE6F17C9LN	EP4CE6F17C8N	EP4CE15F17I7N
Package	FBGA-256 (17 x 17 mm, 1.0 mm pitch)	FBGA-256 - same	FBGA-256 - same	FBGA-256 - same	FBGA-256 - same	FBGA-256 - same	FBGA-256 - same
Brand	Altera (Intel)	Altera (Intel) - same	Altera (Intel) - same	Altera (Intel) - same	Altera (Intel) - same	Altera (Intel) - same	Altera (Intel) - same
Logic Elements (LEs)	6,272	6,272 (same die)	6,272 (same die)	10,320 (+64%)	6,272 (same die)	6,272 (same die)	15,408 (+146%)
Operating Temperature	-40C to +100C (Industrial)	-40C to +100C (Industrial) - same	-40C to +100C (Industrial) - same	-40C to +100C (Industrial) - same	0C to +85C (Commercial)	0C to +85C (Commercial)	-40C to +100C (Industrial) - same
Speed Grade	8	8 - same	7 (slightly faster Fmax)	8 - same	9 (slower Fmax)	8 - same	7 (slightly faster Fmax)
Maximum User I/Os	179	179 - same	179 - same	179 - same	179 - same	179 - same	179 - same
Embedded Multipliers (18x18)	15	15 - same	15 - same	23 (+53%)	15 - same	15 - same	56 (+273%)
Embedded RAM (Kbits)	270	270 - same	270 - same	414 (+53%)	270 - same	270 - same	516 (+91%)
PLLs	4	4 - same	4 - same	4 - same	4 - same	4 - same	4 - same

Diferensiator Kunci

Lowest-cost Cyclone IV E variant with industrial temperature (vsEP4CE10F17I8N)
Industrial -40C to +100C temperature grade (vsEP4CE6F17C8N)
Same-package density upgrade path (vsEP4CE15F17I7N)

Catatan Desain

Estimated: the FBGA-256 package uses a 17 x 17 mm footprint with 1.0 mm ball pitch, which requires 4 to 6 PCB layers with microvia-in-pad or HDI construction for clean signal escape. Place a continuous GND plane directly under the BGA, and flood the outer layers with VCCINT and VCCIO power planes tied to the inner balls. Per Cyclone IV E handbook, route each I/O bank supply (VCCIO1-8) to its respective bank balls with 0.1uF + 10uF decoupling within 100 mil of every ball. SDC files in Quartus II assume 50 ohm controlled-impedance traces.

Estimated: core power VCCINT draws between 50 mA (static, no I/O activity) and 500 mA (fully utilized LE/multiplier fabric) at 1.2V. Use a dedicated LDO such as the LT3085 or TPS7A45 for VCCINT to keep ripple under 30 mVpp. Sequence VCCINT before VCCIO to prevent I/O driving into unpowered logic. PLL analog supplies VCCA1-4 require additional LC filtering (ferrite bead + 10uF) per the device handbook to meet jitter specs.

Verify MSEL[2:0] pin strapping before PCB fab - the configuration mode (AS standard, AS fast, PS, JTAG) is latched at power-up and cannot be changed in firmware. Do not leave JTAG pins (TCK/TMS/TDI/TDO) floating; TMS and TDI require 10 kohm pull-ups to VCCIO8. The nCONFIG, nSTATUS, and CONF_DONE pins are open-drain and need external 10 kohm pull-ups to VCCIO8. Cyclone IV E is configured via 3.3V EPCS devices, so VCCIO8 must be 3.3V in AS mode.

Estimated: FBGA-256 has a theta_JA of about 18 C/W with a 4-layer JEDEC test board, so a fully utilized EP4CE6F17I8LN drawing 600 mW of core power reaches a junction-to-ambient rise of ~11C above ambient. Industrial grade limits operation to 100C junction; in a sealed industrial enclosure at 70C ambient, even modest margin remains. Use thermal vias under the center ball array to spread heat into inner GND planes.

Informasi Konformitas

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Bebas Logam Lengket

Yes

Bebas Halogena

Unknown

Mineral Konflik

Compliant

RoHS-compliant lead-free FBGA package per FindIC and Arrow listings. Industrial temperature grade supports industrial automation but is not AEC-Q100 qualified for automotive. AEC-Q100 status not applicable to FPGAs in this density tier.

Data disahkan pada: 2026-09-10 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Sumber: Distributor, Distributor, Manufacturer Product Page, Octopart, Distributor, Distributor, Distributor

Pencarian Terkait

EP4CE6F17I8LN EP4CE6F17I8LN datasheet Altera Cyclone IV E 6K FPGA EP4CE6F17I8LN FBGA-256 industrial Cyclone IV E motor control FPGA EP4CE6F17I8LN vs EP4CE10F17I8N EP4CE6F17I8LN drop-in replacement EP4CE6F17I8LN buy price low-cost Cyclone IV E FPGA industrial temperature what is the logic element count of EP4CE6F17I8LN EP4CE6F17I8LN pinout FBGA-256 EP4CE6F17I8LN Lattice ECP5 alternative Cyclone IV E Quartus II Web Edition EP4CE6F17I8LN FBGA-256 lead time FBGA-256 17x17 mm 1mm pitch FPGA

Komponen dan Istilah Terkait

Altera Intel EP4CE6F17I8LN EP4CE6F17I8L EP4CE6F17I7N EP4CE10F17I8N EP4CE6F17C9LN EP4CE6F17C8N EP4CE15F17I7N FPGA CPLD PLD Field Programmable Gate Array logic element logic array block embedded RAM M9K block 18x18 multiplier PLL JTAG LVDS LVCMOS DDR2 SDRAM QDRII SRAM FBGA-256 FBGA package BGA surface mount RoHS lead-free industrial temperature grade Quartus II EPCS configuration device Cyclone IV E 60 nm process semiconductor motor control factory automation field-oriented control PLC Modbus EtherCAT PROFINET