Intel

EP4CE115F23C8N - Cyclone IV E FPGA 114K LE 484-BGA | Intel

Référence : EP4CE115F23C8N ✓ Actif

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1.2 V Vdss 484-ball FineLine BGA (F23) Package C8 Speed 3,981,312 bits (3.8 Mbit) Memory

À partir de $145 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-09

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$323.39	$323,39
10	$285.5	$2 855,00
100	$220	$22 000,00
500	$175	$87 500,00
1 000	$145	$145 000,00

ℹ️ Tous les prix sont en USD

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EP4CE115F23C8N Présentation

The Intel EP4CE115F23C8N is a Cyclone IV E Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA package, delivering 114,480 logic elements, 280 user I/Os, and 3,981,312 bits of embedded memory (approximately 3.8 Mbits) on a low-power 60 nm process. It is the largest density option in the Cyclone IV E family, designed for cost-sensitive, high-volume applications that still require substantial logic capacity.

A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O cells can be programmed by the customer after manufacture. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), alongside simpler CPLDs, and above fixed-function ASICs in design flexibility. The Cyclone IV E family targets the mid-density segment, balancing cost, power, and performance for industrial, consumer, and communications designs.

Key features of the EP4CE115F23C8N include 114,480 logic elements arranged in an architecture of adaptive logic modules (ALMs), 432 embedded 18x18 multipliers for DSP-style signal processing, 280 general-purpose I/Os supporting LVDS, LVCMOS, SSTL, and other single-ended and differential standards, and dedicated embedded memory blocks totaling 3.8 Mbits. The device supports up to four general-purpose PLLs for clock management and serialization.

The Cyclone IV E architecture uses a 60 nm low-power process with a 1.2 V core supply, achieving substantially lower static and dynamic power than the previous Cyclone III generation. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes using industry-standard SRAM-based programming cells. The 484-BGA FineLine BGA package offers a 1.0 mm ball pitch, suitable for multilayer PCBs in mid-to-high-complexity designs.

Typical applications for the EP4CE115F23C8N include industrial motor control and machine vision, video processing and display bridges, telecom line cards, automotive driver-assistance pre-processing, and embedded control in test and measurement equipment. The combination of high logic density, embedded multipliers, and rich I/O makes it well-suited for designs that previously required larger or more expensive FPGAs.

When designing with this device, plan power decoupling around each PLL region and use the Quartus II / Quartus Prime toolchain for synthesis, place-and-route, and timing closure. Verify signal-integrity on high-speed LVDS pairs and confirm ball-pattern compatibility against any proposed migration part before PCB respin.

This page synthesizes distributor pricing, package information, drop-in alternatives, and design considerations not found in a single manufacturer datasheet, helping engineers evaluate the EP4CE115F23C8N for new designs or as a replacement candidate in legacy projects.

Alternatives de remplacement direct pour EP4CE115F23C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP4CE115F23C8N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Embedded 18x18 Multipliers, Configuration Modes, Family.

EP4CE115F23I7N

Intel

Package: 484-FBGA (F23) 23x23 mm, 1.0 mm pitch

Process Technology: 60 nm low-power CMOS (TSMC)

Family: EP4CE115 (F23 package)