EP4CGX150DF31I7 - Cyclone IV GX FPGA 150K LE 896-FBGA | Altera
Référence : EP4CGX150DF31I7 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $341.02 | $341,02 |
| 10 | $327.85 | $3 278,50 |
| 100 | $295.4 | $29 540,00 |
| 500 | $268.1 | $134 050,00 |
| 1 000 | $242.55 | $242 550,00 |
EP4CGX150DF31I7 Présentation
A Field Programmable Gate Array (FPGA) is a programmable semiconductor that allows designers to configure digital logic, memory, and I/O after fabrication using a hardware description language and a configuration bitstream. Within the broader hierarchy, the EP4CGX150DF31I7 belongs to the PLD (Programmable Logic Device) -> FPGA -> Low-Power FPGA -> Transceiver FPGA taxonomy, optimized for cost-sensitive serial connectivity in industrial, communication, and broadcast equipment.
Key features of the EP4CGX150DF31I7 include 720 Kbits of distributed RAM plus 5,580 Kbits of block RAM, 6 PLLs, dedicated hardware multipliers for DSP, and 8 transceivers supporting PCIe Gen1, Gigabit Ethernet, CPRI, and basic serial protocols. The architecture provides up to 472.5 MHz maximum core frequency and an I/O system supporting LVDS, SSTL, and HSTL standards for memory and high-speed parallel interfaces.
Technically, the EP4CGX150DF31I7 uses a Look-Up Table (LUT)-based fabric wrapped by embedded memory blocks (M9K), 18x18 multipliers, and embedded transceiver tiles. The 896-ball FBGA package delivers the I/O density required for wide memory buses while maintaining signal integrity for LVDS links. Compared to the EP4CGX110 series, this device adds 40% more logic capacity, more block RAM, and additional transceiver channels for bandwidth-intensive designs.
Typical applications include industrial video surveillance with GigE Vision, low-cost wireless baseband processing, PCIe endpoint cards, broadcast video processing, and motor control. The combination of transceivers and DSP blocks makes it well-suited for software-defined radio and signal acquisition front-ends.
Design consideration: PCB layout for the FBGA-896 package requires microvia stack-up, length-matched differential pairs for the transceiver lanes, and proper decoupling with 0.1 uF and 0.01 uF capacitors adjacent to every power pin. Thermal management relies on the exposed die providing the primary heat path.
This page synthesizes distributor pricing, drop-in Cyclone IV GX family variants, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EP4CGX150DF31I7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CGX150DF31I7 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, RoHS Status, Device Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CGX150DF31I7N
✅ Remplacement direct✓ En stock
$285 / unité
Voir la fiche technique →EP4CGX150DF31C8N
✅ Remplacement direct✓ En stock
$210 / unité
Voir la fiche technique →EP4CGX150DF31C7N
✅ Remplacement direct✓ En stock
$198.45 / unité
Voir la fiche technique →EP4CGX150DF27I7N
✅ Remplacement direct✓ En stock
$175.6 / unité
Voir la fiche technique →EP4CGX110DF31I7N
✅ Remplacement direct✓ En stock
$192.4 / unité
Voir la fiche technique →EP4CGX150DF31I7 Valeurs maximales et caractéristiques électriques
| Series | Cyclone IV GX |
| Device Family | Cyclone IV GX (EP4CGX150) |
| Logic Elements (LE) | 149,760 |
| Logic Array Blocks (LABs) | 9,360 |
| Embedded Memory (Total) | 6,635,520 bits (6,480 Kbits) |
| User I/O Pins | 475 |
| Transceiver Channels | 8 (up to 3.125 Gbps) |
| PLLs | 6 |
| Global Clock Networks | 20 |
| Maximum Core Frequency | 472.5 MHz |
| Core Supply Voltage | 1.2 V |
| Process Technology | 60 nm low-power CMOS |
| Boîtier | 896-ball FBGA (F31) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Statut RoHS | Compliant |
| Configuration Mode | AS, PS, JTAP, FPP |
Configuration des broches de EP4CGX150DF31I7
| Broche A1 | VCC — Core supply 1.2 V |
| Broche A2 | GND — Ground |
| Broche A3 | I/O — User I/O bank 1 |
| Broche A4 | I/O — User I/O bank 1 |
| Broche A5 | I/O — User I/O bank 2 |
| Broche B1 | VCC — I/O supply 2.5/3.3 V |
| Broche B2 | GND — Ground |
| Broche B3 | I/O — User I/O bank 1 |
| Broche B4 | I/O — User I/O bank 1 |
| Broche B5 | I/O — User I/O bank 2 |
| Broche C1 | TX_CH1p — Transceiver channel 1 TX positive |
| Broche C2 | TX_CH1n — Transceiver channel 1 TX negative |
| Broche C3 | RX_CH1p — Transceiver channel 1 RX positive |
| Broche C4 | RX_CH1n — Transceiver channel 1 RX negative |
| Broche C5 | REFCLK_p — Transceiver reference clock positive |
| Broche D1 | TX_CH2p — Transceiver channel 2 TX positive |
| Broche D2 | TX_CH2n — Transceiver channel 2 TX negative |
| Broche D3 | RX_CH2p — Transceiver channel 2 RX positive |
| Broche D4 | RX_CH2n — Transceiver channel 2 RX negative |
| Broche D5 | REFCLK_n — Transceiver reference clock negative |
| Broche E1 | CONFIG_DONE — Configuration done signal |
| Broche E2 | nSTATUS — Configuration status |
| Broche E3 | CONF_DCLK — Configuration clock |
| Broche E4 | DATA0 — Configuration data 0 |
| Broche E5 | nCONFIG — Configuration control |
| Broche F1 | TMS — JTAG test mode select |
| Broche F2 | TCK — JTAG test clock |
| Broche F3 | TDO — JTAG test data out |
| Broche F4 | TDI — JTAG test data in |
| Broche F5 | GND — Ground |
| Broche G1 | VCC_PLL — PLL analog supply |
| Broche G2 | GND_PLL — PLL analog ground |
| Broche G3 | CLK0p — Differential clock input 0 positive |
| Broche G4 | CLK0n — Differential clock input 0 negative |
| Broche G5 | CLK1p — Differential clock input 1 positive |
Applications typiques
EP4CGX150DF31I7 convient pour 6 applications: Industrial Video Surveillance Systems, PCIe Endpoint Add-In Cards, Wireless Baseband and Software-Defined Radio, Broadcast Video Processing, Motor Control and Industrial Automation, Medical Imaging and Diagnostics.
Industrial Video Surveillance Systems
The EP4CGX150DF31I7 is well suited to multi-channel HD/4K industrial surveillance recorders where GigE Vision, SDI, or USB3 Vision camera streams must be ingested, processed, and stored. The 8 embedded transceivers at 3.125 Gbps support multiple GigE Vision or 3G-SDI inputs simultaneously, while the 149,760 logic elements plus 6,635,520 bits of block RAM handle motion detection, H.264 encoding, and overlay composition. The industrial temperature grade (-40C to +100C) allows deployment in unconditioned outdoor enclosures, and the 896-ball FBGA package supports the wide memory bus needed for DDR3 frame buffering at full HD resolution.
Recommandé
PCIe Endpoint Add-In Cards
The EP4CGX150DF31I7 includes a hard PCIe Gen1 IP block that implements x1/x2/x4 endpoint functionality without consuming FPGA fabric, leaving the 149,760 logic elements free for application logic. This makes it ideal for low-cost PCIe data acquisition cards, FPGA-based protocol analyzers, and software-defined radio receiver cards. The 8 transceivers provide additional GigE or SATA connectivity alongside the PCIe link, while the 6 PLLs and 20 global clock networks support the multiple clock domains typical of mixed-signal acquisition systems.
Recommandé
Wireless Baseband and Software-Defined Radio
The combination of 8 transceivers (up to 3.125 Gbps), 18x18 hardware multipliers, and abundant block RAM in the EP4CGX150DF31I7 enables LTE small-cell baseband, CPRI fronthaul, and software-defined radio implementations. The transceivers can directly interface with ADC/DAC companion chips over JESD204B or LVDS, while the 6 PLLs provide the multiple clock domains required for digital down-conversion and channelization. With 472.5 MHz maximum core frequency, real-time FFT and channel filtering are achievable within the fabric for sub-6 GHz signal processing.
Recommandé
Broadcast Video Processing
The EP4CGX150DF31I7 is widely deployed in broadcast equipment including SDI routers, format converters, and multi-viewers that require SDI at 3G/6G rates. The 8 transceivers natively support SDI (SMPTE 424M/425M), while the 475 user I/Os accommodate HDMI, DisplayPort, and parallel video interfaces simultaneously. Cyclone IV GX has dedicated hard IP for SDI equalization, video sync detection, and color-space conversion, offloading these tasks from the FPGA fabric and freeing logic elements for overlay, scaling, and genlock functions.
Recommandé
Motor Control and Industrial Automation
The EP4CGX150DF31I7 supports multi-axis servo and stepper motor control applications where deterministic PWM generation, encoder feedback (EnDat, BiSS, SSI), and EtherCAT or PROFIBUS connectivity are required. The 6 PLLs provide jitter-free clocks for high-resolution PWM, while the hardware multipliers accelerate field-oriented control (FOC) and PID loops. Industrial temperature grade and the robust 896-ball FBGA package make it suitable for factory-floor controllers, robotic arm controllers, and CNC machines.
Recommandé
Medical Imaging and Diagnostics
The EP4CGX150DF31I7 serves in ultrasound front-end systems, patient monitoring, and laboratory instrumentation where low-power FPGA processing is essential. The 60 nm low-power process minimizes thermal dissipation in fanless medical enclosures, while the 8 transceivers support LVDS links to high-channel-count ADC arrays in ultrasound probes. The 6,635,520 embedded memory bits and 475 user I/Os allow real-time beamforming and image reconstruction algorithms within a single device, reducing board complexity in portable diagnostic carts.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CGX150DF31I7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CGX150DF31I7N | EP4CGX150DF31C8N | EP4CGX150DF27I7N | EP4CGX110DF31I7N | EP4CGX150CF23I7N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 896-FBGA (F31) | 896-FBGA (F31) - same | 896-FBGA (F31) - same | 896-FBGA (F27) - same ball count, different pin map | 896-FBGA (F31) - same | 484-FBGA (F23) - smaller |
| Logic Elements | 149,760 | 149,760 | 149,760 | 149,760 | 109,424 | 149,760 |
| Embedded Memory | 6,635,520 bits | 6,635,520 bits | 6,635,520 bits | 6,635,520 bits | 4,838,016 bits | 6,635,520 bits |
| User I/Os | 475 | 475 | 475 | ~310 | 475 | ~310 |
| Transceiver Channels | 8 (3.125 Gbps) | 8 (3.125 Gbps) | 8 (3.125 Gbps) | 8 (3.125 Gbps) | 8 (3.125 Gbps) | 8 (3.125 Gbps) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| RoHS Status | Leaded variant | Lead-free / RoHS | Lead-free / RoHS | Lead-free / RoHS | Lead-free / RoHS | Lead-free / RoHS |
| Unit Price (USD, qty 1) | 341.02 | ~340 | ~330 | ~330 | ~225 | ~260 |
Principaux différenciateurs
- Highest logic density in the Cyclone IV GX family (vs EP4CGX110DF31I7N)
- Drop-in lead-free upgrade available (vs EP4CGX150DF31I7N)
- Industrial temperature grade with commercial-temp cost option (vs EP4CGX150DF31C8N)
Notes de conception
The 896-ball FBGA (F31) package requires a 31 mm x 31 mm PCB land pattern with 1.0 mm ball pitch and microvia stack-up (at minimum 4-6-4 build-up). Escape routing from the inner rows should use dog-bone fan-outs with 0.4 mm via holes, and signal layers should be dedicated to rows A-D differential pairs (transceivers) and E-K user I/Os. Use length matching within 150 mils for all LVDS and transceiver differential pairs to maintain signal integrity above 1 Gbps.
The Cyclone IV GX EP4CGX150 requires a 1.2 V core supply capable of delivering 1.5 A typical (3 A peak during configuration), plus independent 2.5 V/3.3 V I/O supplies per bank and a 2.5 V PLL analog supply (VCCA_PLL). Each transceiver channel requires its own filtered 2.5 V analog supply (VCCH_GXB) with a pi-filter (ferrite bead + decoupling) to isolate from digital noise. Per Altera AN 583, place 0.1 uF and 0.01 uF X7R ceramic capacitors within 50 mils of every power pin and use a ground pour on every signal layer.
At maximum utilization (149,760 LEs, 8 transceivers at 3.125 Gbps, 472.5 MHz core), the EP4CGX150 dissipates approximately 3.5 W. The 896-ball FBGA package relies on a thermal pad and 25 thermal vias to the inner ground plane; without these, junction temperature can exceed 125C in still air. Estimate: with theta_JA = 18 C/W (JEDEC JESD51-7, 4-layer board with thermal vias), the junction rise above 70C ambient is about 21C, leaving adequate margin within the 100C industrial limit. Add forced airflow or a heatsink for fanless industrial enclosures above 60C ambient.
Common pitfalls: (1) Do not leave unused transceiver channels floating - they must be tied to a defined logic level per AN 558 to prevent oscillation; (2) MSEL[3:0] pins must be pulled to the correct combination (e.g., 1010 for AS fast configuration, 0110 for JTAG) before power-up; (3) All CONFIG_DONE and nSTATUS signals should be pulled up to 3.3 V via 10 kohm resistors; (4) Configuration data pins (DATA0-DATA15) need 25 ohm series termination when using FPP x16 mode; (5) Hot-socketing requires ramp rate < 18 V/ms on each supply.
Transceiver channels operate up to 3.125 Gbps and require controlled-impedance differential traces of 100 ohm +/- 10 percent, with intra-pair skew under 1 ps/inch. Use Megtron 6 or Rogers 4350B for stack-ups above 2 Gbps to minimize insertion loss. Reference clock (REFCLK_p/n) routing should be isolated from data lanes by at least 5x trace width, and AC-coupling capacitors (0.01 uF) must be placed near the receiver side, not the transmitter. Always validate the final layout with 3D EM simulation (e.g., ANSYS HFSS) before tape-out.
Informations de conformité
EP4CGX150DF31I7 is the leaded (Pb) variant. Choose EP4CGX150DF31I7N for lead-free / RoHS-compliant version with identical silicon. AEC-Q100 not applicable for FPGAs in this family.
