EP4CGX110DF31C6N - Cyclone IV GX FPGA, 109K LE, 896-FBGA | Intel
Référence : EP4CGX110DF31C6N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256 | $2 560,00 |
| 100 | $228 | $22 800,00 |
| 500 | $198 | $99 000,00 |
| 1 000 | $175 | $175 000,00 |
EP4CGX110DF31C6N Présentation
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O behaviour are defined by a user-supplied configuration bitstream rather than by the silicon vendor. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) - alongside CPLDs - and are used to implement arbitrary digital logic, memory blocks, arithmetic units, and protocol controllers without custom ASIC NRE. The Cyclone IV GX family specifically targets low-cost, transceiver-equipped designs in the FPGA -> programmable logic -> digital semiconductor hierarchy.
Key differentiating features include 156 embedded 18x18 multipliers for DSP workloads, 4 PLLs for clock synthesis, and a hard PCIe Gen1 controller. The 896-ball FBGA package supports high-density board designs where signal integrity, controlled-impedance routing, and power-integrity decoupling are critical. Cyclone IV GX is the lowest-cost Altera/Intel family with multi-gigabit transceivers, often displacing discrete PHY plus CPLD combinations.
In terms of architecture, the EP4CGX110 uses Logic Array Blocks (LABs) containing 16 logic elements each, M9K memory blocks, and distributed MLAB memory. Configuration is loaded via JTAG, Active Serial (AS), or Passive Parallel (PPS) modes from external flash. The device is supported by Intel Quartus Prime design software across the full Cyclone IV GX tool flow.
Typical applications include industrial machine vision, broadcast video processing, low-cost wireline protocol bridging, and PCI Express endpoint cards. The transceiver channels suit SFP/QSFP cages, CPRI links for small-cell base stations, and LVDS/Sub-LVDS display bridging. With 475 user IOs the part also drives wide parallel buses for legacy interface replacement.
When designing with this device, allocate at least one full PCB layer pair for power delivery and use 0402/0201 decoupling placed as close as possible to every BGA ball. Series-termination resistors on LVDS/Sub-LVDS pairs are recommended within 5 mm of the FPGA pin.
This page synthesizes verified distributor pricing, drop-in Cyclone IV GX alternatives, and practical board-design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP4CGX110DF31C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CGX110DF31C6N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Embedded Memory, Family, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CGX110DF31C7N
✅ Remplacement direct✓ En stock
$112.4 / unité
Voir la fiche technique →EP4CGX110DF31I7N
✅ Remplacement direct✓ En stock
$192.4 / unité
Voir la fiche technique →EP4CGX110DF27C8N
✅ Remplacement direct✓ En stock
$152.3 / unité
Voir la fiche technique →EP4CGX110CF23C7N
✅ Remplacement direct✓ En stock
$89.12 / unité
Voir la fiche technique →EP4CGX150DF31C6N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP4CE75F29C8N
✅ Remplacement direct✓ En stock
$149.75 / unité
Voir la fiche technique →EP4CGX110DF31C6N Valeurs maximales et caractéristiques électriques
| Family | Cyclone IV GX |
| Logic Elements | 109,424 |
| Embedded Memory | 5,621,760 bits |
| User I/O Pins | 475 |
| Embedded 18x18 Multipliers | 156 |
| PLLs | 4 |
| Transceiver Count | Up to 8 |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Boîtier | 896-ball FBGA (F31) |
| Speed Grade | C6 |
| Température de fonctionnement | 0C to +85C (commercial) |
| Configuration Modes | JTAG, AS, PPS |
| PCIe Hard IP | PCIe Gen1 x1/x2/x4 |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du EP4CGX110DF31C6N 896-ball fbga (f31)
Configuration des broches du EP4CGX110DF31C6N (boîtier 896-ball fbga (f31)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4CGX110DF31C6N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4CGX110DF31C6N convient pour 6 applications: Industrial Machine Vision, Broadcast Video Processing, PCI Express Endpoint Card, Small-Cell Base Station CPRI Link, LVDS / Sub-LVDS Display Bridge, Multi-Protocol Wireline Bridge.
Industrial Machine Vision
The EP4CGX110DF31C6N's 109,424 logic elements, 156 embedded 18x18 multipliers, and 475 user IOs make it well suited for industrial machine vision pipelines running multiple Camera Link or CoaXPress frame-grabber channels. The 5,621,760 bits of embedded memory buffer full-HD image rows without external SRAM, while four PLLs derive pixel-clock domains from sensor LVDS inputs. Eight multi-gigabit transceivers at 3.125 Gbps drive GigE Vision or USB3 Vision uplinks to host PCs. Design tip: allocate a dedicated ground pour under the BGA and route LVDS pairs with 100 ohm differential impedance.
Recommandé
Broadcast Video Processing
Broadcast video designs using SDI, HDMI, or DisplayPort benefit from the EP4CGX110DF31C6N's up to eight 3.125 Gbps transceivers, which can carry 3G-SDI or HDMI 1.4 TMDS streams with external PHY conditioning. 156 DSP blocks enable real-time scaling, deinterlacing, and color-space conversion, while 475 user IOs aggregate 24-bit RGB buses and parallel video interfaces. Quartus Prime supports free video IP cores for HDMI and SDI. Design tip: place AC-coupling caps within 5 mm of each transceiver ball and isolate the transceiver power island with a ferrite bead.
Recommandé
PCI Express Endpoint Card
The EP4CGX110DF31C6N integrates a hard PCIe Gen1 IP block supporting x1, x2, or x4 lanes at 2.5 Gbps, eliminating external PHY ICs and reducing BOM cost. 109K logic elements implement the PCIe TLP/DLL state machine, BAR mapping, MSI-X interrupts, and customer application logic. Designers can prototype Gen1 endpoint cards on low-cost boards and migrate to Gen2 if higher throughput is needed. Design tip: the PCIe reference clock must be AC-coupled to the FPGA refclk pins; reference Intel AN 456 for board layout.
Recommandé
Small-Cell Base Station CPRI Link
CPRI (Common Public Radio Interface) links between baseband units and remote radio heads run at 3.072 Gbps (CPRI option 6) or higher; the EP4CGX110DF31C6N's eight 3.125 Gbps transceivers comfortably handle four CPRI links plus an SFP+ uplink. 109K logic elements implement the CPRI framing, antenna-carrier mapping, and CPRI-to-Ethernet bridging. The 1.2 V core and 60 nm process deliver low standby power for outdoor small-cell deployments. Design tip: use separate analog and digital power rails and route reference clocks with controlled impedance.
Recommandé
LVDS / Sub-LVDS Display Bridge
The EP4CGX110DF31C6N drives up to 475 LVDS or Sub-LVDS pairs, making it ideal for converting between legacy parallel LCD interfaces and modern MIPI DSI/CSI bridges. Designers use the PLL-driven LVDS SERDES to serialize 24/48-bit RGB buses onto a small number of twisted pairs, easing flex-cable routing. 156 multipliers accelerate color-space conversion and dithering. Design tip: match LVDS trace lengths to within 5 mil across each channel and add a common-mode choke near the connector.
Recommandé
Multi-Protocol Wireline Bridge
Protocol-bridging applications such as Serial RapidIO to Ethernet, PCIe to Aurora, or SGMII to RGMII benefit from the EP4CGX110DF31C6N's mix of transceivers and abundant logic. The device can implement two independent bridging channels simultaneously using only a fraction of the 109K logic budget, leaving room for on-chip packet buffering in 5,621,760 bits of embedded memory. Quartus Prime supports Serial RapidIO and SGMII soft-IP cores free of charge. Design tip: route each transceiver channel on its own ground-bordered microstrip to minimize crosstalk.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CGX110DF31C6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CGX110DF31C7N | EP4CGX110DF31I7N | EP4CGX110DF27C8N | EP4CGX110CF23C7N | EP4CGX150DF31C6N | EP4CE75F29C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 896-ball FBGA (F31) | 896-ball FBGA (F31) - same | 896-ball FBGA (F31) - same | FBGA-672 (F27) - different | FBGA-484 (F23) - different | 896-ball FBGA (F31) - same | FBGA-780 (F29) - different |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 | 149,760 | 78,400 (Cyclone IV E) |
| Speed Grade | C6 | C7 (faster) | I7 (industrial, faster) | C8 | C7 | C6 | C8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Embedded Memory (bits) | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 6,480,000 | 3,063,552 (Cyclone IV E) |
| User I/O Pins | 475 | 475 | 475 | 380 | 290 | 475 | 488 |
| Transceiver Count | 8 (up to 3.125 Gbps) | 8 | 8 | 8 | 4 | 8 | 0 (Cyclone IV E, no transceivers) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principaux différenciateurs
- Integrated 3.125 Gbps transceivers (vs EP4CE75F29C8N)
- Hard PCIe Gen1 controller (vs EP4CE75F29C8N)
- Higher density than Cyclone IV E mid-range (vs EP4CE75F29C8N)
Notes de conception
Estimated: the EP4CGX110DF31C6N draws approximately 1.5 A to 3.5 A from the 1.2 V VCCINT rail and 0.3 A to 1.5 A from each VCCIO bank, depending on toggle rate and utilization. Decouple VCCINT with 4 x 10 uF bulk + 40 x 100 nF ceramics distributed under the BGA, and place 4 x 4.7 uF per VCCIO bank. Provide separate analog VCCAUX and VCCA_PLL rails each decoupled with 100 nF and 10 uF. Use Intel PowerPlay early-power-estimator to refine your budget before sign-off.
Estimated: the 896-ball F31 FBGA uses 1.0 mm ball pitch and a 31 mm x 31 mm body. Microvia (0.1 mm) stack-up is mandatory, and at least one full PCB layer pair should be dedicated to power/GND with the VCCINT island poured continuously under the die. Maintain 100 ohm differential impedance on transceiver pairs, with intra-pair skew below 5 mil. Reference Intel AN 456 for the full Cyclone IV GX high-speed-layout checklist.
Estimated: each multi-gigabit transceiver channel should be AC-coupled with 100 nF caps within 5 mm of the FPGA ball, and reference clocks must be AC-coupled to dedicated refclk pins. Use IBIS-AMI simulations (HSPICE) for critical 3.125 Gbps links, especially backplane applications where insertion-loss budgets of 10 to 15 dB apply at the Nyquist frequency.
Common pitfalls include: (1) omitting the JTAG pull-up on TCK/TMS, which prevents configuration; (2) leaving MSEL pins floating, which selects the wrong configuration mode; (3) under-estimating configuration flash write cycles - use a 16 Mb or larger SPI flash for AS mode; (4) not providing proper POR sequencing - assert nCONFIG after all rails are stable for at least 1 ms. Reference the Cyclone IV Device Handbook chapter 10 for the full configuration checklist.
Informations de conformité
RoHS and REACH compliance per Intel product page; not AEC-Q100 qualified (FPGAs are not typically AEC-Q100 unless specified). Halogen-free per JEDEC JS709.
