EP4CGX15BF14C6N - Cyclone IV GX FPGA, 14.4K LEs, 169-FBGA | Intel
Référence : EP4CGX15BF14C6N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.36 | $42,36 |
| 10 | $39.85 | $398,50 |
| 100 | $35.2 | $3 520,00 |
| 500 | $31.75 | $15 875,00 |
| 1 000 | $28.4 | $28 400,00 |
EP4CGX15BF14C6N Présentation
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor that implements digital logic through configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as transceivers, PLLs, and memory controllers. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLD), which sit alongside ASICs, ASSPs, and microcontrollers as silicon platforms for digital design. The Cyclone IV GX family targets high-volume, power-constrained applications where integration of transceivers, DSP blocks, and Nios II embedded processors reduces system cost and board area.
Key features of the EP4CGX15BF14C6N include 14,400 logic elements, 540 Kbits of embedded memory (M9K blocks), 56 embedded 18x18 multipliers, and 6 clock networks. The device integrates high-speed transceivers capable of up to 3.125 Gbps, supporting PCIe Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI protocols. It also includes dedicated PLL resources and configuration schemes such as Active Serial (AS) and JTAG.
The Cyclone IV GX architecture leverages a low-power 60 nm process with a 1.2V core voltage, delivering up to 50% lower dynamic power than Cyclone III for comparable designs. On-chip transceiver hardening simplifies PCB design, while the LBGA-169 package balances pin count, signal integrity, and thermal performance for compact boards. The -C6 speed grade corresponds to the slowest commercial tier, optimizing static power and cost over timing margin.
Typical applications include industrial machine vision, motor control with EtherCAT or SERCOS, low-cost video capture, wireless baseband preprocessing, and protocol bridging for legacy industrial buses. Designers use the Quartus Prime design suite to develop HDL-based or IP-centric implementations.
When designing with the EP4CGX15BF14C6N, ensure adequate decoupling and proper multi-voltage rail sequencing, and verify that LVDS I/O banks are powered before the transceiver block to avoid latch-up. Use IBIS models for SI simulations on SERDES lanes exceeding 1 Gbps.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer datasheet, including comparison against same-family Cyclone IV GX variants and pin-compatible Lattice ECP5 alternatives.
Alternatives de remplacement direct pour EP4CGX15BF14C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CGX15BF14C6N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Transceivers, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CGX15BF14C6
✅ Remplacement direct✓ En stock
$21.5 / unité
Voir la fiche technique →EP4CGX15BF14A7N
✅ Remplacement direct✓ En stock
$31.05 / unité
Voir la fiche technique →EP4CGX15BF14C7N
✅ Remplacement direct✓ En stock
$20.85 / unité
Voir la fiche technique →EP4CGX15BF14C8N
✅ Remplacement direct✓ En stock
$18.5 / unité
Voir la fiche technique →EP4CGX15BF14I7N
✅ Remplacement direct✓ En stock
$23.1 / unité
Voir la fiche technique →EP4CGX15BF14C6N Valeurs maximales et caractéristiques électriques
| Family | Cyclone IV GX |
| Logic Elements | 14,400 |
| Embedded Memory | 552,960 bits (540 Kbits) |
| Embedded 18x18 Multipliers | 56 |
| General-Purpose I/O | 72 |
| Transceivers | Up to 3.125 Gbps |
| Core Voltage | 1.2 V |
| Speed Grade | C6 (commercial) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Boîtier | 169-LBGA (FBGA) |
| Type de montage | Surface Mount (BGA) |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
| Process Node | 60 nm |
| Configuration Schemes | AS, JTAG |
Guide de configuration des broches du EP4CGX15BF14C6N 169-lbga (fbga)
Configuration des broches du EP4CGX15BF14C6N (boîtier 169-lbga (fbga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4CGX15BF14C6N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4CGX15BF14C6N convient pour 6 applications: Industrial Motor Control with EtherCAT, Low-Cost Video Capture and Processing, PCIe Gen1 Endpoint Card, Industrial Protocol Bridging (Modbus/Profibus/CAN), Wireless Baseband Preprocessing, Software Defined Radio (SDR) Front End.
Industrial Motor Control with EtherCAT
The EP4CGX15BF14C6N is well suited for industrial servo and stepper motor controllers using EtherCAT or SERCOS protocols. Its 14,400 logic elements and 56 embedded 18x18 multipliers implement field-oriented control (FOC) algorithms with up to three current-loop axes in parallel. The integrated transceivers handle the 100 Mbit/s EtherCAT PHY interface directly, eliminating external PHY chips and reducing board cost. With 72 user I/O, designers can connect to multiple encoder interfaces, PWM outputs, and GPIO control lines for a single-axis-to-triple-axis controller on one FPGA.
Recommandé
Low-Cost Video Capture and Processing
The EP4CGX15BF14C6N's 540 Kbits of embedded memory and 56 DSP blocks support entry-level video processing such as scaling, color space conversion, and on-screen display overlay for surveillance and machine vision applications. Designers can implement a DVI/HDMI input interface using LVDS-capable I/O paired with external TMDS encoding, while the embedded memory buffers one or two video lines at a time. The 169-LBGA package is well matched to compact camera boards and supports industrial-grade temperature operation when paired with the I-grade speed variant.
Recommandé
PCIe Gen1 Endpoint Card
With hard PCIe Gen1 transceivers capable of 2.5 Gbps, the EP4CGX15BF14C6N serves as a low-cost PCIe endpoint for instrumentation cards, data acquisition boards, and FPGA accelerator add-in cards. The device includes the PCIe hard IP block which implements the physical layer, data link, and transaction layers, freeing logic for user applications. The 169-LBGA package exposes enough I/O for downstream bus fan-out to memory, ADCs, or external connectors.
Recommandé
Industrial Protocol Bridging (Modbus/Profibus/CAN)
Industrial gateway designs frequently use the EP4CGX15BF14C6N to bridge between legacy fieldbus protocols (Profibus, Modbus RTU, CAN) and modern Ethernet-based networks. The FPGA's flexible I/O supports RS-485 transceivers for Profibus/Modbus and CAN controllers with on-chip DSP for bit-timing. With 72 user I/O, multiple protocol stacks can coexist on one device, and the small 169-LBGA package enables DIN-rail mountable form factors for industrial controllers.
Recommandé
Wireless Baseband Preprocessing
The integrated transceivers up to 3.125 Gbps and 56 DSP blocks make the EP4CGX15BF14C6N suitable for wireless baseband preprocessing in small-cell and repeater designs. Digital up/down conversion, channelization filters, and Crest Factor Reduction (CFR) or Digital Pre-Distortion (DPD) algorithms can be implemented on the DSP blocks. The 540 Kbits of memory holds several microseconds of baseband samples, supporting low-latency feedback loops typical of RF chain digital correction.
Recommandé
Software Defined Radio (SDR) Front End
The EP4CGX15BF14C6N's combination of high-speed transceivers and DSP blocks enables it to serve as the digital front end in compact SDR platforms. Designers implement direct digital synthesis, IQ modulation/demodulation, and digital down-conversion chains on the 56 18x18 multipliers, while the 540 Kbits of embedded memory buffers samples between processing stages. The 169-LBGA package balances I/O count for ADC/DAC interfaces and keeps board area low for portable or embedded SDR enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CGX15BF14C6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CGX15BF14C6 | EP4CGX15BF14A7N | EP4CGX15BF14C7N | EP4CGX15BF14C8N | EP4CGX15BF14I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 169-LBGA | 169-LBGA - same | 169-LBGA - same | 169-LBGA - same | 169-LBGA - same | 169-LBGA - same |
| Logic Elements | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 |
| Speed Grade | C6 (commercial) | C6 | A7 (automotive) | C7 | C8 | I7 (industrial) |
| Operating Temperature | 0C to +85C | 0C to +85C | -40C to +125C | 0C to +85C | 0C to +85C | -40C to +100C |
| Transceivers | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Embedded Memory | 540 Kbits | 540 Kbits | 540 Kbits | 540 Kbits | 540 Kbits | 540 Kbits |
| Embedded 18x18 Multipliers | 56 | 56 | 56 | 56 | 56 | 56 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principaux différenciateurs
- Lowest-cost commercial speed grade within the 14.4K LE Cyclone IV GX family (vs EP4CGX15BF14C8N)
- Same 169-LBGA pinout across all speed/temperature grades (vs EP4CGX15BF14A7N)
- Integrated transceivers eliminate external PHY cost (vs EP4CE15F23C8N (Cyclone IV E))
Notes de conception
The EP4CGX15BF14C6N requires four separate supply rails: VCCINT (1.2V core), VCCIO (1.2V-3.3V I/O banks), VCCA (1.2V transceiver analog), and VCCD_PLL (1.2V PLL digital). According to the Cyclone IV GX handbook CV-51001, VCCA and VCCD_PLL must be powered up before VCCIO to prevent latch-up. Decoupling requires at least 12 x 0.1uF MLCC capacitors placed within 5 mm of the BGA balls, plus bulk 10uF and 100uF tantalum capacitors. Estimate: for a typical 70% utilization design, total power consumption is 1.5-2.5W requiring adequate thermal relief through the LBGA ground balls.
BGA escape routing requires via-in-pad or microvia technology on at least 4 routing layers. According to Intel's PCB layout guidelines for Cyclone IV GX, 100-ohm differential impedance is mandatory for all LVDS pairs and 85-ohm differential for transceiver channels. Use 50-ohm single-ended for general-purpose I/O. Match clock trace lengths to within 25 mils to preserve timing margins, and place the configuration flash within 2 inches of the FPGA to avoid AS mode errors.
Transceiver channels up to 3.125 Gbps require strict signal integrity practices. Use Acorn or HyperLynx for pre-layout channel simulation and verify return loss better than -10 dB up to 3.125 GHz. According to Intel CV-51001 reference designs, AC coupling capacitors (100nF 0402 X7R) are required on every transceiver TX and RX lane. Keep DC bias resistors within 100 mils of the FPGA balls.
Avoid these common pitfalls: (1) do not confuse C6 and C7 speed grades - C7 has tighter timing and is sometimes incorrectly substituted; (2) ensure JTAG chain integrity by adding a 4.7k pull-up on TCK, TMS, and TDI; (3) configure MSEL pins correctly for AS (active serial) mode or JTAG mode per datasheet CV-51001 Table 1-3; (4) leave unused transceiver channels powered down via Quartus device settings to save 80-150 mW per channel.
Informations de conformité
RoHS compliant per Intel product page. The 'N' suffix in C6N indicates lead-free finish. For AEC-Q100 automotive qualification, use the A7 speed grade variant EP4CGX15BF14A7N.
