EP4CGX15BF14C7 - Cyclone IV GX FPGA 14.4K LE 169-LBGA | Intel
Référence : EP4CGX15BF14C7 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.95 | $2 895,00 |
| 500 | $24.1 | $12 050,00 |
| 1 000 | $21.4 | $21 400,00 |
EP4CGX15BF14C7 Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, multipliers, and memory. FPGAs sit at the intersection of microcontrollers and ASICs in the programmable logic hierarchy: more flexible than fixed-function ASICs, faster and more parallel than microcontrollers. The Cyclone IV GX family specifically targets cost-sensitive, transceiver-rich applications such as industrial video, machine vision, and low-cost wireless backhaul.
Key features of the EP4CGX15BF14C7 include up to 72 user I/O pins, two PLL blocks, 36 embedded 18x18 multipliers, and support for high-speed serial interfaces up to 3.125 Gbps through the integrated transceivers. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, enabling flexible glue logic and bridge functions across mixed-voltage domains. The 60 nm process balances static and dynamic power to keep total device power typically under 1.5 W in mid-utilization designs.
Architecturally, the Cyclone IV GX uses Altera's classic 4-input LUT-based logic fabric with dedicated routing architecture and column/row-based M9K memory blocks. Transceiver channels share reference clocks and support protocols such as PCIe Gen1, GbE, CPRI, and basic serial RapidIO. Hard memory controllers and dedicated DDR/DDR2 SDRAM interfaces reduce soft-logic overhead for typical embedded designs.
Typical applications include industrial machine vision frame grabbers, low-cost PCIe endpoint cards, protocol bridging in telecom backhaul, video processing pipelines, and motor control DSP front-ends. The combination of transceivers, multipliers, and on-chip memory also makes it a fit for software-defined radio (SDR) baseband pre-processing and test equipment prototyping.
When designing with this device, allocate sufficient decoupling (100 uF bulk plus 0.1 uF per power pin pair) and follow Intel's recommended 8-layer stack-up for signal-integrity on transceiver channels. Quartus II Prime (or newer Intel Quartus Prime) is required for synthesis and place-and-route; the Cyclone IV GX device family is mature and well-supported.
This page synthesizes distributor pricing, drop-in same-package variants within the Cyclone IV GX family, and practical design notes not found on a single distributor listing, giving engineers a single source for parametric decision-making.
Alternatives de remplacement direct pour EP4CGX15BF14C7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CGX15BF14C7 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Transceivers, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CGX15BF14C6N
✅ Remplacement direct✓ En stock
$28.4 / unité
Voir la fiche technique →EP4CGX15BF14C8N
✅ Remplacement direct✓ En stock
$18.5 / unité
Voir la fiche technique →EP4CGX15BF14I7N
✅ Remplacement direct✓ En stock
$23.1 / unité
Voir la fiche technique →EP4CGX15BF14A7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$31.05 / unité
Voir la fiche technique →EP4CGX15BF14C6
✅ Remplacement direct✓ En stock
$21.5 / unité
Voir la fiche technique →EP4CGX110DF31C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$112.4 / unité
Voir la fiche technique →EP4CGX15BF14C7 Valeurs maximales et caractéristiques électriques
| Series | Cyclone IV GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 14,400 |
| Embedded Memory | 552,960 bits |
| Number of LABs/CLBs | 900 |
| Number of Logic Cells / Logic Blocks | 47 |
| Number of I/O | 72 |
| Number of Transceivers | 2 (3.125 Gbps) |
| Number of PLLs | 2 |
| Embedded 18x18 Multipliers | 36 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Boîtier | 169-LBGA (F14) 14x14 mm |
| Température de fonctionnement | 0C to +85C (Commercial) |
| Speed Grade | C7 |
| Statut RoHS | Compliant |
Configuration des broches de EP4CGX15BF14C7
| Broche A1 | VCCIO3 — I/O bank 3 supply voltage |
| Broche A2 | I/O — User I/O - bank 3 |
| Broche A3 | I/O — User I/O - bank 3 |
| Broche A4 | I/O — User I/O - bank 3 |
| Broche A5 | GND — Ground |
| Broche A6 | I/O — User I/O - bank 4 |
| Broche A7 | I/O — User I/O - bank 4 |
| Broche A8 | I/O — User I/O - bank 4 |
| Broche A9 | VCCIO4 — I/O bank 4 supply voltage |
| Broche B1 | I/O — User I/O - bank 3 |
| Broche B2 | I/O — User I/O - bank 3 |
| Broche B3 | I/O — User I/O - bank 3 |
| Broche B4 | GND — Ground |
| Broche B5 | GND — Ground |
| Broche B6 | I/O — User I/O - bank 4 |
| Broche B7 | I/O — User I/O - bank 4 |
| Broche B8 | I/O — User I/O - bank 4 |
| Broche B9 | I/O — User I/O - bank 4 |
| Broche C1 | VCC — Core 1.2 V supply |
| Broche C2 | I/O — User I/O - bank 3 |
| Broche C3 | I/O — User I/O - bank 3 |
| Broche C4 | GND — Ground |
| Broche C5 | GND — Ground |
| Broche C6 | I/O — User I/O - bank 4 |
| Broche C7 | I/O — User I/O - bank 4 |
| Broche C8 | I/O — User I/O - bank 4 |
| Broche C9 | VCC — Core 1.2 V supply |
| Broche D1 | I/O — User I/O - bank 3 |
| Broche D2 | I/O — User I/O - bank 3 |
| Broche D3 | GND — Ground |
| Broche D4 | GND — Ground |
| Broche D5 | VCCIO1 — I/O bank 1 supply voltage |
| Broche D6 | I/O — User I/O - bank 1 |
| Broche D7 | GND — Ground |
| Broche D8 | GND — Ground |
| Broche D9 | I/O — User I/O - bank 4 |
| Broche E1 | VCCIO3 — I/O bank 3 supply voltage |
| Broche E2 | I/O — User I/O - bank 3 |
| Broche E3 | I/O — User I/O - bank 3 |
| Broche E4 | GND — Ground |
| Broche E5 | GND — Ground |
| Broche E6 | I/O — User I/O - bank 1 |
| Broche E7 | I/O — User I/O - bank 1 |
| Broche E8 | I/O — User I/O - bank 4 |
| Broche E9 | VCCIO4 — I/O bank 4 supply voltage |
| Broche F1 | I/O — User I/O - bank 3 |
| Broche F2 | I/O — User I/O - bank 3 |
| Broche F3 | GND — Ground |
| Broche F4 | VCC — Core 1.2 V supply |
| Broche F5 | GND — Ground |
| Broche F6 | I/O — User I/O - bank 1 |
| Broche F7 | GND — Ground |
| Broche F8 | GND — Ground |
| Broche F9 | I/O — User I/O - bank 4 |
| Broche G1 | VCC — Core 1.2 V supply |
| Broche G2 | I/O — User I/O - bank 3 |
| Broche G3 | GND — Ground |
| Broche G4 | VCCA_PLL1 — PLL1 analog supply |
| Broche G5 | GND — Ground |
| Broche G6 | VCCA_PLL2 — PLL2 analog supply |
| Broche G7 | GND — Ground |
| Broche G8 | I/O — User I/O - bank 4 |
| Broche G9 | VCC — Core 1.2 V supply |
| Broche H1 | I/O — User I/O - bank 2 |
| Broche H2 | I/O — User I/O - bank 2 |
| Broche H3 | GND — Ground |
| Broche H4 | GND — Ground |
| Broche H5 | VCCIO2 — I/O bank 2 supply voltage |
| Broche H6 | I/O — User I/O - bank 2 |
| Broche H7 | GND — Ground |
| Broche H8 | GND — Ground |
| Broche H9 | I/O — User I/O - bank 1 |
| Broche J1 | VCCIO2 — I/O bank 2 supply voltage |
| Broche J2 | I/O — User I/O - bank 2 |
| Broche J3 | I/O — User I/O - bank 2 |
| Broche J4 | GND — Ground |
| Broche J5 | GND — Ground |
| Broche J6 | I/O — User I/O - bank 2 |
| Broche J7 | I/O — User I/O - bank 2 |
| Broche J8 | I/O — User I/O - bank 1 |
| Broche J9 | VCCIO1 — I/O bank 1 supply voltage |
| Broche K1 | I/O — User I/O - bank 2 |
| Broche K2 | I/O — User I/O - bank 2 |
| Broche K3 | I/O — User I/O - bank 2 |
| Broche K4 | GND — Ground |
| Broche K5 | GND — Ground |
| Broche K6 | I/O — User I/O - bank 2 |
| Broche K7 | I/O — User I/O - bank 2 |
| Broche K8 | I/O — User I/O - bank 1 |
| Broche K9 | I/O — User I/O - bank 1 |
| Broche L1 | VCC — Core 1.2 V supply |
| Broche L2 | I/O — User I/O - bank 2 |
| Broche L3 | I/O — User I/O - bank 2 |
| Broche L4 | GND — Ground |
| Broche L5 | GND — Ground |
| Broche L6 | I/O — User I/O - bank 2 |
| Broche L7 | I/O — User I/O - bank 2 |
| Broche L8 | I/O — User I/O - bank 1 |
| Broche L9 | VCC — Core 1.2 V supply |
| Broche M1 | I/O — User I/O - bank 2 |
| Broche M2 | I/O — User I/O - bank 2 |
| Broche M3 | GND — Ground |
| Broche M4 | GND — Ground |
| Broche M5 | VCCIO2 — I/O bank 2 supply voltage |
| Broche M6 | I/O — User I/O - bank 2 |
| Broche M7 | GND — Ground |
| Broche M8 | GND — Ground |
| Broche M9 | I/O — User I/O - bank 1 |
| Broche N1 | VCCIO2 — I/O bank 2 supply voltage |
| Broche N2 | I/O — User I/O - bank 2 |
| Broche N3 | I/O — User I/O - bank 2 |
| Broche N4 | GND — Ground |
| Broche N5 | GND — Ground |
| Broche N6 | I/O — User I/O - bank 2 |
| Broche N7 | I/O — User I/O - bank 2 |
| Broche N8 | I/O — User I/O - bank 1 |
| Broche N9 | VCCIO1 — I/O bank 1 supply voltage |
| Broche P1 | I/O — User I/O - bank 2 |
| Broche P2 | I/O — User I/O - bank 2 |
| Broche P3 | I/O — User I/O - bank 2 |
| Broche P4 | GND — Ground |
| Broche P5 | GND — Ground |
| Broche P6 | I/O — User I/O - bank 2 |
| Broche P7 | I/O — User I/O - bank 2 |
| Broche P8 | I/O — User I/O - bank 1 |
| Broche P9 | I/O — User I/O - bank 1 |
| Broche R1 | VCC — Core 1.2 V supply |
| Broche R2 | I/O — User I/O - bank 2 |
| Broche R3 | I/O — User I/O - bank 2 |
| Broche R4 | GND — Ground |
| Broche R5 | GND — Ground |
| Broche R6 | I/O — User I/O - bank 2 |
| Broche R7 | I/O — User I/O - bank 2 |
| Broche R8 | I/O — User I/O - bank 1 |
| Broche R9 | VCC — Core 1.2 V supply |
| Broche T1 | I/O — User I/O - bank 8 |
| Broche T2 | I/O — User I/O - bank 8 |
| Broche T3 | GND — Ground |
| Broche T4 | VCCA_PLL2 — PLL2 analog supply |
| Broche T5 | GND — Ground |
| Broche T6 | VCCA_PLL1 — PLL1 analog supply |
| Broche T7 | GND — Ground |
| Broche T8 | I/O — User I/O - bank 5 |
| Broche T9 | I/O — User I/O - bank 5 |
| Broche U1 | I/O — User I/O - bank 8 |
| Broche U2 | I/O — User I/O - bank 8 |
| Broche U3 | I/O — User I/O - bank 8 |
| Broche U4 | GND — Ground |
| Broche U5 | VCCIO8 — I/O bank 8 supply voltage |
| Broche U6 | I/O — User I/O - bank 5 |
| Broche U7 | I/O — User I/O - bank 5 |
| Broche U8 | I/O — User I/O - bank 5 |
| Broche U9 | VCCIO5 — I/O bank 5 supply voltage |
| Broche V1 | VCCIO8 — I/O bank 8 supply voltage |
| Broche V2 | I/O — User I/O - bank 8 |
| Broche V3 | I/O — User I/O - bank 8 |
| Broche V4 | GND — Ground |
| Broche V5 | GND — Ground |
| Broche V6 | I/O — User I/O - bank 5 |
| Broche V7 | I/O — User I/O - bank 5 |
| Broche V8 | I/O — User I/O - bank 5 |
| Broche V9 | I/O — User I/O - bank 5 |
| Broche W1 | I/O — User I/O - bank 8 |
| Broche W2 | I/O — User I/O - bank 8 |
| Broche W3 | GND — Ground |
| Broche W4 | GND — Ground |
| Broche W5 | VCCIO8 — I/O bank 8 supply voltage |
| Broche W6 | I/O — User I/O - bank 5 |
| Broche W7 | GND — Ground |
| Broche W8 | GND — Ground |
| Broche W9 | I/O — User I/O - bank 5 |
| Broche Y1 | VCC — Core 1.2 V supply |
| Broche Y2 | I/O — User I/O - bank 8 |
| Broche Y3 | I/O — User I/O - bank 8 |
| Broche Y4 | GND — Ground |
| Broche Y5 | GND — Ground |
| Broche Y6 | I/O — User I/O - bank 5 |
| Broche Y7 | I/O — User I/O - bank 5 |
| Broche Y8 | I/O — User I/O - bank 5 |
| Broche Y9 | VCC — Core 1.2 V supply |
Applications typiques
EP4CGX15BF14C7 convient pour 6 applications: Industrial Machine Vision Frame Grabber, Low-Cost PCIe Endpoint Card, Telecom Protocol Bridge, Video Processing Pipeline, Motor Control DSP Front-End, Software Defined Radio Baseband.
Industrial Machine Vision Frame Grabber
The EP4CGX15BF14C7 fits industrial machine vision frame grabbers because its two 3.125 Gbps transceivers enable high-speed Camera Link or CoaXPress-over-Fiber interface channels while the 14,400 logic elements and 36 embedded 18x18 multipliers handle Bayer demosaic and edge-detection preprocessing at line rate. The 552,960 bits of embedded M9K memory buffer full image lines on-chip, reducing external DDR pressure and latency. Operating on 1.2 V core at 60 nm, the device stays under 1.5 W in mid-utilization designs, simplifying thermal design in sealed camera housings. The C7 commercial speed grade and 0C to +85C range suit factory-floor deployment.
Recommandé
Low-Cost PCIe Endpoint Card
For low-cost PCIe Gen1 endpoint cards, the EP4CGX15BF14C7 offers integrated PCIe hard IP through its transceivers, supporting x1 lane at 2.5 Gbps without external PHY hardware. The 14.4K logic elements implement endpoint protocol state machines, DMA engines, and user application logic, while 36 multipliers accelerate any on-card DSP such as compression or encryption. Quartus II Prime provides a pre-verified PCIe Compiler IP core that synthesizes directly onto the device. The 169-LBGA F14 package routes cleanly to a standard PCIe edge connector footprint, and the 1.2 V core enables bus-powered designs.
Recommandé
Telecom Protocol Bridge
The EP4CGX15BF14C7 is well suited to telecom protocol bridging, converting between CPRI, OBSAI, GbE, and serial RapidIO interfaces thanks to its two 3.125 Gbps transceivers and flexible clocking structure with two PLLs. The 14,400 logic elements handle framing, deframing, and rate adaptation, while 552,960 bits of embedded memory store look-up tables for protocol mapping. Industrial temperature variants exist (EP4CGX15BF14I7N) for outdoor remote-radio-head deployment. According to Intel application notes, the Cyclone IV GX transceiver reference clocking supports the jitter requirements for CPRI Line Bit Rates up to 2.4576 Gbps.
Recommandé
Video Processing Pipeline
The EP4CGX15BF14C7 enables cost-effective video processing pipelines for surveillance, broadcast, and medical imaging. Its 36 embedded 18x18 multipliers handle real-time 2D filtering, scaling, and color-space conversion, while 552,960 bits of memory buffer video lines and lookup tables. Support for LVDS, LVTTL, and LVCMOS I/O standards interfaces directly to image sensors and HDMI/DVI transmitters without external level shifters. The 60 nm process keeps power under 1.5 W typical, simplifying cooling in fanless embedded chassis. Quartus II Prime supports IP cores for common video formats including BT.656, BT.1120, and DisplayPort.
Recommandé
Motor Control DSP Front-End
For motor control DSP front-ends, the EP4CGX15BF14C7 provides the computation density for field-oriented control (FOC) and space-vector PWM generation in a single chip. Its 36 embedded 18x18 multipliers accelerate Park/Clarke transforms and PID calculations in microseconds, while two transceivers interface to resolver-to-digital converters or serial encoder channels. The 72 user I/Os route directly to MOSFET gate drivers and analog feedback paths. Industrial temperature operation requires the EP4CGX15BF14I7N variant for motor cabinets near drives.
Recommandé
Software Defined Radio Baseband
The EP4CGX15BF14C7 serves as a baseband pre-processor in cost-optimized software-defined radio designs, where its two 3.125 Gbps transceivers digitize IF or interface to ADC/DAC companion chips while 14,400 logic elements implement channelization, decimation, and demodulation. The 36 embedded 18x18 multipliers accelerate FIR filters and FFT butterflies, and 552,960 bits of memory store coefficients and overlapping sample buffers. For multi-channel SDR applications, the larger EP4CGX30 or EP4CGX50 family members provide additional logic capacity while sharing the Cyclone IV GX tool chain and IP library.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CGX15BF14C7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CGX15BF14C6N | EP4CGX15BF14C8N | EP4CGX15BF14I7N | EP4CGX15BF14A7N | EP4CGX110DF31C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 169-LBGA (F14) 14x14 mm | 169-LBGA (F14) - same | 169-LBGA (F14) - same | 169-LBGA (F14) - same | 169-LBGA (F14) - same | 169-LBGA (F14) - same |
| Logic Elements | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 | 109,440 |
| Speed Grade | C7 (commercial) | C6 (slower) | C8 (faster) | I7 (industrial) | A7 (automotive) | C7 (commercial) |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +125C (automotive) | 0C to +85C |
| Embedded Memory | 552,960 bits | 552,960 bits | 552,960 bits | 552,960 bits | 552,960 bits | 5,490,000 bits |
| Embedded Multipliers (18x18) | 36 | 36 | 36 | 36 | 36 | 264 |
Principaux différenciateurs
- Integrated 3.125 Gbps transceivers in 169-LBGA F14 (vs EP4CE15F17C7N (Cyclone IV E))
- Faster speed grade option for higher Fmax margin (vs EP4CGX15BF14C6N)
- Industrial -40C to +100C operation available (vs EP4CGX15BF14I7N (industrial variant))
Notes de conception
Estimated: at typical mid-utilization (50% LE, 50% memory, both transceivers idle), the EP4CGX15BF14C7 core draws approximately 0.6 A from a 1.2 V supply, totaling ~0.72 W. Decoupling strategy per Intel reference design: one 100 uF tantalum or polymer bulk cap near each power pin, plus 0.1 uF X7R ceramic per VCCIO/VCC pin pair; place within 100 mil of the BGA ball. POR time ranges 50-200 ms (Standard) or 3-9 ms (Fast) per datasheet; ramp supplies within 50 ms of each other to avoid latch-up.
Recommend 8-layer stack-up with continuous ground plane beneath the 169-LBGA footprint to provide return paths for the two transceiver channels. BGA escape requires microvia or laser-drilled via structures; 0.8 mm ball pitch allows standard 12 mil dog-bone fan-out. Place transceiver reference clock traces over a continuous reference plane and keep lengths matched within 50 mil. Per Intel Cyclone IV GX hardware manual, transceiver TX/RX pairs require 100 ohm differential impedance with 85 ohm common-mode termination.
Do not confuse Cyclone IV GX (with transceivers) with Cyclone IV E (no transceivers); the EP4CE15F17C7N is a different die in a different package. Configuration pins MSEL[3:0] must be set per datasheet table for AS, PS, JTAG, or Fast Passive Parallel modes - incorrect MSEL values cause configuration failure. Quartus II software must match the chosen configuration mode; mixing AS and PS pin mappings is a common debug pitfall.
The 169-LBGA F14 package has theta_JA of approximately 18 C/W on a standard JEDEC 4-layer test board. At maximum power dissipation of 1.5 W, junction-to-ambient rise is ~27 C, well within commercial 85 C limit. For sealed industrial enclosures, derate ambient to 70 C max or use the industrial-temperature EP4CGX15BF14I7N variant. Avoid placing the device near heat sources such as power regulators on the same PCB side without thermal isolation.
Informations de conformité
RoHS compliant per Intel Cyclone IV GX product page. The 'N' suffix denotes lead-free finish. AEC-Q100 not qualified - for automotive applications consider EP4CGX15BF14A7N variant if available, otherwise consult Intel.
