EP4CGX30BF14I6N - Cyclone IV GX FPGA, 30K LE, FBGA-169 | Intel
Référence : EP4CGX30BF14I6N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.8 | $2 980,00 |
| 500 | $26.4 | $13 200,00 |
| 1 000 | $23.1 | $23 100,00 |
EP4CGX30BF14I6N Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks (such as transceivers, multipliers, and memory controllers). FPGAs occupy a unique position in the digital design hierarchy: more flexible than an ASIC and faster than a general-purpose microcontroller, they sit between fixed-logic ICs and software-defined compute. The Cyclone IV GX family specifically extends the Cyclone IV series by adding integrated transceivers while maintaining the lowest static power in the industry's mainstream FPGA segment.
Key features of the EP4CGX30BF14I6N include up to 72 user I/O pins, 1,105,920 bits of embedded memory (approximately 135 Kbytes when configured as M9K blocks), four 3.125 Gbps transceiver channels, two PLLs, and support for external memory interfaces including DDR/DDR2/QDRII SDRAM. The device operates from a 1.2 V core supply with separate V1CCIO banks for I/O voltage flexibility. The F14 package designation indicates the 169-ball fine-pitch BGA, and the I6 speed grade balances performance with the industrial temperature range (-40C to +100C junction).
The Cyclone IV GX architecture combines an enhanced LUT-based logic fabric with dedicated 18x18 multipliers, dual-configuration flash memory support, and hard PCI Express IP. This makes the device suitable for protocol bridging, motor control, and custom video pipelines where designers need parallel DSP performance alongside multi-gigabit serial I/O.
Typical applications include industrial machine vision, low-end wireless backhaul, factory automation controllers, and cost-optimized video surveillance systems. The integrated transceivers allow designers to implement proprietary serial links or standards such as PCIe Gen1 and CPRI without external PHY chips.
When designing with the EP4CGX30BF14I6N, ensure proper decoupling per the Intel reference schematic and verify signal-integrity routing for the high-speed transceiver lanes. The device uses SRAM-based configuration, so an external configuration flash is required for standalone boot. Industrial temperature rating makes this part suitable for harsh-environment deployments.
This page synthesizes distributor pricing, drop-in alternatives sourced from the Cyclone IV GX family and competitor cross-references, and practical design notes not found in the standalone datasheet.
Alternatives de remplacement direct pour EP4CGX30BF14I6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CGX30BF14I6N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Mounting Type, Logic Elements (LE).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CGX30BF14C6N
✅ Remplacement direct✓ En stock
$25.9 / unité
Voir la fiche technique →EP4CGX30BF14C7N
✅ Remplacement direct✓ En stock
$55.78 / unité
Voir la fiche technique →EP4CGX30BF14C8N
✅ Remplacement direct✓ En stock
$43.12 / unité
Voir la fiche technique →EP4CGX22BF14I8N
✅ Remplacement direct✓ En stock
$25.1 / unité
Voir la fiche technique →EP4CGX15BF14I8N
✅ Remplacement direct✓ En stock
$42.1 / unité
Voir la fiche technique →EP4CGX30BF14I6N Valeurs maximales et caractéristiques électriques
| Family | Cyclone IV GX |
| Logic Elements | 29,440 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Boîtier | 169-Ball FBGA (F14) |
| User I/O Pins | 72 (max) |
| Embedded Memory Bits | 1,105,920 |
| Transceiver Channels | 4 (3.125 Gbps) |
| PLLs | 2 |
| Speed Grade | I6 (industrial) |
| Operating Temperature (Junction) | -40C to +100C |
| Type de montage | Surface Mount |
| Configuration Method | SRAM-based, requires external flash |
| DSP Blocks | Embedded multipliers (18x18) |
| Hard Memory Controllers | DDR/DDR2/QDRII SDRAM |
Configuration des broches de EP4CGX30BF14I6N
| Broche A1 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A2 | IO1 — User I/O (bank 1) |
| Broche A3 | IO1 — User I/O (bank 1) |
| Broche A4 | GXB_TX0 — Transceiver 0 transmit |
| Broche A5 | GXB_RX0 — Transceiver 0 receive |
| Broche A6 | IO2 — User I/O (bank 2) |
| Broche A7 | VCCIO2 — I/O bank 2 supply voltage |
| Broche A8 | IO2 — User I/O (bank 2) |
| Broche A9 | GXB_TX1 — Transceiver 1 transmit |
| Broche A10 | GXB_RX1 — Transceiver 1 receive |
| Broche A11 | IO3 — User I/O (bank 3) |
| Broche A12 | VCCIO3 — I/O bank 3 supply voltage |
| Broche A13 | IO3 — User I/O (bank 3) |
| Broche B1 | GND — Ground |
| Broche B2 | VCCINT — Core supply voltage (1.2 V) |
| Broche B3 | IO1 — User I/O (bank 1) |
| Broche B4 | REFCLK0 — Transceiver reference clock 0 |
| Broche B5 | GND — Ground |
| Broche B6 | REFCLK1 — Transceiver reference clock 1 |
| Broche B7 | IO2 — User I/O (bank 2) |
| Broche B8 | GND — Ground |
| Broche B9 | REFCLK2 — Transceiver reference clock 2 |
| Broche B10 | GXB_TX2 — Transceiver 2 transmit |
| Broche B11 | GXB_RX2 — Transceiver 2 receive |
| Broche B12 | IO3 — User I/O (bank 3) |
| Broche B13 | VCCINT — Core supply voltage (1.2 V) |
| Broche C1 | IO1 — User I/O (bank 1) |
| Broche C2 | GND — Ground |
| Broche C3 | IO1 — User I/O (bank 1) |
| Broche C4 | GXB_TX0_p — Transceiver 0 transmit (positive) |
| Broche C5 | GXB_RX0_p — Transceiver 0 receive (positive) |
| Broche C6 | IO2 — User I/O (bank 2) |
| Broche C7 | GXB_TX1_p — Transceiver 1 transmit (positive) |
| Broche C8 | GXB_RX1_p — Transceiver 1 receive (positive) |
| Broche C9 | IO3 — User I/O (bank 3) |
| Broche C10 | GXB_TX2_p — Transceiver 2 transmit (positive) |
| Broche C11 | GXB_RX2_p — Transceiver 2 receive (positive) |
| Broche C12 | GND — Ground |
| Broche C13 | IO3 — User I/O (bank 3) |
| Broche D1 | VCCIO1 — I/O bank 1 supply voltage |
| Broche D2 | IO1 — User I/O (bank 1) |
| Broche D3 | IO1 — User I/O (bank 1) |
| Broche D4 | GXB_TX0_n — Transceiver 0 transmit (negative) |
| Broche D5 | GXB_RX0_n — Transceiver 0 receive (negative) |
| Broche D6 | IO2 — User I/O (bank 2) |
| Broche D7 | GXB_TX1_n — Transceiver 1 transmit (negative) |
| Broche D8 | GXB_RX1_n — Transceiver 1 receive (negative) |
| Broche D9 | IO3 — User I/O (bank 3) |
| Broche D10 | GXB_TX2_n — Transceiver 2 transmit (negative) |
| Broche D11 | GXB_RX2_n — Transceiver 2 receive (negative) |
| Broche D12 | IO3 — User I/O (bank 3) |
| Broche D13 | VCCIO3 — I/O bank 3 supply voltage |
| Broche E1 | GND — Ground |
| Broche E2 | IO1 — User I/O (bank 1) |
| Broche E3 | VCCINT — Core supply voltage (1.2 V) |
| Broche E4 | IO1 — User I/O (bank 1) |
| Broche E5 | GND — Ground |
| Broche E6 | VCCIO2 — I/O bank 2 supply voltage |
| Broche E7 | IO2 — User I/O (bank 2) |
| Broche E8 | VCCINT — Core supply voltage (1.2 V) |
| Broche E9 | IO3 — User I/O (bank 3) |
| Broche E10 | GND — Ground |
| Broche E11 | IO3 — User I/O (bank 3) |
| Broche E12 | VCCINT — Core supply voltage (1.2 V) |
| Broche E13 | IO3 — User I/O (bank 3) |
| Broche F1 | IO1 — User I/O (bank 1) |
| Broche F2 | VCCIO1 — I/O bank 1 supply voltage |
| Broche F3 | IO1 — User I/O (bank 1) |
| Broche F4 | GXB_TX3 — Transceiver 3 transmit |
| Broche F5 | GXB_RX3 — Transceiver 3 receive |
| Broche F6 | IO2 — User I/O (bank 2) |
| Broche F7 | VCCIO2 — I/O bank 2 supply voltage |
| Broche F8 | IO2 — User I/O (bank 2) |
| Broche F9 | GXB_TX3_p — Transceiver 3 transmit (positive) |
| Broche F10 | GXB_RX3_p — Transceiver 3 receive (positive) |
| Broche F11 | IO3 — User I/O (bank 3) |
| Broche F12 | VCCIO3 — I/O bank 3 supply voltage |
| Broche F13 | IO3 — User I/O (bank 3) |
| Broche G1 | GND — Ground |
| Broche G2 | IO1 — User I/O (bank 1) |
| Broche G3 | VCCINT — Core supply voltage (1.2 V) |
| Broche G4 | GXB_TX3_n — Transceiver 3 transmit (negative) |
| Broche G5 | GXB_RX3_n — Transceiver 3 receive (negative) |
| Broche G6 | IO2 — User I/O (bank 2) |
| Broche G7 | VCCINT — Core supply voltage (1.2 V) |
| Broche G8 | IO2 — User I/O (bank 2) |
| Broche G9 | REFCLK3 — Transceiver reference clock 3 |
| Broche G10 | GND — Ground |
| Broche G11 | IO3 — User I/O (bank 3) |
| Broche G12 | VCCINT — Core supply voltage (1.2 V) |
| Broche G13 | IO3 — User I/O (bank 3) |
| Broche H1 | VCCIO1 — I/O bank 1 supply voltage |
| Broche H2 | IO1 — User I/O (bank 1) |
| Broche H3 | IO1 — User I/O (bank 1) |
| Broche H4 | VCC_PLL — PLL analog supply |
| Broche H5 | PLL1_OUT — PLL1 output clock |
| Broche H6 | IO2 — User I/O (bank 2) |
| Broche H7 | VCCIO2 — I/O bank 2 supply voltage |
| Broche H8 | IO2 — User I/O (bank 2) |
| Broche H9 | PLL2_OUT — PLL2 output clock |
| Broche H10 | VCC_PLL — PLL analog supply |
| Broche H11 | IO3 — User I/O (bank 3) |
| Broche H12 | VCCIO3 — I/O bank 3 supply voltage |
| Broche H13 | IO3 — User I/O (bank 3) |
| Broche J1 | GND — Ground |
| Broche J2 | IO1 — User I/O (bank 1) |
| Broche J3 | VCCINT — Core supply voltage (1.2 V) |
| Broche J4 | MSEL0 — Configuration mode select 0 |
| Broche J5 | MSEL1 — Configuration mode select 1 |
| Broche J6 | IO2 — User I/O (bank 2) |
| Broche J7 | VCCINT — Core supply voltage (1.2 V) |
| Broche J8 | IO2 — User I/O (bank 2) |
| Broche J9 | MSEL2 — Configuration mode select 2 |
| Broche J10 | TCK — JTAG test clock |
| Broche J11 | IO3 — User I/O (bank 3) |
| Broche J12 | VCCINT — Core supply voltage (1.2 V) |
| Broche J13 | IO3 — User I/O (bank 3) |
| Broche K1 | IO1 — User I/O (bank 1) |
| Broche K2 | VCCIO1 — I/O bank 1 supply voltage |
| Broche K3 | IO1 — User I/O (bank 1) |
| Broche K4 | nCONFIG — Configuration control (active low) |
| Broche K5 | nSTATUS — Configuration status (active low) |
| Broche K6 | IO2 — User I/O (bank 2) |
| Broche K7 | VCCIO2 — I/O bank 2 supply voltage |
| Broche K8 | IO2 — User I/O (bank 2) |
| Broche K9 | CONF_DONE — Configuration done indicator |
| Broche K10 | TDI — JTAG test data in |
| Broche K11 | IO3 — User I/O (bank 3) |
| Broche K12 | VCCIO3 — I/O bank 3 supply voltage |
| Broche K13 | IO3 — User I/O (bank 3) |
| Broche L1 | GND — Ground |
| Broche L2 | IO1 — User I/O (bank 1) |
| Broche L3 | VCCINT — Core supply voltage (1.2 V) |
| Broche L4 | IO1 — User I/O (bank 1) |
| Broche L5 | DATA0 — Configuration data bit 0 |
| Broche L6 | IO2 — User I/O (bank 2) |
| Broche L7 | VCCINT — Core supply voltage (1.2 V) |
| Broche L8 | IO2 — User I/O (bank 2) |
| Broche L9 | TDO — JTAG test data out |
| Broche L10 | TMS — JTAG test mode select |
| Broche L11 | IO3 — User I/O (bank 3) |
| Broche L12 | VCCINT — Core supply voltage (1.2 V) |
| Broche L13 | IO3 — User I/O (bank 3) |
| Broche M1 | IO1 — User I/O (bank 1) |
| Broche M2 | VCCIO1 — I/O bank 1 supply voltage |
| Broche M3 | IO1 — User I/O (bank 1) |
| Broche M4 | DCLK — Configuration clock |
| Broche M5 | nCE — Chip enable (active low) |
| Broche M6 | IO2 — User I/O (bank 2) |
| Broche M7 | VCCIO2 — I/O bank 2 supply voltage |
| Broche M8 | IO2 — User I/O (bank 2) |
| Broche M9 | CRC_ERROR — Configuration CRC error indicator |
| Broche M10 | CLK0 — Global clock input 0 |
| Broche M11 | IO3 — User I/O (bank 3) |
| Broche M12 | VCCIO3 — I/O bank 3 supply voltage |
| Broche M13 | IO3 — User I/O (bank 3) |
| Broche N1 | GND — Ground |
| Broche N2 | IO1 — User I/O (bank 1) |
| Broche N3 | VCCINT — Core supply voltage (1.2 V) |
| Broche N4 | IO1 — User I/O (bank 1) |
| Broche N5 | DATA1 — Configuration data bit 1 |
| Broche N6 | IO2 — User I/O (bank 2) |
| Broche N7 | VCCINT — Core supply voltage (1.2 V) |
| Broche N8 | IO2 — User I/O (bank 2) |
| Broche N9 | DEV_OE — Device-wide output enable |
| Broche N10 | CLK1 — Global clock input 1 |
| Broche N11 | IO3 — User I/O (bank 3) |
| Broche N12 | VCCINT — Core supply voltage (1.2 V) |
| Broche N13 | IO3 — User I/O (bank 3) |
Applications typiques
EP4CGX30BF14I6N convient pour 7 applications: Industrial Machine Vision, Wireless Remote Radio Unit (RRU), Factory Automation Controller, Cost-Optimized Video Surveillance, Protocol Bridging and Interface Conversion, Embedded Motor Control, PCIe Endpoint Card.
Industrial Machine Vision
The EP4CGX30BF14I6N's 29,440 logic elements and four 3.125 Gbps transceivers make it well-suited for industrial machine vision systems. Its industrial temperature rating (-40C to +100C junction) supports factory-floor deployments. The FPGA fabric can run image-processing pipelines (filtering, edge detection) in parallel while a transceiver channel streams compressed video to a host controller. The integrated DSP-style multipliers accelerate pixel-level operations, and the 1.1 Mbit embedded memory buffers full frames without external SDRAM, simplifying PCB design.
Recommandé
Wireless Remote Radio Unit (RRU)
The four 3.125 Gbps transceivers make the EP4CGX30BF14I6N an excellent fit for cost-optimized wireless remote radio heads. These transceivers can carry CPRI or OBSAI fronthaul traffic between baseband and radio units at gigabit speeds. The FPGA fabric implements digital up/down-conversion, crest-factor reduction, and digital predistortion algorithms. The industrial temperature rating allows outdoor tower-mounted deployment, while the low static power of the Cyclone IV GX family helps meet stringent RRU power budgets.
Recommandé
Factory Automation Controller
Factory automation controllers benefit from the EP4CGX30BF14I6N's deterministic parallel logic, 72 user I/O pins, and industrial temperature rating. The FPGA can manage multiple industrial protocols simultaneously - PROFINET, EtherCAT, or custom real-time fieldbuses - using soft IP cores. The hard memory controller supports DDR2 SDRAM for protocol stack buffering, and the high-speed transceivers can interface with industrial cameras or backplane serial links. Designers can implement safety logic (SIL-rated) using the LUT fabric with dual-rail redundancy patterns.
Recommandé
Cost-Optimized Video Surveillance
Video surveillance systems benefit from the EP4CGX30BF14I6N's ability to run H.264/H.265 encoding in FPGA fabric while simultaneously streaming output via the integrated 3.125 Gbps transceivers. The 1.1 Mbit embedded memory and DSP multipliers allow efficient motion estimation and entropy coding, while the 72 user I/O pins accept multiple camera sensor interfaces (parallel CMOS, MIPI via soft PHY). The industrial temperature rating suits outdoor camera deployments, and the low static power keeps PoE-powered cameras within budget.
Recommandé
Protocol Bridging and Interface Conversion
The EP4CGX30BF14I6N is well-suited to protocol-bridging applications such as PCIe-to-Ethernet, USB-to-SPI, or custom serial-link aggregation. The four 3.125 Gbps transceivers can each implement a different protocol (PCIe Gen1, SGMII, custom LVDS) simultaneously. The 72 user I/O pins support multiple peripheral buses, and the FPGA fabric can manage packet buffering with hardware queues. Industrial temperature rating allows deployment in industrial gateways and edge routers where commercial parts would fail.
Recommandé
Embedded Motor Control
Motor control applications benefit from the EP4CGX30BF14I6N's parallel logic fabric, DSP multipliers for field-oriented control (FOC) loops, and PWM generator capability. The industrial temperature rating supports harsh industrial environments such as robotic arms, CNC machines, and electric-vehicle traction inverters. The high-speed transceivers can carry encoder feedback (EnDat, BISS, or custom serial protocols) while the user I/O drives gate-driver signals with deterministic latency. The 1.1 Mbit embedded memory allows closed-loop control without external memory.
Recommandé
PCIe Endpoint Card
The EP4CGX30BF14I6N integrates hard PCIe Gen1 IP, enabling designers to implement low-cost PCIe endpoint cards without external bridge chips. The four 3.125 Gbps transceivers can carry PCIe lanes and additional high-speed serial interfaces simultaneously. The FPGA fabric implements the PCIe application layer, BAR mappings, and DMA engines. Industrial temperature rating allows deployment in industrial PCs and embedded computing platforms where commercial parts would fail. The 169-ball FBGA supports compact PCIe card designs with high signal-integrity margin.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CGX30BF14I6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CGX30BF14C6N | EP4CGX30BF14C7N | EP4CGX30BF14C8N | EP4CGX22BF14I8N | EP4CGX15BF14I8N |
|---|---|---|---|---|---|---|
| Package | FBGA-169 (F14) | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 21,680 | 14,400 |
| Embedded Memory (bits) | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 | 783,360 | 552,960 |
| Transceiver Channels | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 0 (no transceivers) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I6 | C6 | C7 (faster) | C8 (fastest) | I8 (faster) | I8 (faster) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Industrial temperature rating vs commercial-grade alternatives (vs EP4CGX30BF14C6N)
- Highest logic element density among F14 169-ball variants (vs EP4CGX22BF14I8N)
- Integrated 3.125 Gbps transceivers vs non-transceiver alternatives (vs EP4CGX15BF14I8N)
Notes de conception
The EP4CGX30BF14I6N requires separate 1.2 V (VCCINT) and per-bank VCCIO supplies. Use a low-noise LDO for the 1.2 V core rail with at least 1 A capacity (e.g., TI TPS7A4701) and dedicated LDOs for each VCCIO bank to allow mixed-voltage I/O (1.2 V to 3.3 V). Decouple each transceiver channel with 0.1 uF and 10 uF capacitors placed within 100 mils of the GXB_TX/GXB_RX balls. Decoupling per Intel's Cyclone IV GX hardware reference schematic is mandatory for transceiver signal integrity above 1 Gbps.
Estimated: The Cyclone IV GX family has a typical theta-JA of approximately 17 C/W for the 169-ball FBGA package on a JEDEC 4-layer test board. Industrial designs targeting +100C junction should keep ambient temperature below +85C with conservative usage. Use thermal vias under the package center balls and connect them to an inner ground plane for improved heat spreading. Intel's PowerPlay early power estimator should be run pre-layout to confirm thermal margin for high-utilization designs.
Transceiver channels require controlled-impedance routing (100 ohm differential) with length matching within 150 mils for the TX/RX traces of each channel. Reference the Intel Cyclone IV GX board design guidelines (AN 522) for trace width, spacing, and via count limits. Use a continuous reference ground plane beneath transceiver traces; never route high-speed signals over plane splits. Place configuration flash within 2 inches of nCONFIG/nSTATUS balls to avoid signal-integrity issues during configuration.
Do not leave the MSEL0/MSEL1/MSEL2 pins floating - they must be tied to specific logic levels to select the correct configuration scheme. Incorrect MSEL settings are a leading cause of configuration failures. Ensure the configuration flash (e.g., EPCS4/EPCS16) is sized at least 2x the compressed .sof file size to allow dual-boot redundancy. Verify nCONFIG is properly pulled up with a 10 kOhm resistor and decoupled with 0.1 uF for clean reset behavior.
Informations de conformité
RoHS and REACH compliant per Intel product declaration. Not AEC-Q100 qualified - this part targets industrial rather than automotive-grade applications. Lead-free FBGA balls compatible with standard SAC reflow profiles.
