EP4CGX30BF14I6N - Cyclone IV GX FPGA, 30K LE, FBGA-169 | Intel
N.º da peça: EP4CGX30BF14I6N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.8 | $2.980,00 |
| 500 | $26.4 | $13.200,00 |
| 1.000 | $23.1 | $23.100,00 |
EP4CGX30BF14I6N Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks (such as transceivers, multipliers, and memory controllers). FPGAs occupy a unique position in the digital design hierarchy: more flexible than an ASIC and faster than a general-purpose microcontroller, they sit between fixed-logic ICs and software-defined compute. The Cyclone IV GX family specifically extends the Cyclone IV series by adding integrated transceivers while maintaining the lowest static power in the industry's mainstream FPGA segment.
Key features of the EP4CGX30BF14I6N include up to 72 user I/O pins, 1,105,920 bits of embedded memory (approximately 135 Kbytes when configured as M9K blocks), four 3.125 Gbps transceiver channels, two PLLs, and support for external memory interfaces including DDR/DDR2/QDRII SDRAM. The device operates from a 1.2 V core supply with separate V1CCIO banks for I/O voltage flexibility. The F14 package designation indicates the 169-ball fine-pitch BGA, and the I6 speed grade balances performance with the industrial temperature range (-40C to +100C junction).
The Cyclone IV GX architecture combines an enhanced LUT-based logic fabric with dedicated 18x18 multipliers, dual-configuration flash memory support, and hard PCI Express IP. This makes the device suitable for protocol bridging, motor control, and custom video pipelines where designers need parallel DSP performance alongside multi-gigabit serial I/O.
Typical applications include industrial machine vision, low-end wireless backhaul, factory automation controllers, and cost-optimized video surveillance systems. The integrated transceivers allow designers to implement proprietary serial links or standards such as PCIe Gen1 and CPRI without external PHY chips.
When designing with the EP4CGX30BF14I6N, ensure proper decoupling per the Intel reference schematic and verify signal-integrity routing for the high-speed transceiver lanes. The device uses SRAM-based configuration, so an external configuration flash is required for standalone boot. Industrial temperature rating makes this part suitable for harsh-environment deployments.
This page synthesizes distributor pricing, drop-in alternatives sourced from the Cyclone IV GX family and competitor cross-references, and practical design notes not found in the standalone datasheet.
Alternativas drop-in para EP4CGX30BF14I6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP4CGX30BF14I6N (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Mounting Type, Logic Elements (LE).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP4CGX30BF14C6N
✅ Drop-In✓ Em estoque
$25.9 / unidade
Ver ficha técnica →EP4CGX30BF14C7N
✅ Drop-In✓ Em estoque
$55.78 / unidade
Ver ficha técnica →EP4CGX30BF14C8N
✅ Drop-In✓ Em estoque
$43.12 / unidade
Ver ficha técnica →EP4CGX22BF14I8N
✅ Drop-In✓ Em estoque
$25.1 / unidade
Ver ficha técnica →EP4CGX15BF14I8N
✅ Drop-In✓ Em estoque
$42.1 / unidade
Ver ficha técnica →EP4CGX30BF14I6N Classificações máximas e características elétricas
| Family | Cyclone IV GX |
| Logic Elements | 29,440 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Encapsulamento | 169-Ball FBGA (F14) |
| User I/O Pins | 72 (max) |
| Embedded Memory Bits | 1,105,920 |
| Transceiver Channels | 4 (3.125 Gbps) |
| PLLs | 2 |
| Speed Grade | I6 (industrial) |
| Operating Temperature (Junction) | -40C to +100C |
| Tipo de montagem | Surface Mount |
| Configuration Method | SRAM-based, requires external flash |
| DSP Blocks | Embedded multipliers (18x18) |
| Hard Memory Controllers | DDR/DDR2/QDRII SDRAM |
Configuração de pinos do EP4CGX30BF14I6N
| Pino A1 | VCCIO1 — I/O bank 1 supply voltage |
| Pino A2 | IO1 — User I/O (bank 1) |
| Pino A3 | IO1 — User I/O (bank 1) |
| Pino A4 | GXB_TX0 — Transceiver 0 transmit |
| Pino A5 | GXB_RX0 — Transceiver 0 receive |
| Pino A6 | IO2 — User I/O (bank 2) |
| Pino A7 | VCCIO2 — I/O bank 2 supply voltage |
| Pino A8 | IO2 — User I/O (bank 2) |
| Pino A9 | GXB_TX1 — Transceiver 1 transmit |
| Pino A10 | GXB_RX1 — Transceiver 1 receive |
| Pino A11 | IO3 — User I/O (bank 3) |
| Pino A12 | VCCIO3 — I/O bank 3 supply voltage |
| Pino A13 | IO3 — User I/O (bank 3) |
| Pino B1 | GND — Ground |
| Pino B2 | VCCINT — Core supply voltage (1.2 V) |
| Pino B3 | IO1 — User I/O (bank 1) |
| Pino B4 | REFCLK0 — Transceiver reference clock 0 |
| Pino B5 | GND — Ground |
| Pino B6 | REFCLK1 — Transceiver reference clock 1 |
| Pino B7 | IO2 — User I/O (bank 2) |
| Pino B8 | GND — Ground |
| Pino B9 | REFCLK2 — Transceiver reference clock 2 |
| Pino B10 | GXB_TX2 — Transceiver 2 transmit |
| Pino B11 | GXB_RX2 — Transceiver 2 receive |
| Pino B12 | IO3 — User I/O (bank 3) |
| Pino B13 | VCCINT — Core supply voltage (1.2 V) |
| Pino C1 | IO1 — User I/O (bank 1) |
| Pino C2 | GND — Ground |
| Pino C3 | IO1 — User I/O (bank 1) |
| Pino C4 | GXB_TX0_p — Transceiver 0 transmit (positive) |
| Pino C5 | GXB_RX0_p — Transceiver 0 receive (positive) |
| Pino C6 | IO2 — User I/O (bank 2) |
| Pino C7 | GXB_TX1_p — Transceiver 1 transmit (positive) |
| Pino C8 | GXB_RX1_p — Transceiver 1 receive (positive) |
| Pino C9 | IO3 — User I/O (bank 3) |
| Pino C10 | GXB_TX2_p — Transceiver 2 transmit (positive) |
| Pino C11 | GXB_RX2_p — Transceiver 2 receive (positive) |
| Pino C12 | GND — Ground |
| Pino C13 | IO3 — User I/O (bank 3) |
| Pino D1 | VCCIO1 — I/O bank 1 supply voltage |
| Pino D2 | IO1 — User I/O (bank 1) |
| Pino D3 | IO1 — User I/O (bank 1) |
| Pino D4 | GXB_TX0_n — Transceiver 0 transmit (negative) |
| Pino D5 | GXB_RX0_n — Transceiver 0 receive (negative) |
| Pino D6 | IO2 — User I/O (bank 2) |
| Pino D7 | GXB_TX1_n — Transceiver 1 transmit (negative) |
| Pino D8 | GXB_RX1_n — Transceiver 1 receive (negative) |
| Pino D9 | IO3 — User I/O (bank 3) |
| Pino D10 | GXB_TX2_n — Transceiver 2 transmit (negative) |
| Pino D11 | GXB_RX2_n — Transceiver 2 receive (negative) |
| Pino D12 | IO3 — User I/O (bank 3) |
| Pino D13 | VCCIO3 — I/O bank 3 supply voltage |
| Pino E1 | GND — Ground |
| Pino E2 | IO1 — User I/O (bank 1) |
| Pino E3 | VCCINT — Core supply voltage (1.2 V) |
| Pino E4 | IO1 — User I/O (bank 1) |
| Pino E5 | GND — Ground |
| Pino E6 | VCCIO2 — I/O bank 2 supply voltage |
| Pino E7 | IO2 — User I/O (bank 2) |
| Pino E8 | VCCINT — Core supply voltage (1.2 V) |
| Pino E9 | IO3 — User I/O (bank 3) |
| Pino E10 | GND — Ground |
| Pino E11 | IO3 — User I/O (bank 3) |
| Pino E12 | VCCINT — Core supply voltage (1.2 V) |
| Pino E13 | IO3 — User I/O (bank 3) |
| Pino F1 | IO1 — User I/O (bank 1) |
| Pino F2 | VCCIO1 — I/O bank 1 supply voltage |
| Pino F3 | IO1 — User I/O (bank 1) |
| Pino F4 | GXB_TX3 — Transceiver 3 transmit |
| Pino F5 | GXB_RX3 — Transceiver 3 receive |
| Pino F6 | IO2 — User I/O (bank 2) |
| Pino F7 | VCCIO2 — I/O bank 2 supply voltage |
| Pino F8 | IO2 — User I/O (bank 2) |
| Pino F9 | GXB_TX3_p — Transceiver 3 transmit (positive) |
| Pino F10 | GXB_RX3_p — Transceiver 3 receive (positive) |
| Pino F11 | IO3 — User I/O (bank 3) |
| Pino F12 | VCCIO3 — I/O bank 3 supply voltage |
| Pino F13 | IO3 — User I/O (bank 3) |
| Pino G1 | GND — Ground |
| Pino G2 | IO1 — User I/O (bank 1) |
| Pino G3 | VCCINT — Core supply voltage (1.2 V) |
| Pino G4 | GXB_TX3_n — Transceiver 3 transmit (negative) |
| Pino G5 | GXB_RX3_n — Transceiver 3 receive (negative) |
| Pino G6 | IO2 — User I/O (bank 2) |
| Pino G7 | VCCINT — Core supply voltage (1.2 V) |
| Pino G8 | IO2 — User I/O (bank 2) |
| Pino G9 | REFCLK3 — Transceiver reference clock 3 |
| Pino G10 | GND — Ground |
| Pino G11 | IO3 — User I/O (bank 3) |
| Pino G12 | VCCINT — Core supply voltage (1.2 V) |
| Pino G13 | IO3 — User I/O (bank 3) |
| Pino H1 | VCCIO1 — I/O bank 1 supply voltage |
| Pino H2 | IO1 — User I/O (bank 1) |
| Pino H3 | IO1 — User I/O (bank 1) |
| Pino H4 | VCC_PLL — PLL analog supply |
| Pino H5 | PLL1_OUT — PLL1 output clock |
| Pino H6 | IO2 — User I/O (bank 2) |
| Pino H7 | VCCIO2 — I/O bank 2 supply voltage |
| Pino H8 | IO2 — User I/O (bank 2) |
| Pino H9 | PLL2_OUT — PLL2 output clock |
| Pino H10 | VCC_PLL — PLL analog supply |
| Pino H11 | IO3 — User I/O (bank 3) |
| Pino H12 | VCCIO3 — I/O bank 3 supply voltage |
| Pino H13 | IO3 — User I/O (bank 3) |
| Pino J1 | GND — Ground |
| Pino J2 | IO1 — User I/O (bank 1) |
| Pino J3 | VCCINT — Core supply voltage (1.2 V) |
| Pino J4 | MSEL0 — Configuration mode select 0 |
| Pino J5 | MSEL1 — Configuration mode select 1 |
| Pino J6 | IO2 — User I/O (bank 2) |
| Pino J7 | VCCINT — Core supply voltage (1.2 V) |
| Pino J8 | IO2 — User I/O (bank 2) |
| Pino J9 | MSEL2 — Configuration mode select 2 |
| Pino J10 | TCK — JTAG test clock |
| Pino J11 | IO3 — User I/O (bank 3) |
| Pino J12 | VCCINT — Core supply voltage (1.2 V) |
| Pino J13 | IO3 — User I/O (bank 3) |
| Pino K1 | IO1 — User I/O (bank 1) |
| Pino K2 | VCCIO1 — I/O bank 1 supply voltage |
| Pino K3 | IO1 — User I/O (bank 1) |
| Pino K4 | nCONFIG — Configuration control (active low) |
| Pino K5 | nSTATUS — Configuration status (active low) |
| Pino K6 | IO2 — User I/O (bank 2) |
| Pino K7 | VCCIO2 — I/O bank 2 supply voltage |
| Pino K8 | IO2 — User I/O (bank 2) |
| Pino K9 | CONF_DONE — Configuration done indicator |
| Pino K10 | TDI — JTAG test data in |
| Pino K11 | IO3 — User I/O (bank 3) |
| Pino K12 | VCCIO3 — I/O bank 3 supply voltage |
| Pino K13 | IO3 — User I/O (bank 3) |
| Pino L1 | GND — Ground |
| Pino L2 | IO1 — User I/O (bank 1) |
| Pino L3 | VCCINT — Core supply voltage (1.2 V) |
| Pino L4 | IO1 — User I/O (bank 1) |
| Pino L5 | DATA0 — Configuration data bit 0 |
| Pino L6 | IO2 — User I/O (bank 2) |
| Pino L7 | VCCINT — Core supply voltage (1.2 V) |
| Pino L8 | IO2 — User I/O (bank 2) |
| Pino L9 | TDO — JTAG test data out |
| Pino L10 | TMS — JTAG test mode select |
| Pino L11 | IO3 — User I/O (bank 3) |
| Pino L12 | VCCINT — Core supply voltage (1.2 V) |
| Pino L13 | IO3 — User I/O (bank 3) |
| Pino M1 | IO1 — User I/O (bank 1) |
| Pino M2 | VCCIO1 — I/O bank 1 supply voltage |
| Pino M3 | IO1 — User I/O (bank 1) |
| Pino M4 | DCLK — Configuration clock |
| Pino M5 | nCE — Chip enable (active low) |
| Pino M6 | IO2 — User I/O (bank 2) |
| Pino M7 | VCCIO2 — I/O bank 2 supply voltage |
| Pino M8 | IO2 — User I/O (bank 2) |
| Pino M9 | CRC_ERROR — Configuration CRC error indicator |
| Pino M10 | CLK0 — Global clock input 0 |
| Pino M11 | IO3 — User I/O (bank 3) |
| Pino M12 | VCCIO3 — I/O bank 3 supply voltage |
| Pino M13 | IO3 — User I/O (bank 3) |
| Pino N1 | GND — Ground |
| Pino N2 | IO1 — User I/O (bank 1) |
| Pino N3 | VCCINT — Core supply voltage (1.2 V) |
| Pino N4 | IO1 — User I/O (bank 1) |
| Pino N5 | DATA1 — Configuration data bit 1 |
| Pino N6 | IO2 — User I/O (bank 2) |
| Pino N7 | VCCINT — Core supply voltage (1.2 V) |
| Pino N8 | IO2 — User I/O (bank 2) |
| Pino N9 | DEV_OE — Device-wide output enable |
| Pino N10 | CLK1 — Global clock input 1 |
| Pino N11 | IO3 — User I/O (bank 3) |
| Pino N12 | VCCINT — Core supply voltage (1.2 V) |
| Pino N13 | IO3 — User I/O (bank 3) |
Aplicações típicas
EP4CGX30BF14I6N é adequado para 7 aplicaçãos: Industrial Machine Vision, Wireless Remote Radio Unit (RRU), Factory Automation Controller, Cost-Optimized Video Surveillance, Protocol Bridging and Interface Conversion, Embedded Motor Control, PCIe Endpoint Card.
Industrial Machine Vision
The EP4CGX30BF14I6N's 29,440 logic elements and four 3.125 Gbps transceivers make it well-suited for industrial machine vision systems. Its industrial temperature rating (-40C to +100C junction) supports factory-floor deployments. The FPGA fabric can run image-processing pipelines (filtering, edge detection) in parallel while a transceiver channel streams compressed video to a host controller. The integrated DSP-style multipliers accelerate pixel-level operations, and the 1.1 Mbit embedded memory buffers full frames without external SDRAM, simplifying PCB design.
Recomendado
Wireless Remote Radio Unit (RRU)
The four 3.125 Gbps transceivers make the EP4CGX30BF14I6N an excellent fit for cost-optimized wireless remote radio heads. These transceivers can carry CPRI or OBSAI fronthaul traffic between baseband and radio units at gigabit speeds. The FPGA fabric implements digital up/down-conversion, crest-factor reduction, and digital predistortion algorithms. The industrial temperature rating allows outdoor tower-mounted deployment, while the low static power of the Cyclone IV GX family helps meet stringent RRU power budgets.
Recomendado
Factory Automation Controller
Factory automation controllers benefit from the EP4CGX30BF14I6N's deterministic parallel logic, 72 user I/O pins, and industrial temperature rating. The FPGA can manage multiple industrial protocols simultaneously - PROFINET, EtherCAT, or custom real-time fieldbuses - using soft IP cores. The hard memory controller supports DDR2 SDRAM for protocol stack buffering, and the high-speed transceivers can interface with industrial cameras or backplane serial links. Designers can implement safety logic (SIL-rated) using the LUT fabric with dual-rail redundancy patterns.
Recomendado
Cost-Optimized Video Surveillance
Video surveillance systems benefit from the EP4CGX30BF14I6N's ability to run H.264/H.265 encoding in FPGA fabric while simultaneously streaming output via the integrated 3.125 Gbps transceivers. The 1.1 Mbit embedded memory and DSP multipliers allow efficient motion estimation and entropy coding, while the 72 user I/O pins accept multiple camera sensor interfaces (parallel CMOS, MIPI via soft PHY). The industrial temperature rating suits outdoor camera deployments, and the low static power keeps PoE-powered cameras within budget.
Recomendado
Protocol Bridging and Interface Conversion
The EP4CGX30BF14I6N is well-suited to protocol-bridging applications such as PCIe-to-Ethernet, USB-to-SPI, or custom serial-link aggregation. The four 3.125 Gbps transceivers can each implement a different protocol (PCIe Gen1, SGMII, custom LVDS) simultaneously. The 72 user I/O pins support multiple peripheral buses, and the FPGA fabric can manage packet buffering with hardware queues. Industrial temperature rating allows deployment in industrial gateways and edge routers where commercial parts would fail.
Recomendado
Embedded Motor Control
Motor control applications benefit from the EP4CGX30BF14I6N's parallel logic fabric, DSP multipliers for field-oriented control (FOC) loops, and PWM generator capability. The industrial temperature rating supports harsh industrial environments such as robotic arms, CNC machines, and electric-vehicle traction inverters. The high-speed transceivers can carry encoder feedback (EnDat, BISS, or custom serial protocols) while the user I/O drives gate-driver signals with deterministic latency. The 1.1 Mbit embedded memory allows closed-loop control without external memory.
Recomendado
PCIe Endpoint Card
The EP4CGX30BF14I6N integrates hard PCIe Gen1 IP, enabling designers to implement low-cost PCIe endpoint cards without external bridge chips. The four 3.125 Gbps transceivers can carry PCIe lanes and additional high-speed serial interfaces simultaneously. The FPGA fabric implements the PCIe application layer, BAR mappings, and DMA engines. Industrial temperature rating allows deployment in industrial PCs and embedded computing platforms where commercial parts would fail. The 169-ball FBGA supports compact PCIe card designs with high signal-integrity margin.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP4CGX30BF14I6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP4CGX30BF14C6N | EP4CGX30BF14C7N | EP4CGX30BF14C8N | EP4CGX22BF14I8N | EP4CGX15BF14I8N |
|---|---|---|---|---|---|---|
| Package | FBGA-169 (F14) | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 21,680 | 14,400 |
| Embedded Memory (bits) | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 | 783,360 | 552,960 |
| Transceiver Channels | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 0 (no transceivers) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I6 | C6 | C7 (faster) | C8 (fastest) | I8 (faster) | I8 (faster) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Industrial temperature rating vs commercial-grade alternatives (vs EP4CGX30BF14C6N)
- Highest logic element density among F14 169-ball variants (vs EP4CGX22BF14I8N)
- Integrated 3.125 Gbps transceivers vs non-transceiver alternatives (vs EP4CGX15BF14I8N)
Notas de projeto
The EP4CGX30BF14I6N requires separate 1.2 V (VCCINT) and per-bank VCCIO supplies. Use a low-noise LDO for the 1.2 V core rail with at least 1 A capacity (e.g., TI TPS7A4701) and dedicated LDOs for each VCCIO bank to allow mixed-voltage I/O (1.2 V to 3.3 V). Decouple each transceiver channel with 0.1 uF and 10 uF capacitors placed within 100 mils of the GXB_TX/GXB_RX balls. Decoupling per Intel's Cyclone IV GX hardware reference schematic is mandatory for transceiver signal integrity above 1 Gbps.
Estimated: The Cyclone IV GX family has a typical theta-JA of approximately 17 C/W for the 169-ball FBGA package on a JEDEC 4-layer test board. Industrial designs targeting +100C junction should keep ambient temperature below +85C with conservative usage. Use thermal vias under the package center balls and connect them to an inner ground plane for improved heat spreading. Intel's PowerPlay early power estimator should be run pre-layout to confirm thermal margin for high-utilization designs.
Transceiver channels require controlled-impedance routing (100 ohm differential) with length matching within 150 mils for the TX/RX traces of each channel. Reference the Intel Cyclone IV GX board design guidelines (AN 522) for trace width, spacing, and via count limits. Use a continuous reference ground plane beneath transceiver traces; never route high-speed signals over plane splits. Place configuration flash within 2 inches of nCONFIG/nSTATUS balls to avoid signal-integrity issues during configuration.
Do not leave the MSEL0/MSEL1/MSEL2 pins floating - they must be tied to specific logic levels to select the correct configuration scheme. Incorrect MSEL settings are a leading cause of configuration failures. Ensure the configuration flash (e.g., EPCS4/EPCS16) is sized at least 2x the compressed .sof file size to allow dual-boot redundancy. Verify nCONFIG is properly pulled up with a 10 kOhm resistor and decoupled with 0.1 uF for clean reset behavior.
Informações de conformidade
RoHS and REACH compliant per Intel product declaration. Not AEC-Q100 qualified - this part targets industrial rather than automotive-grade applications. Lead-free FBGA balls compatible with standard SAC reflow profiles.
