EP4SGX530KF43C4 - Stratix IV GX FPGA, 531K LE, 1760-FCBGA | Intel
Référence : EP4SGX530KF43C4 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4280 | $4 280,00 |
| 10 | $4150 | $41 500,00 |
| 100 | $3975 | $397 500,00 |
| 500 | $3850 | $1 925 000,00 |
| 1 000 | $3725 | $3 725 000,00 |
EP4SGX530KF43C4 Présentation
What is an FPGA? A Field Programmable Gate Array (FPGA) is a class of programmable logic device that allows engineers to implement custom digital circuits after manufacturing. Within the broader taxonomy of integrated circuits, FPGAs sit alongside ASICs (Application-Specific ICs) and CPLDs (Complex Programmable Logic Devices). They are widely used for digital signal processing, protocol bridging, hardware acceleration, and prototyping. Stratix IV GX is Intel/Altera's high-end transceiver-rich FPGA family, hierarchical from LEs (Logic Elements) through LABs (Logic Array Blocks) up to full FPGA-level architecture.
Key features of the EP4SGX530KF43C4 include 21,248 Adaptive Logic Modules (ALMs) organized into LABs, embedded 18x18 multipliers for DSP operations, dedicated hardware for memory interfacing, and integrated PCI Express Gen1/Gen2 hard IP blocks. The device supports 800 MHz internal fabric clocking and operates from a 0.9 V core supply. It is offered in the commercial 0 to 85 C temperature grade.
Architecturally, Stratix IV GX devices incorporate Partial Reconfiguration capability, allowing live logic modification without halting system operation. The integrated transceivers support multiple protocols including CPRI, OBSAI, Serial RapidIO, Gigabit Ethernet, and XAUI. Memory interfaces are hardened for DDR3, QDRII+, and RLDRAM II, simplifying high-throughput memory subsystem design.
Typical applications include high-end wireline backhaul, test and measurement equipment with high-speed serial capture, medical imaging pipelines, radar/electronic warfare signal processing, broadcast video infrastructure, and high-performance computing accelerators. The combination of dense logic, high-speed serial I/O, and large on-die memory makes it well suited to data-path-intensive workloads.
When designing with this device, pay careful attention to PCB layout for the FC-BGA package - matched-length routing, controlled-impedance differential pairs, and adequate BGA breakout via patterns are mandatory. Thermal management for the 42.5 mm package requires a heatsink with thermal interface material; refer to the manufacturer pin-out and thermal documents for the package-specific thermal resistance values.
This page synthesizes verified distributor stock, pricing tiers, drop-in alternatives from the Stratix IV GX family, and practical PCB/thermal design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour EP4SGX530KF43C4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4SGX530KF43C4 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Transceivers, Process Technology, Embedded Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4SGX530KF43C3
✅ Remplacement direct✓ En stock
$3700 / unité
Voir la fiche technique →EP4SGX530KF43C3N
✅ Remplacement direct✓ En stock
$3425 / unité
Voir la fiche technique →EP4SGX530KF43C2N
✅ Remplacement direct✓ En stock
$3450 / unité
Voir la fiche technique →EP4SGX530KF43C2
✅ Remplacement direct✓ En stock
$3755 / unité
Voir la fiche technique →EP4SGX530KF43C4 Valeurs maximales et caractéristiques électriques
| Device Type | FPGA - Field Programmable Gate Array |
| Series | Stratix IV GX |
| Logic Elements | 531,200 |
| Logic Array Blocks (LABs) | 21,248 |
| Embedded Memory | 28,033,024 bits |
| User I/Os | 880 |
| Boîtier | 1760-ball FC-BGA (42.5 x 42.5 mm) |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Internal Fabric Clock | 800 MHz (max) |
| Transceivers | Up to 24 channels, 8.5 Gbps |
| Température de fonctionnement | 0 C to +85 C (Commercial) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Lead Free | Yes |
Guide de configuration des broches du EP4SGX530KF43C4 1760-ball fc-bga (42.5 x 42.5 mm)
Configuration des broches du EP4SGX530KF43C4 (boîtier 1760-ball fc-bga (42.5 x 42.5 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4SGX530KF43C4.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4SGX530KF43C4 convient pour 6 applications: High-Speed Wireline Backhaul, Test and Measurement Instrumentation, Medical Imaging Systems, Radar and Electronic Warfare Signal Processing, Broadcast Video Infrastructure, High-Performance Computing Accelerator.
High-Speed Wireline Backhaul
The EP4SGX530KF43C4's 24 transceivers at 8.5 Gbps and 531K logic elements suit CPRI and OBSAI backhaul designs. Placed between baseband processors and optical front-ends, it handles multi-sector aggregation with hardware-implemented protocol offload. Compared with discrete PHY plus ASIC approaches, the integrated transceivers eliminate external SERDES components and reduce board area by roughly 40 percent. Memory bandwidth from 28 Mbit embedded SRAM buffers sub-frame data without external DDR access latency.
Recommandé
Test and Measurement Instrumentation
The combination of 880 user I/Os, large on-die memory, and integrated transceivers makes the EP4SGX530KF43C4 ideal for oscilloscope and logic-analyzer front-end processing. Real-time signal capture benefits from the 28 Mbit embedded SRAM and 800 MHz fabric clock, supporting deep acquisition memory without external buffering. Hard PCI Express Gen2 IP enables direct streaming to host processors. Compared with ASSP-based approaches, the FPGA allows custom protocol decoding and trigger logic tailored to specific measurement workflows.
Recommandé
Medical Imaging Systems
CT, MRI, and ultrasound imaging systems use the EP4SGX530KF43C4 to perform real-time beamforming, image reconstruction, and noise filtering. The 21,248 ALMs combined with hundreds of 18x18 multipliers deliver the DSP throughput required for back-projection algorithms at clinically useful frame rates. Embedded memory blocks eliminate bottlenecks in line-buffer storage, while transceivers stream pre-processed image data to display controllers. The 0-85 C commercial temperature range covers stationary imaging-room equipment without requiring industrial-grade parts.
Recommandé
Radar and Electronic Warfare Signal Processing
Defense and aerospace applications leverage the EP4SGX530KF43C4 for pulse-Doppler and SAR (Synthetic Aperture Radar) processing. The transceiver-rich architecture aggregates multiple RF channels at 8.5 Gbps, while 531K logic elements host FFT and matched-filter implementations in parallel. The 28 Mbit embedded SRAM provides coefficient and sample storage close to DSP blocks, avoiding external memory round-trips during high-rate processing. Partial Reconfiguration capability enables mode switching between surveillance and tracking algorithms without interrupting operation.
Recommandé
Broadcast Video Infrastructure
The EP4SGX530KF43C4 supports 3G-SDI, 6G-SDI, and emerging 12G-SDI video routing and processing in broadcast studios. Transceivers interface directly to serial digital video signals at 11.88 Gbps when using oversampling techniques, while fabric logic handles color-space conversion, frame synchronization, and audio embedding. The 880 user I/Os aggregate many parallel video streams simultaneously. Compared with fixed-function broadcast ASSPs, the FPGA enables support for next-generation formats (SMPTE 2110 IP video) without hardware replacement.
Recommandé
High-Performance Computing Accelerator
HPC clusters employ the EP4SGX530KF43C4 as a co-processor for algorithmic acceleration in finance, genomics, and scientific computing. PCI Express Gen2 hard IP blocks connect directly to host CPUs at 5 Gbps per lane, while 531K logic elements implement custom compute kernels in parallel. The 28 Mbit embedded SRAM stores lookup tables and intermediate results. Compared with GPU acceleration, the FPGA offers deterministic latency and lower power per operation for specific algorithms such as option pricing and BLAST sequence alignment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4SGX530KF43C4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4SGX530KF43C3 | EP4SGX530KF43C3N | EP4SGX530KF43C2N | EP4SGX530KF43C2 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 1760-ball FC-BGA (KF43) 42.5x42.5 mm | 1760-ball FC-BGA (KF43) 42.5x42.5 mm | 1760-ball FC-BGA (KF43) 42.5x42.5 mm | 1760-ball FC-BGA (KF43) 42.5x42.5 mm | 1760-ball FC-BGA (KF43) 42.5x42.5 mm |
| Speed Grade | C4 (fastest) | C3 (-6% fMAX) | C3 (-6% fMAX), lead-free | C2 (-12% fMAX), lead-free | C2 (-12% fMAX) |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Embedded Memory (bits) | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 |
| User I/Os | 880 | 880 | 880 | 880 | 880 |
| Transceivers | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 24 x 8.5 Gbps |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| RoHS / Lead-Free | Compliant / Lead-free | Compliant | Compliant / Lead-free | Compliant / Lead-free | Compliant |
Principaux différenciateurs
- Highest speed grade (C4) in Stratix IV GX family (vs EP4SGX530KF43C3)
- Original non-N lead-free designation (vs EP4SGX530KF43C3N)
- Largest density in Stratix IV GX family (vs EP4SGX360KF43C4)
Notes de conception
The 1760-ball FC-BGA package requires high-density PCB stack-up with at least 10 layers to escape the 1.0 mm ball pitch. Use laser-drilled microvias for inner-row escape and back-drilled through-vias on high-speed transceiver lanes to control stub length below 0.15 mm. Decoupling requires 0402-size capacitors placed within 2 mm of each power pin, with bulk capacitance on the reverse side of the BGA footprint.
Estimated: with a junction-to-ambient thermal resistance in the 5-8 C/W range for the 42.5 mm FC-BGA package (estimated based on package size; refer to manufacturer thermal model for exact theta_JA), the device can dissipate up to 15-20 W reliably without active cooling. For designs targeting full transceiver utilization, attach a heatsink with thermal interface material and ensure forced airflow of 200 LFM minimum across the package.
Transceiver channels operating at 8.5 Gbps require controlled-impedance differential routing with 100 ohm differential impedance and intra-pair skew below 1 ps per cm. Use length-matched serpentine structures to tune channel-to-channel skew within the FPGA's transceiver margin budget. Reference-plane continuity beneath high-speed traces must be maintained; avoid layer transitions that interrupt the return-current path.
The 0.9 V core supply demands a high-current power supply unit capable of delivering 20-40 A with tight regulation (less than 3 percent ripple). Use a multi-phase PWM controller with output inductors below 0.5 uH to minimize transient response. Power-on sequencing must enforce core-before-I/O before-transceiver order; failure to sequence correctly can cause latch-up. Include soft-start circuitry to limit inrush current on hot-plug applications.
Configuration flash must be sized for the chosen bitstream compression mode - uncompressed Stratix IV GX bitstreams can exceed 200 Mbit, requiring external 256 Mbit SPI flash. Do not connect JTAG TCK directly to non-3.3 V tolerant devices; the Stratix IV configuration bank operates at 1.8/2.5/3.3 V selectable. Always verify the AS (active serial) mode timing with the chosen flash device - some lower-cost flashes fail the 50 MHz AS_CLK spec.
Informations de conformité
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Reach and conflict-mineral compliance status from manufacturer product disclosure.
